JPH07221429A - Resin mold electronic circuit unit, and its manufacture - Google Patents

Abstract

PURPOSE:To easily change the function and characteristics only by changing the components without deteriorating water-proofness. CONSTITUTION:A circuit board 1 mounted with electronic components 2, 3, 4, etc., is stored in a case 5. Among the components, a surrounding body 7 for an electronic component 4 composed of a ROM element that needs memory change, is provided on a circuit board 1. A plurality of connector terminals 9 are provided on the circuit board 1 in the surrounding body 7. The case 5 including the surrounding body 7 is filled with resin 6a so as to mold the electronic components 2 and 3 and the circuit board 1. The space outside the surrounding body 7 in the case 5 is filled with resin 6b to the prescribed height. Each terminal 4a of the electronic component 4 composed of ROM element is connected by connector at the top of each connector terminal 9 exposed from the surface of the resin 6a in the surrounding body 7. At the top of the surrounding body 7, a cover 10 is fixed by seal material 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof resin mold type electronic circuit unit and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 6 shows the structure of a conventional resin mold type electronic circuit unit of this type.

The resin mold type electronic circuit unit is provided with a circuit board 1, and on the circuit board 1 are composed of electronic parts such as resistors 2, electronic parts consisting of a microcomputer 3, and ROM (read only memory). A plurality of electronic components such as the electronic component 4 are connected. The circuit board 1 on which the electronic components 2, 3, 4 and the like are mounted is housed in a case 5 made of metal or resin, and is entirely molded with the resin 6 filled in the case 5.

Such a waterproof resin mold type electronic circuit unit is used, for example, for controlling an object to be controlled of an internal combustion engine.

In internal combustion engines, there are many control objects that need to be controlled according to various control conditions. For example, in an internal combustion engine using an ignition device, it is necessary to control the ignition timing of the engine according to the rotation speed. Further, in an internal combustion engine that supplies fuel using an injector, it is necessary to control the fuel injection timing and injection time according to the opening of the throttle valve, intake air temperature, atmospheric pressure, and the like. Further, when a valve for controlling the exhaust timing of the engine is provided, it is necessary to control the opening degree of the valve according to the rotation speed.

When such a control target of the internal combustion engine is controlled by the resin mold type electronic circuit unit described above, for example, control data giving the control characteristics of a predetermined control target of the internal combustion engine and the control data are used. A control program for controlling the controlled object so as to obtain a predetermined control characteristic is stored in the electronic component 4 including the ROM, and the control program is executed by the electronic component 3 including the microcomputer to control the controlled object. It should be noted that the control data and the control program may be stored in the electronic component 4 composed of separate ROMs.

[0007]

However, in the resin-molded electronic circuit unit having the structure shown in FIG. 6, although waterproofness and vibration resistance can be ensured, the function and characteristics of the circuit board 1 are determined, so that the circuit is concerned. When the function or characteristic of the substrate 1 is to be changed later, this resin mold type electronic circuit unit must be replaced as a whole, which causes a problem of extremely high cost.

In order to avoid this, a tube is fitted around the outer periphery of a variable electronic component such as a variable resistor and molded,
A resin mold type electronic circuit unit has been proposed in which a passage for a variable operation part is secured in the tube so that adjustment of the variable type electronic component can be performed after molding. There is a problem that it is possible to only adjust the characteristics of the above, but it is not possible to change the function, and there is also a problem that the waterproofness of the variable electronic component in the tube cannot be ensured.

It is an object of the present invention to provide a resin mold type electronic circuit unit which can easily change the function and characteristics without deteriorating the waterproof property by exchanging a part of parts.

Another object of the present invention is to easily change the function and characteristics without deteriorating the waterproof property by exchanging a part of parts, and to adjust the characteristics of a part without deteriorating the waterproof property. Another object of the present invention is to provide a resin mold type electronic circuit unit that can also be used.

Another object of the present invention is to use a resin mold type which can easily change the function and characteristics without deteriorating the waterproof property by exchanging a part of parts, and can also perform a light emitting display regardless of the resin mold type. An object is to provide an electronic circuit unit.

Another object of the present invention is to make it possible to easily change the function and characteristics without deteriorating the waterproof property by exchanging a part of the parts, and to detect the external environment regardless of the resin mold type. It is to provide a mold type electronic circuit unit.

Another object of the present invention is to make it possible to easily manufacture a resin mold type electronic circuit unit in which the functions and characteristics can be easily changed without changing the waterproof property by exchanging some of the parts. An object is to provide a method of manufacturing an electronic circuit unit.

[0014]

The means of the present invention for achieving the above object will be described below.

In the resin mold type electronic circuit unit of the present invention, a circuit board to which a plurality of electronic parts are attached is housed in a case, and an electronic part composed of a ROM element of which the stored contents need to be changed. Where the enclosure is located, an enclosure surrounding the electronic component made of the ROM element is arranged on the circuit board, and a plurality of connector terminals for connecting the electronic component made of the ROM element are provided on the circuit board in the enclosure. Is provided, and the case is filled with a resin that molds the electronic components and the circuit board excluding the enclosure body, and the enclosure body is filled with the resin by exposing at least the upper ends of the connector terminals. Each terminal of the electronic component composed of the ROM element is connected to the upper end of each connector terminal exposed from the surface of the resin inside the enclosure. It is continued, cover the upper end of the enclosure is characterized in that it is fixed in an airtight manner.

