JPH07183634A - Structure and method for mounting panel, and flexible wiring board, and driver ic exchange method - Google Patents

Abstract

PURPOSE:To provide structure, a method, etc., for mounting a panel, which can downsize the panel and enable the mounting at low cost and with high reliability and easy reworking. CONSTITUTION:The electrode terminals 3 at the edge 2' of a panel are divided into groups corresponding to each flexible wiring boards 4, 4', and 4'', and space is provided between these groups. An output terminal 42, an input terminal 41, and a relay terminal 43 are provided at the places corresponding to the space at the right of one group of the electrode terminals 3 and the space at the right of one group out of the flexible wiring boards 4, 4', and 4'', and a circuit wiring for connecting the input terminal 41 and the relay terminal 43 is provided. The electrode 3,... in each group and the output terminals 42,... of each wiring board are connected with each other, and also the relay terminal of the flexible wiring board lying at the left and the input terminal of the flexible wiring board lying at the left are connected with each other, on the space between each group and the next.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel mounting structure and method, a flexible wiring board and a driving IC.
Regarding replacement method. More specifically, for example, liquid crystal, EL,
The present invention relates to a structure and a method for mounting a panel such as a plasma panel in which electrode terminals are provided in a peripheral portion. Also,
The present invention relates to a flexible wiring board used for mounting the panel. The present invention also relates to a driving IC replacement method for replacing the driving IC mounted on the flexible wiring board.

[0002]

2. Description of the Related Art A liquid crystal panel among various panels will be described. As shown in FIGS. 20 and 21, the liquid crystal panel 120
In general, a liquid crystal 121 is enclosed between a pair of glass substrates 101 and 102, and a large number of electrode terminals 103 are arranged on the peripheral edge of one glass substrate 102. Note that FIG. 21 shows a cross section taken along line A′-A ′ in FIG. In the mounted state, the flexible wiring boards 104, 104 ′, ... Incorporating the driving IC 105 for driving the liquid crystal panel 120, and the substantially L-shaped common wiring for receiving a signal from the outside are mounted on the peripheral portion of the panel. Board 107
Then, a substantially rectangular control board 111 for supplying a signal to the common wiring board through the connector 108 is provided (the mounted state is referred to as a "module"). As shown in FIG. 20, on one surface of the common wiring board 107, a bus line (circuit wiring) 171 and electrode terminals 172 that are electrically connected to the bus line 171 and correspond to the flexible wiring boards 104, 104 ′, ... It is provided. As shown in FIG. 21, the flexible wiring board 104 is constructed by providing a wiring layer including the output terminals 142 and the input terminals 106 on the flexible base material surface 140. The driving IC 105 is connected to the wiring layer by bump electrodes 105a and 105b (196 indicates a resin).

Conventionally, when mounting, the glass substrate 10 is used.
2 and the board wiring board 107 are arranged side by side so that the electrode terminals 103 and 172 face upward, and
172 and the output terminal 14 of the flexible wiring board 104
2. The input terminals 106 were electrically connected by the anisotropic conductive material 195 and solder (not shown), respectively. In addition, as shown in FIG. 20, the bus line 1 of the common wiring substrate 107
71 is connected to one end of the connector 108, and the other end of the connector 108 is connected to a signal supply terminal (not shown) of the control board.

During operation, a signal is supplied from the control board 111 to the bus line 171 of the common wiring board 107 through the connector 108, and the flexible wiring boards 104, 104 ', through the bus line 171, the electrode terminals 172, and the input terminal 106. A signal is input to the driving IC 105. Then, the signal output from the driving IC 105 is applied to the pixel through the output terminal 142 and the electrode terminal 103. As a result, the liquid crystal panel 120 is driven.

Such a technique is a driver IC mounting technique.
(Monthly Semiconductor World (Semicondostor Wor
ld) Special issue "93 Latest liquid crystal process technology").

[0006]

By the way, there is a severe competition in the development of liquid crystal panels in recent years, and there is a strong demand to reduce the size of the mounted state (module) of the liquid crystal panel in size and weight. However, in the above-mentioned conventional mounting structure, since the common wiring substrate 107 and the control substrate 111 are arranged on the side of the liquid crystal panel 120 separately from each other, there is a problem that the size of the module inevitably becomes large. Also, since two types of large articles, the common wiring board 107 and the control board 111, are provided,
The weight of the module is increasing, which prevents the weight from being reduced.
In addition, the number of parts increases and the material cost increases. Moreover, the input terminal 106 and the output terminal 14 of the flexible wiring board 104
Since it is necessary to connect the two separately and the number of connecting steps is large, there is a problem that the number of steps increases and the cost becomes high.

Further, if the number of parts is large and the size is large, it is easily affected by an external force, and if the number of connections is large, the probability of occurrence of defects increases.

Further, if a connection failure or a drive IC operation failure occurs during the mounting process or in the market, it is difficult to replace the drive IC and rework is troublesome.

Therefore, an object of the present invention is to mount a panel, such as a liquid crystal panel, in which electrode terminals are arranged at the peripheral portion, which is small in size, light in weight, low in cost and highly reliable and can be easily reworked. And a mounting method and a flexible wiring board. In addition, when an operation failure of the drive IC occurs during the mounting process or in the market, the drive I
It is an object of the present invention to provide a method for exchanging a driving IC, which makes it possible to easily exchange C.

[0010]

In order to achieve the above object, the panel mounting structure according to claim 1 has the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface. A driving IC for driving the panel is mounted on the surface of a base material having flexibility, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and the flexible wirings On the board,
In a panel mounting structure for electrically connecting circuit wirings for transmitting a signal given from the outside, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and A space provided between the flexible wiring board and the flexible wiring board, which corresponds to a group of electrode terminals on the peripheral portion of the panel, a gap on one side of the group, and a gap on the other side of the group. An output terminal, an input terminal, and a relay terminal, each of which is a part of the wiring layer, and circuit wiring connecting the input terminal and the relay terminal, and the flexible wirings on the peripheral portion of the panel. The plates are overlapped with each other, and the electrode terminals of each group on the peripheral portion of the panel and the output terminals of the flexible wiring boards are electrically connected to each other by the first connecting member, and The relay terminal of the flexible wiring board on one side and the input terminal of the flexible wiring board on the other side are correspondingly electrically connected by the second connecting material on the above-mentioned gap between Is characterized by.

According to a second aspect of the present invention, there is provided a panel mounting structure according to the first aspect, wherein the first connecting material and the second connecting material are the same type of connecting material. It is characterized by that.

The panel mounting structure according to a third aspect is the panel mounting structure according to the second aspect, wherein the connecting material of the same kind is an anisotropic conductive film.

According to a fourth aspect of the present invention, there is provided a panel mounting structure according to the first aspect, wherein the first connecting material and the second connecting material are different kinds of connecting materials. It is characterized by that.

According to a fifth aspect of the present invention, there is provided a panel mounting structure according to the fourth aspect, wherein the first connecting material is an anisotropic conductive film and the second connecting material is It is characterized by being solder.

According to a sixth aspect of the present invention, there is provided a mounting structure for a panel, wherein the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface is provided on the flexible base material surface. And a plurality of flexible wiring boards having a wiring layer connected to the driving ICs are electrically connected to each other, and a signal applied from the outside is applied to each of the flexible wiring boards. In a panel mounting structure for electrically connecting transmitting circuit wiring, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, In the flexible wiring board, at a location corresponding to one group of the electrode terminals on the peripheral portion of the panel, a gap on one side of the one group, and a gap on the other side of the one group,
An output terminal, an input terminal, and a relay terminal, each of which is a part of the wiring layer, are provided, and circuit wiring for connecting the input terminal and the relay terminal is provided, and the flexible wiring board is provided on the peripheral portion of the panel. Overlapping, the electrode terminals of each group on the peripheral edge of the panel correspond to the output terminals of each flexible wiring board, respectively, and the relay terminals of the flexible wiring board existing on one side on the gap between the groups. And the input terminal of the flexible wiring board on the other side correspond to each other, and are made of a shape memory alloy or a shape memory resin having a U-shaped cross section, and a clip is provided for press-contacting the corresponding terminals. I am trying.

According to a seventh aspect of the present invention, in the panel mounting structure according to the first aspect, a circuit for transmitting a signal to be input to the driving IC to a corner of the panel peripheral portion in the panel mounting structure according to the first aspect. Wiring is provided, and an input terminal or a relay terminal of the flexible wiring board closest to the corner among the plurality of flexible wiring boards is connected to the circuit wiring.

The panel mounting structure according to an eighth aspect is the panel mounting structure according to the first aspect, wherein circuit wiring for transmitting a signal to be input to the driving IC is provided at a peripheral portion of the panel. Control boards that have are arranged side by side,
An input terminal or a relay terminal of the flexible wiring board closest to the corner of the panel peripheral portion of the plurality of flexible wiring boards is connected to the circuit wiring of the control board.

According to a ninth aspect of the present invention, in the panel mounting structure, the portion of the flexible wiring board that extends laterally from the peripheral portion of the panel is bent by winding the peripheral portion of the panel. Is characterized by.

According to a tenth aspect of the present invention, there is provided a flexible wiring board, wherein a plurality of groups of electrode terminals are arranged along the peripheral edge of one side, and the electrode terminals of the panel having a gap between the groups are electrically connected to each other. A flexible wiring board to be electrically connected, and a driving IC for driving the panel is mounted on the surface of a flexible base material, and the driving IC is
Corresponding to a group of electrode terminals on the peripheral portion of the panel, a gap on one side of the group, and a gap on the other side of the group. The output terminal, the input terminal, and the
In addition to having a relay terminal, circuit wiring for connecting the input terminal and the relay terminal is provided, and spare input terminals and relay terminals are formed on the sides of the circuit wiring where the input terminal and the relay terminal exist, respectively. It is characterized by being.

