JPH07235791A - Heat dissipation structure of electronic equipment housing - Google Patents
Heat dissipation structure of electronic equipment housingInfo
- Publication number
- JPH07235791A JPH07235791A JP2510594A JP2510594A JPH07235791A JP H07235791 A JPH07235791 A JP H07235791A JP 2510594 A JP2510594 A JP 2510594A JP 2510594 A JP2510594 A JP 2510594A JP H07235791 A JPH07235791 A JP H07235791A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- heat dissipation
- wiring board
- horizontal
- backside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器筐体の放熱構
造に関し、特に裏面プリント配線基板の水平，垂直分割
実装により放熱用空気流路を確保することに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating structure for an electronic equipment casing, and more particularly to securing a heat dissipating air flow path by horizontally and vertically separately mounting a backside printed wiring board.
【０００２】[0002]
【従来の技術】従来の電子機器筐体の放熱構造は、図３
に示す通り、複数枚のプリント基板１の背面に裏面プリ
ント配線基板６が実装されるため、放熱用空気流路５を
確保する事が困難であった。そのため、通常プリント基
板１及び裏面プリント配線基板６を収容する筐体４の上
方に放熱用ユニット７を設けることにより、放熱用空気
流路５を確保し、筐体背面に放熱するのが一般的であっ
た。2. Description of the Related Art A conventional heat dissipation structure for electronic equipment is shown in FIG.
As shown in FIG. 5, the back side printed wiring board 6 is mounted on the back surface of the plurality of printed circuit boards 1, so that it is difficult to secure the heat radiation air flow path 5. Therefore, it is general that the heat radiation unit 7 is provided above the housing 4 for accommodating the printed circuit board 1 and the back side printed wiring board 6 to secure the heat radiating air flow path 5 and radiate heat to the back surface of the housing. Met.
【０００３】[0003]
【発明が解決しようとする課題】従来の電子機器筐体の
放熱構造は、筐体内に実装される複数枚のプリント基板
を接続する裏面プリント配線基板が放熱用空気流路の妨
げとなるため、筐体とは別に放熱用ユニットを設け放熱
用空気流路を確保しなければならなかった。このような
放熱構造には、空間が増大し、また、余分な部材を必要
とするという欠点があった。In the conventional heat dissipation structure of the electronic device housing, the backside printed wiring board connecting the plurality of printed boards mounted in the housing interferes with the heat dissipation air flow path. A heat dissipation unit had to be provided separately from the housing to secure an air flow path for heat dissipation. Such a heat dissipation structure has drawbacks of increasing space and requiring an extra member.
【０００４】そこで、本発明は、前記従来の電子機器筐
体の放熱構造を改良し、放熱用ユニットの設置を不要に
して放熱用空気流路の確保を図るものである。Therefore, the present invention is intended to improve the heat dissipation structure of the conventional electronic equipment casing and to secure a heat dissipation air passage by eliminating the installation of a heat dissipation unit.
【０００５】[0005]
【課題を解決するための手段】本発明は、前記課題を解
決するため、複数枚のプリント基板及びそれらを機能的
に接続するためプリント基板背面に実装する裏面プリン
ト配線基板からなり、裏面プリント配線基板を、複数枚
のプリント基板の背面に、プリント基板と同一平面上又
は平行な平面上に位置する複数枚の水平裏面プリント配
線基板と、プリント基板挿入方向を除いて複数枚の水平
裏面プリント配線基板に対して垂直に位置し各水平裏面
プリント配線基板を接続する垂直裏面プリント配線基板
とに分割して実装し、複数枚の水平裏面のプリント配線
基板と電子機器筐体の背面との間にファンモータを配置
する電子機器筐体の放熱構造を構成する。In order to solve the above-mentioned problems, the present invention comprises a plurality of printed boards and a back printed wiring board mounted on the back surface of the printed boards for functionally connecting them. The board is a plurality of horizontal backside printed wiring boards located on the same plane as or parallel to the printed boards on the backside of the printed wiring boards, and a plurality of horizontal backside printed wirings except for the printed board insertion direction. Mounted separately on a vertical backside printed wiring board that connects each horizontal backside printed wiring board that is positioned vertically to the board and is mounted between multiple horizontal backside printed wiring boards and the backside of the electronic device housing. A heat dissipation structure of an electronic device housing in which a fan motor is arranged is configured.
【０００６】[0006]
【実施例】次に本発明の一実施例について図面を参照し
て説明する。図１は、本発明の一実施例を示す外観斜視
図である。筐体４内には複数枚のプリント基板１が実装
され、その背面にはそれらを機能的に接続するための１
枚の垂直裏面プリント配線基板２及び複数枚の水平裏面
プリント配線基板３が実装されている。複数枚の水平裏
面プリント配線基板３は、複数枚のプリント基板１とそ
れぞれ同一平面上に位置する。また、１枚の垂直裏面プ
リント配線基板２は、複数枚の水平裏面プリント配線基
板３の下方に複数枚の水平裏面プリント配線基板３に対
して垂直に位置する。さらにその背面にファンモータ８
が実装されており、筐体４の前面から背面へ放熱用空気
流路５を通って放熱可能な構造となっている。An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing an embodiment of the present invention. A plurality of printed circuit boards 1 are mounted in a housing 4, and a back surface 1 for functionally connecting them.