In the resin-molded electronic circuit unit of the present invention, a circuit board to which a plurality of electronic parts are attached is housed in a case, and an electronic device including a ROM element of which the stored contents need to be changed. An enclosure surrounding the ROM element is arranged on the circuit board at a location where the component exists, and the R is provided on the circuit board in the enclosure.
A plurality of connector terminals for connecting an electronic component including an OM element are provided, variable electronic components that require adjustment among the electronic components are also disposed on the circuit board in the enclosure, and the case is provided in the case. A resin for molding the electronic component and the circuit board is filled except for the inside of the enclosure,
The resin is filled in the enclosure so that at least the upper ends of the connector terminals and the variable operation part of the variable electronic component are exposed, and the upper ends of the connector terminals exposed from the surface of the resin in the enclosure. Each terminal of the electronic component including the ROM element is connected to the connector by a connector, and a lid is airtightly fixed to the upper end of the enclosure.

As the variable electronic component, for example, a variable resistor, a variable capacitor or the like can be used.

Further, in the resin-molded electronic circuit unit of the present invention, the circuit board to which a plurality of electronic components are attached is housed in the case, and the electronic component comprises a ROM element of which the stored contents need to be changed. An enclosure surrounding the ROM element is disposed on the circuit board at a location where the electronic component is present, and a plurality of connector terminals for connecting the electronic component including the ROM element are provided on the circuit board in the enclosure. An electronic component including a light emitting element is also disposed on the circuit board in the enclosure, and a resin that molds the electronic component and the circuit board is filled in the case except the interior of the enclosure. The inside of the body is filled with the resin by exposing at least the upper end of each of the connector terminals and the display surface of the electronic component including the light emitting element,
Each terminal of the electronic component made of the ROM element is connected to the upper end of each connector terminal exposed from the surface of the resin in the enclosure, and a transparent or translucent lid is hermetically fixed to the upper end of the enclosure. It is characterized by being.

As the electronic component composed of the light emitting element, for example, a light emitting diode or the like can be used.

Further, in the resin-molded electronic circuit unit of the present invention, a circuit board having a plurality of electronic components mounted therein is housed in a case, and the electronic component comprises a ROM element of which the stored contents need to be changed. At a place where an electronic component exists, an enclosure surrounding the electronic component made of the ROM element is arranged on the circuit board, and a plurality of electronic components made of the ROM element are connected on the circuit board in the enclosure. A connector terminal is provided, and an electronic component made up of a sensor for detecting an external environment is also arranged on the circuit board in the enclosure, and an electronic component made up of a sensor for detecting the external environment is provided from the ROM element in the enclosure. The electronic component and the circuit board are housed in a chamber independent of the chamber housing the electronic component. Is filled with resin, and at least the upper end of each of the connector terminals and the detection part of the electronic component made up of a sensor for detecting the external environment are exposed in the enclosure, and the resin is filled in the enclosure, and the resin is filled in the enclosure. At the upper end of each connector terminal exposed from the surface of the resin, the R
Each terminal of an electronic component made of an OM element is connected to a connector, a lid is hermetically fixed to the upper end of the enclosure, and a portion of the lid corresponding to a chamber accommodating an electronic component made of a sensor for detecting the external environment. Is provided with a communication hole communicating with the external environment.

As the electronic component including a sensor for detecting the external environment, for example, an atmospheric pressure sensor, a humidity sensor or the like can be used.

Further, in the method of manufacturing a resin mold type electronic circuit unit according to the present invention, a ROM in which a plurality of electronic parts are attached and whose stored contents need to be changed.
On a circuit board provided with an enclosure for enclosing the electronic component made of the ROM element at a location where the electronic component made of the element is present, and for providing a plurality of connector terminals for connecting the electronic component made of the ROM element in the enclosure. In a case, a first resin filling step of filling a resin into at least one of the inside of the case and / or the enclosure to a height for sealing at least a lower portion of the enclosure, and the inside of the case A second resin filling step of filling a resin to a predetermined height from the upper end of the electronic component excluding the enclosure, and the ROM element on the upper end of each connector terminal exposed from the surface of the resin in the enclosure. And a step of connecting a connector to each terminal of the electronic component and a step of hermetically fixing the lid to the upper end of the enclosure.

