JPH07190726A - Coaxial lighting device and its method - Google Patents

Coaxial lighting device and its method

Info

Publication number
JPH07190726A
JPH07190726A JP32948793A JP32948793A JPH07190726A JP H07190726 A JPH07190726 A JP H07190726A JP 32948793 A JP32948793 A JP 32948793A JP 32948793 A JP32948793 A JP 32948793A JP H07190726 A JPH07190726 A JP H07190726A
Authority
JP
Japan
Prior art keywords
light
camera
light emitting
coaxial
half mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32948793A
Other languages
Japanese (ja)
Inventor
Motoharu Honda
素春 本多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP32948793A priority Critical patent/JPH07190726A/en
Publication of JPH07190726A publication Critical patent/JPH07190726A/en
Pending legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To make uniform the distribution of illumination intensity in a camera photographing surface for a photographed object by a coaxial lighting device provided with a half mirror to be disposed in front of a lens of a camera. CONSTITUTION:When light is irradiated from a surface light source where emitting strength is controlled every coaxially disposed light emitting diode 47 while the center axis of the surface light source is perpendicularly intersected with the optical axis of a camera 10, light passes through a diffusion plate 43 which is disposed while being faced to the surface light source, it is reflected by a half mirror 41 which is disposed while being inclined by 45 deg. with respect to the optical axis of the camera 10, and it is irradiated over a photographed surface, so that an image can thereby be picked up over a camera photographing surface while illumination intensity is uniformly distributed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、主に半導体素子認識用
として使用される同軸照明装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coaxial lighting device mainly used for recognizing semiconductor elements.

【0002】[0002]

【従来の技術】粘着シート1に離隔配置された半導体素
子2を突き上げピンおよび吸着コレットによりピックア
ップし、粘着シート1から取り出し、リードフレーム等
にマウントするダイボンダーには、半導体素子2全体を
撮像し、半導体素子2の位置を検出するためのカメラ1
0が配置してあり、更に、このカメラ10には半導体素
子2を十分な照度で照明するための同軸照明装置20が
組み込んである。この同軸照明装置20は、図4に示す
ような構造をしており、11はカメラ10の本体、12
はレンズ、21はレンズ12の前方にミラーボックス2
2を介して支持されたハーフミラーであり、このハーフ
ミラー21はレンズ12の光軸に対し45度傾斜するよ
うに支持されている。
2. Description of the Related Art A semiconductor element 2 separated from an adhesive sheet 1 is picked up by a push-up pin and a suction collet, taken out from the adhesive sheet 1, and mounted on a lead frame or the like. Camera 1 for detecting the position of semiconductor element 2
0 is arranged, and a coaxial illumination device 20 for illuminating the semiconductor element 2 with sufficient illuminance is incorporated in the camera 10. The coaxial lighting device 20 has a structure as shown in FIG.
Is a lens, 21 is a mirror box 2 in front of the lens 12.
The half mirror 21 is supported via 2 and is supported so as to be inclined by 45 degrees with respect to the optical axis of the lens 12.

【0003】23はミラーボックス22と連結した状態
でハーフミラー21の側方に配置されたランプハウスで
ある。このランプハウス23は、ランプハウス23の略
中央に配置されたランプ24と、ランプ24の後方に配
置された反射鏡25と、ランプ24の前方に配置した凸
レンズ26およびランプハウス前面のハーフミラー21
と対向する面に配置した拡散板27とによって構成され
ている。そして、ランプ24から照射された光を、レン
ズ26および拡散板27を介してハーフミラー21に送
り、ハーフミラー21によって反射させて半導体素子2
上に導くことにより、半導体素子2を照明するようにし
ている。
Reference numeral 23 denotes a lamp house which is arranged beside the half mirror 21 in a state of being connected to the mirror box 22. The lamp house 23 includes a lamp 24 arranged substantially in the center of the lamp house 23, a reflecting mirror 25 arranged behind the lamp 24, a convex lens 26 arranged in front of the lamp 24, and a half mirror 21 in front of the lamp house 23.
And a diffusion plate 27 arranged on the surface facing the. Then, the light emitted from the lamp 24 is sent to the half mirror 21 via the lens 26 and the diffusion plate 27, and is reflected by the half mirror 21 to be reflected by the semiconductor element 2
The semiconductor element 2 is illuminated by guiding it upward.