Further, the flexible wiring board according to claim 11 is the flexible wiring board according to claim 10, wherein a gap between the input terminal and the output terminal on the base material surface of the flexible wiring board, A slit is provided in at least one of the gaps between the output terminal and the relay terminal.

According to a twelfth aspect of the present invention, there is provided a method of mounting a panel, wherein the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface is provided on the flexible base material surface. Is mounted with a driving IC for driving, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and a signal externally applied to each of the flexible wiring boards is transmitted. In the mounting method of the panel to electrically connect the circuit wiring to
The electrode terminals on the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one group of electrode terminals on the peripheral portion of the panel of the flexible wiring board is provided. The output terminal and the input terminal, which are formed of a part of the wiring layer and are connected to the driving IC, are relayed at locations corresponding to the gap on one side of the one group and the gap on the other side of the one group. A terminal is provided, circuit wiring for connecting the input terminal and the relay terminal is provided, and the same type of connecting material is supplied to the input terminal, the output terminal, and the relay terminal of each of the flexible boards, and then the flexible wiring board of one flexible wiring board is provided. The output terminals are aligned so as to face the one group of electrode terminals on the peripheral portion of the panel, and then the output terminal and the input terminal of another flexible wiring board are respectively adjacent to the one group on the peripheral portion of the panel. After matching the electrode terminals of the group to be matched with the relay terminals of the one flexible wiring board and aligning them, and after finishing the alignment of the last flexible wiring board, the terminals aligned and aligned with each other are collectively treated. It is characterized by connecting.

A panel mounting method according to a thirteenth aspect is the panel mounting method according to the twelfth aspect.
The connecting material is an anisotropic conductive film.

According to a fourteenth aspect of the present invention, there is provided a method of mounting a panel, wherein the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface is provided on the flexible base material surface. Is mounted with a driving IC for driving, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and a signal externally applied to each of the flexible wiring boards is transmitted. In the mounting method of the panel to electrically connect the circuit wiring to
The electrode terminals on the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one group of electrode terminals on the peripheral portion of the panel of the flexible wiring board is provided. The output terminal and the input terminal, which are formed of a part of the wiring layer and are connected to the driving IC, are relayed at locations corresponding to the gap on one side of the one group and the gap on the other side of the one group. And a circuit wiring for connecting the input terminal and the relay terminal are provided, a second connecting material is previously supplied to the relay terminal, and the electrode terminal of the panel is different from the second connecting material. Of the flexible wiring board, the output terminal of one flexible wiring board is aligned with the electrode terminals of the one group of the peripheral portion of the panel so as to face each other, and then the output of another flexible wiring board is output. Terminal,
After the alignment of the final flexible wiring board is completed, the input terminals are aligned so as to face the electrode terminals of the group adjacent to the one group on the peripheral edge of the panel and the relay terminals of the flexible wiring board, respectively. The terminals, which are opposed to each other and are aligned with each other, are collectively connected.

A panel mounting method according to a fifteenth aspect is the panel mounting method according to the fourteenth aspect.
The first connecting material is an anisotropic conductive film, and the second connecting material is solder.

According to a sixteenth aspect of the present invention, there is provided a method of mounting a panel, wherein the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface is provided on the flexible base material surface. Is mounted with a driving IC for driving, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and a signal externally applied to each of the flexible wiring boards is transmitted. In the mounting method of the panel to electrically connect the circuit wiring to
The electrode terminals on the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one group of electrode terminals on the peripheral portion of the panel of the flexible wiring board is provided. The output terminal and the input terminal, which are formed of a part of the wiring layer and are connected to the driving IC, are relayed at locations corresponding to the gap on one side of the one group and the gap on the other side of the one group. With the provision of terminals, circuit wiring for connecting the input terminal and the relay terminal is provided, and the flexible wiring boards are stacked on the peripheral portion of the panel,
The electrode terminals of each group of the panel peripheral portion and the output terminals of each flexible wiring board are aligned so as to face each other, and on the gap between the groups, of the flexible wiring board existing on one side. The relay terminal and the input terminal of the flexible wiring board existing on the other side are opposed to each other and aligned, and the above-described opposed alignment is performed using a clip made of a shape memory alloy or a shape memory resin having a U-shaped cross section. The feature is that the terminals are pressed together at one time.

According to a seventeenth aspect of the present invention, there is provided a method of mounting a panel, wherein the electrode terminal of a panel having a plurality of electrode terminals arranged along a peripheral portion of one surface is provided on the flexible base material surface. Is mounted with a driving IC for driving, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and a signal externally applied to each of the flexible wiring boards is transmitted. In the mounting method of the panel to electrically connect the circuit wiring to
The electrode terminals on the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one group of electrode terminals on the peripheral portion of the panel of the flexible wiring board is provided. The output terminal and the input terminal, which are formed of a part of the wiring layer and are connected to the driving IC, are relayed at locations corresponding to the gap on one side of the one group and the gap on the other side of the one group. A terminal is provided, circuit wiring for connecting the input terminal and the relay terminal is provided, and the same type of connecting material is supplied to the input terminal, the output terminal, and the relay terminal of each of the flexible boards, and then the flexible wiring board of one flexible wiring board is provided. The output terminals are aligned and connected so as to oppose to a group of electrode terminals on the peripheral portion of the panel, and an operation test of this flexible wiring board is performed. The terminals are respectively aligned and connected to the electrode terminals of the group adjacent to the one group on the peripheral edge of the panel and the relay terminals of the one flexible wiring board, and the operation test of the flexible wiring board is performed. Is characterized by.

Further, in the panel mounting method according to the eighteenth aspect, the electrode terminal of the panel having a plurality of electrode terminals arranged along the peripheral edge of one surface is provided on the flexible base material surface. Is mounted with a driving IC for driving, and a plurality of flexible wiring boards having wiring layers connected to the driving IC are electrically connected, and a signal externally applied to each of the flexible wiring boards is transmitted. In the mounting method of the panel to electrically connect the circuit wiring to
The electrode terminals on the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one group of electrode terminals on the peripheral portion of the panel of the flexible wiring board is provided. The output terminal and the input terminal, which are formed of a part of the wiring layer and are connected to the driving IC, are relayed at locations corresponding to the gap on one side of the one group and the gap on the other side of the one group. And a circuit wiring for connecting the input terminal and the relay terminal to each other, and supplying the same type of connecting material to the input terminal, the output terminal, and the relay terminal of each of the flexible boards, and thereafter, the electrodes on the peripheral portion of the panel. The flexible wiring board is arranged in every other group of the terminal group, and the output terminal of the flexible wiring board is aligned and connected to the electrode terminal of the every other group, and the connection is made. Each frame The operation test of the sible wiring board is performed, and then the flexible wiring board is arranged in the remaining unconnected group of the electrode terminal group on the peripheral portion of the panel, and the output terminal, the input terminal and the relay of the flexible wiring board are arranged. The terminals are respectively the electrode terminals of the unconnected group, the relay terminals of the flexible wiring board arranged on one side of the unconnected group, and the flexible terminals arranged on the other side of the unconnected group. It is characterized in that the input terminals of the wiring board are opposed to each other, aligned and connected, and an operation test is performed on each of the connected flexible wiring boards.

According to a nineteenth aspect of the present invention, there is provided a driving IC exchange method, wherein a plurality of groups of electrode terminals are arranged along the peripheral edge of one surface, and the electrode terminals of the panel having a gap between the groups are provided. A driving IC replacement method for replacing a driving IC on a flexible wiring board electrically connected to the flexible wiring board according to claim 10, wherein the input terminal and the spare input are provided on a base surface of the flexible wiring board. While disconnecting the connection between the electrode terminal at the peripheral edge of the panel and the output terminal of the flexible wiring board, leaving the part on one side where the terminal exists and the part on the other side where the relay terminal and the spare relay terminal exist. The portion including the output terminal and the driving IC on the base material surface is removed, and the flexible wiring board is provided on the electrode terminal at the peripheral portion of the panel, the spare input terminal, and the spare relay terminal, respectively. Output terminals of the new flexible wiring board having the same structure except for the input terminal and the relay terminal,
The feature is that the spare input terminal and the spare relay terminal are connected in correspondence with each other.

A method of exchanging the driving IC according to claim 20 is a method of exchanging the driving IC on the flexible wiring board of the panel mounting structure according to claim 1. After removing only the driving IC on the board or the base material of the flexible wiring board in the vicinity of the driving IC, only a new driving IC having the same configuration as the driving IC or the vicinity of the new driving IC The new drive IC, including the flexible wiring board substrate
Is connected to the flexible wiring board.

[0030]

In the panel mounting structure according to claim 1, during operation,
A signal is supplied to the input terminal of the first flexible wiring board at the peripheral portion of the panel from the external control board directly or via a connector, circuit wiring, etc., and is input to the driving IC. The signal output from the driving IC is supplied to the inside of the panel through the output terminal of the flexible wiring board and the electrode terminal of the first group on the peripheral portion of the panel. This drives the panel. The signal is also transmitted to the relay terminal through the circuit wiring provided on the flexible wiring board and supplied to the input terminal of the second flexible wiring board adjacent to the flexible wiring board. Then, it is input to the driving IC of the second flexible wiring board. The signal output from the driving IC is supplied to the inside of the panel via the output terminal of the second flexible wiring board and the electrode terminal of the second group on the peripheral portion of the panel. In this way, the signals are successively supplied to the electrode terminals of the group corresponding to the adjacent flexible wiring boards.

In the mounting structure of this panel, a common wiring board which is conventionally arranged on the side of the panel (see FIGS. 20 and 21).
Is omitted. Therefore, the size of the module is smaller than in the conventional case. In addition, the number of parts is reduced and the weight of the module is reduced. Further, since the number of parts is reduced in this way, the material cost is reduced. Moreover,
The electrode terminals on the peripheral portion of the panel, the output terminals of the flexible wiring board, the relay terminals of the flexible wiring board, and the input terminals of the adjacent flexible wiring board are collectively connected via, for example, an anisotropic conductive material or solder, and There is no step of connecting the flexible wiring board and the common wiring board. Therefore,
The number of man-hours is reduced as compared with the conventional method. Therefore, the cost is reduced.