[0023]

As described above, the enclosure for enclosing the electronic component composed of the ROM element at the location where the electronic component composed of the ROM element whose storage content needs to be changed exists among the plurality of electronic components on the circuit board. Is provided on the circuit board, a plurality of connector terminals for connecting the electronic components made of the ROM element are provided on the circuit board in the enclosure, and the enclosure for the circuit board is removed except for the enclosure. The resin for molding the electronic parts and the circuit board is filled, at least the upper end of the connector terminal is exposed in the enclosure, and the resin is filled. From the ROM element to the upper end of each connector terminal exposed from the surface of the resin in the enclosure, If each terminal of the electronic component is connected with a connector and the lid is airtightly fixed to the upper end of the enclosure, the lid can be opened and each connector can be opened when it becomes necessary to change the function or characteristics. It is possible to replace and connect the electronic component consisting of the ROM element connected to the connector to the upper end of the child with the electronic component consisting of the ROM element for storing another memory, and then fix the lid airtightly to the upper end of the enclosure again. it can.

In this way, it becomes possible to easily change the function and characteristics without deteriorating the waterproof property by exchanging some parts.

In this case, an electronic component holding portion for holding the electronic component composed of the ROM element can be provided under the lid. The electronic component holding portion may be integrated with the lid or may be a separate body. It is preferable that the electronic component holding portion is formed of an elastic body such as rubber or styrofoam.

Further, variable electronic components that require adjustment among electronic components are also arranged on the circuit board in the enclosure, and at least the upper end of the connector terminal and the variable operation part of the variable electronic components are disposed in the enclosure. To the top of each connector terminal exposed from the surface of the resin inside the enclosure.
Connect each terminal of the electronic component consisting of OM element with a connector,
If the lid is airtightly fixed to the top of the enclosure, 1
When it becomes necessary to adjust the characteristics of one part, the lid can be opened and the variable operation part of the variable electronic component can be operated to adjust the characteristics of one part.

By doing so, it is possible to provide a resin-molded electronic circuit unit in which the characteristics and the like of one portion can be adjusted without deteriorating the waterproof property.

Further, an electronic component composed of a light emitting element is also arranged on the circuit board in the enclosure, and at least the upper end of the connector terminal and the display surface of the electronic component composed of the light emitting element are exposed in the enclosure to expose the resin. Each terminal of the electronic component composed of the ROM element was connected to the upper end of each connector terminal which was filled and exposed from the resin surface in the enclosure, and the transparent or semitransparent lid was airtightly fixed to the upper end of the enclosure. With the structure, the light emitting display of the light emitting element can be viewed through the transparent or translucent lid.

Therefore, it is possible to provide a resin mold type electronic circuit unit which can perform light emitting display regardless of the resin mold type.

Further, an electronic component made up of a sensor for detecting the external environment is also arranged on the circuit board in the enclosure, and the electronic component made up of a sensor for detecting the external environment is RO in the enclosure.
It is housed in a room independent of a room accommodating electronic parts made of M elements, and at least the upper end of each connector terminal and the detection part of the electronic part made of a sensor for detecting the external environment are exposed in the enclosure to fill the resin. A sensor that detects the external environment by connecting each terminal of the electronic component consisting of a ROM element to the upper end of each connector terminal exposed from the resin surface inside the enclosure and connecting the lid to the upper end of the enclosure airtightly. If the lid part corresponding to the chamber containing the electronic component is provided with a communication hole that communicates with the external environment, it will consist of a sensor that detects the external environment through the communication hole in the lid part. It can be done with electronic components.

Therefore, it is possible to provide a resin mold type electronic circuit unit which can detect the external environment regardless of the resin mold type. In this case, even if the lid has a communication hole that exposes the electronic component including the sensor for detecting the external environment to the external environment, the electronic component including the ROM element is different from the electronic component including the sensor for detecting the external environment in the enclosure. Since it is housed in a separate room, the waterproofness of the electronic component composed of the ROM element is not impaired.

Further, as in the present invention, a plurality of electronic parts are attached, and in the place where there is an electronic part consisting of a ROM element whose storage content needs to be changed, the electronic part consisting of the ROM element is surrounded. Provide an enclosure to
At least one of the step of housing a circuit board provided with a plurality of connector terminals for connecting the electronic components made of the ROM element in the enclosure, and the case or the enclosure, or both. A first resin filling step of filling the resin to a height for sealing the lower part of the enclosure, and a second resin filling the case to a predetermined height from the upper end of the electronic component excluding the inside of the enclosure. A filling step, a step of connecting each terminal of the electronic component made of the ROM element to the upper end of each connector terminal exposed from the surface of the resin in the enclosure, and a lid hermetically fixed to the upper end of the enclosure. When the resin mold type electronic circuit unit is manufactured by the step of forming the resin, the resin can seal the lower part of the enclosure and the circuit board by the first resin filling step. Even filling of the resin due to fat filling process is performed subsequent to a predetermined height, it is possible to form a space not filled with the resin in the enclosure body easily.

In each of the above embodiments, the lid may be formed of plastic or metal, or may be formed of a material having a sealing function such as rubber. In the case of a lid made of plastic or metal, a sealing material is required to perform the sealing. In the case of a lid formed of a material having a sealing function, it is preferable to place and fix a holding frame having the shape of the upper surface of the enclosure on the lid.

[0034]

Embodiments of the present invention will now be described in detail with reference to the drawings. The parts corresponding to those in FIG. 6 described above are denoted by the same reference numerals.