【0004】[0004]

【発明が解決しようとする課題】上記したごとく、ハー
フミラー21を介してランプハウス23からの光を半導
体素子2に導けば、カメラ10の光軸と照明光の照射方
向とを同軸上にできるため、半導体素子2照明時、撮像
に悪影響を与える不要な影が発生するのを防止できる。
しかし、上記同軸照明装置20に使用されるランプハウ
ス23は、ランプ24からの光を、凸レンズ26および
拡散板27を使用して均一化しているため、どうしても
らんぷ24のフィラメントが位置する中心部が明るくな
り、その周辺が暗くなるといった現象を起こし、全ての
半導体素子2を均一に照射することができないといった
問題があった。
As described above, if the light from the lamp house 23 is guided to the semiconductor element 2 via the half mirror 21, the optical axis of the camera 10 and the irradiation direction of the illumination light can be coaxial. Therefore, when the semiconductor element 2 is illuminated, it is possible to prevent unnecessary shadows that adversely affect imaging.
However, in the lamp house 23 used in the coaxial lighting device 20, since the light from the lamp 24 is made uniform by using the convex lens 26 and the diffusion plate 27, the central portion where the filament of the lamp 24 is inevitably located. Has a problem in that all of the semiconductor elements 2 cannot be uniformly irradiated.

【0005】また、近年、半導体素子2のサイズは大型
化する傾向にあるが、半導体素子2のサイズが大型化
し、照明エリアが拡大すると、従来の同軸照明装置20
では十分に対応できないといった問題もあった。
In recent years, the size of the semiconductor element 2 has tended to increase, but when the size of the semiconductor element 2 increases and the illumination area expands, the conventional coaxial lighting device 20 is required.
There was also a problem that it could not be adequately dealt with.

【0006】すなわち、同軸照明装置20のランプハウ
ス23は、凸レンズ26を使用しており、この凸レンズ
26の大口径化には限界があるため、このレンズ径の制
約により照明エリアをあまり大きくすることができない
といった問題もあった。
That is, since the lamp house 23 of the coaxial illuminating device 20 uses the convex lens 26, and there is a limit to the enlargement of the diameter of the convex lens 26, the illumination area is made too large due to the restriction of the lens diameter. There was also a problem that I could not do it.

【0007】さらに、カメラ10のレンズ12の近傍に
ランプ24を収納したランプハウス23を配置すると、
ランプ24からの熱により、レンズ12の近傍の大気が
熱せられ、大気に揺らぎが発生し、カメラ10によって
捕らえた画像が揺らぎ、正確な位置判定ができなくなつ
ことがあるといった問題もあった。
Further, when a lamp house 23 accommodating a lamp 24 is arranged near the lens 12 of the camera 10,
The heat from the lamp 24 heats the atmosphere in the vicinity of the lens 12 to cause fluctuations in the atmosphere, and the images captured by the camera 10 fluctuate, which may make accurate position determination impossible.

【0008】更に、上記の問題を解決するために図5に
示すような発光平面板に光ファイバーを用いた「同軸照
明装置」特願平4−239090号が提案されているが
半導体素子2が大型化したことによりレンズの照射エリ
アが広がりレンズに入射する光束の角度範囲が拡大した
ことにより、被撮像部からレンズを通過してくる光のう
ち、レンズの中心を通る光束は周辺から来る光束に比べ
て大きくなるというコサイン4乗の法則の影響を受ける
こととなり、均一な照度分布を有する発光体により照射
してもカメラ撮像面において均一な照度分布を得ること
はできなかった。
Further, in order to solve the above problem, there is proposed a "coaxial illumination device", Japanese Patent Application No. 4-239090, which uses an optical fiber for a light emitting flat plate as shown in FIG. 5, but the semiconductor element 2 is large. As a result, the irradiation area of the lens is expanded and the angular range of the light beam incident on the lens is expanded, so that of the light that passes through the lens from the imaged part, the light beam that passes through the center of the lens is the light beam that comes from the periphery. This is affected by the law of cosine fourth, which is larger than that of the comparative example, and it was not possible to obtain a uniform illuminance distribution on the camera image pickup surface even when the light was emitted by a light emitter having a uniform illuminance distribution.

