JPH07188545A - Resin composition for electric and electronic part - Google Patents

Abstract

PURPOSE:To obtain a resin composition inexpensively, which contains an aromatic polyethersulfone resin, an aromatic polysulfone resin and polyphenylene sulfide resin in a specific proportion, thus shows excellent heat resistance, flame retardancy, chemical resistance and mechanical strength. CONSTITUTION:The composition comprises (A) 50 to 85wt.% of an aromatic polyethersulfone resin having the recurring units given in formula I, (B) 10 to 45wt.% of an aromatic polysulfone resin having recurring units of formula II and (C) 5 to 25wt.% of a polyphenylene sulfide resin. The composition is prepared by mixing components A, B and C with a Henschel mixer, then melt- kneaded in a single- or twin-screw extruder at 300 to 380 deg.C and pelletized. The component C is obtained, for example, by polymerization reaction between a halogen-substituted aromatic compound and an alkali sulfide followed by cross-linking into macromolecules.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a resin composition for electric / electronic parts.

[0002]

2. Description of the Related Art Conventionally, aromatic polyether sulfone resins have been excellent in heat resistance, flame resistance, chemical resistance and mechanical strength.
In recent years, its application has been particularly advanced as an electric / electronic component.
For example, it is being used as a material for IC sockets, burn-in sockets, PGA sockets, and the like. These socket materials are molded into a large number of
The C pin receiving fitting is inserted and the IC is set in the socket. IC socket and PGA socket are IC
Is incorporated into the electrical circuit before it is set in the socket. That is, the socket in which the IC pin receiving fitting is inserted is soldered to the printed board. At that time, the socket must have solder heat resistance, and further, chemical cleaning is required because cleaning with trichloroethane is performed to clean the flux used for soldering. . Further, in the burn-in socket, the IC is set in the socket and used for the IC performance test under a high temperature of 100 ° C. or higher. In addition, the flame retardance of electrical and electronic parts is V-
0 is required.

To satisfy all these conditions,
Aromatic polyether sulfone resin is used,
The price is high and the application is restricted. Also,
Aromatic polysulfone resins, which are cheaper in price than aromatic polyether sulfone resins, have no problems in heat resistance and mechanical strength, but have poor flame retardancy and chemical resistance and are not used.

It is known to blend an aromatic polysulfone resin with an aromatic polyether sulfone resin, and Japanese Patent Publication No. 3-67113 discloses 40-90% by weight of the aromatic polyether sulfone resin and 60 of the aromatic polysulfone resin. A composition for producing a circuit board and an electrical connector, which comprises 10 to 10% by weight, is disclosed to improve the plateability of an aromatic polyether sulfone resin while maintaining an appropriate heat distortion temperature. However, when the thickness is 2 mm or less, the flame retardancy is lowered from V-0 to V-1, which is a limitation in use. Further, it is known to blend an aromatic polyether sulfone resin or a polyphenylene sulfide resin with an aromatic polysulfone resin, and in particular, the flame retardancy and chemical resistance of the aromatic polysulfone resin can be improved, but the mechanical strength is lowered. Therefore, it is not practical.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive resin composition for electric / electronic parts which is excellent in heat resistance, flame retardancy, chemical resistance and mechanical strength.

[0006]

[Means for Solving the Problems] As a result of intensive studies to develop an inexpensive resin composition for electric / electronic parts, which has excellent flame retardancy, chemical resistance, and mechanical strength, aromatic polyether The present invention has been achieved by finding that the above problems can be solved by using a sulfone resin, an aromatic polysulfone resin, and a polyphenylene sulfide resin at a specific blending ratio.

That is, the present invention comprises 50 to 85% by weight of an aromatic polyether sulfone resin having a repeating unit represented by (A) (formula) 1 (formula 2),
An aromatic polysulfone resin 1 having a repeating unit represented by
A resin composition for electric / electronic parts, comprising 0 to 45% by weight and (C) a polyphenylene sulfide resin of 5 to 25% by weight.

[0008]

[Chemical 2] In the present invention, the aromatic polyether sulfone resin or the aromatic polysulfone resin is obtained by subjecting an alkali phenolate group, an aromatic halogen group activated by an electron-withdrawing sulfone to a condensation reaction in an aprotic polar solvent. It is a polymer of the type described above, and is a linear polymer having an arylene bond (aromatic bond), an ether bond and a sulfone bond as essential bond units. For example, it can be easily produced by the method described in JP-B-40-10067, JP-B-42-7799 and JP-B-47-617. Specifically, as the aromatic polyether sulfone resin, ULTRASON-E (manufactured by BASF), R
ADEL (manufactured by Amoco) and the like, and as an aromatic polysulfone resin, ULTRASON-S (manufactured by BASF),
There is UDEL (manufactured by Amoco) and the like.

The polyphenylene sulfide resin used in the present invention contains 60 mol% or more of the repeating structural unit represented by the formula (3) (Chemical formula 3), and may contain an ether bond or a sulfone bond.

