JPH07230964A - Heat treatment device - Google Patents

Abstract

PURPOSE:To thermally treat a work with efficiency keeping it uniform in quality by a method wherein a heat value controlling means is provided between a panel heater and the work so as to enable a radiation energy to be more incident on the periphery than on the center of the work. CONSTITUTION:A heat treatment section 10 is a section which carries out various heat treatments to a work 100 such as a semiconductor wafer or an LCD and is equipped with a press tube 12, and a gas feed pipe 14 which feeds processing gas from outside is arranged inside the process tube 12. On the other hand, a heat value controlling means 120 is provided between a work 100 disposed at a processing position and a corresponding part of the heat equalizing member 22 in parallel with the work 100. The heat value controlling means 12 enables the radiation energy distribution to be more incident on the periphery than on the center of the work 100.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for heat treating an object in a vertical process tube.

[0002]

2. Description of the Related Art In the manufacture of semiconductor wafers, LCD substrates, etc., various heat treatment apparatuses are used to perform processes such as oxidation, diffusion, annealing and CVD.
In these heat treatment apparatuses, for example, achieving high precision of the process, improving the uniformity of the temperature distribution in the surface of the object to be processed, and increasing the efficiency of the heat treatment are major technical problems. There is.

By the way, in recent years, the semiconductor process has been further miniaturized, and along with this, the diameter of the wafer has been increased from 8 inches to
The diameter is increasing to 12 inches, and LC
There is also a need for a heat treatment apparatus that uniformly and efficiently processes a large substrate such as a D substrate. As the process becomes finer in response to such circumstances and the size of the object to be processed becomes larger, the processing becomes more precise, the temperature distribution in the surface of the object becomes more uniform, and the heat treatment efficiency is improved. Further improvement of is needed. Moreover, it is also required to improve the throughput in the case of manufacturing an object to be processed having such a large diameter.

[0004]

With the increase in the diameter of the object to be processed, there have been the following problems when the actual processing is performed.

That is, slips and distortions that occur in the object to be processed due to the increase in the diameter of the object to be processed are effectively prevented.
It is necessary to improve the uniformity of temperature distribution within the surface of the object to be processed. Therefore, in order to meet such requirements, how to maintain a uniform temperature in the object to be processed, in particular, the temperature between the central part and the peripheral part, which is caused by the larger heat radiation amount in the peripheral part than in the central part A major technical issue is how to reduce the difference. Further, with the miniaturization of the process, it is necessary to improve the accuracy of the treatment on the object to be processed and reduce the degree of contamination on the object to be processed. Therefore, in order to achieve uniform film quality and film thickness within the surface of the object to be processed, how to perform the heat treatment efficiently in a short time,
A major technical issue is whether to reduce the damage of contamination of the object to be processed due to heavy metals or the like.

Therefore, in view of the problems in the above-described conventional heat treatment apparatus, an object of the present invention is to provide a heat treatment apparatus capable of efficiently performing heat treatment while ensuring in-plane uniformity of the object to be treated. It is in.

[0007]

In order to solve the above-mentioned problems, the invention according to claim 1 has a lower end opening for loading and unloading the object to be processed, and heats the object to be processed which is arranged at the processing position. A vertical process tube equipped with a heat source, a holder for the object to be carried in which the object to be horizontally supported is loaded into the process tube through the opening, and is set at a predetermined processing position, and the process tube. A gas supply means for supplying a reaction gas toward a processing position therein, a planar heating element having a surface parallel to the object to be processed, and a heating element disposed between the planar heating element and the object to be processed. In addition, the heat quantity adjusting means for setting the radiant energy incident on the peripheral portion of the object to be processed is larger than that on the central portion of the object to be processed.

According to a second aspect of the present invention, in the first aspect, the heat quantity adjusting means is composed of a heat equalizing member capable of accumulating heat and made of a material free from impurity contamination. It is characterized in that the primary radiant heat is stored and the secondary radiant heat is radiated toward the object to be processed.

According to a third aspect of the present invention, in the first or second aspect, the heat quantity adjusting means is composed of a plurality of heat equalizing members whose diameters are successively set from the planar heating element toward the object to be treated. It is characterized by being.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the heat quantity adjusting means has a surface parallel to the planar heating element, and a thickness of a central portion of the surface is a peripheral portion. It is characterized by being set thicker than the thickness of.

According to a fifth aspect of the present invention, a vertical process tube having a lower end opening for loading and unloading an object to be processed and having a heat source for heating the object to be processed arranged at a processing position is supported horizontally. A holder for the object to be processed which carries the object to be processed into the process tube from the opening and sets it to a predetermined processing position, and a gas supply means for supplying a reaction gas toward the processing position in the process tube. And a sheet-like heat generating element arranged to face the object to be treated, and a material disposed between the sheet-like heat generating element and the object to be treated with less impurity contamination. A heat equalizing member that stores the primary radiant heat from the body and radiates the secondary radiant heat toward the object to be treated, wherein the planar heating element and / or the heat equalizing member has an outer edge portion that is the object to be treated. Curved or slanted to approach the body It is characterized in that.

According to a sixth aspect of the present invention, in the fifth aspect, the planar heating element and / or the soaking member are set in a dome shape.

[0013]

According to the present invention, it is possible to suppress the heat radiation in the peripheral portion of the object to be processed, eliminate the temperature difference in the surface, and ensure the in-plane uniformity. That is, the radiant energy that directly enters the object to be processed from the sheet heating element by the heat amount adjusting means located between the sheet heating element and the object to be processed is closer to the peripheral portion than to the central portion of the object to be treated. Much done Therefore, in the peripheral portion of the object to be processed, the incident thermal energy is made larger than that in the central portion, so that the loss due to heat dissipation is compensated and the temperature distribution in the surface is made uniform.