1A and 1B and 2A to 2C.
Shows a first embodiment of the present invention. The resin-molded electronic circuit unit of this embodiment includes a circuit board 1, and an electronic component such as a resistor 2, an electronic component 3 including a microcomputer 3, and a ROM on the circuit substrate 1.
A plurality of electronic components such as an electronic component 4 (read only memory) are connected. Programs and characteristic data for operating the electronic component 3 including a microcomputer are written in the electronic component 4 including a ROM element.

Among these electronic components, at a location where the electronic component 4 composed of a ROM element whose storage content needs to be changed is present, the plastic or metal enclosure 7 surrounding the electronic component 4 composed of the ROM element is used. It is arranged on the circuit board 1. The enclosure 7 is fixed by passing a plurality of positioning pins 8 protruding from the lower portion thereof through the respective positioning holes of the circuit board 1 and soldering or the like.

On the circuit board 1 in the enclosure 7, a plurality of connector terminals 9 for connecting the electronic component 4 composed of a ROM element.
Is provided. As shown in FIG. 1B, each connector terminal 9 of this embodiment is made of a hollow metal tube, and is inserted into each through hole of the circuit board 1 and fixed by soldering. A plurality of slits 9a are formed in the upper part of each connector terminal 9 in the circumferential direction so that each terminal 4a of the electronic component 4 composed of a ROM element can be easily inserted and the contact with each terminal 4a is ensured. It is supposed to be. The height of the connector terminal 9 is determined so that the upper end thereof is located above the upper ends of the electronic components 2 and 3 outside the enclosure 7.

The case 5 is filled with the resin 6a including the inside of the enclosure 7 to a height that covers the upper ends of the electronic components 2 and 3 outside the enclosure 7. As a result, the electronic components 2 and 3 outside the enclosure 7 and the circuit board 1 are molded with the resin 6a, and the circuit board 1 is molded with the resin 6a in the enclosure 7, but the upper end of each connector terminal 9a is It is exposed on the resin 6a.

Inside the case 5 outside the enclosure 7, FIG.
As shown in (A), the same resin 6b as the resin 6a is filled up to near the upper end of the case 5.

At the upper end of each connector terminal 9 exposed from the surface of the resin 6a in the enclosure 7, an electronic component 4 composed of a ROM element in which a program of functions and characteristics is written is provided with each terminal 4a of these connector terminals 9. The connector is connected by being inserted into the hole 9b.

At the upper end of the enclosure 7, a lid 10 made of plastic or metal is provided with a screw 12 via a rubber seal material 11.
It is fixed at. Below the lid 10, an electronic component holding portion 13 for holding the electronic component 4 composed of a ROM element is integrally attached. The electronic component pressing portion 13 is formed of an elastic body such as rubber or styrofoam.

With such a structure, when it becomes necessary to change the function or the characteristic, the lid 10 is opened and the electronic component 4 composed of the ROM element connected to the upper end of each connector terminal 9 by a connector. Is exchange-connected with the electronic component 4 composed of a ROM element for storing another memory, and then the lid 10 is again connected.
Can be fixed to the upper end of the enclosure 7 via the sealing material 11.

According to such a resin mold type electronic circuit unit, it is possible to easily change the function and the characteristic by replacing a part of the parts without deteriorating the waterproof property.

If an electronic component holding portion 13 for holding the electronic component 4 composed of a ROM element is provided under the lid 10,
It is possible to reliably prevent the terminals 4a of the electronic component 4 including the ROM element from coming off from the connector terminals 9 due to vibration or the like.

It goes without saying that the electronic component pressing portion 13 may have a structure separate from the lid 10.

Next, the method of manufacturing the resin mold type electronic circuit unit of the first embodiment will be described with reference to FIGS.
This will be described with reference to (A) to (C).

On the circuit board 1, the plurality of electronic components 2 described above are provided.
Attach 3, 4, etc. At a portion of the electronic components 2, 3, 4 where the electronic component 4 including a ROM element that requires a change in stored content is present, the enclosure 7 surrounding the electronic component 4 including the ROM element is provided on the circuit board 1. Position and fix to. On the circuit board 1 in the enclosure 7, a plurality of connector terminals 9 for connecting the electronic component 4 composed of the ROM element
Is erected in advance and soldered to the circuit of the circuit board 1. The height of each connector terminal 9 is determined so that the upper end of the connector terminal 9 extends beyond the upper ends of the electronic components 2 and 3 outside the enclosure 7.

The circuit board 1 having the above-described structure is housed in the case 5 while being floated from the bottom surface thereof by a spacer or the like not shown.

In this state, the first resin filling step is performed to fill the case 5 with the resin 6a outside the enclosure 7 to a height at which the electronic components 2 and 3 outside the enclosure 7 are submerged. When the resin 6a is filled in this manner, the resin 6a enters the enclosure 7 through the gap between the lower surface of the enclosure 7 and the circuit board 1 and reaches the height at which the upper ends of the connector terminals 9 are exposed as shown in the figure. Is filled. The first resin filling step may be carried out by filling the enclosure 7 with the resin 6a, or by filling the inside and outside of the enclosure 7 with the resin 6a at the same time.