A vertical back surface printed wiring board 2 and a plurality of horizontal back surface printed wiring boards 3 are mounted. The plurality of horizontal backside printed wiring boards 3 are located on the same plane as the plurality of printed circuit boards 1. Further, one vertical back surface printed wiring board 2 is positioned below the plurality of horizontal back surface printed wiring boards 3 and vertically to the plurality of horizontal back surface printed wiring boards 3. On the back of the fan motor 8
Is mounted, and the structure is such that heat can be radiated from the front surface to the back surface of the housing 4 through the heat radiating air flow path 5.
【０００７】図２は、本発明の裏面プリント配線基板の
実装方法を示した外観斜視図である。水平裏面プリント
配線基板３は、プリント基板１を受け、さらに垂直裏面
プリント配線基板２に接続する。よって、複数枚のプリ
ント基板１は、垂直裏面プリント配線基板２によって機
能的に接続されている。FIG. 2 is an external perspective view showing a mounting method of the back side printed wiring board of the present invention. The horizontal back surface printed wiring board 3 receives the printed board 1 and is further connected to the vertical back surface printed wiring board 2. Therefore, the plurality of printed circuit boards 1 are functionally connected by the vertical back surface printed wiring board 2.
【０００８】また、図１に示す垂直裏面プリント配線基
板２を水平裏面プリント配線基板３の上方に実装した場
合も同一の放熱構造となる。Also, when the vertical back side printed wiring board 2 shown in FIG. 1 is mounted above the horizontal back side printed wiring board 3, the same heat radiation structure is obtained.
【０００９】また、図１に示す実装において、筐体４の
前面と背面を結ぶ軸に対して９０度及び−９０度回転し
た配置で実装した場合も、同一の放熱構造となる。Further, in the mounting shown in FIG. 1, the same heat radiating structure can be obtained even when the mounting is performed in a position rotated by 90 ° and −90 ° with respect to the axis connecting the front and back surfaces of the housing 4.
【００１０】[0010]
【発明の効果】以上説明したように本発明は、複数枚の
プリント基板の接続用として背面に実装される裏面プリ
ント配線基板を垂直，水平に分割して実装したことによ
り、放熱用ユニット等の別空間を設けずに筐体内空間で
放熱用空気流路を確保することができる。As described above, according to the present invention, since the back side printed wiring board mounted on the back side for connecting a plurality of printed circuit boards is vertically and horizontally divided and mounted, a heat dissipation unit or the like is mounted. The air passage for heat dissipation can be secured in the space inside the housing without providing a separate space.
【図１】本発明の一実施例を示す外観斜視図である。FIG. 1 is an external perspective view showing an embodiment of the present invention.
【図２】図１における裏面プリント配線基板の外観斜視
図である。FIG. 2 is an external perspective view of a backside printed wiring board in FIG.
【図３】従来技術の一例を示す外観斜視図である。FIG. 3 is an external perspective view showing an example of a conventional technique.
１ プリント基板 ２ 垂直裏面プリント配線基板 ３ 水平裏面プリント配線基板 ４ 筐体 ５ 放熱用空気流路 ６ 裏面プリント配線基板 ７ 放熱用ユニット ８ ファンモータ 1 Printed Circuit Board 2 Vertical Backside Printed Wiring Board 3 Horizontal Backside Printed Wiring Board 4 Case 5 Heat Dissipation Air Flow Path 6 Backside Printed Wiring Board 7 Heat Dissipation Unit 8 Fan Motor
Claims (2)
的に接続するためプリント基板背面に実装する裏面プリ
ント配線基板からなり、裏面プリント配線基板を、複数
枚のプリント基板の背面に、プリント基板とそれぞれ同
一平面上又は平行な平面上に位置する複数枚の水平裏面
プリント配線基板と、プリント基板挿入方向を除いて複
数枚の水平裏面プリント配線基板に対して垂直に位置し
各水平裏面プリント配線基板を接続する垂直裏面プリン
ト配線基板とに分割し実装することを特徴とする電子機
器筐体の放熱構造。1. A printed circuit board comprising a plurality of printed circuit boards and a back surface printed wiring board mounted on the back surface of the printed circuit board for functionally connecting the printed circuit boards. A plurality of horizontal backside printed wiring boards which are respectively located on the same plane or parallel planes, and each horizontal backside printed wiring board which is vertically positioned with respect to the plurality of horizontal backside printed wiring boards except for the printed board insertion direction. A heat dissipation structure for an electronic device housing, characterized in that the heat dissipation structure is mounted separately on a vertical backside printed wiring board for connection with.
子機器筐体の背面との間にファンモータを配置すること
を特徴とする請求項１記載の電子機器筐体の放熱構造。2. The heat dissipation structure for an electronic equipment casing according to claim 1, wherein a fan motor is arranged between the plurality of horizontal back surface printed wiring boards and the rear surface of the electronic equipment casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2510594A JPH07235791A (en) | 1994-02-23 | 1994-02-23 | Heat dissipation structure of electronic equipment housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2510594A JPH07235791A (en) | 1994-02-23 | 1994-02-23 | Heat dissipation structure of electronic equipment housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07235791A true JPH07235791A (en) | 1995-09-05 |
Family
ID=12156651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2510594A Withdrawn JPH07235791A (en) | 1994-02-23 | 1994-02-23 | Heat dissipation structure of electronic equipment housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07235791A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006114860A1 (en) * | 2005-04-18 | 2006-11-02 | Media Global Links Co., Ltd. | Light-wave multiplex transmission device |
-
1994
- 1994-02-23 JP JP2510594A patent/JPH07235791A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006114860A1 (en) * | 2005-04-18 | 2006-11-02 | Media Global Links Co., Ltd. | Light-wave multiplex transmission device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010508 |