Further, according to the present invention, a soaking member is arranged between the sheet heating element and the object to be treated, and by this soaking member, the primary light is incident vertically from the sheet heating element to the object to be treated. It is possible to block radiant heat and accumulate this primary radiant heat. Therefore, the secondary radiant heat from the heat equalizing member is substantially uniformly incident on the entire surface of the object to be processed, while the primary radiant heat diffused or reflected from the planar heating element and incident on the object to be processed is the peripheral edge of the object to be processed. By increasing the number of incident rays to the portion, the loss of the amount of heat due to heat radiation in the peripheral portion of the object to be processed is compensated. In addition, the accumulated amount in the heat equalizing member can be set in a state where the in-plane uniformity in the object to be processed can be secured by adjusting and setting the multi-stage structure of the heat equalizing member and the size of each step.

Further, according to the present invention, among the primary radiant heat from the planar heating element to the object to be processed, the primary radiant heat to the central portion of the object to be processed having the largest radiant energy is accumulated in the heat equalizing member. It is possible to average the radiant energy with the peripheral portion of the object to be processed. Moreover, since the amount of radiant energy absorbed in the central portion can be adjusted depending on the thickness of the heat equalizing member, the radiant energy in the central portion and the peripheral portion of the object to be processed can be made uniform. Therefore, the temperature within the surface of the object to be processed can be more surely made uniform.

According to the present invention, the radiant energy from the planar heating element and / or the heat equalizing member with respect to the surface of the object to be processed can be made uniform. That is, in the present invention, the radiant energy incident on the peripheral portion of the object to be processed is smaller in the contribution of the vertical component vertically radiated from the heat equalizing member than in the central part, We pay attention to the fact that the in-plane uniformity cannot be obtained. Then, in the peripheral portion of the object to be processed, similarly to the central portion, the shape is set such that the radiant energy of the vertical component from the planar heating element or the heat equalizing member contributes to heating. In addition, since there is a heat loss due to heat dissipation in the peripheral portion of the object to be processed, the heat loss can be compensated by bringing the distance between the planar heating element or the heat equalizing member closer to the peripheral portion.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the embodiments shown in FIGS.

FIG. 1 is a sectional view showing the overall construction of a heat treatment apparatus according to an embodiment of the present invention.

In the heat treatment apparatus of this embodiment, the heat treatment unit 10, the object loading / unloading unit 50 and the shutter drive unit 6 are used.
0 is provided.

The heat treatment section 10 is, for example, a semiconductor wafer or L
The process tube 12 is a part for performing various heat treatments on the object to be processed 100 such as a CD. The process tube 12 is a cylindrical member having a lower end opening, and in the present embodiment, it is made of high-purity quartz.

An air supply pipe 14 for supplying a process gas from the outside is arranged inside the process tube 12. The air supply pipe 14 has an opening at the upper end in the internal space of the process tube 12, and on the way to the opening, that is, below the heat treatment position of the object 100 to be processed, as shown in FIG. A preheating portion 14A including a space portion is formed. This preheating section 14A
Absorbs atmospheric heat below the heat treatment position of the object to be processed 100 to heat the process gas supplied from the outside and temporarily stored, and then ejects the heated process gas into the space above the processing section. Therefore, since the process gas is set to a state close to the processing temperature before being ejected, the time required to reach the temperature for the reaction processing is shortened.

Below the position corresponding to the back side of the processing surface of the object 100 to be processed, atmospheric heat is absorbed by the preheating portion 14A, so that the processing surface of the object 100 to be processed and the space on the back side thereof. The temperature is set to a temperature at which a temperature gradient for setting the in-plane uniformity of the object 100 to be processed is obtained. As a structure inside the preheating portion 14A of the air supply pipe 14, a plurality of heat radiation fins (not shown) may be provided along the circumferential direction. Thereby, the heat from the heat treatment section 10 can be efficiently transferred to the process gas.
An exhaust pipe 26 for exhausting the process gas supplied from the air supply pipe 14 is provided in the vicinity of the lower end opening of the process tube 12, and the process gas introduced into the process tube 12 by a combination of these pipes. In this way, a proper flow can be generated to uniformize the thin film formed on the surface of the object 100 to be processed.
As a matter of course, the air supply and exhaust pipes 14 and 28 that come into contact with the process gas are covered with, for example, quartz to prevent heavy metal contamination.

On the other hand, around the process tube 12,
For example, a heat insulating material 1 made of alumina ceramics or the like
6 is provided. The heat insulating material 16 is provided, for example, inside a heat insulating material 17 made of a ceramics wool molded product arranged on the outer periphery thereof. Insulation material 1
The heat insulating material 16 may include the range in which 7 is provided.

In the case where the heat insulating material 17 is arranged, a water cooling mechanism 18 including a water cooling jacket formed of an inner shell 18A and an outer shell 18B is provided on the outer wall surface of the heat insulating portion 17 and the outside. There is thermal isolation between the two. As a result, when high-temperature heat treatment is being performed in the heat treatment unit 10, it is possible to ensure the safety of external operations.

Further, above the process tube 12, a planar heat source 20 is provided. The planar heat source 20 is, for example, a resistance heating such as molybdenum disilicide (MoSi2) or a Kanthal (trade name) wire which is an alloy wire of iron (Fe), chromium (Cr) and aluminum (Al). It is configured by disposing the body on the upper inner wall surface of the heat insulating material 16. Especially, molybdenum disilicide is 1800 ℃
Since it can sufficiently withstand the high temperature, it is suitable as a heater material for a high temperature process such as an oxidation diffusion treatment process. Such a sheet-like heat generating source 20 can also be configured, for example, by arranging resistance heating wires made of a single wire of molybdenum disilicide in a spiral shape. Further, this planar heat source 2
It is effective in terms of thermal efficiency that the heat generation surface of 0 is twice or more the outer diameter of the object 100 to be processed.