After the filled resin 6a is hardened, the second resin filling step is performed, and the case 5 is placed outside the enclosure 7.
Resin 6b from the top of electronic parts 2 and 3 up to a specified height
To fill. In this case, when the case 5 is filled with the resin 6b outside the enclosure 7, the resin 6b does not enter the enclosure 7 because the lower part of the enclosure 7 is sealed with the resin 6a. Therefore, the upper end of each connector terminal 9 is not buried in the resin 6b.

Next, the terminals 4a of the electronic component 4 composed of the ROM element are inserted into the upper ends of the respective connector terminals 9 exposed from the surface of the resin 6a in the enclosure 7 to form the electronic component 4 composed of the ROM element. A connector is connected to the connector terminal 9.

Then, the sealing material 11 is attached to the upper end of the enclosure 7.
The lid 10 is placed via the and fixed with the screw 12.

In the first resin filling step, the resin 6a
Does not need to be filled up to a height where the electronic components 2 and 3 outside the enclosure 7 are submerged, and at least the lower portion of the enclosure 7 is sealed and the surface of the circuit board 1 is filled with the resin 6a to a height where it is molded. Good.

When the resin mold type electronic circuit unit is manufactured in this manner, the resin 6a can seal the lower portion of the enclosure 7 and the circuit board 1 by the first resin filling step, and the second resin filling step can be performed. Even if the resin 6b is filled by the resin filling step outside the enclosure 7 to a predetermined height, it is possible to easily form a space in the enclosure 7 that is not filled with the resin.

FIGS. 3A and 3B show the second embodiment of the present invention. This embodiment differs from the first embodiment in the structure inside the enclosure 7.

That is, in the resin mold type electronic circuit unit of this embodiment, the variable type electronic component 14 such as a variable resistor which requires adjustment is also arranged on the circuit board 1 in the enclosure 7, and the circuit is formed. It is electrically and mechanically connected to the circuit of the substrate 1. The enclosure 7 is filled with resin 6a so that the upper end of the connector terminal 9 and the variable operation portion 14a of the variable electronic component 14 are exposed. At the upper end of each connector terminal 9 exposed from the surface of the resin 6a in the enclosure 7, each terminal 4a of the electronic component 4 composed of a ROM element is connector-connected as described above. At the upper end of the enclosure 7, FIG.
The lid 10 having the shape shown in FIG.
It is fixed in the same manner as described above via the sealing material 11 having the shape shown in FIG. Under the lid 10,
Although not shown, an electronic component holding portion 13 for holding the electronic component 4 composed of a ROM element is provided in an integrated structure or a separate structure.

With such a structure, when it is necessary to adjust the characteristics of one part, etc., the lid 13 is opened, and the variable operation part 14a of the variable electronic component 14 is operated to operate one part. Adjust characteristics etc.

By doing so, it is possible to provide a resin-molded electronic circuit unit that can adjust the characteristics of a part that does not depend on the electronic component 3 including a microcomputer without deteriorating the waterproof property.

As the variable electronic component 14, for example, a variable capacitor or the like can be used in addition to the variable resistor.

FIG. 4 shows a third embodiment of the present invention. Also in this embodiment, the structure inside the enclosure 7 is different from that of the first embodiment.

That is, in the resin mold type electronic circuit unit of the present embodiment, the electronic component 15 composed of the light emitting element is also arranged on the circuit board 1 in the enclosure 7, and the circuit board 1
Is electrically and mechanically connected to the circuit. The enclosure 7 is filled with the resin 6a so that the upper end of the connector terminal 9 and the display surface of the electronic component 15 including the light emitting element are exposed. At the upper end of each connector terminal 9 exposed from the surface of the resin 16a in the enclosure 7, each terminal 4a of the electronic component 4 composed of a ROM element is connector-connected as described above. At the upper end of the enclosure 7, the transparent or translucent lid 10 having the shape shown in FIG. 2B is described above via the sealing material 11 having the shape shown in FIG. 2C. It is fixed as well. Under the lid 10, although not shown, the RO
Electronic component holding portion 13 for holding the electronic component 4 composed of M elements
Are provided as an integral structure or separate structure.

With such a structure, the light emitting display of the electronic component 15 including the light emitting element can be seen through the transparent or semitransparent lid 10. For example, disconnection of the coupler of the circuit board 1 and an operation pattern may be performed on the electronic component 1 including the light emitting element.
These states can be confirmed through the transparent or translucent lid 10 by blinking and displaying 5.

Therefore, it is possible to provide a resin mold type electronic circuit unit which can perform light emitting display regardless of the resin mold type.

In this case, the electronic component 15 including the light emitting element
For example, a light emitting diode or the like can be used.

FIGS. 5A to 5C show a fourth embodiment of the present invention. Also in this embodiment, the structure inside the enclosure 7 is different from that of the first embodiment.