[0010]

[Chemical 3] As a method for producing a polyphenylene sulfide resin,
Method by reaction of halogen-substituted aromatic compound with alkali sulfide (US Pat. No. 2,513,188, JP-B-45-33)
68) etc., which are polymerized and then cross-linked to give a high molecular weight
Specific examples of the cross-linked polyphenylene sulfide resin include Ryton P-6 (manufactured by Phillips Petroleum Co., Ltd.). Further, at the time of polymerization, by allowing an oxide or hydroxide of an alkaline earth metal to coexist,
Method for obtaining high molecular weight linear polymer (JP-A-60-55)
029, JP-A-60-5030) and the like, and specific examples thereof include Fortron W-205 (manufactured by Kureha Chemical Industry Co., Ltd.) as a linear polyphenylene sulfide resin.

The resin composition for electric / electronic parts of the present invention is 50 to 85% by weight of an aromatic polyethersulfone resin, 10 to 45% by weight of an aromatic polysulfone resin, and 5 to 25% by weight of a polyphenylene sulfide resin. . Aromatic polyether sulfone resin 50-
70% by weight, aromatic polysulfone resin 15-40% by weight, and polyphenylene sulfide resin 10-25
% By weight. If the amount of the aromatic polyether sulfone resin is less than 50% by weight, the chemical resistance is inferior, and if it exceeds 85% by weight, the price becomes high and the application is restricted. If the amount of the aromatic polysulfone resin is less than 10% by weight, the price is similarly high and the application is restricted. If it exceeds 45% by weight, the chemical resistance is poor. If the polyphenylene sulfide resin is less than 5% by weight, the flame retardancy will decrease from V-0 to V-1, and if it exceeds 45% by weight, the mechanical strength will decrease.

The method for producing the resin composition for electric / electronic parts of the present invention comprises the steps of mixing an aromatic polyether sulfone resin, an aromatic polysulfone resin, and a polyphenylene sulfide resin with a Henschel mixer, a ribbon blender or the like, and then using a single screw. Alternatively, it is melt-kneaded using a twin-screw extruder or the like and pelletized. The appropriate heating temperature for kneading is usually 300 to 380 ° C.

If desired, other engineering plastics, inorganic fillers and various additives may be added to the composition. Engineering plastics include polycarbonate, polybutylene terephthalate, polyethylene terephthalate, nylon, aromatic nylon, polyphenylene sulfide, etc.As inorganic fillers, glass fiber, glass beads, carbon black, carbon fiber, talc, alumina, sulfuric acid. Examples thereof include calcium and calcium carbonate.
Glass fibers are preferably added in the range of 10 to 40% by weight. As various additives, antioxidants such as hindered phenols, phosphites, hindered amines, UV absorbers such as benzotriazoles and benzophenones, lubricants such as paraffins and fatty acid esters, hydrotals Examples include acidic gas features such as sites.

[0014]

The present invention will be described in more detail with reference to the following examples. The physical properties of the examples and comparative examples were evaluated according to the following methods. The heat resistance was evaluated by the heat distortion temperature, and the mechanical strength was evaluated by the Izod impact test. In each test, after the present resin composition was kneaded into pellets, various test pieces were prepared from the pellets by using an injection molding machine and evaluated. (1) Heat resistance (heat distortion temperature) Based on JIS-K7202. Bending stress 18.5
6 kg / cm ² (2) Flame retardance Based on UL-94. Test piece thickness, 1.0m
m (3) Chemical resistance 30 × 100 mm, 2.0 mm thick test piece
After immersing in 1,1-trichloroethane at 23 ° C. for 1 hour, one having no change in appearance was regarded as acceptable. (4) Mechanical strength (Izod impact test) Based on JIS-K7110.

Examples 1 to 4 Aromatic polyether sulfone resin having the above formula (1) [manufactured by BASF, trade name Ultrazone E2010],
Aromatic polysulfone resin having the above formula (2) [BAS
Company F, trade name Ultrazone S1010] and polyphenylene sulfide resin [Kureha Chemical Industry Co., trade name Fortron W-205] were blended in the proportions shown in Table 1, and kneaded and pelletized at 360 ° C. Thereafter, various test pieces were prepared from the pellets using an injection molding machine and evaluated.

Examples 5 to 6 Aromatic polyether sulfone resin having the above formula (1) [manufactured by BASF, trade name Ultrazone E1010],
Aromatic polysulfone resin having the above formula (2) [BAS
Company F, trade name Ultrazone S1010], and polyphenylene sulfide resin [manufactured by Phillips Petroleum Co., trade name Ryton P-6] were blended in the proportions shown in Table 1, and after kneading and pelletizing at 360 ° C.,
Various test pieces were prepared from the pellets using an injection molding machine and evaluated.

Comparative Examples 1 to 6 In Examples 1 to 4, when the content is out of the range of the present invention, heat resistance, flame retardancy, chemical resistance, or mechanical strength is poor, and electric and electronic properties are poor. It cannot be used as a resin composition for parts.

[0018]

[Table 1]

[0019]

The resin composition for electric / electronic parts of the present invention is excellent in heat resistance, flame retardancy, chemical resistance and mechanical strength, and its utility value is great.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomoyuki Nakata 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd.

Claims (1)

[Claims] 1. Aromatic polyether sulfone resins 50 to 85 having a repeating unit represented by the formula (1) (Chemical Formula 1) (A).
Resin for electric / electronic parts, which comprises 10 wt% by weight, (B) 10-45 wt% of an aromatic polysulfone resin having a repeating unit represented by the formula (2) (Chemical formula 1), and (C) 5-25 wt% of polyphenylene sulfide resin Composition. [Chemical 1]