A soaking member 22 is provided between the process tube 12 and the planar heat source 20 to uniformly apply heat from the planar heat source 20 to the object 100 to be processed. . For this heat equalizing member 22, for example, a material having a relatively low degree of contamination such as silicon carbide (SiC) and good heat resistance is selected. In the case of this embodiment, the upper wall of the process tube 12 is parallel to the object to be processed. And a region where the peripheral edge of the object to be processed 100 placed at the processing position can be heated.

On the other hand, heat quantity adjusting means 120 is provided between the position of the soaking member 22 parallel to the object 100 to be processed and the object 100 to be processed which is arranged at the processing position. The heat amount adjusting means 120 is configured by a heat equalizing member that is parallel to the object 100 to be processed and has the same size as the outer diameter of the object 100 to be processed (hereinafter, referred to as a heat amount adjusting heat equalizing member 120). . The heat quantity adjusting heat equalizing member 120 is capable of storing heat by the radiant heat from the planar heat source 20, and can radiate the radiant heat from the planar heat generating element 20 to the object 100 to be processed. Generally, the soaking member 2
The radiant heat from the planar heat source 20 via 2 becomes the largest radiant energy when it directly enters the central portion of the object 100 to be processed as a vertical component from the planar heat source 20. Therefore, the temperature distribution in the plane of the object 100 to be processed is
As shown in FIG. 2A, the distribution is such that the highest temperature can be obtained in the central portion of the object to be processed. However, by disposing the heat quantity adjusting heat equalizing member 120, the radiant heat in the region corresponding to the central portion of the object to be processed 100 is accumulated by the heat quantity adjusting heat equalizing member 120 and is secondarily radiated. Figure 2 (B)
As shown in FIG. 5, there is a time delay in which the radiant energy reaches the peripheral portion of the object 100 to be processed from the planar heating element 20.
Therefore, the distribution of radiant energy is lower in the central portion of the object 100 than in the peripheral portion. As a result, the in-plane temperature distribution of the object 100 to be processed is set to a substantially uniform distribution in the central portion and the peripheral portion, as shown in FIG. 2 (C).

By the way, the heat equalizing member 120 for adjusting the heat quantity is used.
The radiant energy to the central portion of the object 100 to be processed can be changed according to the degree of radiant energy from the planar heating element 20 through the heat equalizing member 22.

FIG. 3 shows an example of this case. The heat quantity adjusting soaking member 120 includes a first heat quantity adjusting soaking member 120A and a second heat quantity adjusting soaking member along the longitudinal direction. 1
20B is installed. The heat quantity adjusting heat equalizing members 120 </ b> A and 120 </ b> B are set to have smaller diameters as they approach the object to be processed 100. Generally, the object to be processed 100
It is said that the following relationship can be obtained with the thermal energy (E) received by. That is, when the radiant heat is (T) and the distance to the heat source is (L), E = T (4th power) / L (2nd power)
Is obtained.

Therefore, when the heat equalizing member 120 for heat quantity adjustment is provided to reduce the distance to the object to be processed by using the multi-stage, the planar heat generation to the peripheral portion of the object to be processed 100 is performed. The angle of incidence of radiant heat from the body may be difficult to obtain. This is because when the radiant heat from the planar heating element 20 is made to enter the peripheral portion of the object 100 to be processed by reflection from the peripheral wall of the heat equalizing member 22, the size of the heat quantity adjustment uniforming member 120 is changed to the object to be processed. This is because it is necessary to shield the radiant heat that is directly incident from the planar heating element 20 by making it correspond to the size of 100. Therefore, in the present embodiment, in order to secure the incident amount of the radiant heat to the peripheral portion of the pair to be processed 100, the target object 10 is processed.
A first heat quantity adjusting heat equalizing member 120 corresponding to a size of 0
A is arranged at a position with a certain distance from the object 100 to be processed, and the second heat equalizing member 120B for heat quantity adjustment having an outer diameter smaller than the heat equalizing member 120A is provided to the object 10 to be processed.
It is arranged at a position close to 0 to ensure that the radiant heat from the heat source is incident on the peripheral portion of the object to be processed 100 and also to secure the thermal energy directly radiated from the heat equalizing member 120B. . In the structure shown in FIG.
The temperature of the planar heat source 20 is T1, and the temperature of the heat equalizing member 120 is T
2, the temperature of the first heat quantity adjusting heat equalizing member 120A is T3,
When the temperature of the second heat quantity adjusting heat equalizing member 120B is T4, the temperature at each part has a relationship of T1>T2>T3> T4, but the temperature distribution in the plane of the object 100 to be processed is: Figure 4
As shown by the solid line in, a substantially uniform state is obtained.
In addition, in FIG. 4, a chain double-dashed line represents a temperature distribution in the case where the heat quantity adjusting heat equalizing member is not installed.

As a structure for controlling the secondary heat radiation in the heat quantity adjusting heat equalizing member 120, there is a structure shown in FIG.