Further, since the number of parts is smaller and the module size is smaller than the conventional one, it is less likely to be affected by external force. Moreover, since the number of connections is small, the probability of occurrence of defects is reduced, and the reliability of the module is improved.

According to a second aspect of the present invention, in the panel mounting structure, between the first connecting member connecting the electrode terminals of each group at the peripheral portion of the panel and the output terminal of each flexible wiring board, and between each group. Since, on the above-mentioned gap, the second connecting member connecting the relay terminal of the flexible wiring board existing on one side and the input terminal of the flexible wiring board existing on the other side is the same kind of connecting material, The material supply process is simplified. Therefore, the cost is further reduced. In addition, the connection conditions are stabilized and the reliability is further improved.

In the panel mounting structure of claim 3, since the same type of connecting material is an anisotropic conductive film and is one of the current mainstream connecting materials, the know-how of existing equipment and connection technology is utilized. It Therefore, the module can be easily mass-produced in a short period of time with a small investment.

In the panel mounting structure according to the fourth aspect, since the first connecting material and the second connecting material are different connecting materials, the connecting material according to the resistance specifications required for each connection point. Is selected. Therefore, the reliability is further improved.

In the panel mounting structure of claim 5, since the first connecting material is an anisotropic conductive film and the second connecting material is solder, existing know-how of equipment and connection technology is utilized. It Therefore, the module can be easily mass-produced in a short period of time with a small investment.

The panel mounting structure according to the sixth aspect has the same operation and effect as the first aspect. Moreover, since a clip made of a shape memory alloy or shape memory resin having a U-shaped cross section is provided, the corresponding terminals can be easily connected by the clip. Further, when the driving IC mounted on the specific flexible wiring board is found to be defective after mounting, the flexible wiring board including the driving IC is easily replaced by removing the clip. At this time, it is not necessary to wipe the connecting material.

In the panel mounting structure according to claim 7, a circuit wiring for transmitting a signal to be input to the driving IC is provided at a corner of the panel peripheral portion, and the circuit wiring includes:
Since the input terminal or the relay terminal of the flexible wiring board closest to the corner among the plurality of flexible wiring boards is connected, a signal from the outside is transmitted to the driving IC on the flexible wiring board with a simple structure. Supplied.

In the panel mounting structure according to claim 8, a control board having a circuit wiring for transmitting a signal to be input to the driving IC is arranged in parallel at the peripheral portion of the panel, and the circuit wiring of the control board is Since the input terminal or the relay terminal of the flexible wiring board closest to the corner of the peripheral portion of the panel is connected among the plurality of flexible wiring boards, the number of parts and the number of connection points are reduced. Therefore, reliability is improved.

In the panel mounting structure according to claim 9, the portion of the flexible wiring board that protrudes laterally from the peripheral portion of the panel is bent by winding the peripheral portion of the panel. Becomes even smaller.

When a module is constructed by using the flexible wiring board according to the tenth aspect, as in the first aspect, the effects of reducing the number of parts, the number of steps, the weight, the module size, the cost and the reliability are improved. Play. Moreover, when it is determined that the drive IC mounted on the specific flexible wiring board is defective after mounting, the drive IC is easily replaced. That is, first, of the base material surface of the flexible wiring board, the part on one side where the input terminal and the spare input terminal exist, and the part on the other side where the relay terminal and the spare relay terminal exist, The connection between the electrode terminal of the panel and the output terminal of the flexible wiring board is released, and the remaining central portion including the output terminal and the driving IC is removed from the surface of the base material. The electrode terminal of the panel, the spare input terminal, and the spare relay terminal are respectively connected to the flexible wiring board and the output terminal of the new flexible wiring board having the same configuration except the input terminal and the relay terminal. Connect the input terminal and the auxiliary relay terminal in correspondence. In this way
A defective driving IC can be easily replaced.

In the flexible wiring board according to the eleventh aspect, slits are respectively provided in the gap between the input terminal and the output terminal and the gap between the output terminal and the relay terminal on the base material surface of the flexible wiring board. Since it is provided, when the driving IC mounted on the specific flexible wiring board is found to be defective after mounting, the remaining portion including the output terminal and the driving IC on the base material surface is removed. At this time, the portion protruding laterally from the peripheral portion of the panel may be cut substantially perpendicular to the peripheral portion of the panel up to the slit. As a result, the driving IC can be replaced more easily without damaging the panel.

In the panel mounting method of the twelfth aspect, corresponding terminals are collectively connected using the same type of connecting material. Further, there is no step of connecting the flexible wiring board and the common wiring board. Therefore, the man-hours are reduced and the cost is reduced. Further, the connection conditions of the input terminal and the output terminal are the same, variations in connection conditions of both terminals during manufacturing are reduced, and the reliability of the module is stabilized.

In the panel mounting method of the thirteenth aspect, since the connecting material is an anisotropic conductive film, the know-how of existing equipment and connecting technology is utilized. Therefore, the module can be easily mass-produced in a short period of time with a small investment.

According to a fourteenth aspect of the present invention, in the panel mounting method, between the first connecting member connecting the electrode terminals of each group on the peripheral portion of the panel and the output terminal of each flexible wiring board, and between each group. When the second connecting material connecting the relay terminal of the flexible wiring board on one side and the input terminal of the flexible wiring board on the other side on the above gap is a different connecting material, The connection material is selected according to the resistance specifications required for each connection point. Therefore, the reliability is further improved. Further, corresponding terminals are collectively connected, and there is no step of connecting the flexible wiring board and the common wiring board. Therefore, the man-hours are reduced and the cost is reduced.

In the panel mounting method according to the fifteenth aspect, since the first connecting material is solder and the second connecting material is an anisotropic conductive film, existing know-how of equipment and connection technology is utilized. It Therefore, the module can be easily mass-produced in a short period of time with a small investment.

In the panel mounting method according to the sixteenth aspect, the terminals, which are aligned in opposition to each other, are pressed together at once by using a clip made of a shape memory alloy or a shape memory resin having a U-shaped cross section. Each terminal is easily connected. Further, when the driving IC mounted on the specific flexible wiring board is found to be defective after mounting, the flexible wiring board including the driving IC is easily replaced by removing the clip. At this time,
There is no need to wipe the connecting material.

In the panel mounting method according to the seventeenth aspect, an operation test is performed every time each flexible wiring board is connected to a group of electrode terminals on the peripheral portion of the panel. Therefore, a drive IC with poor connection or operation is mounted. The flexible board is immediately replaced. Therefore, as compared with the case where the operation test is collectively performed after the module is completed, when the connection process is not stable, the drive IC is prone to electrostatic breakdown, or when the drive IC is used without inspection. As a result, rework may decrease and man-hours may decrease.

In the panel mounting method according to the eighteenth aspect, after the flexible wiring board is connected to the electrode terminals of every other group of the electrode terminals at the peripheral portion of the panel, the operation test of the connected flexible wiring board is performed. Is done. At this stage, the flexible wiring boards are arranged in every other group and do not overlap each other. Therefore, if a connection failure or electrostatic damage of the driving IC is found in the operation test, the flexible wiring boards are easy to use. Removed and replaced. Then, after the flexible wiring board is connected to the remaining unconnected electrode terminals of the group, an operation test of the connected flexible wiring board is performed. The flexible wiring board newly connected at this stage overlaps with the flexible wiring board previously connected. Therefore, when connection failure or electrostatic damage to the driving IC is found, only the flexible wiring board is connected. Are easily removed and replaced. As described above, according to this panel mounting method, only the flexible wiring board which is found to be defective is removed and easily replaced.

According to a nineteenth aspect of the present invention, there is provided a driving IC exchanging method.
Of the base surface of the flexible wiring board, the output terminal and the driving IC are left, leaving the part on one side where the input terminal and the spare input terminal are present and the part on the other side where the relay terminal and the spare relay terminal are present. Only the containing central portion is removed. Output terminals of the new flexible wiring board having the same configuration except for the flexible wiring board, the input terminal and the relay terminal, respectively, on the electrode terminal at the peripheral portion of the panel, the spare input terminal, and the spare relay terminal. , A spare input terminal and a spare relay terminal are connected correspondingly. As described above, according to this drive IC exchanging method, the drive IC is exchanged while leaving the flexible wiring boards arranged on one side and the other side of the flexible wiring board as they are. Therefore, the driving IC can be easily replaced.

In the method of exchanging the driving IC according to claim 20,
Driving IC only or driving I on flexible wiring board
After removing the base material of the flexible wiring board in the vicinity of C including the base material of the flexible wiring board in the vicinity of the new drive IC only or the new drive IC, the new drive IC is added to the above flexible Connect to the wiring board. Therefore, the driving IC can be easily replaced.

[0052]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The panel mounting structure and mounting method, the flexible wiring board, and the driving IC replacement method of the present invention will be described in detail below with reference to embodiments.

FIG. 1 shows a liquid crystal module according to an embodiment of the present invention when viewed obliquely. Liquid crystal panel 20
Is configured by enclosing a liquid crystal between a pair of glass substrates 1 and 2. A flexible wiring board 4, 4 ', 4 "having a driving IC 5 for driving the liquid crystal panel 20 is attached to a peripheral edge portion 2'of one side of the glass substrate 2, and a peripheral edge portion 2 of another side is attached. A flexible wiring board 4S, 4S 'on which a driving IC 5'for driving the liquid crystal panel 20 is mounted is attached to the "". The mounting structure of the peripheral portion 2'is the one to which the present invention is applied. On the other hand, the mounting structure of the peripheral portion 2 ″ is outside the scope of the present invention.

