JPH07193157A - Semiconductor device and fixing tool for directly mounting other parts on semiconductor device - Google Patents

Abstract

PURPOSE:To increase the density of a substrate by increasing the density of the substrate and at the same time constituting a fixing tool with a member which does not require much space by performing testing or board modification easily even if the pitch of an external lead is small. CONSTITUTION:In a semiconductor device where a semiconductor chip 1 and an inner lead 2 electrically connected to the semiconductor chip 1 are sealed by resin 3, a test hole 11 is penetrated or not penetrate but electrically connected to the inner lead 2 is provided at the resin 3. Also, a plurality of pins directly engaged to or gear-locked to the semiconductor device or a pin member with a plurality of pins are mounted to mounting parts in advance or on assembly in the fixing tool.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a semiconductor chip and internal leads electrically connected to the semiconductor chip are sealed with a resin, and a fixing jig for directly mounting other components on the semiconductor device. .

[0002]

2. Description of the Related Art FIG. 20 is a plan view showing a conventional example of this type of semiconductor device, and FIG. 21 is a side view of the same. In the figure, 1
Is a semiconductor chip, 2 is a plurality of internal leads electrically connected to the semiconductor chip 1, and these are encapsulated by a resin 3. Reference numeral 4 is an external lead which is an extension of the internal lead, and the external lead 4 transmits an electric signal inside the semiconductor device 5 to the outside.

With the above configuration, conventionally, the external leads 4 of the semiconductor device 5 are soldered to the wiring on the substrate to electrically connect the semiconductor device 5 and the substrate, and in testing and substrate repair, A check probe or a jumper wire is connected to the external lead 4. FIG. 22 is a perspective view showing a state in which other components are directly mounted on the semiconductor device 5 of this type by the adhesive material 6. Here, a radiator 7 is shown as a mounting component, and the radiator 7 has a fin shape having a large surface area and a high heat radiation amount by providing a plurality of grooves made of a material having good thermal conductivity. However, the adhesive material 6 expands as the semiconductor device 5 is heated, and if the expansion coefficient is not uniform, there is a drawback in that the fixing ability decreases.

Therefore, there is a configuration in which mounted components are fixed by using a fixing jig without using an adhesive material. FIG. 23 is a perspective view showing a first conventional example of this type of fixing jig. Here, the radiator 7 as a mounting component is directly mounted on the semiconductor device 5 with a screw 8. FIG. 24 shows a second example of this type of fixing jig.
FIG. 7 is a perspective view showing a conventional example of FIG. 1, in which a radiator 7 as a mounting component is sandwiched between a radiator mounting socket 9 and a metal fitting 10 and fixed in contact with the semiconductor device 5.

[0005]

However, according to the conventional semiconductor device having the above-mentioned structure, when the pitch of the external leads becomes narrower as the density of the semiconductor device becomes higher, during testing or substrate repair, Checking probe or jumper wire can easily contact the adjacent external lead,
Testing work becomes difficult. Therefore, the size of the semiconductor device is increased, and the density of the substrate is limited.

In addition, according to the conventional fixing jig having the above-mentioned structure, since members such as screws and sockets are used,
It requires a certain amount of space, thus limiting the densification of the substrate. In view of the above problems, the present invention obtains a configuration in which a check probe or a jumper wire does not approach an adjacent external lead, and enables easy testing or board repair even if the pitch of the external lead is narrow. The purpose is to achieve higher density.

A further object of the present invention is to realize a high-density board by forming a fixing jig with a member that does not take up space.

[0008]

In order to achieve the above object, in the semiconductor device of the present invention, the connection point of the check probe or jumper wire is set at a position distant from the adjacent external lead. That is, the present invention relates to a semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are sealed with a resin, and a penetrating or non-penetrating resin electrically connected to the internal lead is formed in a sealing resin. It is characterized by having a test hole.