That is, in any of the structures shown in FIG. 5, the heat capacity of the heat quantity adjusting heat equalizing member 120 is made different between the central portion and the peripheral portion, and secondary heat radiation to the object 100 to be processed is performed. It is designed to have different energies. Therefore, in FIG. 5A, a conical shape having a top in the center is set on the surface facing the object 100 to be processed, and
In FIG. 5B, a step portion is formed in which the thickness of the central portion is thicker than that of the peripheral portion. In such a structure, since the heat storage amount in the heat quantity adjusting heat equalizing member 120 is different,
Regarding the time until secondary heat radiation, the object to be processed 100
The secondary heat radiation starts earlier in the peripheral portion than in the central portion, so that the temperature at the peripheral portion of the object 100 to be processed can be raised more than that in the central portion. Further, not only the shape setting but also the surface roughness and the like are made different from each other so that the incident state of so-called radiant energy is changed to the treated object 100.
You may make it change with the center part and peripheral part.

Next, another embodiment of the present invention will be described.

In FIG. 6, the temperature distribution within the surface of the object to be treated is not made uniform by the structure of the heat quantity adjusting heat equalizing member, but the radiation from the planar heat source 20 and / or the heat equalizing member 22 is used. The in-plane uniformity of the object to be processed is obtained by controlling the radiation state of the energy itself. That is, in the structure shown in FIG. 6, the planar heat source 20 and the heat equalizing member 22 are shaped such that the radiant energy of the vertical component thereof can be directly incident on the central portion and the peripheral portion of the object to be processed, specifically, Has a dome shape as shown.

Even when the sheet heating source 20 and the heat equalizing member 22 having such a shape are provided, the object 1 to be processed is
A heat loss occurs due to heat dissipation at the peripheral portion of 00. Therefore, in this embodiment, for example, as shown in FIG. 7, the first and second heat amount adjusting heat equalizing members 120A and 12 shown in FIG.
0B is provided.

Further, instead of providing such a heat quantity adjusting heat equalizing member, it is possible to make the distance of the heat equalizing member 22 to the peripheral portion of the object 100 to be processed shorter than the central portion.
By setting such a distance, the heat quantity relational expression described in FIG. 3 can be established to compensate for the heat radiation quantity at the peripheral portion of the object 100 to be processed.

Further, as shown in FIG. 8, the planar heat source 2
0 and the planar heat source 20 of the heat equalizing member 22 is formed in a dome shape, it is possible to make the heat transfer efficiency different between the central portion and the peripheral portion with respect to the heat equalizing member 22. By changing the incident state of the radiant energy from the heat equalizing member 22 to the object 100 to be processed, the object 10 to be processed is changed.
You may make it supplement the heat loss by heat radiation in the peripheral part of 0. Also in this case, the radiant energy to the object to be processed may be adjusted by arranging the first, second and third heat amount adjusting-like heat equalizing members 120A, 120B and 120C. Regarding the combination of the dome shape and the planar shape, contrary to the case of FIG.
It is also possible to make the flat surface and make the heat equalizing member 22 a dome shape.

It should be noted that, in the air barrier constituted by the heat equalizing member 22, the inside facing the peripheral wall of the heat equalizing member 22 is shown in FIG.
As shown in, a heat insulating material 24 is provided for blocking radiant heat from the heat equalizing member 22. This heat insulating material 24 is
By blocking the radiant heat from the heat equalizing member 22, the object to be processed 100
This is for setting a temperature gradient at the heat treatment position of. The heat insulating material 24 is made of, for example, alumina oxide (Al
20 3), silicon dioxide (SiO 2), or the like, which is a heat-shielding wall, and when the object to be processed 100 is set at a predetermined processing position, at least the object to be processed 10
It is arranged with a height (H) capable of covering the space below the processing position of 0.

The heat insulating material 24 can have a different height depending on the type of film formation. That is, when forming an oxide film, the height covering the space below the processing position of the object to be processed 100 is set, and when forming a metal film, the height above the processing position of the object to be processed 100 is set. May also cover the space area above. Then, in this case, as a structure for compensating for the heat loss in the peripheral portion of the object to be processed 100, as shown in FIG. 9, the portion of the heat insulating material 24 facing the peripheral portion of the object to be processed 100 is omitted. Then, the state in which the radiant energy from the heat equalizing member 22 can enter is set.

On the other hand, in FIG. 1, the process tube 1
Inside 2 is a holder 30 for an object to be processed for transferring the object 100 to the heat treatment section 10 with respect to the processing section 10.

The holder 30 for the object to be processed is the object 10 to be processed.
It is equipped with a mounting portion 30A of 0 and a shielding member 30B.
The mounting portion 30A is formed at one end in the axial direction of the target object holder 30 and has a shape capable of horizontally mounting the target object 100. The shield member 30B is provided to shield radiant heat from the inside of the processing unit, seal the process gas in the heat treatment unit, and rectify the airflow when the target object 100 moves. It is composed of a lid body provided on the way to the other end of the holder 30 in the axial direction.

The shielding member 30B is used as the object to be processed 10.
Since heat is stored by heating from the soaking member 22 located on the back surface of 0, it is possible to have a function of preheating the object 100 to be processed placed. In addition, the shielding member 3
0B has a configuration for performing the function of rectifying the airflow when the object 100 to be processed is moved. That is, FIG.
In the above, the outer diameter (A) of the shielding member 30B is equal to the gas existing between the placing portion 30A and the inner wall surface of the preheating portion 14A of the air supply pipe 14 when the placing portion 30A is moved in and out from the processing position. The size is set so as to obtain a gap that does not cause a rapid flow velocity, and in this embodiment, it is set to be smaller than the inner diameter (B) of the inner wall surface of the preheating portion 14A by about 5 to 30 mm. .