【0009】[0009]

【課題を解決するための手段】このため、本発明の同軸
照明装置は、被撮像物を撮像するカメラと、その光軸に
対し傾斜してカメラ先端に支持されたハーフミラーと、
前記ハーフミラーの側方に支持された拡散板と、前記拡
散板と対向し同心円状に配列した発光素子からなる面光
源と、前記発光素子毎に対応して電気的に独立制御する
照明制御部とを具備し、前記面光源の中心軸を前記カメ
ラの光軸と直交配置したことを特徴としている。
Therefore, the coaxial illumination device of the present invention includes a camera for picking up an image of an object to be imaged, a half mirror tilted with respect to the optical axis of the camera and supported by the tip of the camera.
A diffusion plate supported laterally of the half mirror, a surface light source composed of light-emitting elements facing the diffusion plate and arranged in a concentric pattern, and an illumination control unit that electrically independently controls the light-emitting elements. And the central axis of the surface light source is arranged orthogonal to the optical axis of the camera.

【0010】また、本発明の同軸照明装置は、発光素子
を発光ダイオードとしたことを特徴としている。
The coaxial lighting device of the present invention is characterized in that the light emitting element is a light emitting diode.

【0011】また、本発明の同軸照明装置は、発光部全
体の形状を、円形あるいは四角形としたことを特徴とし
ている。
Further, the coaxial lighting device of the present invention is characterized in that the shape of the entire light emitting portion is a circle or a quadrangle.

【0012】また、本発明の同軸照明方法は、輝度むら
の補正教示においては、撮像面に無地均一なものを置き
認識装置にて輝度分布を計測し、認識装置による輝度分
布のむらが極小となるように同心円状に配列した発光素
子毎に発光強度を制御して発光強度データを決定し、認
識時には記憶しておいた前記発光強度データにより発光
制御を行うことを特徴としている。
Further, according to the coaxial illumination method of the present invention, in the teaching of correction of uneven brightness, a uniform solid object is placed on the image pickup surface, the brightness distribution is measured by the recognition device, and the unevenness of the brightness distribution by the recognition device is minimized. As described above, the light emission intensity is controlled for each light emitting element arranged in a concentric circle to determine the light emission intensity data, and the light emission control is performed based on the stored light emission intensity data at the time of recognition.

【0013】また、本発明の同軸照明方法は、被撮像物
の認識のための照明光量の教示において、輝度むらの補
正教示を微少光量から最大光量までの複数に区分した光
量の各段階についてそれぞれ被撮像物の認識のための照
明光量の教示以前に行い記憶し、前記記憶データを基に
被撮像物が均一な撮像がされるような発光制御行うこと
を特徴としている。
Further, according to the coaxial illumination method of the present invention, in the teaching of the illumination light amount for recognizing the object to be imaged, the correction instruction for the uneven brightness is divided into a plurality of light amounts from a slight light amount to a maximum light amount. It is characterized in that it is performed and stored before teaching of an illumination light amount for recognition of an object to be imaged, and light emission is controlled based on the stored data so that the object to be imaged is uniformly imaged.

【0014】[0014]

【作用】発光面となる発光平面板に多数の発光素子を同
心円状に配置し、かつ、面光源の中心軸をカメラ光軸と
直交するよう固定し、更に、撮像面において均一な照度
を得るよう同心円状の発光素子ごとに独立して発光強度
を制御することとした。
[Function] A large number of light emitting elements are concentrically arranged on a light emitting flat plate serving as a light emitting surface, and the central axis of the surface light source is fixed so as to be orthogonal to the camera optical axis, and further, uniform illuminance is obtained on the image pickup surface. As described above, the light emission intensity is independently controlled for each concentric light emitting element.

