JPH07205463A - Method for sticking head substrate in thermal print head - Google Patents

Method for sticking head substrate in thermal print head

Info

Publication number
JPH07205463A
JPH07205463A JP335594A JP335594A JPH07205463A JP H07205463 A JPH07205463 A JP H07205463A JP 335594 A JP335594 A JP 335594A JP 335594 A JP335594 A JP 335594A JP H07205463 A JPH07205463 A JP H07205463A
Authority
JP
Japan
Prior art keywords
adhesive
heat dissipation
head substrate
dissipation plate
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP335594A
Other languages
Japanese (ja)
Inventor
Tetsushi Suga
哲史 菅
Original Assignee
Rohm Co Ltd
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, ローム株式会社 filed Critical Rohm Co Ltd
Priority to JP335594A priority Critical patent/JPH07205463A/en
Publication of JPH07205463A publication Critical patent/JPH07205463A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Abstract] [Purpose] When the head substrate 1 of the thermal print head is attached to the metal heat dissipation plate 3 using an adhesive, the cost required for this is reduced. [Structure] A recessed groove 4 is provided in a portion of one side edge of the heat dissipation plate on the upper surface of the heat dissipation plate 3, the head substrate 1 is superposed on the upper surface of the heat dissipation plate, and then the recessed groove 4 is irradiated with ultraviolet rays. Then, the UV adhesive 5 which is cured is filled, and then the concave groove 4 is irradiated with ultraviolet rays.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal print head used in a facsimile or a printer, in which a head substrate having a heating resistor is attached to a radiator plate made of metal such as aluminum. The present invention relates to a method of bonding using an adhesive.

[0002]

2. Description of the Related Art Generally, a thermal print head of this type has a heating resistor formed on its upper surface as described in, for example, Japanese Patent Application Laid-Open No. 56-126180 or Japanese Patent Application Laid-Open No. 57-24272. It is well known that the ceramic head substrate is bonded to a heat sink made of metal such as aluminum with an adhesive.

In the past, as an adhesive used when the head substrate is attached to a heat sink,
A so-called heat-curable adhesive that is cured by heating is used, or a room-temperature-curable adhesive that is cured at room temperature by mixing curing agents is used. After applying the coating to one or both of the substrate and the heat sink, the head substrate is attached to the heat sink.

[0004]

However, when the former thermosetting adhesive is used as the adhesive, the entire head substrate is heated to an appropriate temperature after the head substrate is attached to the heat dissipation plate. Since the process, that is, the heating device for curing the heat-curable adhesive used for the bonding is required, the manufacturing equipment of the thermal print head becomes complicated and large, and the manufacturing cost increases. is there.

When the latter cold-setting adhesive is used as the adhesive, the above-mentioned heating device is not required, but on the other hand, the hardening speed of the cold-setting adhesive is high. If one is used, the room temperature curable adhesive is cured before the head substrate is attached to the heat dissipation plate, so that the adhesive strength is reduced.

Therefore, as the curing agent in the room temperature curing type adhesive, one having a slow curing rate must be used, and therefore, it takes a long time to cure after bonding, and therefore, it is also manufactured. The cost was increased. Further, in some conventional cases, a UV adhesive that is cured by irradiation of ultraviolet rays is used to bond the head substrate to the heat dissipation plate.
The UV adhesive is cured by irradiating the adhesive with ultraviolet rays through a large number of through holes formed in the heat dissipation plate.

However, in this method, since a large number of through holes for irradiating the UV adhesive used for bonding with ultraviolet rays must be formed in the heat sink, the strength of the heat sink is greatly increased. Not only is there a problem that
Since the heat dissipation from the head substrate to the heat dissipation plate becomes non-uniform due to the existence of the large number of through holes, there is a problem that uneven printing occurs on the recording paper.

The present invention has a technical object to provide a bonding method which solves these problems.

[0009]

In order to achieve this technical object, the present invention provides "a dent groove at a side edge portion of the heat radiating plate on the upper surface of the heat radiating plate, and the dent groove is the one side. It is provided so as to extend along the edge, and the head substrate is superposed on the upper surface of the heat dissipation plate, and then the concave groove is filled with a UV adhesive which is cured by irradiation of ultraviolet rays, or the concave groove is exposed to ultraviolet rays. UV cured by irradiation
After the adhesive is filled, the head substrates are overlapped with each other, and then the concave groove is irradiated with ultraviolet rays. "It was to be.

[0010]

[Operation] In this way, by irradiating ultraviolet rays into the concave groove provided so as to extend along the one side edge of the heat dissipation plate, the UV adhesive filled in the concave groove is immediately cured. Therefore, it is not necessary to heat the adhesive to cure it, and it is necessary to form a large number of through-holes in the heat dissipation plate without causing the adhesive strength to decrease. Instead, it can be done in a short time.

[0011]

As described above, according to the present invention, the cost required for bonding the head substrate to the heat dissipation plate by using the adhesive can be significantly reduced, and uneven printing occurs on the recording paper. Has the effect of reliably preventing

[0012]

Embodiments of the present invention will be described below with reference to the drawings when applied to a line type thermal print head. 1 and 2, reference numeral 1 denotes a ceramic head substrate having a heating resistor 2 formed in a line on the upper surface thereof, and reference numeral 3 denotes a metal heat dissipation plate such as aluminum.

A recessed groove 4 is formed on the upper surface of the heat dissipation plate 3 at one side edge 3a in the longitudinal direction of the heat dissipation plate 3.
Is provided so that the recessed groove 4 extends along the one side edge 3a. Then, as shown in FIGS. 3 and 4, the head substrate 1 is superposed on the upper surface of the heat dissipation plate 3 so that one side edge 1 a of the head substrate 1 is in the recessed groove 4. After aligning at a predetermined mounting position, it is fixed at a predetermined position by being sandwiched by a clamp 6 made of a leaf spring.