This is to prevent an in-plane temperature difference from occurring in the object 100 to be processed when the object holder 30 moves from the heat treatment section 10 after the heat treatment.
That is, when the members that are close to each other move relative to each other, as in the relationship between the preheating unit 14A and the shielding member 30B, the gas existing between them, particularly the gas existing in the vicinity of the periphery of the shielding member 30B, is trapped. Flow velocity is generated. The velocity of this airflow is influenced by the size of the gap between the two, and if this gap is too small, the flow velocity increases rapidly, and convection occurs within the processing position, which is one space with the shielding member 30B as the boundary. It will be. Therefore, heat dissipation from the peripheral portion of the object 100 to be processed is promoted. Therefore, by determining the outer diameter dimension of the shielding member 30B, the temperature gradient within the processing position is not changed during the heat treatment, and when the processing target 100 moves from the processing position because it is unloaded. Suppresses the increase of the air flow rate and prevents the in-plane temperature difference of the object 100 to be processed. Therefore, when the object to be processed 100 moves for unloading, even if a certain speed is generated in the airflow around the shielding member 30B, this speed is not allowed to act in the processing position. Convection at the processing position is prevented and the object to be processed 1
It is possible to prevent the in-plane temperature difference of 00 from occurring. In this embodiment, in addition to specifying the outer diameter dimension of the shielding member 30B, a plurality of gas escape holes 30B1 are formed in the shielding member 30B along the circumferential direction. The gas escape holes 30B1 may be formed to reduce gas entrapment in the vicinity of the peripheral edge of the object 100 to be processed.

The shape of the shielding member 30B is not limited to the above-mentioned lid shape, and it is needless to say that a shape that suppresses the turbulence of the air flow and the generation of velocity when the holder 30 for the object to be processed moves is set. For example, the shape may be a combination of upper and lower conical shapes, or a plurality of sheets may be continuously provided.

FIG. 10 shows an example in which a plurality of shielding members are provided. In this case, a plurality of shielding members, that is, four stages of shielding members 30B1 in FIG.
0, 30B12, 30B14, 30B16 are provided,
The relationship is set to be gradually expanded toward the lower stage. Then, partition plates 30B20, 30B fixed to the inner wall of the process tube 12 in the vicinity of the peripheral surface of each of these shielding members and having a diameter reduced in order from the upper stage side along the vertical direction.
22, 30B24 are arranged. This partition plate 30
B20, 30B22, and 30B24 are provided to block heat in the heat treatment unit 10 to prevent a temperature gradient between the heat treatment unit and a lower portion thereof, thereby preventing the generation of airflow. In addition, a plurality of gas escape holes are formed in the same manner as the upper shield member 30B. In this case, the gas escape holes are formed at different positions between the shielding members in each step. Furthermore, 2 for each partition plate
Shielding members 30B10, 30B12, 30B1 after the second stage
4, 30B16 is a pedestal 3 of the holder 30 for the object to be processed
Partition plates 30B20, 30B when 0A is in the processing position
22 and 30B24 are positioned below and fixed to the rod portion of the object holder 30. The structure of the shielding member shown in FIG. 10 has a structure in which the preheating portion 14A of the intake pipe 14 shown in FIG.
However, it is also possible to target the case where the preheating portion 14A of the intake pipe 14 is provided, as in the case of FIG. 1, and FIG. 11 shows the structure in this case. ing. In the case shown in FIG. 11, the preheating portion 14A of the intake pipe 14 is arranged on the lower side and is configured such that the diameter thereof is gradually reduced.

The shield members 30B10, 30B12, 3 described above are provided at the other end of the object holder 30 in the axial direction.
In addition to 0B14 and 30B16, another heat shield member 30C
Is provided. This heat shield member 30C is constituted by a flange, and the cooling rod 3 located below this end portion.
It is connected to 2. The heat shield member 30C covers the vicinity of the lower end opening of the process tube 12 when the mounting portion 30A of the holder 30 for the object to be processed is set at the processing position of the object 100 to be processed in the heat treatment section 10, and will be described later. This is for blocking the passage of the radiant heat to the object loading / unloading part 50. Of these shielding members, the shielding member 30B10 located at the uppermost stage can be used for heating the back surface of the object 100 to be processed, and further, the central portion and the peripheral edge of the heat equalizing member located on the back surface side. It is also possible to have different temperatures for different parts. Especially, in the latter case, it goes without saying that the temperature is set higher at the peripheral portion.

On the other hand, the cooling rod 32 is for cooling the object holder 30. Therefore, the cooling rod 32 is made of metal, and a water cooling jacket 32A is formed inside, as shown in FIG.

Further, as shown in FIG. 12, a through hole 34 reaching the mounting portion 30A is formed in the central portions of the object holder 30 and the cooling rod 32. A lead wire 36A of a thermometer 36 for approximately measuring the processing temperature in the heat treatment section 10 is inserted through the through hole 34. The thermometer 36 is arranged on the back surface of the mounting portion 30A of the object 100 to be processed and detects the surface temperature of the object 100 to be processed. Further, the through hole 34 can be used as an optical path to an optical temperature sensor that detects the temperature from the surface color of the object to be processed 100 instead of the thermometer. In addition, a part of the through hole 34 may be, for example, N
A supply pipe 38 for a purge gas such as 2 gas is connected to purge the inside of the through hole 34.

By the way, the holder 30 for the object to be processed and the cooling rod 32 are provided with a drive mechanism 40 for moving up and down and rotating, which mechanism will be described later.

On the other hand, the object carrying-in / out section 50 is composed of an airtight chamber located below the lower end opening of the process tube 12, and is mainly connected to the object holder 30 while maintaining an airtight state with respect to the atmosphere. It is a place where the object 100 to be processed is carried in and out.