【0015】[0015]

【実施例】以下、本発明の実施例について図面を参照し
ながら説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0016】1図および図2は、本発明に係わる同軸照
明装置である。同図において、10はカメラで、カメラ
本体11の下方にレンズ12が配置されている。41
は、レンズ12で前方にミラーボックス42を介して支
持されたハーフミラーであり、このハーフミラー41は
レンズ12の光軸に対し45度傾斜するように支持され
ている。43は、ミラーボックス42の側方に支持フレ
ーム44を介して支持された拡散板、45は同じく支持
フレーム44により拡散板43と対向するように支持さ
れ多数の発光ダイオード(以下LEDと称する)47を
同心円状に配列した面光源48を配置した発光平面板で
ある。49は、発光平面板45と照明電源46とを電気
的に結ぶ多数の照明配線ケーブル、51は発光平面板4
5と照明配線ケーブル49を接続するコネクターであ
る.52は照明電源46とマイクロコンピュータ53か
らなる照明制御部である。照明配線ケーブル49の照明
電源46側の端部は一束に束ねられ、照明電源46の前
面に設けたコネクター46a内で固定され、その各端面
は、照明電源46内の各リング照明電源部53と対応す
るように接続してある。同心円状のLED(以下LED
リングと称する)毎に輝度が制御できるように、各LE
Dリング毎に各リング照明電源部53と対応して配線す
る。54は各LEDリングの発光輝度を制御するために
マイクロコンピュータ53と接続する制御信号ケーブル
である。
1 and 2 show a coaxial lighting device according to the present invention. In the figure, 10 is a camera, and a lens 12 is arranged below the camera body 11. 41
Is a half mirror that is supported in front of the lens 12 via a mirror box 42. The half mirror 41 is supported so as to be inclined by 45 degrees with respect to the optical axis of the lens 12. Reference numeral 43 denotes a diffuser plate which is supported on the side of the mirror box 42 through a support frame 44, and 45 is also supported by the support frame 44 so as to face the diffuser plate 43, and a large number of light emitting diodes (hereinafter referred to as LEDs) 47. Is a light emitting flat plate on which are arranged surface light sources 48 arranged in a concentric pattern. Reference numeral 49 is a large number of illumination wiring cables that electrically connect the light emitting flat plate 45 and the illumination power supply 46, and 51 is the light emitting flat plate 4.
5 is a connector for connecting the lighting wiring cable 49. Reference numeral 52 is an illumination control unit including an illumination power supply 46 and a microcomputer 53. The end portion of the illumination wiring cable 49 on the side of the illumination power source 46 is bundled and fixed in a connector 46a provided on the front surface of the illumination power source 46, and each of its end faces has a ring illumination power source portion 53 in the illumination power source 46. Are connected to correspond to. Concentric LED (hereinafter LED
Each LE so that the brightness can be controlled for each ring).
Wiring is performed corresponding to each ring illumination power supply unit 53 for each D ring. Reference numeral 54 is a control signal cable connected to the microcomputer 53 to control the emission brightness of each LED ring.

【0017】また、照明配線ケーブル49の発光平面板
45側の端部は各LED47と接続され、各LED47
の発光面は拡散板43と対向し、各LED47の発光平
面板45側の端面は発光平面板45に埋設固定される。
そして、各LED47の発光平面板45への埋設固定
は、発光平面板上で同心円を描くように配置する、発光
平面板45の同心円中心軸はレンズ12光軸と垂直に交
わる位置に設置する。
Further, the end portion of the illumination wiring cable 49 on the light emitting flat plate 45 side is connected to each LED 47, and each LED 47.
The light emitting surface of the LED 47 faces the diffusion plate 43, and the end surface of each LED 47 on the light emitting flat plate 45 side is embedded and fixed in the light emitting flat plate 45.
The LEDs 47 are embedded and fixed in the light emitting flat plate 45 so as to draw concentric circles on the light emitting flat plate. The central axis of the concentric circle of the light emitting flat plate 45 is installed at a position perpendicular to the optical axis of the lens 12.