Next, the concave groove 4 is filled with a UV adhesive 5 which is hardened by irradiation of ultraviolet rays.
The filling of the UV adhesive 5 into the recessed groove 4 is performed by sandwiching the superposed state of the head substrate 1 with respect to the heat dissipation plate 3 by a clamp 6 made of a leaf spring, as shown in FIGS. 5 and 6. Held in place, the recessed groove 4 is turned upward,
Then, the dispenser nozzle 7 that ejects the UV adhesive 5 from a small hole is moved along the recessed groove 4, and the UV adhesive 5 is removed by the filling method. The UV in the groove 4
The adhesive 5 can be filled so as to be surely attached to both the heat dissipation plate 3 and the head substrate 1. In this case, after the UV adhesive 5 is filled in the recessed groove 4, heat radiation is performed. By tilting the plate 3 and the head substrate 1 in the left-right direction in FIG. 6, the adhesion area of the UV adhesive 5 to the heat dissipation plate 3 and the head substrate 1 can be increased.
The adhesive strength can be increased.

As another filling method, after the UV adhesive 5 is filled in the recessed groove 4 of the heat dissipation plate 3,
The head substrate 1 is superposed on the heat dissipation plate 3, or
Alternatively, following this superposition, the heat dissipation plate 3 and the head substrate 1 may be tilted in the left-right direction with the recessed groove 4 facing upward. When the UV adhesive 5 is filled in the recessed groove 4 in this manner, the recessed groove 4 is held in a state where the head substrate 1 is superposed on the heat dissipation plate 3 by being sandwiched by a clamp 6 made of a leaf spring. The inside is irradiated with ultraviolet rays.

Then, the UV adhesive 5 filled in the recessed groove 4 is irradiated with ultraviolet rays, so that the UV adhesive 5 is immediately hardened. On the other hand, the head substrate 1 can be securely fixed over its entire length.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a head substrate and a heat dissipation plate are disassembled.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is a perspective view showing a state in which a head substrate and a heat dissipation plate are superposed on each other.

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG.

FIG. 5 is a perspective view showing a state where a UV adhesive is filled in the recessed groove of the heat dissipation plate.

6 is an enlarged sectional view taken along line VI-VI of FIG.

[Explanation of symbols]

 1 Head Substrate 2 Heating Resistor 3 Heat Radiating Plate 4 Recessed Groove 5 UV Adhesive

Claims (1)

[Claims]
1. A radiating groove is provided at a side edge portion of the radiating plate on the upper surface of the radiating plate such that the dent groove extends along the one side edge. After filling the recessed groove with a UV adhesive that cures by irradiation with ultraviolet rays, or, after filling the recessed groove with a UV adhesive that cures by irradiation with ultraviolet rays, superimpose a head substrate, Next, a method for laminating a head substrate in a thermal print head, which comprises irradiating the concave groove with ultraviolet light.
JP335594A 1994-01-18 1994-01-18 Method for sticking head substrate in thermal print head Pending JPH07205463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP335594A JPH07205463A (en) 1994-01-18 1994-01-18 Method for sticking head substrate in thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP335594A JPH07205463A (en) 1994-01-18 1994-01-18 Method for sticking head substrate in thermal print head

Publications (1)

Publication Number Publication Date
JPH07205463A true JPH07205463A (en) 1995-08-08

Family

ID=11555048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP335594A Pending JPH07205463A (en) 1994-01-18 1994-01-18 Method for sticking head substrate in thermal print head

Country Status (1)

Country Link
JP (1) JPH07205463A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114289A1 (en) * 2015-01-16 2016-07-21 ローム株式会社 Thermal print head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114289A1 (en) * 2015-01-16 2016-07-21 ローム株式会社 Thermal print head

Similar Documents

Publication Publication Date Title
US5420627A (en) Inkjet printhead
US5534372A (en) IC card having image information
US6323456B1 (en) Method of forming an ink jet printhead structure
JP3386177B2 (en) Inkjet print head
US5366573A (en) UV-curable adhesive semiconductor chip mounting process
US6424394B1 (en) Liquid crystal display device having grid-shaped light shielding films in peripheral region
EP0564103B1 (en) Adhesive seal for an inkjet printhead
EP0564080B1 (en) Aligning a substrate with orifices in an ink jet printhead
EP0719642B1 (en) An ink-jet recording head, a manufacturing method therefor, and a recording apparatus thereof
JP2856844B2 (en) Plate cylinders in offset printing presses
US6739716B2 (en) Systems and methods for curing a fluid
US5408738A (en) Method of making a nozzle member including ink flow channels
JP4167735B2 (en) Inkjet print cartridge
US5506608A (en) Print cartridge body and nozzle member having similar coefficient of thermal expansion
EP0723499B1 (en) Droplet deposition apparatus
US4600667A (en) Preparation of printing plate by pattern exposing both sides of curable liquid resin
JP3908800B2 (en) Inkjet print cartridge
US5847356A (en) Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system
US5606440A (en) Assembling method of flat type display device
US4515375A (en) Process and arrangement for sealing the gap between the ends of a gravure printing plate mounted on a printing cylinder
EP1138496A2 (en) Liquid discharge recording head, liquid discharge recording apparatus, and method for manufacturing liquid discharge head
US8008119B2 (en) Surface mount optoelectronic component with lens having protruding structure
US6000784A (en) Structure and method for mounting an ink jet head
US7144471B2 (en) Bonding method and apparatus
EP0564101B1 (en) Laser ablated nozzle member for inkjet printhead