Therefore, the object loading / unloading section 50 is shown in FIG.
As shown in FIG. 4, the first and second load lock chambers 52, 5
4 and the object 1 to be processed from these load lock chambers 52 and 54
Delivery chamber 5 for delivering 00 to the process tube 12
6 are arranged at right angles. The first and second load lock chambers 52 and 54 have the same configuration, and the first load lock chamber 52 will be described. The first and second gate valves 52A and 52B
Transport arm 52C that can be raised and lowered and rotated, gas introduction hole 5
2D and a gas discharge hole 52E are provided. In addition, the second load lock chamber 54 includes the first and second gate valves 54
A, 54B, transfer arm 5 that can be expanded / contracted / lifted and rotated
A 4C gas introduction hole 54D and a gas discharge hole 54E are provided, respectively. Gate valves 52A, 52B, 54A, 54
B is opened between the outside of the apparatus and the load lock chambers 52 and 54, or between the load lock chambers 52 and 54 and the delivery chamber 56 when loading and unloading the object 100, and when the airtight state is maintained. It has an opening / closing function of closing. The transfer arms 52C and 54C are configured by, for example, an arm having multiple joints, and are connected to the load lock chambers 52 and 5 from the outside of the device.
4 or from the load lock chambers 52 and 54 to the delivery chamber 56. The gas introduction holes 52D and 54D are provided in the load lock chamber 52.
And 54 are purged with, for example, N2 gas, and the gas discharge holes 52E and 54E are for vacuuming the load lock chambers 52 and 54.

A shutter drive unit 60 is provided in the vicinity of the unit 50 for carrying in the object to be processed.

That is, the shutter driving section 60 is provided with a plurality of first and second heat-shielding shutters 62 and 64 provided below the lower end opening of the process tube 12 along the vertical axis. This heat shield first, second
The shutters 62 and 64 are disposed on both sides in the vertical axis direction across the workpiece loading / unloading unit 50, and can be opened and closed by moving in opposite directions by a driving member 66 such as a cylinder, and shutter plates 62A and 62B. It has 64A and 64B.

Each of the shutter plates has a heat insulating structure in which a water cooling jacket is formed. Among these shutter plates, the shutter plates 62A and 62B of the first shutter 62 located on the lower end opening side of the process tube 12 have the facing surfaces L as shown in FIG.
It is formed in a letter shape to form a curved surface. This is because when the opposing surfaces are in close contact with each other, the lower surfaces of the shutter plates are made flat and the passage of radiant heat rays from the process tube 12 is blocked to prevent the temperature below the hermetic chamber from rising. This is to prevent it. Further, as shown in FIG. 16 (A), the shutter plates 64A and 64B of the second shutter 64 are formed with recesses at their tips into which the holder 30 for the object to be processed can be inserted. Then, as shown in FIG. 16 (B), the tips can overlap each other, and when the object-to-be-processed holder 30 is held in the overlapped state, heat rays from above are absorbed. It is designed to block the passage of.

The first and second shutters 62,
The airtight chamber in which 64 is located is provided with a structure for switching the atmospheric gas of the object 100 to be processed.

That is, the first and second shutters 62,
As shown in FIG. 17, for example, an injection nozzle 70 for blowing out an inert gas different from the process gas, for example, a helium gas (He), is provided in the advancing / retreating portion 64 at positions equally divided in the circumferential direction. Are arranged. This jet gas immediately switches the atmosphere gas from the atmosphere of the process gas to the object to be processed 100 carried out from the heat treatment unit 10 to interrupt the contact of the process gas, and thus the unwanted film formed during the movement of the object to be processed 100. To prevent the formation of Further, such an atmospheric gas is immediately switched and is placed in contact with an inert gas which is not affected by the temperature from the heat treatment section, so that the object to be processed 10 can be processed.
The thermal budget of 0, that is, the so-called heat balance received by the object to be processed 100 is stabilized to suppress the change of the temperature distribution in the plane and ensure the in-plane uniformity. Then, in accordance with the number of the jet nozzles 70, the jet nozzles 70 are arranged in the circumferential direction.
An exhaust port 68 is provided at an equal position where it does not interfere with. This injection nozzle 70 has an injection port that horizontally injects the cooling gas along the vertical axis direction, and as shown in FIG. 17, injects the cooling gas in parallel with the surface of the object 100 to be processed in the retracted position. Can be jetted. The ejected gas may be used for cooling the first and second shutters, and further, the object 100 to be processed carried out from the heat treatment section 10 may be cooled using this gas.

By the way, the holder 3 for the object to be processed described above.
The drive mechanism 40 for 0 and the cooling rod 32 has the following configuration.

That is, the drive mechanism 40 includes an elevating arm 42 connected to the axial end portion of the cooling rod that is integrated with the object holder 30. The elevating arm 42 is, for example, a ball screw. It can be moved up and down by an elevating mechanism 44 in which a nut and a nut are combined. A rotating mechanism via a gear, for example, is provided in the elevating arm 42, and this rotating mechanism is at least one rotation when the object holder 30 is carried in and out of the heat treatment section 10. The rotation of the object 10 and the holder 30 for the object to be processed retreat from the heat treatment unit 10
When 0 is opposed to the injection nozzle 70 located below the first shutter 62, for example, rotation of about 60 rpm is performed. In order to ensure airtightness during the lifting operation of the object holder 30,
A seal structure 46 (see FIG. 1) using a magnetic fluid or a bellows structure (not shown) is provided between the airtight chamber and the object holder 30. Regarding the raising / lowering drive of the object holder 30, the raising / lowering mechanism 4 described above is used.
In addition to 4, it may be moved up and down independently.

The object to be processed 30 is adapted to rotate at the required number of rotations during the heat treatment, but at the time of loading into and unloading from the heat treatment section 10, at least one rotation is required. Drive control is performed to move while carrying out. Such rotation during loading and unloading makes uniform the supply of the radiant heat from the planar heat source 24 and the contact with the process gas, so that the object to be processed 100 before and after the heat treatment.
Is performed to ensure in-plane uniformity of the.