【0018】各LED47によって形成される面光源4
8の形状は、図2に示すごとく円形にする以外に、例え
ば図3に示すように四角形状にしてもよい。
Surface light source 4 formed by each LED 47
The shape of 8 may be a quadrangular shape as shown in FIG. 3, instead of the circular shape as shown in FIG.

【0019】なお、図中50は発光平面板45の後方に
配置したカバー部材である。
Reference numeral 50 in the drawing denotes a cover member arranged behind the light emitting flat plate 45.

【0020】上記構成において、本発明に係わる同軸照
明装置により、マウント時の半導体素子2の照明を行え
ば、LED47より照射された光は、拡散板43に向け
て照射される。この時、発光平面板45に形成される面
光源48全体の照度分布を同心円状に周辺部の輝度を高
くするよう制御する。この面光源48からの光が拡散板
43によって発光分布がより滑らかな変化とされた後、
ハーフミラー41に達し、ハーフミラー41で反射され
て半導体素子2を照らすため、半導体素子2は周辺が徐
々に明るい状態に照射される。この照射された光がレン
ズ12により周辺減光され、カメラ撮像面においては撮
像エリアが均一化された画像得る。
In the above structure, when the semiconductor device 2 is mounted at the time of mounting by the coaxial lighting device according to the present invention, the light emitted from the LED 47 is emitted toward the diffusion plate 43. At this time, the illuminance distribution of the entire surface light source 48 formed on the light emitting flat plate 45 is controlled so as to concentrically increase the luminance of the peripheral portion. After the light emitted from the surface light source 48 is changed by the diffusion plate 43 so that the light emission distribution is changed more smoothly,
The semiconductor element 2 reaches the half mirror 41 and is reflected by the half mirror 41 to illuminate the semiconductor element 2. Therefore, the periphery of the semiconductor element 2 is gradually illuminated in a bright state. The emitted light is peripherally dimmed by the lens 12, and an image with a uniform image pickup area is obtained on the image pickup surface of the camera.

【0021】均一な照明反射光を得るために各LEDの
発光輝度を制御する教示手順は、先ず、被撮像面には白
紙を置き、前LEDリングを同一輝度にて発光させる。
カメラを通してこの時の白紙の照度分布を認識装置にて
計測し、各LEDリングの輝度をカメラ撮像面における
照度分布が均一となるよう、各LEDリングの発光強度
を光軸の輝度を基準として周辺部輝度を光軸部より順に
輝度補正制御する。被撮像物の認識のための照明光量の
教示においては、輝度むらの補正教示を微少光量から最
大光量までを区分した各段階について例えば、10段階
についてそれぞれ被撮像物の認識のための照明光量の教
示以前に行い記憶しておき、実際の被撮像物の認識のた
めの照明光量の教示・調整時に、照明光量を作業者が調
整するボリュウム値を読み取りながら各段階の輝度補正
記憶データを基に補間補正データを演算し、被撮像物が
均一な撮像がされるよう発光制御する。
The teaching procedure for controlling the emission brightness of each LED in order to obtain a uniform illumination reflected light is as follows. First, place a blank paper on the surface to be imaged and let the front LED ring emit light with the same brightness.
The illuminance distribution on the white paper at this time is measured by the recognition device through the camera, and the light emission intensity of each LED ring is based on the brightness of the optical axis so that the brightness distribution of each LED ring is uniform on the camera imaging surface. The partial brightness is controlled to be corrected in order from the optical axis part. In the teaching of the illumination light amount for recognizing the object to be imaged, for each step in which the correction instruction for the brightness unevenness is divided from the minute light amount to the maximum light amount, for example, for each of 10 steps, the illumination light amount for recognizing the object to be imaged It is performed and stored before teaching, and when teaching / adjusting the illumination light amount for actual recognition of the object to be imaged, the operator adjusts the illumination light amount while reading the volume value and based on the brightness correction storage data at each stage. The interpolation correction data is calculated, and the light emission is controlled so that the object to be imaged is uniformly imaged.