FIG. 2 (a) is a top view of the peripheral portion of one side of the liquid crystal panel 20 and the flexible wiring boards 4, 4 ', 4 ", and FIG. 2 (b) shows A- in FIG. 2 (a). A cross section taken along the line A and Fig. 3 respectively show the state before connecting the flexible wiring board, as shown in Fig. 2 (a), in the peripheral edge portion 2'of the liquid crystal panel 20 (glass substrate 2). A plurality of electrode terminals 3 are arranged along 2 '. The electrode terminals 3 are divided into corresponding groups of flexible wiring boards 4, 4', 4 ", and a gap is provided between each group. There is. The electrode terminal 3
Is connected to a pixel (not shown) inside the panel via a wiring 31. As shown in FIG. 3, at the corner of the panel peripheral portion 2 ', the same layer as the electrode terminals 3 is formed, and the driving IC
Circuit wiring 22 for transmitting a signal is provided to the circuit 5. The end of the circuit wiring 22 near the electrode terminal 3 is the relay terminal 21, and the end on the opposite side is the connector terminal 23.

On the other hand, the flexible wiring board 4 has the driving IC 5 mounted on the flexible base material surface 40 and has a wiring layer connected to the driving IC. This wiring layer is provided on the back side of the base material, and has an input terminal 41 and an output terminal 42.
And a relay terminal 43. The output terminal 42, the input terminal 41, and the relay terminal 43 are provided at a location corresponding to a group of the electrode terminals 3 of the panel peripheral portion 2 ', a gap on the left side in the figure of this group, and a gap on the right side of the group. ing. A rectangular protruding region 40a is provided at a portion where the input terminal 41 exists on the substrate surface 40 having a substantially rectangular shape as a whole.
On the other hand, a rectangular cutout region 40b is provided in the place where the relay terminal 43 exists. Further, the flexible wiring board 4 is provided with a circuit wiring 44 having a substantially U-shaped pattern for connecting the input terminal 41 and the relay terminal 43 through the lower surface of the driving IC. The output terminal 42
Is connected to the driving IC 5 via the wiring 45, while the input terminal 41 is connected to the driving IC 5 by the circuit wiring 44 passing through the lower surface of the driving IC 5. The driving IC 5 is
In the example of FIG. 4 (FIG. 4A shows a cross section on the input terminal side and FIG. 4B shows a cross section on the output terminal side), the bump electrodes 51 and 52 mounted on the front surface side of the base material are interposed. It is connected to the wirings 44 and 45. In addition, as shown in FIG.
Is a solder bump 53, 54 or an anisotropic conductive film (not shown)
It may be mounted on the back surface side of the base material via the above. Further, an insulating resin or the like (not shown) may be applied to the surface of the circuit wiring 44 in order to increase the insulation reliability between the wirings.
Further, in order to improve the display quality and the like, components such as capacitors and resistors may be mounted on the flexible wiring board 4.

In mounting, as shown in FIGS. 2A and 2B, the peripheral portion 2'of the liquid crystal panel 20 and the flexible wiring board 4 are opposed to each other, and the relay terminal 21 of the peripheral portion 2'of the panel is arranged. , The first group of electrode terminals 3 on the left end, and the input terminal 41 and the output terminal 42 of the flexible wiring board 4 are respectively 1
Align one to one. Then, the relay terminal 21, the electrode terminal 3 and the input terminal 41, the output terminal 42 are pressure-bonded to each other via the connecting material 6 such as an anisotropic conductive film, solder, or photo-curing resin. As a result, the corresponding terminals are collectively electrically connected. In this way, by using the same kind of connecting material on the output terminal side and the input terminal side of each flexible wiring board, the material supply process can be simplified. Next, the panel peripheral portion 2'and the flexible wiring board 4 '(having the same structure as the flexible wiring board 4) are opposed to each other,
The relay terminal 43 of the flexible wiring board 4, the second group of electrode terminals 3 on the peripheral edge of the panel, and the input terminal 41 'and the output terminal 42' of the flexible wiring board 4'are aligned with each other so that the corresponding terminals are connected to each other. Connection is made collectively via the connecting material 6 '. Similarly, the panel peripheral portion 2'and the flexible wiring board 4 "(having the same structure as the flexible wiring boards 4 and 4 ') are opposed to each other, and the relay terminal 43' of the flexible wiring board 4'and the panel peripheral edge are arranged. A third group of electrode terminals 3 of
Flexible wiring board 4 "input terminal 41", output terminal 4
2 ″ is aligned with each other, and the corresponding terminals are collectively connected via the connecting material 6 ″. After that, similarly to the conventional case, a control board (not shown) for supplying a signal for driving the liquid crystal panel 20 is connected to the connector terminal 23 of the panel peripheral portion 2 ′ via the connector 8. Since the circuit wiring 22 including the connector terminal 23 is provided in this manner, the signal from the control board can be input to the flexible wiring board 4 with a simple structure and a small number of parts and connection points. Can be supplied to.

In operation, a signal for driving is applied from the control board through the connector 8 to the circuit wiring 22 of the panel peripheral portion 2 '. This signal is transmitted from the relay terminal 21 to the input terminal 41 of the flexible wiring board 4 and the circuit wiring 44.
Is input to the driving IC 5 via The signal output from the driving IC 5 is the wiring 45 of the flexible wiring board 4, the output terminal 42, the first group of electrode terminals 3 on the peripheral portion of the panel, and the wiring 3.
1 to be supplied to the pixels (not shown) of the liquid crystal panel 20. As a result, the liquid crystal panel 20 is driven. Also,
The drive signal is branched at the bump portion 51, passes through the circuit wiring 44 of the flexible wiring board 4 and the relay terminal 43,
It is supplied to the input terminal 41 'of the flexible wiring board 4'adjacent to the flexible wiring board 4. The circuit wiring 4 of the flexible wiring board 4'from the input terminal 41 '
It is input to the driving IC 5 via 4 '. This drive IC
The signal output by 5 is supplied to the inside of the panel via the output terminal 42 'of the flexible wiring board 4'and the second group of electrode terminals 3 on the peripheral edge of the panel. In this way, signals are supplied to the flexible wiring boards 4'and 4 "that are adjacent to each other.

In this liquid crystal module, the common wiring board (see FIGS. 20 and 21) arranged on the side of the conventional panel is omitted, so that the module size can be reduced as compared with the conventional one. it can. In addition, the number of parts can be reduced and the weight of the module can be reduced. Also,
Since the number of parts is reduced in this way, the material cost can be reduced. Moreover, the input terminals and output terminals of the flexible wiring boards 4, 4 ', 4 "are connected to the corresponding terminals at the peripheral edge of the panel by connecting materials 6, 6', such as anisotropic conductive films.
6 ″, and the flexible wiring board 4 and the common wiring board are not connected.
(Note that the control board is connected to the circuit wiring 22 on the peripheral portion of the panel through a connector as in the conventional case.). Therefore, the number of steps can be reduced and the cost can be reduced as compared with the conventional case. In addition, since the number of parts is smaller and the module size is smaller than before, it is less susceptible to external forces. Moreover, since the number of times of connection is small, there is an effect that the probability of occurrence of defects is reduced. Therefore, the reliability of the module can be improved.

Further, each flexible wiring board 4, 4 ',
Since the same kind of connecting material is used for the 4 ″ output terminal side and the input terminal side to simplify the material supply process, the cost can be further reduced. Further, the connection conditions can be stabilized to further improve the reliability. In particular, when this type of connecting material is an anisotropic conductive film, the anisotropic conductive film is one of the mainstream connecting materials at present, so existing know-how of equipment and connection technology can be utilized. Therefore, the module can be easily mass-produced in a short period of time with a small investment.

Further, as shown in FIG. 7, the peripheral portion 2'of the panel 20 of the flexible wiring boards 4, 4 ', 4 "is formed.
The portion protruding laterally from may be bent by winding the panel peripheral portion 2 '. In this case, the size of the module can be further reduced. In this example, the flexible wiring boards 4S, 4S ″ arranged on the other side of the panel 20 are also bent by winding the peripheral edge portion 2 ″.

Further, as shown in FIG. 8, no corresponding connecting member is used between the corresponding terminals 3, 42, ..., With a clip 7 made of a shape memory alloy or shape memory resin having a U-shaped cross section. May be. In this case, the flexible wiring board 4,
After arranging 4 ′ and 4 ″ on the panel peripheral edge 2 ′ and aligning them, the corresponding terminals 3, 42, ... Can be easily connected by the ends 7a and 7b of the clip 7. When the driving IC mounted on the specific flexible wiring board is found to be defective after mounting, the flexible wiring board including the driving IC can be easily replaced by removing the clip 7, and the connecting material can be used. It is not necessary to remove the clip 7. In this example, the clip 7
A cushioning material 71 made of rubber or the like is provided between the end portion 7a of each of the flexible wiring boards 4, ... As shown in FIG. 2 (b), the regions where the output terminals 42, 42 ', ... of the flexible wiring boards 4, 4', ... exist and the relay terminals (adjacent flexible wiring boards overlap) 43, 43 ', The total thickness is different from the area where ... exists. Therefore, a cushioning material 71 such as a rubber material is provided so as to obtain an appropriate pressing force in each region.

In the mounting method described above, the flexible wiring boards are connected to each other, but as shown in the flow chart of FIG. 9, the flexible wiring boards 4, 4'and 4 "are collectively connected. That is, first of all, connecting materials 6, 6 ', to each flexible wiring board 4, 4', 4 "shown in FIG.
6 ″ is supplied (S1). Next, the flexible wiring board 4
Are arranged on the panel peripheral portion 2 ', and corresponding terminals are aligned with each other (S2). Similarly, the flexible wiring board 4'is arranged on the panel peripheral portion 2 ', and the corresponding terminals are aligned with each other (S3). Similarly, the flexible wiring board 4 ″ is arranged on the panel peripheral portion 2 ′ and the corresponding terminals are aligned with each other (S4). After that, all the corresponding terminals are collectively connected (S5). Further, the connection state inspection and the driving IC operation test are collectively performed (S6) In this case, the number of steps can be reduced and the cost can be further reduced. Since the connection conditions of the terminals can be the same, it is possible to reduce the variation in the connection conditions of both terminals at the time of manufacturing, and to improve the reliability of the module. It is possible to use the know-how of connection technology and connection technology, and therefore, it is possible to easily mass-produce modules in a short period of time with a small investment.