Next, the operation will be described.

When the object 100 to be processed is subjected to heat treatment, the object 100 is carried into the object loading / unloading section 50. That is, this case will be described below for the second load lock chamber 54.

First, when the object to be processed 100 is loaded, the inside of the second load lock chamber 54 is filled with N by the gas introduction hole 54D.
2 Set to the same pressure as atmospheric pressure in advance by purging. If the outside air and the inside of the load lock chamber 54 are made to have the same pressure, it is possible to prevent dust and the like from entering and scattering due to a sudden flow of gas when the gate valve is opened. Next, the gate valve 54A is opened, and the object 100 to be processed is carried into the delivery chamber 56 by the transfer arm 54C. afterwards,
The gate valve 54B is closed, evacuation is performed by the gas exhaust hole 54E, and N is exhausted by the gas introduction hole 54D.
2 Purging is performed. In this case, it is desirable that the delivery chamber 56 be similarly evacuated and N2 purged in advance. Further, the process tube 12, the first,
The space between the second shutters 62 and 64 is also evacuated,
In addition, it is desirable to keep the same pressure as the load lock chamber 54 by purging with N2.

On the other hand, when the object 100 to be processed is transferred to the delivery chamber 56 by the transfer arm 54C in the load lock chamber 54, the placing portion 30A of the object holder 30 is previously transferred to the transfer path of the transfer arm 54C. As it is located above,
The object to be processed 100 is delivered. At this time,
The second shutter 64 is closed and the first shutter 62 is open. Then, when the delivery of the object 100 to be processed is completed, the holder 30 for the object to be processed starts to rotate by the drive mechanism 40. The object holder 30 is
Until the heat treatment unit 10 reaches a predetermined processing position, it makes one or more rotations, such as 2 to 3 rotations, and stops rotation when it reaches the predetermined processing position. At this time, both the first and second shutters 62 and 64 are open.

In the process of raising the object holder 30, the object 100 is placed in the atmosphere of process gas as soon as it is moved from the atmosphere of helium gas in the gas switching structure to the heat treatment section 10. Become.
Then, the object holder 30 that has reached the processing position is
The preheating portion 14A of the air supply pipe 14 is positioned at a position close to the vicinity of the inner seed surface and is switched to the rotation speed at the time of heat treatment. Then, in the heat treatment unit 10, the preheated process gas is supplied from the air supply pipe 14.

When the heat treatment is started by supplying the process gas, the first shutter 62 remains open, and the second shutter 64 is kept closed.
Therefore, the shielding member 30B of the holder 30 for the object to be processed is arranged so as to cover the lower portion of the heat treatment unit 10, so that the heat ray of the radiant heat leaking from the heat treatment unit 10 is blocked. Moreover, in the heat treatment unit 10, the process gas is sealed to set the heat treatment environment, and the heat equalizing member 22
The radiant energy from the planar heat source 20 via the heat source is accumulated in the central portion of the object to be processed 100 due to the presence of the heat quantity adjusting soaking member 120. Therefore, the radiant heat reflected from the heat equalizing member 22 is incident on the peripheral portion of the object 100 to be processed, while the heat accumulated by the heat amount adjusting heat equalizing member 120 is secondary in the central portion of the object 100 to be processed. The radiation amount of the radiant energy differs between the central portion and the peripheral portion of the object to be processed 100, and specifically, the peripheral portion has a larger amount of radiation energy, which compensates for heat loss due to heat dissipation. As a result, the temperature distribution within the surface of the object to be processed 100 is made uniform. Further, even when the planar heat source 20 and / or the heat equalizing member 22 are shaped such that the radiant heat can directly enter the central portion and the peripheral edge portion of the object to be treated 100, the object to be treated is treated in the same manner as described above. The temperature distribution in the plane of the body is made uniform.

On the other hand, at the end of the heat treatment, the holder 30 for the object to be processed has its mounting portion 30A mounted on the first shutter 6a.
Positioned below 2. At this time, the shield member 30B of the holder 30 for the object to be processed is set to have an outside diameter dimension with respect to the gas escape hole and the preheating portion 14A of the air supply pipe 14 so that gas entrapment at the peripheral edge portion is reduced and thus the object to be processed is reduced. The heat radiation from the peripheral portion of the body 100 can be suppressed, and the non-uniform temperature distribution in the plane can be prevented.

Further, in the holder 30 for the object to be processed positioned below the first shutter 62, the object 100 to be processed on the mounting portion 30A rotates while being switched to a rotational speed of, for example, about 60 rpm. By the helium gas supplied from the advancing / retreating portion of the shutter, the object 10
Heat is shut off in a manner matching with the 0 carry-in / out section 50, the environment of the atmospheric gas is switched, and the object 100 to be processed is cooled. Further, at this time, the object 100 to be processed is promoted to be cooled by the cool air from the first shutter 62 located above.

In this way, the object to be processed 100 that has been cooled after the heat treatment is set in the same state as when it was carried in. Then, in this state, the object 100 to be processed can be moved from the position facing the injection nozzle 70 to the delivery chamber 56, and the object 100 to be processed can be carried out by the procedure reverse to that at the time of carrying in.

According to this embodiment, the heat capacity can be changed by changing the shape of the heat quantity adjusting soaking member. Therefore, it becomes possible to make the temperature distribution within the surface of the object to be processed uniform without adding a special structure.

Further, according to the present embodiment, the heat insulating material surrounding the lower portion of the processing position is provided between the heat equalizing member and the process tube, and the form of this heat insulating material is made different according to the type of film formation, thereby improving the efficiency. Good film formation.

The present invention is not limited to the above embodiment, but various modifications can be made within the scope of the gist of the present invention.