That is, in the resin mold type electronic circuit unit of this embodiment, the electronic component 16 including the sensor for detecting the external environment is also arranged on the circuit board 1 in the enclosure 7, and the circuit of the circuit board 1 is arranged. Is electrically and mechanically connected to. The electronic component 16 including the sensor that detects the external environment is housed in the enclosure 7 in a chamber 7b that is independent from the chamber 7a that houses the electronic component 4 including the ROM element. That is, the electronic component 4 including the ROM element in the enclosure 7.
The chamber 7a that accommodates the electronic component 16 and the chamber 7b that accommodates the electronic component 16 including the sensor that detects the external environment are separated by the partition 7c and are independent of each other. The upper surface of the partition body 7c is provided at the same height as the upper surface of the enclosure body 7. The enclosure 7 is filled with the resin 6a so that the upper ends of the connector terminals 9 and the detection portion of the electronic component 16 including a sensor for detecting the external environment are exposed. At the upper end of each connector terminal 9 exposed from the surface of the resin 6a in the enclosure 7, each terminal 4a of the electronic component 4 composed of a ROM element is connected by a connector as described above. A lid 10 is fixed to the upper end of the enclosure 7 via a sealing material 11. In this case, the sealing material 11 is also present on the upper surface of the partition 7c. Electronic component 16 including a sensor for detecting the external environment
In the portion of the lid 10 corresponding to the chamber 7b accommodating the above, a communication hole 17 for communicating with the external environment is provided. Below the lid 10, an electronic component holding portion 13 for holding the electronic component 4 composed of a ROM element is provided as an integral structure or a separate structure.

With this structure, the external environment can be detected by the electronic component 16 including a sensor for detecting the external environment through the communication hole 17 in the lid 10.

Therefore, it is possible to provide a resin mold type electronic circuit unit which can detect the external environment regardless of the resin mold type.

In this case, the lid 10 has the communication hole 17 for exposing the electronic component 16 including the sensor for detecting the external environment to the external environment.
, The electronic component 4 consisting of a ROM element is the electronic component 16 consisting of a sensor that detects the external environment inside the enclosure 7.
Since it is housed in a room 7a which is different from the room 7b for housing, the waterproofness of the electronic component 4 composed of the ROM element is not impaired.

As the electronic component 16 including a sensor for detecting the external environment, for example, an atmospheric pressure sensor, a humidity sensor, a temperature sensor or the like can be used.

The resin mold type electronic circuit unit of the second embodiment to the fourth embodiment can be manufactured by the same method as the method of manufacturing the resin mold type electronic circuit unit of the first embodiment.

Further, each connector terminal 9 is not limited to the one in which each connector terminal 9 is independent as in the above embodiment, but each connector terminal 9 is incorporated in a common insulator, That is, an IC connector type can also be used.

Further, although the electronic component holding portion 13 is formed of an elastic material such as rubber or styrofoam in the above-mentioned embodiment, it is made of the same material as the lid 10, and the lower surface of the lid 10 is integrally formed with a protruding portion. It can also be formed.

Alternatively, the electronic component retainer 13 has the lid 10
It is also possible to form it by a projecting portion integrally formed on the lower surface of and the elastic layer attached to the tip of the projecting portion. With such a structure, the thickness of the elastic layer can be made as thin as possible.

In the above embodiment, the lid 10 is made of plastic or metal and the sealing material 11 is made of rubber.
Instead, the lid 10 is made of a material having a sealing function such as rubber, and a holding frame having a shape like the sealing material 11 shown in FIG. 2C in FIG. In FIG. 5, a holding frame having a shape like the sealing material 11 shown in FIG. 5 (C) can be placed and fixed to the upper surface of the enclosure 7 with screws 12 in an airtight manner.

[0076]

As described above, according to the present invention,
The following excellent effects can be achieved.

In the resin-molded electronic circuit unit according to the present invention, the ROM element is formed at the location where the electronic element made of the ROM element that needs to be changed in the stored contents exists among the plurality of electronic elements on the circuit board. An enclosure for enclosing electronic components is arranged on the circuit board, and a plurality of connector terminals for connecting electronic components made of the ROM element are provided on the circuit board in the enclosure, and a case for accommodating the circuit board is provided. Is filled with a resin that molds the electronic components and the circuit board except for the inside of the enclosure, and at least the upper ends of the connector terminals are exposed inside the enclosure and filled with the resin. Each connector exposed from the surface of the resin inside the enclosure. Each terminal of the electronic component consisting of a ROM element is connected to the upper end of the terminal with a connector, and the lid is airtightly fixed to the upper end of the enclosure, so the functions and characteristics are changed. If the principal has occurred, open the lid,
ROM connected to the connector at the top of each connector terminal
The electronic component made of the element can be exchanged and connected to the electronic component made of the ROM element for storing another memory, and then the lid can be hermetically fixed to the upper end of the enclosure again.

Therefore, according to the resin mold type electronic circuit unit of the present invention, it is possible to easily change the function and the characteristic without deteriorating the waterproof property by replacing a part of the parts.