Further, according to the present invention, by performing fine fitting or locking at a plurality of points, the fixing jig can be made smaller and at the same time a stable fixing force can be obtained. That is, the fixing jig of the present invention is a fixing jig for directly mounting another component on a semiconductor device in which a semiconductor chip and internal leads electrically connected to the semiconductor chip are sealed with a resin. A plurality of pins that are directly fitted to or locked with the pin or a pin member having the plurality of pins are attached to the mounting component in advance or during assembly.

At this time, the pin member is composed of a fixed portion and one or a plurality of pins having an upper end embedded therein, or a plurality of pins arranged at predetermined intervals, and a groove for fitting the fixed portion of the pin member to the other component. Should be provided.

[0011]

With the above-described structure, the semiconductor device of the present invention has the through hole or the non-through hole for the test electrically connected to the inner lead. Therefore, the test hole is provided separately from the outer lead or for the test. By inserting a contact member capable of changing the position or distance of the connection point into the hole, the connection point of the checking probe or jumper wire can be separated from the adjacent external lead.

Further, according to the fixing jig of the present invention having the above-mentioned structure, the plurality of pins attached to the mounting parts in advance or at the time of assembly directly fit or lock with the semiconductor device. A single member is fine and has a small fixing force, but since it is a plurality of members, sufficient fixing can be performed. At this time, the pin member is configured by a fixing portion and one pin having an upper end embedded therein or a plurality of pins arranged at a predetermined interval, and a groove for fitting the fixing portion of the pin member is provided in the other component. Since the position of the pin can be freely adjusted, it is possible to prepare another component having the pin whose position has been adjusted in advance.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments will be described below with reference to the drawings. 1 is a fragmentary perspective view showing a first embodiment of a semiconductor device of the present invention, and FIG. 2 is a perspective view showing the appearance of the same embodiment. In the figure, 15 is a semiconductor device, 1 is a semiconductor chip, 2 is a plurality of internal leads electrically connected to the semiconductor chip 1, and these are encapsulated by a resin 3. Reference numeral 4 denotes an external lead which is an extension of the internal lead 2, and the external lead 4 transmits an electric signal inside the semiconductor device to the outside.

Reference numeral 11 denotes a test hole penetrating in the vertical direction. The inner wall of the test hole 11 is electrically connected to the internal lead 2 in order to obtain an electric signal inside the semiconductor device 5. Although not shown here, the test hole 11 may be provided with a pad. Further, the test hole 11 may not be penetrated. Reference numeral 12 is a dummy hole that is not electrically connected to the internal lead 2 and is used when mounting components.

Here, in the figure, the hole at the 1-pin position is processed into a quadrangular surface portion to distinguish it from other holes, but the inner portion has the same shape as the other holes. FIG. 3 is a perspective view showing an example of the testing of the present embodiment having the above-mentioned configuration, and shows a state in which the tip of the testing probe 13 is inserted into the hole for checking. Reference numeral 14 is a tester device.

FIG. 4 is a perspective view showing an example of the modification of the substrate of this embodiment. An electric conductor line such as a jumper wire 16 and a passive element 17 are used, the tip of which is a test hole 11 of a semiconductor device 15 of the present invention. The signal line is being changed when the board is repaired. FIG. 3 shows a second semiconductor device according to the present invention.
It is a perspective view showing the appearance of the example of. In the figure, reference numeral 18 denotes a semiconductor device, in which a semiconductor chip 1 and internal leads 2 similar to those of the first embodiment are sealed with resin. 19
Is a non-penetrating test hole provided in the side surface direction, and is electrically connected to the internal lead 2.

6 and 7 are perspective views showing an application example of this embodiment. The test hole of the present embodiment also serves as an external lead connection hole for selectively inserting the various conversion external leads 20a to 20f as separate parts. By selecting the conversion external lead, a normal, for example, DIP can be used.・ SOP ・ S
Can be freely converted to OJ or one side DI shown in FIG.
P One-sided SOP becomes possible.

