JPH07221228A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To provide a semiconductor integrated circuit device wherein a heat radiation fin to be laid is miniaturized and the mounting density on a board can be increased in a semiconductor integrated circuit device mounting a semiconductor chip of large heat generation. CONSTITUTION:The circuit device comprises outer electrodes 1 transmitting a signal to the outside, bonding wires 3 connecting the outer electrodes 1 with a semiconductor chip 2 through inner wirings, a radiation fin 5 dissipating the heat from the semiconductor chip 2 toward the outside via a heat dissipating plate 4, and adhesive agent 7 fixing the radiation fin 5 to a semiconductor integrated circuit device main body 6. Pin fins 8 as protruding type heat dissipating parts are formed in the radiation fin 5. The sectional form of the pin fin 8 in the horizontal direction is square. The pin fins 8 are so arranged that the corner parts 8a of the squares 8a face the wind flow direction 9. Hence the heat dissipating surfaces in the vertical direction of the pin fins 8 are arranged obliquely to the wind flow direction 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device in a semiconductor manufacturing technique, and more particularly to the shape of a radiation fin installed in a semiconductor integrated circuit device mounted with a semiconductor chip that generates a large amount of heat.

[0002]

2. Description of the Related Art In a semiconductor integrated circuit device having a semiconductor chip, which is a semiconductor element that generates a large amount of heat, a heat radiation fin is installed to improve its heat radiation effect. The heat radiation fin is made of ceramic or molded resin. In many cases, it is fixed by screws or the like via a heat diffusion plate attached to the main body of the semiconductor integrated circuit device.

Further, the heat radiation fin is provided with a pin fin which is a projecting heat radiation portion, and the heat radiation effect is further enhanced by increasing the heat radiation area of the pin fin.

Here, in the heat dissipation fin provided with the pin fin, the heat dissipation surface of the pin fin is provided horizontally or vertically to the semiconductor integrated circuit device.

The cooling fan for cooling the mounted components such as the semiconductor integrated circuit device on the mounting substrate is horizontal or vertical to the mounting substrate (to the semiconductor integrated circuit device which is the mounted component). It is attached so that the wind hits.

Therefore, as a result, the heat dissipation surface of the pin fin is provided so as to hit the wind sent from the cooling fan at a right angle.

[0007]

However, in the above-mentioned technique, since the heat dissipating surface of the pin fin is provided at an angle at which the heat dissipating surface of the pin fin collides with the air blown from the cooling fan at a right angle, the air blown by the air vent In many cases, the surface of each pin fin does not effectively act on the heat radiation on the leeward side of the pin fin, and it is considered that heat radiation is not performed effectively. .

Further, since the amount of heat generated tends to increase with the increase in the integration and size of the semiconductor chip, when the radiation fin having the heat radiation property for cooling it is installed, the pin fin is In the provided heat radiation fins, the heat is not effectively radiated, so that there is a problem that the outer diameter of the heat radiation fins becomes large and the mounting density on the mounting substrate becomes low.

Therefore, it is an object of the present invention to reduce the size of the radiation fins installed in a semiconductor integrated circuit device mounting a semiconductor chip (semiconductor element) that generates a large amount of heat to increase the mounting density on the mounting board. An object is to provide a semiconductor integrated circuit device that can be used.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, in a semiconductor integrated circuit device in which a heat radiation fin having a pin fin which is a projecting heat radiation portion is installed, the heat radiation surface in the vertical direction of the pin fin is provided obliquely to the wind direction. is there.

The pin fin has a polygonal horizontal cross section, and is provided with the corners of the polygon oriented in the wind direction.

Further, the pin fin is a prism.

Further, in the semiconductor integrated circuit device in which a heat radiation fin having a flat plate fin which is a heat radiation portion is installed, the vertical heat radiation surface of the flat fin is provided obliquely to the wind direction. It is a thing.

[0016]

According to the above-mentioned means, the pin fin which is the projecting heat dissipation portion of the heat dissipation fin is provided with the vertical heat dissipation surface being inclined with respect to the wind direction, or in the horizontal direction of the pin fin. The cross section is polygonal,
By providing the pin fins with the corners of the polygon oriented in the wind direction, the wind that collides with the corners flows to the leeward side, so the wind can be applied to the leeward pin fins. .

As a result, the area of the fins on the heat radiation fins, which is exposed to the wind, increases, so that the heat radiation performance can be improved.

Further, since the heat dissipation is improved, the heat dissipation fin of the semiconductor integrated circuit device according to the present invention can be downsized in order to obtain the same heat dissipation amount as compared with the conventional heat dissipation fin. As a result, the mounting density on the mounting board can be increased.

