JPH07205463A - Method for sticking head substrate in thermal print head - Google Patents

Abstract

PURPOSE:To reduce a cost in the case where a head substrate of a thermal print head is stuck to a heat radiation plate made of a metal by using an adhesive. CONSTITUTION:A groove 4 is provided on one end section in a top face of a heat radiation plate 3 and a head substrate 1 is put on the top face of the heat radiation plate 3. After that, a UV adhesive 5 to be cured by the radiation of ultraviolet rays is filled into the groove 4. Next, the concave groove 4 is irradiated with the ultraviolet rays.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal print head used in a facsimile or a printer, in which a head substrate having a heating resistor is attached to a radiator plate made of metal such as aluminum. The present invention relates to a method of bonding using an adhesive.

[0002]

2. Description of the Related Art Generally, a thermal print head of this type has a heating resistor formed on its upper surface as described in, for example, Japanese Patent Application Laid-Open No. 56-126180 or Japanese Patent Application Laid-Open No. 57-24272. It is well known that the ceramic head substrate is bonded to a heat sink made of metal such as aluminum with an adhesive.

In the past, as an adhesive used when the head substrate is attached to a heat sink,
A so-called heat-curable adhesive that is cured by heating is used, or a room-temperature-curable adhesive that is cured at room temperature by mixing curing agents is used. After applying the coating to one or both of the substrate and the heat sink, the head substrate is attached to the heat sink.

[0004]

However, when the former thermosetting adhesive is used as the adhesive, the entire head substrate is heated to an appropriate temperature after the head substrate is attached to the heat dissipation plate. Since the process, that is, the heating device for curing the heat-curable adhesive used for the bonding is required, the manufacturing equipment of the thermal print head becomes complicated and large, and the manufacturing cost increases. is there.

When the latter cold-setting adhesive is used as the adhesive, the above-mentioned heating device is not required, but on the other hand, the hardening speed of the cold-setting adhesive is high. If one is used, the room temperature curable adhesive is cured before the head substrate is attached to the heat dissipation plate, so that the adhesive strength is reduced.

Therefore, as the curing agent in the room temperature curing type adhesive, one having a slow curing rate must be used, and therefore, it takes a long time to cure after bonding, and therefore, it is also manufactured. The cost was increased. Further, in some conventional cases, a UV adhesive that is cured by irradiation of ultraviolet rays is used to bond the head substrate to the heat dissipation plate.
The UV adhesive is cured by irradiating the adhesive with ultraviolet rays through a large number of through holes formed in the heat dissipation plate.

However, in this method, since a large number of through holes for irradiating the UV adhesive used for bonding with ultraviolet rays must be formed in the heat sink, the strength of the heat sink is greatly increased. Not only is there a problem that
Since the heat dissipation from the head substrate to the heat dissipation plate becomes non-uniform due to the existence of the large number of through holes, there is a problem that uneven printing occurs on the recording paper.

The present invention has a technical object to provide a bonding method which solves these problems.

[0009]

In order to achieve this technical object, the present invention provides "a dent groove at a side edge portion of the heat radiating plate on the upper surface of the heat radiating plate, and the dent groove is the one side. It is provided so as to extend along the edge, and the head substrate is superposed on the upper surface of the heat dissipation plate, and then the concave groove is filled with a UV adhesive which is cured by irradiation of ultraviolet rays, or the concave groove is exposed to ultraviolet rays. UV cured by irradiation
After the adhesive is filled, the head substrates are overlapped with each other, and then the concave groove is irradiated with ultraviolet rays. "It was to be.

[0010]

[Operation] In this way, by irradiating ultraviolet rays into the concave groove provided so as to extend along the one side edge of the heat dissipation plate, the UV adhesive filled in the concave groove is immediately cured. Therefore, it is not necessary to heat the adhesive to cure it, and it is necessary to form a large number of through-holes in the heat dissipation plate without causing the adhesive strength to decrease. Instead, it can be done in a short time.