【0022】発光制御を行う白紙の代わりに無地の均一
な紙あるいは無地の部品を用いても教示できるのは勿論
である。また、輝度むらの補正教示を微少光量から最大
光量までを区分した各段階については、10段階による
例を示したが5段階でも20段階でもあるいはより多数
の段階でも教示できるのは勿論である。
Of course, it is possible to teach by using plain uniform paper or plain parts instead of the white paper for controlling the light emission. Regarding the steps for dividing the uneven brightness from the small amount of light to the maximum amount of light, the example of 10 steps is shown, but it is needless to say that the steps can be given in 5 steps, 20 steps, or more steps.

【0023】[0023]

【発明の効果】以上説明したように、本発明は、発光面
となる発光平面板を多数のLEDにて構成し、かつ、各
LEDの発光平面板への埋設固定は、発光平面板上で同
心円を描くように配置したことにより、光軸を中心とし
た同心円状の部分ごとに発光光量を制御可能となり、カ
メラ撮像面において半導体素子を均一に照らすことが可
能となる。
As described above, according to the present invention, the light emitting flat plate serving as the light emitting surface is composed of a large number of LEDs, and each LED is embedded and fixed in the light emitting flat plate on the light emitting flat plate. By arranging so as to draw concentric circles, the amount of emitted light can be controlled for each concentric portion centered on the optical axis, and the semiconductor element can be uniformly illuminated on the camera imaging surface.

【0024】また、本発明は、ランプハウスを不要なも
のとし発光面となる発光平面板を電気的連結手段によっ
て多数のLEDを使用することにより、ランプ前面から
凸レンズを排除し、発光平面板上にLED面光源によっ
て形成される発光部の面積を自由に設定できるようにな
り、半導体素子の大口径化に伴う照明エリアの拡大に十
分対応できるようになる。さらに、本発明は、熱源とな
るランプを有しておらずLEDは熱をほとんど発生しな
いため、カメラのレンズ近傍の大気がランプによって加
熱されるのを確実に防止できると同時に、カメラの前面
に配置される発光部を大幅に小型化できる。
Further, according to the present invention, a convex lens is eliminated from the front surface of the lamp by using a large number of LEDs for the light emitting flat plate serving as a light emitting surface by electrically connecting means without using a lamp house. In addition, the area of the light emitting portion formed by the LED surface light source can be freely set, and it is possible to sufficiently cope with the expansion of the illumination area accompanying the increase in the diameter of the semiconductor element. Further, the present invention does not have a lamp as a heat source and the LED hardly generates heat, so that it is possible to reliably prevent the atmosphere near the lens of the camera from being heated by the lamp, and at the same time, in front of the camera. The arranged light emitting unit can be significantly downsized.

【0025】さらに、光源として寿命の長いLEDを用
いていることにより、従来の白熱ランプやハロゲンラン
プまた蛍光灯に比べメンテナンスが不要となる。
Further, since the LED having a long life is used as the light source, maintenance is not required as compared with the conventional incandescent lamp, halogen lamp or fluorescent lamp.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施例である同軸照明装置の部分断
面を示す側面図
FIG. 1 is a side view showing a partial cross section of a coaxial lighting device according to an embodiment of the present invention.

【図2】 本発明の実施例である同軸照明装置の発光平
面板を示す正面図
FIG. 2 is a front view showing a light emitting flat plate of the coaxial lighting device according to the embodiment of the invention.

【図3】 本発明の他の実施例である同軸照明装置の発
光平面板を示す正面図
FIG. 3 is a front view showing a light emitting flat plate of a coaxial lighting device according to another embodiment of the present invention.

【図4】 従来の同軸照明装置の部分断面側面図FIG. 4 is a partial sectional side view of a conventional coaxial lighting device.

【図5】 従来の光ファイバーを用いた同軸照明装置の
部分断面側面図
FIG. 5 is a partial sectional side view of a conventional coaxial illumination device using an optical fiber.