Further, as shown in the flow of FIG. 10, connection and inspection may be performed for each flexible wiring board 4, 4 ', 4 ". That is, first, each flexible wiring board shown in FIG. Wiring board 4, 4 ', 4 "to connection material 6, 6',
6 ″ is supplied (S11). Next, the flexible wiring board 4 is arranged on the panel peripheral portion 2 ′, the corresponding terminals are aligned and connected (S12), and then the connection state is inspected. Then, an operation test of the driving IC is performed (S13) .If the connection or operation is defective, rework is performed. Similarly, the flexible wiring board 4'is arranged on the panel peripheral portion 2'and the corresponding terminals are connected to each other. Align and connect (S1
4) Then, the connection state is inspected and the driving IC is tested for operation (S15). If the connection or operation is bad, rework is performed. Similarly, the flexible wiring board 4 ″ is arranged on the panel peripheral portion 2 ′, and the corresponding terminals are aligned and connected (S16). Subsequently, the connection state inspection and the drive IC operation test are performed. (S17) If the connection is poor or the operation is defective, rework is performed. In this way, after the connection and connection state are inspected for each flexible wiring 4, 4 ', 4 ", and the operation test of the driving IC is performed, Since the adjacent flexible wiring boards are connected to each other, the flexible board on which the drive IC having poor connection or malfunction is mounted is immediately replaced. Therefore, as compared with the case where the operation test is collectively performed after the module is completed, when the connection process is not stable, the drive IC is prone to electrostatic breakdown, or when the drive IC is used without inspection. In addition, the man-hours can be reduced as a whole, and the cost can be reduced.

FIG. 11 shows each of the above flexible wiring boards 4,
4'and 4 "are mounted on the output terminal side and the input terminal side using different kinds of connecting materials. That is, the electrode terminals 3 and the flexible wiring boards 4 of each group at the peripheral portion of the panel are shown.
The output terminals 4'and 4'are connected to each other by one anisotropic conductive film 60 as a first connecting material, while the flexible wiring board 4 existing on the left side, for example, on the gap between the groups. Of the relay terminal 43 and the input terminal 41 'of the flexible wiring board 4'on the right side are solder 61, 62 as the second connecting material.
Connected by. Similarly, the relay terminals 43 'of the flexible wiring board 4'and the input terminals 41 "of the flexible wiring board 4" are soldered as the second connecting material 61', 6 '.
Connected by 2 '. Note that the connector terminal 2
3 and the connector 8 are also connected by the anisotropic conductive film 60.

In mounting, as shown in the flow chart of FIG. 12, first, the input terminals and relay terminals (the input terminals of the leftmost flexible wiring board 4) of the flexible wiring boards 4, 4 ', 4 "shown in FIG. Are supplied as the second connecting material (S21) (S21) Note that only one of the input terminal and the relay terminal may be supplied. One sheet of anisotropic conductive film 60 is supplied to the area covering the electrode terminals 3, relay terminals 21 and connector terminals 23 of each group 2 '(S22). 2'is arranged and corresponding terminals are aligned with each other (S23).
Similarly, the flexible wiring board 4'is arranged on the panel peripheral portion 2 ', and the corresponding terminals are aligned with each other (S2).
4). Similarly, the flexible wiring board 4 ″ is arranged on the panel peripheral portion 2 ′ and the corresponding terminals are aligned with each other (S25). Further, the connector 8 is arranged on the panel peripheral portion 2 ′ and the connector terminals 23 are arranged. Align with (S2
6). After that, all corresponding terminals are collectively connected, and the connection state inspection and the drive IC operation test are collectively performed (S27).

In this way, each flexible wiring board 4,
When different kinds of connecting materials are used for the 4'and 4 "output terminal side and the input terminal side, the connecting material can be selected according to the resistance specifications required at each connection point, and therefore the reliability can be further improved. In addition, the corresponding terminals can be collectively connected, and there is no step of connecting the flexible wiring board and the common wiring board, so that the number of steps can be reduced and the cost can be reduced. First above
Since the connecting material is an anisotropic conductive film and the second connecting material is solder, the know-how of existing equipment and connection technology can be utilized. Therefore, the module can be easily mass-produced in a short period of time with a small investment.

FIGS. 13 (a) and 13 (b) show an example in which flexible wiring boards of different configurations are arranged and mounted on the odd-numbered electrode terminal groups and the even-numbered electrode terminal groups of the panel peripheral portion 2 '. Shows. That is, in the odd-numbered, for example, the leftmost first flexible wiring board 46, rectangular cutout regions 50a are formed at the locations where the input terminals 41 and the relay terminals 43 are present in the substantially rectangular substrate surface 50 as a whole. , 50b are provided. The third flexible wiring board 46 ″ from the left side also has the same configuration as this flexible wiring board 46. On the other hand, the flexible wiring board 46 ′ arranged in the even-numbered, here second from the left, electrode terminal group. Has
The input terminal 4 of the substrate surface 50 'having a substantially rectangular shape as a whole
1 ', the rectangular protruding regions 50a', 50b 'are provided at the positions where the relay terminals 43 are present. The other parts of each flexible wiring board 46, 46 ', 46 "have the same structure as the flexible wiring board 4 shown in FIG.

Upon mounting, as shown in the flow chart of FIG. 14, anisotropic conductive films 63, 63 'are used as connecting materials at the output terminals, input terminals, and relay terminals of the flexible wiring boards 46, 46', 46 ". , 63 ″ are supplied (S31). Next, the flexible wiring boards 46 and 46 ″ are arranged on the odd-numbered panel peripheral portion 2 ′, that is, the leftmost first electrode terminal group and the third electrode terminal group in the example of FIG. The electrode terminals 3, 3, ... And the output terminals 42, 42 ″ are aligned and connected (S32). Next, the connection state of the connected flexible wiring boards 46, 46 "is inspected and the operation test of the driving IC 5 is performed (S33). If the connection or the operation is defective, rework is performed. Since 46 ″ are arranged in every other group and do not overlap each other, the flexible wiring board can be easily removed and replaced when connection failure or electrostatic damage to the driving IC is found. Next, the flexible wiring board 46 'is arranged on the even-numbered, here, second electrode terminal group of the panel peripheral portion 2', and the output terminal 42 ', the input terminal 41', and the relay terminal of the flexible wiring board 46 'are arranged. 43 'are aligned and connected to the unconnected second group of electrode terminals 3, the relay terminal 43 of the flexible wiring board 46, and the input terminal 41 "of the flexible wiring board 46" (S).
34). Next, an inspection of the connection state of the connected flexible wiring board 46 'and an operation test of the driving IC 5 are performed (S).
33). If the connection or operation is bad, rework is performed. Flexible wiring board 4 newly connected at this stage
6'is the flexible wiring boards 46, 4 previously connected.
Since it is overlapped on the 6 ″, if a connection failure or electrostatic damage to the driving IC is found, the flexible wiring board 4
Only 6'can be easily removed and replaced. in this way,
According to this panel mounting method, it is possible to remove only the flexible wiring board which is found to be defective, and it is possible to easily replace it.

15 (a) and 15 (b) show another liquid crystal module to which the present invention is applied. The same figure (a) is the liquid crystal panel 2
Peripheral part of one side of 0 'and flexible wiring board 47, 4
FIG. 7B shows a cross section of the peripheral portion of the panel when 7 ', 47 "is viewed from above. As shown in FIG. 7A, the peripheral portion of the liquid crystal panel 20' (glass substrate 2) is shown. 2'in FIG.
Similar to the liquid crystal panel 20 shown in FIG. 2, a plurality of electrode terminals 3 are arranged along the peripheral edge 2 '. The electrode terminal 3 is divided into corresponding groups of flexible wiring boards 47, 47 ', 47 ", and a gap is provided between the groups. The electrode terminal 3 is provided inside the panel via the wiring 31. It is connected to a pixel (not shown) and is formed in the same layer as the electrode terminal 3 at the corner of the panel peripheral portion 2'and has a substantially U shape (rectangular shape) for transmitting a signal to the driving IC 5. including)
Circuit wiring 82 having a pattern is provided. An end portion of the circuit wiring 82 near the electrode terminal 3 serves as a relay terminal 81, and an opposite end portion thereof serves as a connector terminal 83.

On the other hand, as shown in FIG. 16, the flexible wiring board 47 (having the same structure as the flexible wiring boards 47 ', 47 ") has a flexible base material surface 70.
The drive IC 55 is mounted and has a wiring layer connected to the drive IC. This wiring layer is provided on the back surface side of the base material and includes an input terminal 71, an output terminal 72, and a relay terminal 73. The output terminal 72, the input terminal 71, and the relay terminal 73 are respectively the electrode terminals 3 of the panel peripheral portion 2 '.
A group of left side gaps in the figure of this group and a right side gap of the above group. A rectangular cutout region 70b is provided at a position where the relay terminal 73 exists on the substantially rectangular base material surface 70 as a whole. In this example, the input terminal 71 is lined with the base material surface 70a. Further, a slit 70 e is provided in the gap between the input terminal 71 and the output terminal 72 on the base material surface 70.
Further, the cutout region 70b at the position of the relay terminal 73 substantially forms a slit between the flexible wiring board and the adjacent flexible wiring board after mounting. Further, the flexible wiring board 47 has a substantially U-shaped pattern of circuit wiring 74 that connects the input terminal 71 and the relay terminal 73 through the lower surface of the driving IC.
Is provided. A spare input terminal 76 is provided on the side of the circuit wiring 74 where the input terminal 71 is present, while a spare relay terminal 77 is provided on the side of the circuit wiring 74 where the relay terminal 73 is present. Rectangular holes 70c and 70d are provided in the base material surface 70 at locations where the spare input terminal 76 and the spare relay terminal 77 are present. Output terminal 7
2 is connected to the driving IC 5 via the wiring 75, while the input terminal 71 is a circuit wiring 74 passing through the lower surface of the driving IC 55.
Is connected to the driving IC 5. Driving IC5
5 is connected to the wirings 74 and 75 via bump electrodes 56, 56 ', ..., 56 "; 59.