[0011]

As described above, according to the present invention, the cost required for bonding the head substrate to the heat dissipation plate by using the adhesive can be significantly reduced, and uneven printing occurs on the recording paper. Has the effect of reliably preventing

[0012]

Embodiments of the present invention will be described below with reference to the drawings when applied to a line type thermal print head. 1 and 2, reference numeral 1 denotes a ceramic head substrate having a heating resistor 2 formed in a line on the upper surface thereof, and reference numeral 3 denotes a metal heat dissipation plate such as aluminum.

A recessed groove 4 is formed on the upper surface of the heat dissipation plate 3 at one side edge 3a in the longitudinal direction of the heat dissipation plate 3.
Is provided so that the recessed groove 4 extends along the one side edge 3a. Then, as shown in FIGS. 3 and 4, the head substrate 1 is superposed on the upper surface of the heat dissipation plate 3 so that one side edge 1 a of the head substrate 1 is in the recessed groove 4. After aligning at a predetermined mounting position, it is fixed at a predetermined position by being sandwiched by a clamp 6 made of a leaf spring.

Next, the concave groove 4 is filled with a UV adhesive 5 which is hardened by irradiation of ultraviolet rays.
The filling of the UV adhesive 5 into the recessed groove 4 is performed by sandwiching the superposed state of the head substrate 1 with respect to the heat dissipation plate 3 by a clamp 6 made of a leaf spring, as shown in FIGS. 5 and 6. Held in place, the recessed groove 4 is turned upward,
Then, the dispenser nozzle 7 that ejects the UV adhesive 5 from a small hole is moved along the recessed groove 4, and the UV adhesive 5 is removed by the filling method. The UV in the groove 4
The adhesive 5 can be filled so as to be surely attached to both the heat dissipation plate 3 and the head substrate 1. In this case, after the UV adhesive 5 is filled in the recessed groove 4, heat radiation is performed. By tilting the plate 3 and the head substrate 1 in the left-right direction in FIG. 6, the adhesion area of the UV adhesive 5 to the heat dissipation plate 3 and the head substrate 1 can be increased.
The adhesive strength can be increased.

As another filling method, after the UV adhesive 5 is filled in the recessed groove 4 of the heat dissipation plate 3,
The head substrate 1 is superposed on the heat dissipation plate 3, or
Alternatively, following this superposition, the heat dissipation plate 3 and the head substrate 1 may be tilted in the left-right direction with the recessed groove 4 facing upward. When the UV adhesive 5 is filled in the recessed groove 4 in this manner, the recessed groove 4 is held in a state where the head substrate 1 is superposed on the heat dissipation plate 3 by being sandwiched by a clamp 6 made of a leaf spring. The inside is irradiated with ultraviolet rays.

Then, the UV adhesive 5 filled in the recessed groove 4 is irradiated with ultraviolet rays, so that the UV adhesive 5 is immediately hardened. On the other hand, the head substrate 1 can be securely fixed over its entire length.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a head substrate and a heat dissipation plate are disassembled.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is a perspective view showing a state in which a head substrate and a heat dissipation plate are superposed on each other.

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG.

FIG. 5 is a perspective view showing a state where a UV adhesive is filled in the recessed groove of the heat dissipation plate.

6 is an enlarged sectional view taken along line VI-VI of FIG.

[Explanation of symbols]

 1 Head Substrate 2 Heating Resistor 3 Heat Radiating Plate 4 Recessed Groove 5 UV Adhesive

Claims (1)

[Claims] 1. A radiating groove is provided at a side edge portion of the radiating plate on the upper surface of the radiating plate such that the dent groove extends along the one side edge. After filling the recessed groove with a UV adhesive that cures by irradiation with ultraviolet rays, or, after filling the recessed groove with a UV adhesive that cures by irradiation with ultraviolet rays, superimpose a head substrate, Next, a method for laminating a head substrate in a thermal print head, which comprises irradiating the concave groove with ultraviolet light.