FIG. 8 is a perspective view showing an example of the testing or substrate modification of the present embodiment having the above-mentioned structure, in which only the conversion external lead 20b to which the check probe 13 or the jumper wire 21 should be connected is attached in the opposite direction. Thus, testing or board repair can be easily performed. FIG. 9 is a perspective view showing a first embodiment of the fixing jig of the present invention, and FIG. 10 is a side sectional view of the same embodiment. In each of the embodiments described below, a radiator 7 is provided as another component to be mounted on the semiconductor device.
It is shown.

In the first embodiment, the structure of the corresponding semiconductor device has a vertical signal hole or a plurality of holes provided as dummy. Here, 30 is a pin embedded in the radiator 7 in advance, and a plurality of pins 7 are formed so as to project corresponding to the holes of the semiconductor device. In addition, when the hole for inserting the pin 7 is a signal hole, that is, when it is electrically connected to the internal lead, the pin 7 is made of an insulating member or is coated with an insulating coating.

With the above structure, the fixing jig of this embodiment is
Since the plurality of pins 7 are directly fitted to the semiconductor device, the pins 7
The single is fine and has a small fixing force, but since it is plural, it can be sufficiently fixed. FIG. 11 is a perspective view showing a second embodiment of the fixing jig of the present invention, and FIG. 12 is a side sectional view of the same embodiment.

In the second embodiment, the structure of the corresponding semiconductor device is a plurality of holes 31 provided as dummy on the side surface.
Is to have. Here, 32 is a "V" -shaped pin that is incorporated in the radiator 7 in advance, and the pin 32 is
A plurality of protrusions are formed corresponding to the holes 31 of the semiconductor device. Since the fixing action is the same as that of the first embodiment, the description will be omitted.

Further, even if the pin 32 of the second embodiment is not embedded in the radiator 7 in advance and is fitted into the radiator 7 and the semiconductor device at the time of assembly, the same fixing action can be obtained. In this case, the radiator 7 can be reused even if the pin 32 is damaged. It should be noted that, in the embodiments shown below, this advantage is applicable to all cases where the fixing member is separate from the radiator 7.

FIG. 13 is a perspective view showing a third embodiment of the fixing jig of the present invention. Here, 33 is a pin member that is inserted from the radiator 7 side during assembly, and the pin member 33 is formed by connecting one ends of a plurality of pins 34 protruding corresponding to the holes of the semiconductor device at predetermined intervals. is there. Also, the radiator 7
A hole 35 for penetrating the pin member 33 is previously provided on the side. If the hole for inserting the pin 34 is a signal hole, that is, if it is electrically connected to the internal lead, the pin 34
Is composed of an insulating member or is coated with an insulating coating.

Since the fixing action is the same as that of the first embodiment, its explanation is omitted. FIG. 14 is a perspective view showing a fourth embodiment of the fixing jig of the present invention. Here, 36 is a pin inserted from the radiator 7 side at the time of assembly, and a plurality of the pins 36 are prepared corresponding to the holes of the semiconductor device. Further, a hole 37 for penetrating the pin 36 is provided in advance on the radiator 7 side. When the hole into which the pin 36 is inserted is a signal hole, that is, the pin 36 is electrically connected to the internal lead, the pin 36 is made of an insulating member or is coated with an insulating coating.

Since the fixing action is the same as that of the first embodiment, its explanation is omitted. FIG. 15 is a perspective view showing a fifth embodiment of the fixing jig of the present invention. In the fifth embodiment, the configuration of the corresponding semiconductor device has a plurality of holes provided as dummies on the side surface, as in the second embodiment. Here, 38 is a pin member to be mounted from above the radiator 7 during assembly, and the pin member 38 is formed by integrating a plurality of "V" -shaped pins 39 projecting corresponding to the holes of the semiconductor device. is there.