For example, the object to be processed according to the present invention is
At least a planar object to be processed may be used, and an LCD or the like may be used instead of the semiconductor wafer. Further, as the heat treatment apparatus to which the present invention is applied, other than the CVD apparatus, for example, an apparatus applied to oxidation, diffusion or annealing can be targeted.

[0073]

As described above, according to the present invention, the temperature distribution within the surface of the object to be processed can be made uniform. In other words, the amount of radiant energy incident from the planar heat source can be made different between the central portion and the peripheral portion of the object to be processed, so that the radiant energy sufficient to compensate for the heat loss due to heat dissipation in the peripheral portion is in the central portion. Can be more than. Therefore,
It is possible to suppress the temperature decrease in the peripheral portion due to heat radiation and to make the temperature distribution uniform within the surface of the object to be processed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining an overall configuration of a heat treatment apparatus showing an embodiment of the present invention.

2 is a diagram for explaining a temperature distribution obtained by the heat treatment apparatus shown in FIG. 1, (A) showing a temperature distribution in a conventional example, (B) showing a radiant energy distribution according to the present embodiment, (C) shows the in-plane temperature distribution of the object to be processed according to this example.

FIG. 3 is a partial cross-sectional view showing another example of the heating structure in the heat treatment apparatus shown in FIG.

FIG. 4 is a diagram for explaining a temperature distribution in a plane of a target object obtained by the heat treatment apparatus shown in FIG.

5 is a cross-sectional view showing a partial modification of the heat quantity adjusting heat equalizing member used in the heat treatment apparatus shown in FIG. 1. FIG.

6 is a sectional view corresponding to FIG. 3 showing another example of the heating structure used in the heat treatment apparatus shown in FIG.

7 is a partial cross-sectional view showing a partially modified example of the heating structure shown in FIG.

FIG. 8 is a partial cross-sectional view showing still another modification of a part of the heating structure shown in FIG.

9 is a partial cross-sectional view showing a modified example of the heat insulating structure in the heat treatment apparatus shown in FIG.

10 is a cross-sectional view showing the structure of a holder for an object to be processed used in the heat treatment apparatus shown in FIG.

11 is a partial cross-sectional view showing another structure of the object holder shown in FIG.

FIG. 12 is a cross-sectional view for explaining the internal structure of the object holder shown in FIG.

13 is a perspective view showing the structure of a process gas supply unit of the heat treatment apparatus shown in FIG.

FIG. 14 is a schematic plan view for explaining the configuration of a target object loading / unloading unit used in the heat treatment apparatus shown in FIG. 1.

15 is a sectional view of a shutter used in the heat treatment apparatus shown in FIG.

16A and 16B are schematic diagrams showing an example of the shutter shown in FIG. 13, in which FIG. 16A shows an open state and FIG. 16B shows a closed state.

17 is a cross-sectional view showing a gas switching and cooling structure in the heat treatment apparatus shown in FIG.

[Simple explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Processing position 12 Process tube 14 Air supply pipe which forms a gas supply means 14A Preheating part 30 Holder 30A for processing object 30A mounting part 30B Shielding member 30B10-30B16 Shielding member 30C Heat shielding member 50 The processing object comprised by the airtight chamber Carry-in / out unit 60 Shutter drive unit 62 First shutter 64 Second shutter 66 Injection nozzle 120 Heat quantity adjusting soaking member 120A that constitutes heat quantity adjusting means 120A First heat quantity adjusting soaking member 120B Second heat quantity adjusting uniform Heat member 120C Third heat quantity adjusting soaking member

Claims (6)

[Claims] 1. A lower end opening for loading and unloading an object to be processed,
A vertical process tube equipped with a heat source that heats the object to be processed placed at the processing position, and the object to be processed horizontally supported is carried into the process tube through the opening and placed at a predetermined processing position. An object holder to be set, a gas supply means for supplying a reaction gas toward a processing position in the process tube, a planar heating element having a surface parallel to the processing object, and the planar heating element. And a heat amount adjusting means arranged to set the radiant energy incident on the peripheral portion of the object to be processed to be larger than that of the central portion on the object to be processed. apparatus. 2. The heat quantity adjusting means according to claim 1, wherein the heat quantity adjusting means is composed of a heat storage member made of a material free from impurity contamination and capable of storing heat, and the heat storage member stores primary radiation heat from the planar heating element. And radiates secondary radiant heat toward the object to be processed. 3. The heat quantity adjusting means according to claim 1 or 2, wherein the heat quantity adjusting means is composed of a plurality of heat equalizing members whose diameters are successively set from the planar heating element toward the object to be treated. Characterizing heat treatment equipment. 4. The heat quantity adjusting means according to claim 1, wherein the heat quantity adjusting means has a surface parallel to the planar heating element, and a thickness of a central portion of the surface is thicker than a thickness of a peripheral edge portion. A heat treatment apparatus characterized by being set. 5. A lower end opening for loading and unloading an object to be processed,
A vertical process tube equipped with a heat source for heating the object to be processed placed in the processing position, and the object to be processed horizontally supported is carried into the process tube through the opening and placed at a predetermined processing position. An object holder to be set, a gas supply means for supplying a reaction gas toward a processing position in the process tube, a sheet heating element arranged to face the object to be treated, and the sheet heat generating element. It is arranged between the body and the object to be treated, and is made of a material with less impurity contamination. A heat member, and the sheet heating element and / or the heat equalizing member,
A heat treatment apparatus, wherein an outer edge portion is curved or inclined so as to approach the object to be processed. 6. The heat treatment apparatus according to claim 5, wherein the planar heating element and / or the heat equalizing member are set in a dome shape.