Further, when the heat radiation fin is provided with a flat plate fin which is a flat plate heat radiation portion, the vertical heat radiation surface of the flat fin is inclined with respect to the wind direction (with respect to the outer shape of the semiconductor integrated circuit device). Since it is provided, the number of the flat plate fins can be increased as compared with the case where the flat plate fins are provided parallel to the wind direction, and further,
Plate fins with long distances can be provided.

As a result, it is possible to increase the heat radiation area of the flat plate fin.

Therefore, heat dissipation can be improved,
As in the case of the pin fins, the heat radiation fins can be downsized and the mounting density of the mounted components on the mounting board can be increased.

[0022]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a diagram showing an example of the structure of a semiconductor integrated circuit device according to an embodiment of the present invention.
(A) is the top view, (b) is the sectional view.

The structure of the semiconductor integrated circuit device according to the first embodiment will be described with reference to FIGS. 1A and 1B. The external electrode 1 for transmitting a signal to the outside, the external electrode 1 and the semiconductor element are used. A bonding wire 3 for connecting a certain semiconductor chip 2 via internal wiring (not shown), a radiation fin 5 for radiating heat generated from the semiconductor chip 2 to the outside through a heat diffusion plate 4, and the radiation fin 5 And a heat-adhesive 7 for fixing the semiconductor integrated circuit device main body 6 to the semiconductor integrated circuit device main body 6.
Is provided.

Here, the horizontal cross-sectional shape of the pin fin 8 according to the first embodiment is a polygon, and the case where the polygon is a quadrangle will be described.

That is, in the first embodiment, the pin fin 8 is used.
Is a square prism.

The pin fins 8 are provided such that the rectangular corners 8a having a cross-sectional shape are oriented in the wind direction 9 of the wind sent by a cooling fan or the like (not shown).

Therefore, the vertical heat radiation surface 8b of the pin fin 8 is installed obliquely to the wind direction 9.

The heat radiation fin 5 is formed by extruding aluminum or the like having a high thermal conductivity, and is fixed to the semiconductor integrated circuit device body 6 by an adhesive 7 having a high thermal conductivity.

Next, the operation of the semiconductor integrated circuit device according to the first embodiment will be described with reference to FIGS. 1 (a) and 1 (b).
A pin fin 8 which is a protruding heat dissipation portion of the heat dissipation fin 5.
Is the square corner 8 of the horizontal section of the pin fin 8.
It is provided in a state where a is directed in the wind direction 9. That is, since the vertical heat radiating surface 8b of the pin fin 8 is provided obliquely to the wind direction 9, the wind colliding near the corner 8a does not bounce and follows the heat radiating surface 8b. It passes through and flows to the leeward side of the pin fin 8.

As a result, it becomes possible to sufficiently apply the wind to the pin fins 8 on the leeward side.

Therefore, since the area of the pin fins 8 on the radiating fins 5 exposed to the wind (heat radiating area) is increased, it is possible to improve the heat radiating property.

Further, since it is possible to improve the heat radiation property, when it is desired to obtain the same heat radiation amount as that obtained in the conventional semiconductor integrated circuit device, the heat radiation of the semiconductor integrated circuit device according to the first embodiment is performed. The fin 5 can be miniaturized, and as a result, the mounting density of the mounted components (semiconductor integrated circuit device or the like) on the mounting substrate (not shown) can be increased.

(Embodiment 2) FIG. 2 is a diagram showing an example of the structure of a semiconductor integrated circuit device according to another embodiment of the present invention.
(A) is the top view, (b) is the sectional view.

The structure of the semiconductor integrated circuit device according to the second embodiment will be described with reference to FIGS. 2A and 2B. The external electrode 1 for transmitting a signal to the outside, the external electrode 1 and the semiconductor element are used. A bonding wire 3 for connecting a certain semiconductor chip 2 via internal wiring (not shown), a radiation fin 5 for radiating heat generated from the semiconductor chip 2 to the outside through a heat diffusion plate 4, and the radiation fin 5 Of the heat-dissipating fins 5, which is a flat plate-shaped heat dissipation portion.
0 is provided.

The flat plate fin 10 according to the second embodiment will now be described.
The heat radiation surface 10b in the vertical direction of the flat plate fin 10 is provided obliquely to the wind direction 9 of the wind sent by a cooling fan or the like (not shown).

Between the adjacent flat plate fins 10 is a groove 10c for passing air.

The radiating fins 5 are formed by extruding aluminum or the like having a high thermal conductivity, and are fixed to the semiconductor integrated circuit device body 6 with an adhesive 7 having a high thermal conductivity.

Next, the operation of the semiconductor integrated circuit device according to the second embodiment will be described with reference to FIGS. 2 (a) and 2 (b).
A vertical heat radiating surface 10b of a flat plate fin 10 which is a flat plate heat radiating portion provided on the heat radiating fin 5 is provided obliquely to the wind direction 9 (with respect to the outer shape of the semiconductor integrated circuit device body 6). Therefore, as compared with the case where the flat plate fins 10 are provided in parallel to the wind direction 9, the number of the flat plate fins 10 can be increased, and the flat plate fins 10 having a long distance can also be provided.