The drive IC 55 has a bump group 5
A wiring 74b having a pattern that reverses the arrangement order of the signals input to 6, 56 ', ..., 56 "is provided. The signals input to the bump groups 56, 56' ,.
Bump groups 57, 57 ', ..., 57 "provided on the opposite side
Appears in a state where the order is reversed. As a result, after mounting, signals can be supplied to the input terminals of the adjacent flexible wiring boards in the same arrangement order as the original arrangement order.

The mounting may be performed according to the same flow as that shown in FIG. 9, for example. That is, first, FIG. 15 (b)
The connecting materials 85, 85 ', 85 "are supplied to the flexible wiring boards 47, 47', 47" shown in (S1). Next, the flexible wiring board 47 is arranged on the panel peripheral portion 2 ', and the corresponding terminals are aligned with each other (S2). Similarly, the flexible wiring board 47 'is arranged on the panel peripheral portion 2', and the corresponding terminals are aligned with each other (S
3). Similarly, the flexible wiring board 47 ″ is arranged on the panel peripheral portion 2 ′ and the corresponding terminals are aligned with each other (S4). Thereafter, all the corresponding terminals are collectively connected (S5). Further, the connection state inspection and the driving IC operation test are collectively performed (S6) In this case, the number of steps can be reduced and the cost can be further reduced. Since the connection conditions of the terminals can be the same, it is possible to reduce the variation in the connection conditions of both terminals at the time of manufacturing, and to improve the reliability of the module. It is possible to use the know-how of connection technology and connection technology, and therefore, it is possible to easily mass-produce modules in a short period of time with a small investment.

During operation, a drive signal is applied from a control board (not shown) to the circuit wiring 82 of the panel peripheral portion 2'through the electrode terminal 88 and the relay terminal 83 of the connector 8 shown in FIG. 15 (a). This signal is transmitted from the relay terminal 81 to the input terminal 71 and the circuit wiring 74 of the flexible wiring board 4.
Is input to the driving IC 55. This driving IC5
The signal output by 5 is the wiring 75 of the flexible wiring board 4,
It is supplied to the pixel (not shown) of the liquid crystal panel 20 'through the output terminal 72, the first group of electrode terminals 3 at the peripheral portion of the panel, and the wiring 31. As a result, the liquid crystal panel 20 'is driven.
Further, the drive signals are the bump portions 56, 56 ', ...,
The circuit wiring 74 of the driving IC 55 is branched at 56 ″.
It is supplied to the input terminal 71 'of the flexible wiring board 47' adjacent to the flexible wiring board 47 through the circuit wiring 74c of the flexible wiring board 47 and the relay terminal 73b. Then, it is input from the input terminal 71 'to the driving IC 55 through the circuit wiring 74' of the flexible wiring board 47 '. The signal output from the driving IC 55 is supplied to the inside of the panel via the output terminal 72 'of the flexible wiring board 47' and the second group of electrode terminals 3 on the peripheral edge of the panel. In this way, the flexible wiring boards 4 adjacent to each other one after another
A signal is supplied to 7 ', 47 ".

In this liquid crystal module, like the one shown in FIGS. 2 (a) and 2 (b), the number of parts, man-hours and weight are reduced.
It is possible to achieve the operational effects of module size reduction, cost reduction, and high reliability. Moreover, the driving IC mounted on the specific flexible wiring board after mounting
If it is found that the drive IC is defective, the drive IC can be easily replaced.

For example, as shown in FIG. 17, it is assumed that the driving IC 55 of the second flexible wiring board 47 'from the left end of the panel peripheral portion 2'becomes defective in the market after mounting. First, the portion of the base material surface 70 'that protrudes laterally from the panel peripheral portion 2'is cut along the lines C and D until it reaches the slits 70e' and 70b '. Since the portion to be cut does not overlap the peripheral portion 2'of the panel, it can be easily cut. Also, the second group of electrode terminals 3 on the panel peripheral portion 2'and the output terminals 72 'are peeled off to release the connection. The connecting material remaining on the electrode terminals 3 of the second group is wiped off with a solvent or the like. As a result, FIG.
As shown in FIG. 5, the base material surface 70 ′ is left with the left side portion where the input terminal 71 ′ and the spare input terminal 76 ′ are present and the right side portion where the relay terminal and the spare relay terminal 77 ′ are present. Output terminal 72 'of 70', drive IC 5
Remove the central part containing 5. Next, on the second group of electrode terminals 3, the spare input terminal 76 ', and the spare relay terminal 77' (the input terminal 71 "of the adjacent flexible wiring board 47") of the panel peripheral portion 2 ', the above-mentioned flexible portions are respectively provided. An output terminal, a spare input terminal, and a spare relay terminal of a new flexible wiring board having the same structure as the wiring board 47 'are connected in association with each other. In this way, the defective drive IC 55 can be easily replaced. Note that, as shown in FIG.
As a new flexible wiring board, the flexible wiring board 48 from which the input terminal and the relay terminal are removed may be used. In the flexible wiring board 48, portions of the base material surface 90 corresponding to input terminals and relay terminals unnecessary for rework are removed to form cutout areas 90a and 90b. Other than that, the configuration is the same as that of the flexible wiring board 47 shown in FIG.

As another reworking method, i) a crimping structure using clips as shown in FIG. 8 is used.
Method of replacing by removing clip, ii) Solder bump 5 with drive IC 5 as shown in FIG.
3, 54, and a method of replacing only the driving IC 5 with a new driving IC, iii) As shown in FIG. 6, the protective resin 9 shown in FIG. A method is conceivable, such as a method of cutting and removing at line H, connecting a new non-defective IC 92, and then applying a protective resin (Japanese Patent Publication No. 3-29304).

FIG. 19 shows a modification of the mounting structure shown in FIGS. 15 (a) and 15 (b). In this mounting structure, the electrode terminal 88 'of the control board 8'is directly connected to the spare input terminal 76 of the leftmost flexible wiring board 47. A signal can be directly supplied from the electrode terminal 88 'to the auxiliary input terminal 76 of the flexible wiring board 47. With this structure, the number of connectors can be reduced, and the number of parts and the weight can be reduced. Furthermore, the number of connection points can be reduced, and the number of steps can be reduced. Therefore, the cost can be further reduced.

In this embodiment, the number of flexible wiring boards arranged on the peripheral portion of the panel is three, but the number of flexible wiring boards is not limited to this. The present invention can be applied to the case where other numbers of flexible wiring boards are arranged. Further, it can be applied not only to one side of the panel but also to the remaining sides at the same time.

[0079]

As is apparent from the above, in the panel mounting structure according to the first aspect, the common wiring board (see FIGS. 20 and 21) arranged on the side of the conventional panel can be omitted. The size of the module can be reduced in comparison with. In addition, the number of parts can be reduced and the weight of the module can be reduced. Moreover, since the number of parts can be reduced in this way, the material cost can be reduced. Moreover, the electrode terminals on the peripheral portion of the panel, the output terminals of the flexible wiring board, and the relay terminals of the flexible wiring board and the input terminals of the adjacent flexible wiring board are collectively connected via, for example, anisotropic conductive material or solder. Moreover, there is no step of connecting the flexible wiring board and the common wiring board. Therefore, it is possible to reduce the number of steps and cost as compared with the conventional case. In addition, since the number of parts is smaller and the module size can be made smaller than before, it is less susceptible to external forces, and since the number of connections is also small, the effects such as the probability of failure occurrence are reduced, and the reliability of the module is improved. Can be increased.

According to a second aspect of the present invention, in the panel mounting structure, between the first connecting member connecting the electrode terminals of each group and the output terminal of each flexible wiring board at the peripheral edge of the panel, and between each group. Since, on the above-mentioned gap, the second connecting member connecting the relay terminal of the flexible wiring board existing on one side and the input terminal of the flexible wiring board existing on the other side is the same kind of connecting material, The material supply process can be simplified. Therefore, the cost can be further reduced. In addition, the connection conditions can be stabilized and the reliability can be further improved.

In the panel mounting structure of claim 3, since the same type of connecting material is an anisotropic conductive film and is one of the current mainstream connecting materials, it is possible to utilize the know-how of existing equipment and connection technology. . Therefore, the module can be easily mass-produced in a short period of time with a small investment.

In the panel mounting structure according to the fourth aspect, since the first connecting material and the second connecting material are different kinds of connecting materials, the connecting material according to the resistance specifications required at each connection location. Can be selected. Therefore, the reliability can be further improved.

In the panel mounting structure according to the fifth aspect, since the first connecting material is the anisotropic conductive film and the second connecting material is solder, the know-how of existing equipment and connection technology can be utilized. . Therefore, the module can be easily mass-produced in a short period of time with a small investment.

The panel mounting structure according to the sixth aspect of the invention has the same effect as the first aspect. Moreover, since the clip made of a shape memory alloy or shape memory resin having a U-shaped cross section is provided, the corresponding terminals can be easily connected by the clip. Further, when the driving IC mounted on a specific flexible wiring board is found to be defective after mounting, the flexible wiring board including the driving IC can be easily replaced by removing the clip. At this time, it is not necessary to remove the connecting material.

In the panel mounting structure according to claim 7, a circuit wiring for transmitting a signal to be input to the driving IC is provided at a corner of the peripheral portion of the panel, and the circuit wiring includes:
Since the input terminal or the relay terminal of the flexible wiring board closest to the corner among the plurality of flexible wiring boards is connected, a signal from the outside is sent to the driving IC on the flexible wiring board with a simple structure. Can be supplied.

