JPH07235345A - Shield connector - Google Patents

Abstract

PURPOSE:To provide a shield connector which is metal plated and used in an electronic appliance such as a communication apparatus, electric fittings for car, etc., wherein the manufacturing costs for metal plating can be suppressed and the plating be generated with a high dimensional accuracy. CONSTITUTION:Grooves 6, 6a are formed around each terminal penetration hole 5 in an insulated housing 2 which is capable of being metal plated, and an insulative coating material 3a not admitting metal plating is injected, and a metal plating process is applied to the surface of the housing 2. Thus a shield connector is achieved at a low manufacturing cost, to which metal plating is applied with a high dimensional accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in high-sensitivity equipment such as communication equipment and automobile electrical equipment, and is a shield for removing interference radio waves from the outside and unnecessary radio waves generated in the equipment. The present invention relates to a shielded connector having a property.

[0002]

2. Description of the Related Art In recent years, shielded connectors have been used as noise countermeasure parts for high-sensitivity equipment such as communication equipment and electrical equipment for automobiles.

A conventional shielded connector will be described with reference to FIG. According to FIG. 4 (a), reference numeral 2 denotes a box-shaped metal-plated insulating housing made of, for example, polyphthalamide resin, on the bottom wall of which a plurality of terminals 1 are held and held at a constant pitch. Around the hole 5, an insulative coating material 3 which cannot be metal-plated, for example, a silicone liquid is applied by masking. Metal plating 4 is formed on the surface of the insulating housing 2 excluding the coated surface of the insulating coating material 3.

FIG. 4 (b) shows a conventional shielded connector having a chip capacitor. Explaining only the part different from FIG. 4 (a), 2 shows a pair of recesses 9a, 9b capable of holding the chip capacitor 7 as terminal through holes. An insulating coating material 3 which is provided in the vicinity of 5 and in the outer peripheral portion 10 and which cannot be metal-plated is coated around the terminal through hole 5 by masking except for the pair of concave portions 9a and 9b. Then, except for the coated surface of the insulating coating material 3, the pair of recesses 9a,
Metal plating 4 is formed on the surface of the insulating housing 2 including 9b, and the electrode portions 8 at both ends of the chip capacitor 7 are soldered to the metal plating 4 formed in the recesses 9a and 9b, respectively.

The operation of the shielded connector constructed as described above will be described below.

First, in the shielded connector of FIG. 4A, the metal plating 4 formed around the insulating housing 2 is provided on a printed circuit board (not shown) by a ground portion (not shown) outside the insulating housing 2. (3) is electrically connected to the ground pattern, and the shield connector is shielded by the metal plating 4 to shield radiation noise.

Further, in the shielded connector of FIG. 4B, the conduction noise flowing through each terminal 1 is further removed by the chip capacitor 7 through the metal plating 4 around the terminal through hole 5, and the removed conduction noise is isolated by the insulating housing 2.
Through the metal plating 4 on the outer periphery 10 of the insulating housing 2
It flows to an earth pattern on the printed circuit board by an external earth part.

[0008]

However, in the above-mentioned conventional structure, since the insulating coating material 3 which cannot be metal-plated is coated around the terminal through hole 5 by masking, it is difficult to obtain high dimensional accuracy. There is a problem that the manufacturing process is complicated and the cost is high, and it is difficult to coat the shielded connector with a small dimension between adjacent terminals by masking. The present invention solves the above problems and provides a low cost, highly accurate shielded connector plated with metal.

[0009]

In order to solve the above-mentioned problems, the shield connector of the present invention is a box-shaped insulating housing capable of metal-plating and holding a plurality of terminals therethrough. A groove is formed on the groove, and an insulative coating material that cannot be plated with metal is formed by injection into the groove.
The surface of the insulating housing excluding the surface of the insulating coating forming portion is plated with metal to provide a shield property.

[0010]

With this structure, painting by masking the insulating coating material is unnecessary, and by injecting and forming the insulating coating material in the groove provided in the insulating housing, it is possible to form with high dimensional accuracy and also in the manufacturing process. The cost can be reduced because of simplification.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A shielded connector of the present invention will be described with reference to FIGS. The same parts as those in the prior art will be described with the same numbers. As shown in FIG. 2, 2 is a box-shaped metal-plated insulating housing in which a plurality of terminals 1 are held through the bottom wall at a constant pitch, and grooves 6 are provided above and below the terminal through holes 5. An insulative coating material 3a that cannot be metal-plated is formed by injection, and a metal plating 4 is formed on the surface of the insulating housing 2 excluding the injection-formed surface of the insulation coating material 3a. Furthermore, each terminal 1 is vertically folded at a certain position,
It serves as a connection terminal for the printed circuit board of the equipment used. The ground portion 11 outside the insulating housing 2 is a connection portion connected to a ground pattern on the printed board.