Since the fixing action is the same as that of the first embodiment, its explanation is omitted. FIG. 15 is a perspective view showing a sixth embodiment of the fixing jig of the present invention. This is an application of the fifth embodiment, and in the figure, reference numeral 40 is a pin member, and the connection form between the "V" -shaped pins 41 is different from the fifth embodiment. FIG. 17 is a perspective view showing a seventh embodiment of the fixing jig of the present invention,
18 is a sectional view of the same side, and FIG. 19 is a side view of the same main portion.

In the seventh embodiment, the structure of the corresponding semiconductor device has a signal hole in the vertical direction or a plurality of holes provided as dummy. In the figure, 4
2, 43 are pin members, and the pin members 42, 43 are
As shown in FIG. 19, it comprises a fixing portion 45 and a pin 46 having an upper end embedded therein. When the hole into which the pin 46 is inserted is a signal hole, that is, the pin is electrically connected to the internal lead, the pin 46 is made of an insulating member or is coated with an insulating coating.

Here, the pin member 42 is composed of a plurality of pins 46 protruding corresponding to the holes and one fixing portion 45 in which the pins 46 are embedded at a predetermined interval. Also,
Like the pin member 43, if it is configured by one pin 46 and one fixing portion 45, it can be used for holes with different intervals in the semiconductor device, or the radiator 7 can be attached by limiting the holes used. It will be possible. In order to prevent the pin member 43 from being displaced in a portion where the hole is not used, an adapter 47 is arranged between them to fix the displacement.

On the other hand, the lower surface of the radiator 7 is provided with a groove 48 into which the pin member 43 is fitted, and at least one of the side ends of the groove 48 is opened so that the pin member 42/43 can be inserted and removed. are doing. With the above configuration, the position of the pin can be freely adjusted, and the radiator 7 having the pin whose position has been adjusted in advance can be prepared, so that the fixing work is simplified.

Since the fixing action is the same as that of the first embodiment, its explanation is omitted. Here, among the above-described embodiments, in the case of using the vertical pin, it is possible to make a device that does not easily fall out by a configuration such as disposing a leaf spring for fixing the pin in the hole on the semiconductor device side. In the first, third, fourth and seventh embodiments among the above-mentioned embodiments,
In the case where the corresponding hole of the semiconductor device is a signal hole penetrating therethrough, fixing the radiator 7 to the semiconductor device can achieve electrical connection and fixing to the substrate of the semiconductor device at the same time.

In this case, the pin is made of a conductive member. Further, when the mounted components such as the radiator are made of an electric conductor, the portions that come into contact with the mounted components are plated with an insulating material so as not to short-circuit with other signals. Regarding the configuration of the seventh embodiment, the fixing portion 45 may be made of an insulating member. In these cases, if the position and the number can be selected like the pin 36 of the fourth embodiment or the pin member 43 of the seventeenth embodiment, the connection with the predetermined internal lead can be freely performed.

[0032]

As described above in detail, according to the present invention, in a semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are encapsulated with a resin, the encapsulation resin is provided with the internal lead. Since the through hole or the non-through hole for test electrically connected is provided, the connection point of the check probe or the jumper wire can be set at a position apart from the adjacent external lead.

As a result, it is possible to prevent the checking probe and the jumper wire from approaching the adjacent external leads, and it is possible to easily perform testing or substrate modification even if the pitch of the external leads is narrow, and to increase the density of the substrate. Has the effect of realizing. Further according to the invention,
In a fixing jig for directly mounting other components on a semiconductor device in which a semiconductor chip and internal leads electrically connected to the semiconductor chip are sealed with resin, a plurality of members that are directly fitted or locked to the semiconductor device Since the pin or the pin member having the plurality of pins is attached to the mounting component in advance or at the time of assembly, the fixing jig can be miniaturized at the same time by performing fine fitting or locking at a plurality of points. A stable fixing force can be obtained.