In the panel mounting structure according to claim 8, a control board having a circuit wiring for transmitting a signal to be input to the driving IC is provided in parallel at the peripheral portion of the panel, and the circuit wiring of the control board is Since the input terminal or the relay terminal of the flexible wiring board closest to the corner of the panel peripheral portion among the plurality of flexible wiring boards is connected, the number of components and the number of connection points can be reduced. Therefore, reliability can be improved.

In the panel mounting structure according to claim 9, the portion of the flexible wiring board that protrudes laterally from the peripheral edge of the panel is bent by winding the peripheral edge of the panel. Can be further reduced.

When a module is constructed by using the flexible wiring board according to the tenth aspect, as in the first aspect, the operational effects of reduction of parts, reduction of man-hours, weight reduction, module size reduction, cost reduction and high reliability are achieved. Play. Moreover, when it is determined that the driving IC mounted on the specific flexible wiring board is defective after mounting, the driving IC can be easily replaced.

In the flexible wiring board according to the eleventh aspect, slits are provided in the gap between the input terminal and the output terminal and the gap between the output terminal and the relay terminal on the base material surface of the flexible wiring board. Since it is provided, when the driving IC mounted on the specific flexible wiring board is found to be defective after mounting, the remaining portion including the output terminal and the driving IC on the base material surface is removed. At this time, the portion protruding laterally from the peripheral portion of the panel may be cut substantially perpendicular to the peripheral portion of the panel up to the slit. Thereby, the driving IC can be replaced more easily.

In the panel mounting method of the twelfth aspect, corresponding terminals are collectively connected using the same type of connecting material. Further, there is no step of connecting the flexible wiring board and the common wiring board. Therefore, the number of steps can be reduced and the cost can be reduced. Further, by making the connection conditions of the input terminal and the output terminal the same, variations in connection conditions of both terminals at the time of manufacturing can be reduced, and the reliability of the module can be improved.

In the panel mounting method according to the thirteenth aspect, since the connecting material is an anisotropic conductive film, the know-how of existing equipment and connecting technology can be utilized. Therefore, the module can be easily mass-produced in a short period of time with a small investment.

According to a fourteenth aspect of the present invention, in the panel mounting method, between the first connecting member connecting the electrode terminals of each group on the peripheral edge of the panel and the output terminal of each flexible wiring board, and between each group. When the second connecting material connecting the relay terminal of the flexible wiring board on one side and the input terminal of the flexible wiring board on the other side on the above gap is a different connecting material, The connection material can be selected according to the resistance specifications required for each connection point. Therefore, the reliability can be further improved. In addition, corresponding terminals can be connected together, and there is no step of connecting the flexible wiring board and the common wiring board. Therefore, the number of steps can be reduced and the cost can be reduced.

In the panel mounting method of the fifteenth aspect, since the first connecting material is solder and the second connecting material is an anisotropic conductive film, the know-how of existing equipment and connection technology can be utilized. . Therefore, the module can be easily mass-produced in a short period of time with a small investment.

In the panel mounting method of the sixteenth aspect, since the clips made of a shape memory alloy or a shape memory resin having a U-shaped cross section are used to press the terminals aligned and opposed to each other at once, Each terminal can be easily connected. Further, when the driving IC mounted on a specific flexible wiring board is found to be defective after mounting, the flexible wiring board including the driving IC can be easily replaced by removing the clip. At this time,
There is no need to wipe the connecting material.

According to the panel mounting method of the seventeenth aspect, an operation test is performed every time each flexible wiring board is connected to a group of electrode terminals on the peripheral portion of the panel. Therefore, a drive IC with poor connection or operation is mounted. The flexible board can be replaced immediately. Therefore, as compared with the case where the operation test is collectively performed after the module is completed, when the connection process is not stable, the drive IC is prone to electrostatic breakdown, or when the drive IC is used without inspection. For example, the man-hours can be reduced as a whole.

In the panel mounting method of the eighteenth aspect, after the flexible wiring board is connected to the electrode terminals of every other group of the electrode terminals at the peripheral portion of the panel, the operation test of the connected flexible wiring board is performed. I do. At this stage, the flexible wiring boards are arranged in every other group and do not overlap each other.
If the electrostatic breakdown of is found, the flexible wiring board can be easily removed and replaced. After this, after the flexible wiring board is connected to the remaining unconnected group of electrode terminals,
An operation test of the connected flexible wiring board is performed.
The flexible wiring board newly connected at this stage overlaps with the flexible wiring board previously connected. Therefore, when connection failure or electrostatic damage to the driving IC is found, only the flexible wiring board is connected. Can be easily removed and replaced. Thus, according to this panel mounting method, it is possible to remove only the flexible wiring board which is found to be defective and easily replace it.

According to a nineteenth aspect of the present invention, there is provided a method for exchanging drive ICs,
The drive IC can be replaced by leaving the flexible wiring boards arranged on one side and the other side of the flexible wiring board as they are. Therefore, it is possible to easily replace the driving IC.

In the method of exchanging the driving IC according to claim 20,
The driving IC can be replaced by leaving only the driving IC or a portion other than the vicinity thereof as it is. Therefore, it is possible to easily replace the driving IC.

[Brief description of drawings]

FIG. 1 is a diagram showing a liquid crystal module according to an embodiment of the present invention when viewed obliquely.

FIG. 2 is a diagram showing a main part of the liquid crystal module.

FIG. 3 is a diagram showing each component before mounting the liquid crystal module.

FIG. 4 is a diagram showing a cross section around a driving IC of the liquid crystal module.

FIG. 5 is a diagram showing a modified example around a driving IC of the liquid crystal module.

FIG. 6 is a diagram illustrating a method of replacing a driving IC of the liquid crystal module.

FIG. 7 is a diagram showing a modification of the liquid crystal module.

FIG. 8 is a diagram showing a modification of the liquid crystal module.

FIG. 9 is a diagram illustrating a mounting process flow of the liquid crystal module.

FIG. 10 is a diagram illustrating a mounting process flow of the liquid crystal module.

FIG. 11 is a diagram showing a modification of the liquid crystal module.

FIG. 12 is a diagram illustrating a mounting process flow of the liquid crystal module shown in FIG. 11.

FIG. 13 is a diagram showing a modification of the liquid crystal module.

FIG. 14 is a diagram illustrating a mounting process flow of the liquid crystal module shown in FIG.

FIG. 15 is a diagram showing a modification of the liquid crystal module.

16 is a diagram showing a flexible wiring board used to mount the liquid crystal module of FIG.

FIG. 17 is a diagram illustrating a method of replacing the driving IC of the liquid crystal module.

FIG. 18 is a diagram illustrating a method of replacing the driving IC of the liquid crystal module.

FIG. 19 is a diagram showing a modification of the liquid crystal module.

FIG. 20 is a diagram showing a conventional liquid crystal module when viewed obliquely.

FIG. 21 is a diagram showing a cross section of a conventional liquid crystal module.

[Explanation of symbols]

1, 2 glass substrate 2'panel peripheral portion 3 electrode terminals 4, ..., 4 ", 46, ... 46", 47, ..., 47 ", 4
8, 4S, 4S 'Flexible wiring board 5, 55 Driving IC 6, 6, 6 ", 60, 61, 61', 62, 62 ', 6
3, ..., 63 ", 85, ..., 85" Connection material 20, 20 'Liquid crystal panel 41, ..., 41 ", 71, ... 71" Input terminal 42, ..., 42 ", 72, ..., 72", 92 ′ Output terminals 21, 43, ..., 43 ″, 73, ..., 73 ″, 81 Relay terminals 22, 44, ..., 44 ″, 74, ..., 74 ″, 94 ′
Circuit wiring

Claims (20)