FIG. 1B shows another embodiment of the present invention.
The difference from the embodiment of FIG. 1 (a) is that a groove 6a into which the insulating coating material 3a is injected is provided around the terminal 1.

FIG. 3 shows another embodiment in which the chip capacitor of the present invention is inserted. In FIG. 3, 2 is a box-shaped insulating housing capable of metal plating, and a plurality of terminals 1 are fixed on the bottom wall thereof. It is held through at a pitch of. Further, the insulating housing 2 is provided with a pair of recesses 9a and 9b for holding the chip capacitor 7 in the vicinity of the terminal through hole 5 and the outer peripheral portion 10, and a groove 6b is provided around the terminal through hole 5 to prevent metal plating. The possible insulating coating material 3a is the recess 9
It is formed by injection to the lower parts of a and 9b.

Metal plating 4 is formed on the surface of the insulating housing 2 including the pair of recesses 9a and 9b except for the injection-formed surface of the insulating coating material 3a, and the electrode portions 8 at both ends of the chip capacitor 7 are formed. Are soldered to the metal plating 4 formed in the recesses 9a and 9b, respectively.

In the above embodiment, the chip capacitor 7
The electrode portions 8 at both ends are electrically connected by soldering to the metal platings 4 formed in the recesses 9a and 9b, respectively. However, when soldering, heat resistance against the soldering temperature of the insulating housing 2 is required, and therefore soldering is performed. It is more preferable to use a conductive adhesive that cures at a temperature lower than the temperature for electrical conduction.

When soldering, the material of the metal plating 4 needs to be plated with Au, Sn, or Sn-Pb having good solder wettability on the surface of Cu, which has a good shielding property. When conducting with a conductive adhesive, it is not necessary to select the material of the metal plating 4. For example, it is possible to apply to the surface of Cu, which has a good shielding property, Ni, which has excellent environmental resistance but poor solder wettability. Become.

At this time, the metal plating 4 is as thick as possible and has a large area to improve the radiation noise shielding effect, and the conduction noise removing effect in the case of FIG. 3 is also removed from the chip capacitor to the ground on the printed circuit board. Since the impedance up to the pattern is reduced, it is further improved.

The operation is the same as that of the prior art, so the description thereof will be omitted. As described above, according to this embodiment, the groove 6 or 6a or 6b is provided around the terminal through hole 5 of the insulating housing 2 capable of metal plating, and the insulating coating material 3a which cannot be metal plated is formed by injection. By doing so, painting by masking the insulating coating material 3a is unnecessary, and the cost can be reduced by a simple manufacturing process. In addition, the insulating coating material 3
By injecting and forming a, the metal plating 4 can be formed on the surface of the insulating housing 2 excluding the injection forming surface of the insulating coating material 3a with the dimensional accuracy of the insulating housing 2, and high dimensional accuracy can be obtained. Is possible.

[0019]

As described above, according to the present invention, a groove is provided around the terminal through hole of the insulating housing which can be plated with metal, and an insulating coating material which cannot be plated with metal is formed by injection. Since the insulating portion is formed by, the cost can be reduced, and an excellent shielded connector that enables metal plating with high dimensional accuracy can be realized.

[Brief description of drawings]

FIG. 1A is a perspective view of a main part of an embodiment of a shield connector according to the present invention. FIG. 1B is a perspective view of a main part of the other embodiment.

FIG. 2 is a perspective view of the same.

FIG. 3 is a perspective view of a main part of the other embodiment.

FIG. 4A is a perspective view of a main part of a conventional shielded connector. FIG. 4B is a perspective view of a main part of another conventional technique.

[Explanation of symbols]

 1 Terminal 2 Insulation Housing 3a Insulating Coating Material 4 Metal Plating 5 Terminal Through Hole 6, 6a, 6b Groove 7 Chip Capacitor 8 Electrode 9a, 9b Recess

Front page continuation (72) Inventor Shinji Kiguchi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A box-shaped insulating housing capable of metal plating, comprising a plurality of terminals penetratingly held, wherein a groove is formed around each terminal through hole, and the groove is an insulating coating in which metal plating is not possible. A shielded connector in which a material is injected and formed, and the surface of the insulating housing excluding the surface of the insulating coating forming portion is metal-plated to have a shielding property. 2. A pair of recesses for holding a chip capacitor in an insulating housing are provided in the vicinity of the terminal through hole and the outer peripheral portion,
2. The electrode parts on both ends of the chip capacitor are electrically connected to the metal plating formed in the recesses, respectively.
The shielded connector shown. 3. The shielded connector according to claim 2, wherein the electrodes on both ends of the chip capacitor and the metal plating formed in the recess provided in the insulating housing are electrically connected by a conductive adhesive.