【符号の説明】[Explanation of symbols]

10 カメラ 12 レンズ 41 ハーフミラー 43 拡散板 47 発光素子(発光ダイオード) 48 面光源 52 照明制御部 10 Camera 12 Lens 41 Half Mirror 43 Diffuser 47 Light Emitting Element (Light Emitting Diode) 48 Surface Light Source 52 Lighting Control Section

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】被撮像物を撮像するカメラと、その光軸に
対し傾斜してカメラ先端に支持されたハーフミラーと、
前記ハーフミラーの側方に支持された拡散板と、前記拡
散板と対向し同心円状に配列した発光素子からなる面光
源と、前記発光素子毎に対応して電気的に独立制御する
照明制御部とを具備し、前記面光源の中心軸を前記カメ
ラの光軸と直交配置した同軸照明装置。
1. A camera for picking up an image of an object to be imaged, and a half mirror tilted with respect to an optical axis of the camera and supported by a front end of the camera.
A diffusion plate supported laterally of the half mirror, a surface light source composed of light-emitting elements facing the diffusion plate and arranged in a concentric pattern, and an illumination control unit that electrically independently controls the light-emitting elements. And a coaxial illumination device in which the central axis of the surface light source is arranged orthogonal to the optical axis of the camera.
【請求項2】前記発光素子を発光ダイオードとする請求
項1記載の同軸照明装置。
2. The coaxial lighting device according to claim 1, wherein the light emitting element is a light emitting diode.
【請求項3】前記面光源の形状を円形あるいは四角形と
する請求項1記載の同軸照明装置。
3. The coaxial lighting device according to claim 1, wherein the surface light source has a circular shape or a quadrangular shape.
【請求項4】カメラの光軸に対して傾斜配置したハーフ
ミラーで同心円状に配列した発光素子からの光を反射し
て、無地均一な被撮像物に光を照射し、前記の無地均一
な被撮像物を前記カメラで撮像した映像信号を処理して
輝度分布を計測し、測定した輝度分布を均一に制御する
に必要な発光強度データを記憶し、前記発光強度データ
に基づいて前記発光素子毎に光量を独立に制御する同軸
照明方法。
4. The light from a light-emitting element arranged concentrically with a half mirror inclined with respect to the optical axis of the camera is reflected to illuminate the object to be imaged with a uniform solid color, and the uniform image with a solid color is formed. The luminance signal is processed by processing a video signal of an object to be imaged by the camera, the light emission intensity data necessary for uniformly controlling the measured luminance distribution is stored, and the light emitting element is based on the light emission intensity data. A coaxial lighting method that controls the amount of light independently for each.
【請求項5】前記発光強度データを予め定めた光量制御
範囲の各段階に記憶する請求項4記載の同軸照明方法。
5. The coaxial illumination method according to claim 4, wherein the light emission intensity data is stored in each step of a predetermined light amount control range.
JP32948793A 1993-12-27 1993-12-27 Coaxial lighting device and its method Pending JPH07190726A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32948793A JPH07190726A (en) 1993-12-27 1993-12-27 Coaxial lighting device and its method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32948793A JPH07190726A (en) 1993-12-27 1993-12-27 Coaxial lighting device and its method

Publications (1)

Publication Number Publication Date
JPH07190726A true JPH07190726A (en) 1995-07-28

Family

ID=18221924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32948793A Pending JPH07190726A (en) 1993-12-27 1993-12-27 Coaxial lighting device and its method

Country Status (1)

Country Link
JP (1) JPH07190726A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066452A (en) * 2006-09-06 2008-03-21 Renesas Technology Corp Manufacturing method of semiconductor device
JP2012191237A (en) * 2012-06-13 2012-10-04 Renesas Electronics Corp Manufacturing method of semiconductor device
WO2013094070A1 (en) * 2011-12-22 2013-06-27 パイオニア株式会社 Semiconductor manufacturing apparatus and push-up apparatus for semiconductor manufacturing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066452A (en) * 2006-09-06 2008-03-21 Renesas Technology Corp Manufacturing method of semiconductor device
US8574933B2 (en) 2006-09-06 2013-11-05 Renesas Electronics Corporation Fabrication method of semiconductor device
WO2013094070A1 (en) * 2011-12-22 2013-06-27 パイオニア株式会社 Semiconductor manufacturing apparatus and push-up apparatus for semiconductor manufacturing apparatus
JP2012191237A (en) * 2012-06-13 2012-10-04 Renesas Electronics Corp Manufacturing method of semiconductor device

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