As a result, the fixing jig can be constituted by a member that does not take up space, and there is an effect that the density of the substrate can be increased. Further, at this time, the pin member is constituted by a fixing portion and one or a plurality of pins having an upper end portion embedded in the fixing portion, and a groove for fitting the fixing portion of the pin member to the other component is formed. If it is provided, the position of the pin can be adjusted freely, so that there can be prepared another component having the pin whose position has been adjusted in advance, which has the effect of simplifying the fixing work.

[Brief description of drawings]

FIG. 1 is a fragmentary perspective view showing a first embodiment of a semiconductor device of the present invention.

FIG. 2 is a perspective view showing an appearance of a first embodiment of a semiconductor device of the present invention.

FIG. 3 is a perspective view showing an example of testing of the first embodiment of the semiconductor device of the present invention.

FIG. 4 is a perspective view showing an example of substrate modification of the first embodiment of the semiconductor device of the present invention.

FIG. 5 is a perspective view showing the outer appearance of a second embodiment of the semiconductor device of the present invention.

FIG. 6 is a perspective view showing an application example of the second embodiment of the semiconductor device of the present invention.

FIG. 7 is a perspective view showing an application example of the second embodiment of the semiconductor device of the present invention.

FIG. 8 is a perspective view showing an example of testing / substrate modification of the second embodiment of the semiconductor device of the present invention.

FIG. 9 is a perspective view showing a first embodiment of the fixing jig of the present invention.

FIG. 10 is a side sectional view showing a first embodiment of the fixing jig of the present invention.

FIG. 11 is a perspective view showing a second embodiment of the fixing jig of the present invention.

FIG. 12 is a side sectional view showing a second embodiment of the fixing jig of the present invention.

FIG. 13 is a perspective view showing a third embodiment of the fixing jig of the present invention.

FIG. 14 is a perspective view showing a fourth embodiment of the fixing jig of the present invention.

FIG. 15 is a perspective view showing a fifth embodiment of the fixing jig of the present invention.

FIG. 16 is a perspective view showing a sixth embodiment of the fixing jig of the present invention.

FIG. 17 is a perspective view showing a seventh embodiment of the fixing jig of the present invention.

FIG. 18 is a side sectional view showing a seventh embodiment of the fixing jig of the present invention.

FIG. 19 is a side sectional view of a main portion showing a seventh embodiment of the fixing jig of the present invention. .

FIG. 20 is a plan view showing a conventional semiconductor device.

FIG. 21 is a side view showing a conventional semiconductor device.

FIG. 22 is a side view showing component mounting with an adhesive material.

FIG. 23 is a perspective view showing a first conventional example of a fixing jig.

FIG. 24 is a perspective view showing a second conventional example of a fixing jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor chip 2 internal lead 3 resin 4 external lead 7 heat sink 11 test hole 12 dummy hole 15 semiconductor device 18 semiconductor device 19 test hole 20a to 20f conversion external lead 30, 32, 34, 36, 39, 41, 46 Pin 33, 38, 40, 43 Pin member 45 Fixed part 48 Groove

Claims (3)

[Claims] 1. A semiconductor device in which a semiconductor chip and an internal lead electrically connected to the semiconductor chip are encapsulated with a resin, and a through-hole or non-penetration test electrically connected to the encapsulation resin is performed. A semiconductor device having a hole for use. 2. A fixing jig for directly mounting another component on a semiconductor device in which a semiconductor chip and internal leads electrically connected to the semiconductor chip are sealed with a resin, or by directly fitting the semiconductor device to the semiconductor device. A fixing jig for directly mounting other components on a semiconductor device, wherein a plurality of pins to be locked or a pin member having the plurality of pins are attached to the mounting component in advance or at the time of assembly. 3. The pin member is constituted by a fixing portion and one or a plurality of pins having an upper end portion embedded in the fixing portion, and the pin member is formed with a groove for fitting the fixing portion of the pin member to the other component. A fixing jig for directly mounting other components on the semiconductor device according to claim 2, wherein the fixing jig is provided.