Further, in the resin mold type electronic circuit unit according to the present invention, the variable type electronic component requiring adjustment among the electronic components is also arranged on the circuit board in the enclosure, and at least the connector terminal is provided in the enclosure. The upper end of the connector and the variable operation part of the variable electronic component are exposed and filled with resin, and the RO is attached to the upper end of each connector terminal exposed from the surface of the resin inside the enclosure.
Each terminal of the electronic component consisting of M elements is connected to a connector, and the lid is hermetically fixed to the upper end of the enclosure. Therefore, when it is necessary to adjust the characteristics of one part,
Open the lid and operate the variable operation part of the variable electronic component 1
It is possible to adjust the characteristics of the parts.

Therefore, according to the resin mold type electronic circuit unit of the present invention, it is possible to adjust the characteristics and the like of one part without deteriorating the waterproof property.

Further, in the resin mold type electronic circuit unit according to the present invention, the electronic component made of the light emitting element is also arranged on the circuit board in the enclosure, and at least the upper end of the connector terminal and the light emitting element are provided in the enclosure. The display surface of the electronic component is exposed and filled with resin, and each terminal of the electronic component consisting of the ROM element is connected to the upper end of each connector terminal exposed from the resin surface in the enclosure, and the upper end of the enclosure is connected. Since the transparent or translucent lid is airtightly fixed, the light emitting display of the light emitting element can be seen through the transparent or translucent lid.

Therefore, according to the resin mold type electronic circuit unit of the present invention, light emitting display can be performed regardless of the resin mold type.

Further, in the resin mold type electronic circuit unit according to the present invention, an electronic component including a sensor for detecting the external environment is also arranged on the circuit board in the enclosure, and the electronic component including the sensor for detecting the external environment. ROM in the enclosure
It is housed in a room independent of the room that houses the electronic parts made of elements, and at least the upper ends of the connector terminals and the detection parts of the electronic parts made up of sensors that detect the external environment are exposed and filled with resin in the enclosure. , Connect the connector of each terminal of the electronic component consisting of the ROM element to the upper end of each connector terminal exposed from the resin surface inside the enclosure, and fix the lid to the upper end of the enclosure airtightly, from the sensor that detects the external environment. Since the lid part corresponding to the chamber containing the electronic component has a communication hole that communicates with the external environment, the external environment is detected from the sensor that detects the external environment through the communication hole of the lid part. Can be done with electronic components.

Therefore, according to the resin mold type electronic circuit unit of the present invention, the external environment can be detected regardless of the resin mold type. Further, in the present invention, even if the lid has a communication hole that exposes the electronic component including the sensor for detecting the external environment to the external environment, the electronic component including the ROM element includes the electronic component including the sensor for detecting the external environment in the enclosure. ROM is stored in a room different from the room
It is possible to prevent the waterproofness of the electronic component including the element from being impaired.

Further, in the method for manufacturing a resin mold type electronic circuit unit according to the present invention, a plurality of electronic parts are attached, and the RO content of which needs to be changed.
A circuit board provided with an enclosure surrounding the electronic component made of the ROM element at a location where the electronic component made of the M element is present, and provided with a plurality of connector terminals for connecting the electronic component made of the ROM element in the enclosure. A step of accommodating the upper part in a case; a first resin filling step of filling a resin in at least one of the inside of the case and the enclosure with a height for sealing at least a lower portion of the enclosure; and the case A second resin filling step of filling the inside of the electronic component up to a predetermined height from the upper end of the electronic component excluding the enclosure body;
A step of connecting each terminal of the electronic component made of the ROM element to the upper end of each connector terminal exposed from the surface of the resin in the enclosure by a connector, and a step of hermetically fixing the lid to the upper end of the enclosure. Since the resin mold type electronic circuit unit is manufactured, the resin can seal between the lower portion of the enclosure and the circuit board in the first resin filling step, and the resin filling in the second resin filling step can be performed in a predetermined manner. Even if it is performed up to the height of, the space not filled with the resin in the enclosure can be easily formed.

[Brief description of drawings]

FIG. 1A is a vertical sectional view of a first embodiment of a resin mold type electronic circuit unit according to the present invention, and FIG. 1B is an upper perspective view of a connector terminal used in the first embodiment.

2A is a plan view of a second embodiment of a resin mold type electronic circuit unit according to the present invention, FIG. 2B is a plan view of a lid used in this second embodiment, and FIG. It is a top view of the sealing material used in the 2nd example.

FIG. 3A is a plan view of a third embodiment of a resin mold type electronic circuit unit according to the present invention, and FIG. 3B is a vertical cross-sectional view of a portion of a variable electronic component in the third embodiment.

FIG. 4 is a plan view of a resin-molded electronic circuit unit according to a fourth embodiment of the present invention.

5A is a plan view of a fifth embodiment of a resin mold type electronic circuit unit according to the present invention, FIG. 5B is a plan view of a lid used in this fifth embodiment, and FIG. It is a top view of the sealing material used in the 5th example.