Further, the wind sent from the wind direction 9 by a cooling fan or the like (not shown) comes out to the outside again through the groove 10c while contacting the heat radiation surface 10b in the vertical direction of the flat plate fin 10.

As a result, it is possible to increase the heat radiation area formed by the heat radiation surface 10b and the groove 10c in the flat plate fin 10 as compared with the conventional semiconductor integrated circuit device.

Therefore, since the heat dissipation can be improved, the heat dissipation fin 5 can be downsized and mounted on the mounting substrate as in the case of the pin fin 8 (see FIG. 1A or 1B) described in the first embodiment. The mounting density of mounted components (semiconductor integrated circuit device, etc.) can be increased.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the pin fin described in the first embodiment is a quadrangular prism, but its horizontal cross-sectional shape may be a polygon such as a rhombus or a triangle, or a fan. .

Further, the pin fins may be truncated pyramids such as truncated triangular pyramids and truncated quadrangular pyramids other than prisms.

Although the radiating fins described in the first and second embodiments are made of aluminum, any material other than aluminum may be used as long as it has a good thermal conductivity.

[0047]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). In a semiconductor integrated circuit device in which a heat radiation fin is installed, a vertical heat radiation surface of a pin fin provided in the heat radiation fin is provided obliquely to a wind direction, or a corner portion in a horizontal cross section of the pin fin. Is provided in the wind direction, it is possible to sufficiently apply the wind to the pin fins on the leeward side.

As a result, the area of the pin fins on the radiating fins exposed to the wind (heat radiating area) increases, so that the heat radiating property can be improved.

(2). In the semiconductor integrated circuit device in which the heat radiation fins are installed, the flat fins provided on the heat radiation fins are provided with the heat radiation surface in the vertical direction oblique to the wind direction (with respect to the outer shape of the semiconductor integrated circuit device). The number of the plate fins can be increased as compared with the case where the plate fins are provided in parallel to the wind direction, and further, the plate fins having a long distance can be provided.

As a result, it is possible to increase the heat radiation area of the flat plate fins, so that it is possible to enhance the heat radiation performance.

(3). Since it is possible to improve the heat dissipation property from the above (1) and (2), when it is desired to obtain the same amount of heat dissipation as the conventional heat dissipation fin, the heat dissipation fin of the semiconductor integrated circuit device according to the present invention. Can be miniaturized.

(4). From the above (3), since the heat radiation fin can be downsized, the mounting density of the mounted components (semiconductor integrated circuit device, etc.) on the mounting substrate can be increased.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a structure of a semiconductor integrated circuit device which is an embodiment of the present invention, in which (a) is a plan view thereof and (b) is a sectional view thereof.

2A and 2B are diagrams showing an example of the structure of a semiconductor integrated circuit device which is another embodiment of the present invention, in which FIG. 2A is a plan view thereof and FIG. 2B is a sectional view thereof.

[Explanation of symbols]

 1 External Electrode 2 Semiconductor Chip (Semiconductor Element) 3 Bonding Wire 4 Thermal Diffusion Plate 5 Heat Dissipation Fin 6 Semiconductor Integrated Circuit Device Main Body 7 Adhesive 8 Pin Fin (Protruding Heat Dissipation Part) 8a Corner 8b, 10b Heat Dissipation Surface 9 Wind Direction 10 Flat plate fin (flat plate heat dissipation part) 10c groove

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Minoru Kubozono 2326 Imai, Ome, Tokyo, Hitachi Device Development Center (72) Inventor Hiroshi Kuroda 2326 Imai, Ome, Tokyo Hitachi, Ltd. Device Development Center (72) Inventor Akihiro Tobita 2326 Imai, Ome-shi, Tokyo Inside Hitachi, Ltd. Device Development Center

Claims (4)

[Claims] 1. A semiconductor integrated circuit device having a heat radiation fin provided with a pin fin which is a projecting heat radiation portion, wherein a vertical heat radiation surface of the pin fin is provided obliquely to a wind direction. A semiconductor integrated circuit device characterized by the above. 2. The semiconductor device according to claim 1, wherein the pin fin has a polygonal horizontal cross section, and is provided with the corners of the polygon oriented in the wind direction. Integrated circuit device. 3. The semiconductor integrated circuit device according to claim 2, wherein the pin fin is a prism. 4. A semiconductor integrated circuit device in which a heat radiation fin having a flat plate fin, which is a flat heat radiation portion, is installed, wherein a vertical heat radiation surface of the flat fin is provided obliquely to a wind direction. And a semiconductor integrated circuit device.