[Claims] 1. A driving IC for driving the panel is mounted on a flexible base material surface on the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, A panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the drive ICs and electrically connecting circuit wirings for transmitting a signal given from the outside to the flexible wiring boards. In the mounting structure, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and the electrode terminals at the peripheral portion of the panel of the flexible wiring board are provided. , A gap on one side of the one group, and a gap on the other side of the one group, at a location corresponding to the output terminal, the input terminal, and the relay terminal, each of which is a part of the wiring layer. Circuit wiring for connecting the input terminal and the relay terminal is provided, the flexible wiring boards are overlapped on the peripheral portion of the panel, the electrode terminals of each group of the panel peripheral portion and the flexible wiring are provided. The output terminals of the board are respectively electrically connected to each other by the first connecting member, and the relay terminal of the flexible wiring board existing on one side and the other side of the other side on the gap between the groups. The mounting structure of the panel, wherein the flexible wiring board and the input terminal of the flexible wiring board are electrically connected to each other by a second connecting material. 2. The panel mounting structure according to claim 1, wherein the first connecting material and the second connecting material are the same kind of connecting material. 3. The panel mounting structure according to claim 2, wherein the connecting material of the same kind is an anisotropic conductive film. 4. The panel mounting structure according to claim 1, wherein the first connecting material and the second connecting material are different kinds of connecting materials. 5. The panel mounting structure according to claim 4, wherein the first connecting material is an anisotropic conductive film, and the second connecting material is solder. . 6. A driving IC for driving the panel is mounted on a flexible base material surface of the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, A panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the drive ICs and electrically connecting circuit wirings for transmitting a signal given from the outside to the flexible wiring boards. In the mounting structure, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and the electrode terminals at the peripheral portion of the panel of the flexible wiring board are provided. , A gap on one side of the one group, and a gap on the other side of the one group, at a location corresponding to the output terminal, the input terminal, and the relay terminal, each of which is a part of the wiring layer. Circuit wiring for connecting the input terminal and the relay terminal is provided, the flexible wiring boards are overlapped on the peripheral portion of the panel, the electrode terminals of each group of the panel peripheral portion and the flexible wiring are provided. The output terminals of the board correspond to each other, and on the gap between the groups, the relay terminals of the flexible wiring board existing on one side and the input terminals of the flexible wiring board existing on the other side correspond to each other, Made of shape memory alloy or shape memory resin with U-shaped cross section,
A mounting structure for a panel, wherein a clip is provided to press the corresponding terminals into pressure contact with each other. 7. The panel mounting structure according to claim 1, wherein a circuit wiring for transmitting a signal to be input to the driving IC is provided at a corner of the panel peripheral portion, and the plurality of circuit wirings are provided in the circuit wiring. Of the flexible wiring board, the input terminal or the relay terminal of the flexible wiring board closest to the corner is connected to the panel mounting structure. 8. The panel mounting structure according to claim 1, wherein a control board having circuit wiring for transmitting a signal to be input to the driving IC is arranged in parallel at the peripheral portion of the panel, A panel mounting structure, wherein an input terminal or a relay terminal of a flexible wiring board, which is closest to a corner of the panel peripheral portion of the plurality of flexible wiring boards, is connected to the circuit wiring. 9. A panel mounting structure, wherein a portion of the flexible wiring board that protrudes laterally from the peripheral edge of the panel is bent by winding the peripheral edge of the panel. 10. A flexible wiring board to be electrically connected to the electrode terminals of a panel, wherein a plurality of groups of electrode terminals are arranged along the peripheral edge of one surface and a gap is provided between the groups. Then, a driving IC for driving the panel is mounted on the surface of the base material having flexibility, and a wiring layer connected to the driving IC is provided, and an electrode at the peripheral portion of the panel on the surface of the base material. An output terminal, an input terminal, and a relay terminal formed of a part of the wiring layer, respectively, at locations corresponding to the one group of terminals, the gap on one side of the one group, and the gap on the other side of the one group. And a circuit wiring for connecting the input terminal and the relay terminal, and a spare input terminal and a relay terminal are formed on the sides of the circuit wiring where the input terminal and the relay terminal exist, respectively. Flexible arrangement characterized by Line board. 11. The flexible wiring board according to claim 10, wherein a gap between the input terminal and the output terminal and a gap between the output terminal and the relay terminal are provided on the base material surface of the flexible wiring board. A flexible wiring board having a slit provided on at least one side thereof. 12. A driving IC for driving the panel is mounted on a flexible base material surface of the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, Mounting of a panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the driving IC and electrically connecting circuit wirings for transmitting a signal applied from the outside to each of the flexible wiring boards. In the method, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one of the electrode terminals at the peripheral portion of the panel of the flexible wiring board is formed. Group, the gap on one side of the one group, and the gap on the other side of the one group, each of which is formed of a part of the wiring layer and connected to the driving IC. In addition to providing the input terminal and the relay terminal, the circuit wiring for connecting the input terminal and the relay terminal is provided, and after supplying the same kind of connecting material to the input terminal, the output terminal, and the relay terminal of each flexible board, The output terminals of the flexible wiring board are aligned so as to face the one group of electrode terminals of the panel peripheral portion, and subsequently, the output terminals and the input terminals of another flexible wiring board are respectively arranged on the panel peripheral portion of the panel peripheral portion. After the positioning of the last flexible wiring board is completed and aligned, the terminals of the group adjacent to the group of electrodes and the relay terminal of the one flexible wiring board are aligned, and then the terminals are aligned and aligned with each other. Panel mounting method characterized by connecting all at once. 13. The panel mounting method according to claim 12, wherein the connecting material is an anisotropic conductive film. 14. A driving IC for driving the panel is mounted on a flexible base material surface on the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, Mounting of a panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the driving IC and electrically connecting circuit wirings for transmitting a signal applied from the outside to each of the flexible wiring boards. In the method, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one of the electrode terminals at the peripheral portion of the panel of the flexible wiring board is formed. Group, the gap on one side of the one group, and the gap on the other side of the one group, each of which is formed of a part of the wiring layer and connected to the driving IC. In addition to providing an input terminal and a relay terminal, providing circuit wiring for connecting the input terminal and the relay terminal, supplying a second connecting material to the relay terminal in advance, and connecting the electrode terminal of the panel to the second connection material. After supplying the first connecting material different from the material, the output terminals of the one flexible wiring board are aligned so as to face the one group of electrode terminals of the panel peripheral portion, and then the other flexible The output terminal and the input terminal of the wiring board are aligned so as to face the electrode terminals of the group adjacent to the one group and the relay terminal of the one flexible wiring board on the peripheral edge of the panel, respectively, and A method for mounting a panel, characterized in that after the alignment is completed, the terminals aligned and opposed to each other are collectively connected. 15. The panel mounting method according to claim 14, wherein the first connecting material is an anisotropic conductive film, and the second connecting material is solder. . 16. A driving IC for driving the panel is mounted on the flexible base material surface of the panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, Mounting of a panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the driving IC and electrically connecting circuit wirings for transmitting a signal applied from the outside to each of the flexible wiring boards. In the method, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one of the electrode terminals at the peripheral portion of the panel of the flexible wiring board is formed. Group, the gap on one side of the one group, and the gap on the other side of the one group, each of which is formed of a part of the wiring layer and connected to the driving IC. In addition to providing an input terminal and a relay terminal, a circuit wiring for connecting the input terminal and the relay terminal is provided, and the flexible wiring boards are overlapped on the peripheral portion of the panel, and the electrode terminals of each group of the peripheral portion of the panel. And the output terminal of each of the flexible wiring boards are opposed to each other and aligned, and the relay terminal of the flexible wiring board existing on one side and the flexible wiring existing on the other side on the gap between the groups. The input terminals of the plate are opposed to each other and aligned, and the terminals of the opposed and aligned terminals are collectively pressed by using a clip made of a shape memory alloy or a shape memory resin having a U-shaped cross section. Characteristic panel mounting method. 17. A driving IC for driving the panel on a flexible base material surface is mounted on the electrode terminal of a panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, Mounting of a panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the driving IC and electrically connecting circuit wirings for transmitting a signal applied from the outside to each of the flexible wiring boards. In the method, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one of the electrode terminals at the peripheral portion of the panel of the flexible wiring board is formed. Group, the gap on one side of the one group, and the gap on the other side of the one group, each of which is formed of a part of the wiring layer and connected to the driving IC. In addition to providing the input terminal and the relay terminal, the circuit wiring for connecting the input terminal and the relay terminal is provided, and after supplying the same kind of connecting material to the input terminal, the output terminal, and the relay terminal of each flexible board, The output terminals of the flexible wiring board are aligned and connected so as to face the one group of electrode terminals on the peripheral portion of the panel, and the flexible wiring board is subjected to an operation test. The terminal and the input terminal are positioned and connected so as to face the electrode terminal of the group adjacent to the one group on the peripheral portion of the panel and the relay terminal of the one flexible wiring board, respectively, and the operation test of the flexible wiring board is performed. The mounting method of the panel characterized by performing. 18. A driving IC for driving the panel is mounted on a flexible base material surface of the panel having a plurality of electrode terminals arranged along the peripheral edge of one surface, Mounting of a panel for electrically connecting a plurality of flexible wiring boards having wiring layers connected to the driving IC and electrically connecting circuit wirings for transmitting a signal applied from the outside to each of the flexible wiring boards. In the method, the electrode terminals at the peripheral portion of the panel are divided into groups corresponding to the flexible wiring boards, and a gap is provided between the groups, and one of the electrode terminals at the peripheral portion of the panel of the flexible wiring board is formed. Group, the gap on one side of the one group, and the gap on the other side of the one group, each of which is formed of a part of the wiring layer and connected to the driving IC. In addition to providing the input terminal and the relay terminal, circuit wiring for connecting the input terminal and the relay terminal is provided, and the same kind of connecting material is supplied to the input terminal, the output terminal, and the relay terminal of each of the flexible boards, and then the panel. A flexible wiring board is arranged in every other group of the electrode terminals in the peripheral portion, and the output terminals of the flexible wiring board are aligned and connected so as to face the electrode terminals in the other group. , An operation test of each of the connected flexible wiring boards is performed, and subsequently, the flexible wiring board is arranged in the remaining unconnected group among the group of electrode terminals at the peripheral portion of the panel, and the output terminals of the flexible wiring board are arranged. , Input terminals and relay terminals, respectively, electrode terminals of the unconnected group, relay terminals of a flexible wiring board arranged in a group existing on one side of the unconnected group, the other side of the unconnected group Each is opposed to the input terminals of the flexible wiring board arranged in groups residing connected through aligned mounting method of a panel and performing an operation test of each flexible wiring board that this connection. 19. The electrode terminal according to claim 10, wherein a plurality of groups of electrode terminals are arranged along a peripheral portion of one surface and electrically connected to the electrode terminals of the panel having a gap between the groups. Driver I for replacing the driver IC on the flexible wiring board
In the C replacement method, a portion of the base surface of the flexible wiring board on one side where the input terminal and the spare input terminal are present, and a portion on the other side where the relay terminal and the spare relay terminal are present are left. Then, the connection between the electrode terminal at the peripheral portion of the panel and the output terminal of the flexible wiring board is released, and the portion of the surface of the base material including the output terminal and the driving IC is removed, and the electrode at the peripheral portion of the panel is removed. On the terminal, the spare input terminal, and the spare relay terminal, the output terminal of the new flexible wiring board having the same configuration except the flexible wiring board, the input terminal, and the relay terminal, the spare input terminal, and the spare input terminal, respectively. A method for exchanging drive ICs, characterized in that the relay terminals of the above are connected correspondingly. 20. A drive IC replacement method for replacing a drive IC on the flexible wiring board of the panel mounting structure according to claim 1, wherein the drive IC alone or the drive IC on the flexible wiring board is replaced. After removing the base material of the flexible wiring board near the drive IC, only the new drive IC having the same configuration as the drive IC, or the base material of the flexible wiring board near the drive IC, The new drive IC
Is connected to the flexible wiring board, and a method for exchanging a driving IC.