FIG. 6 is a vertical cross-sectional view of a conventional resin mold type electronic circuit unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Electronic parts such as resistors 3 Electronic parts consisting of microcomputer 4 Electronic parts consisting of ROM 4a Terminals 5 Cases 6, 6a, 6b Resin 7 Enclosures 7a, 7b Chamber 7c Partitions 8 Positioning pins 9 Connector terminals 9a Slit 9b Hole 10 Lid 11 Sealing material 12 Screw 13 Electronic component retainer 14 Variable electronic component 14a Variable operating part 15 Electronic component consisting of light emitting element 16 Electronic component consisting of sensor for detecting external environment 17 Communication hole

Claims (5)

[Claims] 1. A ROM in which a circuit board to which a plurality of electronic components are attached is housed in a case, and the stored contents of the electronic components need to be changed.
At a location where an electronic component made of an element is present, an enclosure surrounding the electronic component made of the ROM element is arranged on the circuit board, and the electronic component made of the ROM element is connected to the circuit board in the enclosure. A plurality of connector terminals are provided, the inside of the case is filled with a resin that molds the electronic component and the circuit board except the inside of the enclosure, and at least the upper ends of the connector terminals are exposed inside the enclosure. Is filled with the resin, each terminal of the electronic component made of the ROM element is connected to the upper end of each connector terminal exposed from the surface of the resin in the enclosure, and a lid is hermetically sealed at the upper end of the enclosure. A resin-molded electronic circuit unit, which is fixed to. 2. A ROM in which a circuit board to which a plurality of electronic components are attached is housed in a case, and the stored contents of the electronic components need to be changed.
An enclosure surrounding the ROM element is disposed on the circuit board at a location where an electronic component made of an element exists, and a plurality of connectors for connecting the electronic component made of the ROM element are provided on the circuit board in the enclosure. A terminal is provided, a variable-type electronic component that requires adjustment among the electronic components is also disposed on the circuit board in the enclosure, and the electronic component and the circuit are provided in the case except for the enclosure. A resin that molds the substrate is filled, and at least the upper ends of the connector terminals and the variable operation part of the variable electronic component are exposed in the enclosure, and the resin is filled in the enclosure, and the surface of the resin in the enclosure. Each terminal of the electronic component formed of the ROM element is connected to the upper end of each connector terminal exposed from the connector, and a lid is airtightly fixed to the upper end of the enclosure. Plastic molded electronic circuit unit according to claim Rukoto. 3. A ROM in which a circuit board to which a plurality of electronic components are attached is housed in a case, and the stored contents of the electronic components need to be changed.
An enclosure surrounding the ROM element is disposed on the circuit board at a location where an electronic component made of an element exists, and a plurality of connectors for connecting the electronic component made of the ROM element are provided on the circuit board in the enclosure. A terminal is provided, an electronic component made of a light emitting element is also disposed on the circuit board in the enclosure, and a resin for molding the electronic component and the circuit board is filled in the case except for the enclosure. The enclosure is filled with the resin by exposing at least the upper ends of the connector terminals and the display surface of the electronic component including the light emitting element, and the connector terminals exposed from the surface of the resin in the enclosure. Each terminal of the electronic component composed of the ROM element is connected to the upper end of the connector by a connector, and a transparent or translucent lid is airtightly fixed to the upper end of the enclosure. Plastic molded electronic circuit unit, characterized in that. 4. A ROM in which a circuit board to which a plurality of electronic components are attached is housed in a case, and the stored contents of the electronic components need to be changed.
At a location where an electronic component made of an element is present, an enclosure surrounding the electronic component made of the ROM element is arranged on the circuit board, and the electronic component made of the ROM element is connected to the circuit board in the enclosure. A plurality of connector terminals are provided, and an electronic component made up of a sensor for detecting an external environment is also arranged on the circuit board in the enclosure, and an electronic component made up of a sensor for detecting the external environment is provided in the enclosure. It is housed in a room independent of a room accommodating an electronic component including a ROM element, the case is filled with a resin that molds the electronic component and the circuit board except the enclosure, and the enclosure is at least The resin is filled by exposing the upper end of each connector terminal and a detection part of an electronic component including a sensor that detects the external environment, Each terminal of the electronic component made of the ROM element is connected to the upper end of each connector terminal exposed from the surface of the resin in the housing, and a lid is airtightly fixed to the upper end of the enclosure to protect the external environment. A resin mold type electronic circuit unit, wherein a communication hole communicating with the external environment is provided in a portion of the lid corresponding to a chamber accommodating an electronic component including a sensor for detecting. 5. A plurality of electronic parts are attached, and at a place where an electronic part consisting of a ROM element whose storage content needs to be changed exists, an enclosure for surrounding the electronic part consisting of the ROM element is provided. The RO in the enclosure
A step of accommodating a circuit board provided with a plurality of connector terminals for connecting an electronic component made of an M element in a case, and at least one of the inside of the case and the enclosure, or both, and at least a lower portion of the enclosure. A first resin filling step of filling the resin to a sealing height; a second resin filling step of filling the case to a predetermined height from the upper end of the electronic component excluding the inside of the enclosure; and the enclosure The steps of connecting the terminals of the electronic component made of the ROM element to the upper ends of the connector terminals exposed from the surface of the resin in the body by a connector and the step of hermetically fixing the lid to the upper ends of the enclosures are performed. A method of manufacturing a resin-molded electronic circuit unit, comprising: