JPH07181192A - Speed sensor - Google Patents

Abstract

PURPOSE:To provide a speed sensor whose structure is formed in such a way that, even when a housing is expanded or contracted due to a temperature change, a thermal stress is hardly applied to an IC terminal at the inside of the housing and to the fixation part of the IC terminal to a terminal and in which the IC terminal is not destroyed when water or the like creeps into the inside. CONSTITUTION:A speed sensor 21 is provided with a housing 22 in which a vertical part 23d is formed at the base end part 23a of a terminal 23, in which an oblique crank part 23c is formed near the tip part of the terminal 23 and in which an elastic material 24 is installed around the crank part 23c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a speed sensor for an automobile, and more particularly to a speed sensor suitable for insert molding an IC package to manufacture a housing.

[0002]

2. Description of the Related Art As a conventional speed sensor of this type, one shown in FIG. 12 is known. In the figure, reference numeral 1 is a speed sensor, and the speed sensor 1 is such that a resin housing 3 is fixed to an upper part of a metallic case 2 by screws 4. A rotating shaft 5 that rotates in synchronization with the rotation of the transmission is provided at the center of the case 2, and a magnet 6 that rotates together with the rotating shaft is attached to the top of the rotating shaft 5. Further, in the central portion of the housing 3, the IC is provided so as to face the magnet 6.
A package 7 is provided, and this IC package 7
The terminal 8 of the IC projects from the side surface 7a. This I
The base end portion 9a of the terminal 9 is connected to the tip end of the C terminal 8, and the tip end portion 9b of the terminal 9 is exposed in the space 10 formed in the tip end portion of the housing 3, and in the space 10 The connector (not shown) on the side is fitted and connected. The housing 3 is provided with a crank portion 9 in the middle so that the terminal 9 does not apply the fitting force from the mating connector to the base end portion 9a.
c is formed, and the base end portion 9 a is spot-welded to the IC terminal 8 and is insert-molded into the housing 3 together with the IC package 7 to be manufactured. An IC element 11 is fixed to the base end of an IC terminal 8 inside the IC package 7, and the metal used for inserting the IC package around the IC package 7 as shown in FIG. A space 13 is formed after the in-mold chuck jig 12 is extracted, and the space 13 is later filled with an elastic material 14 so as to wrap the IC package 7 as shown in FIG. An O-ring 15 is provided on the upper end of the case 2 so as to surround the outer circumference of the magnet 6, and the O-ring 15 is strongly pressed against the flange surface of the housing while the housing 3 is fixed to the case 2. It has become a thing.

[0003]

However, in the above-mentioned conventional speed sensor, since the crank portion 9c of the terminal 9 embedded in the housing 3 is formed vertically, the surroundings of the location where the speed sensor is installed. When the temperature is high or low depending on the temperature, the terminal 9 has the crank portion 9c.
As a starting point, thermal expansion and contraction occur toward the base end 9a side and the tip end side 9b side. However, since the terminal 9 is made of metal and the housing 3 is made of resin, the terminals 9 and 3 have different linear expansion coefficients, and the IC terminal 8 connected to the terminal 9 is different. Thermal stress is generated on the IC terminal 8 and the welded portion between the base end portion of the terminal 9 and the IC terminal 8 is peeled off, or the IC element 11 fixed to the IC terminal 8 inside the IC package 7 is removed. Peeled off from I
There was a fear that the function of C would be lost.

In addition, the elastic material filled in the space of the chuck jig through the contact surface between the case 2 and the housing 3 and I
Water may enter from the interface with the C package 7 and finally into the IC package 7, and the function of the IC element 11 may be lost.

The present invention has been made in view of the above-mentioned circumstances, and the thermal stress caused by the difference in the linear expansion coefficient between the terminal and the housing causes a defective connection between the terminal and the IC terminal, or an IC element. It is an object of the present invention to provide a speed sensor which is prevented from peeling off from the IC terminal to cause the IC to stop functioning, or to prevent water from entering the inside of the IC package to cause a defective IC element.

[0006]

In order to solve the above problems, a speed sensor according to a first aspect of the present invention has a vertical portion formed at a base end portion of a terminal and an oblique crank portion formed at a tip end side thereof. Further, an elastic material is further provided along the crank portion.

According to another aspect of the speed sensor of the present invention, a vertical portion is formed at the base end portion of the terminal, the entire surface of the IC package is covered with an elastic body, and the IC package is supported when the IC package is insert-molded. It is characterized in that the support holes of the support member are filled with an adhesive.

According to another aspect of the speed sensor of the present invention, the base end portion of the terminal forms a space between the base end portion and the side surface of the IC package, and the first side portion is bent vertically upward along the side surface. A second side portion that is horizontally bent from the first side portion along the upper surface of the IC package,
A vertical portion that is vertically bent upward from the upper surface of the IC package continuously from the second side portion, and further between the first and second side portions of the terminal and the side surface of the IC package. It is characterized by being filled with an elastic material.

According to another aspect of the speed sensor of the present invention, a vertical portion is formed at the base end portion of the terminal, the outer periphery of the IC package is covered with an elastic body, and the IC package is enclosed in a housing by a sealing material. It is characterized by being sealed in.

According to a fifth aspect of the present invention, in the speed sensor according to the fifth aspect, a vertical portion which is vertically bent upward along a side surface of the IC package is formed at a base end portion of the terminal.
The C package is characterized in that the entire outer periphery is covered with an elastic body, and the entire IC package held by the terminal at the center of the mold and covered with the elastic body is resin-molded.

According to a sixth aspect of the present invention, there is provided an inclined crank portion on the tip end side of the terminal according to the second, third, fourth or fifth aspect, and an elastic member is provided along the crank portion. It is characterized by that.

[0012]

In the speed sensor of the present invention, since the vertical portion is formed at the base end portion of the terminal, the vertical portion is fixed inside the housing and exerts a large resistance force in the horizontal direction. . Also, since the crank part is formed diagonally and the elastic material is provided around this crank part, even if the terminal part expands and contracts due to temperature changes, the horizontal resistance of the crank part is so large. Instead, the crank portion easily moves in the horizontal direction inside the elastic material. Therefore, even if the housing or terminal expands or contracts at high or low temperatures and there is a difference in the amount of expansion or contraction between them, the vertical part does not move in the horizontal direction. The amount of movement in the horizontal direction is extremely small in the vicinity of the base end portion of the non-terminal, and almost no thermal stress is generated in the IC terminal fixed to this base end portion.

According to the speed sensor of the second aspect, since the supporting member for supporting the IC package at the time of insert molding can be used, the IC package can be positioned at the center of the housing. Then, after the housing is solidified, the space formed after removing the support member is filled with an adhesive, whereby the IC package is embedded inside the housing while being completely shielded from the outside. Furthermore, since the IC package is covered with the elastic body, even if the housing expands or contracts due to temperature change, the elastic body does not absorb them and the force does not act directly on the IC package. It will not be destroyed. Further, even when water enters the housing, the elastic material prevents the water from entering the IC package. The vertical portion has the same operation as the vertical portion of claim 1.

In the speed sensor according to the third aspect of the present invention, the space portion is formed between the first side portion and the second side portion of the terminal, the IC package, and the supporting member that supports these in the mold. The resin does not enter the space during insert molding, and the elastic material is potted into this space formed after the support member is removed while the housing is solidified, so that the side surface of the IC package is elastic. As a result, even if the housing expands or contracts due to temperature change, the displacement is absorbed and the IC package is not affected. The vertical portion has the same operation as the vertical portion of claim 1.

In the speed sensor according to the fourth aspect, since the IC package is supported in the mold by the sealing material during insert molding, the IC package can be positioned at the center of the mold, and the IC package is It is embedded inside the housing in a state of being completely shielded from the outside, and a good waterproof effect is obtained. Further, since the surface of the IC package is covered with the elastic body, it is not affected by the thermal deformation of the housing. The vertical portion has the same operation as the vertical portion of claim 1.

In the speed sensor according to the fifth aspect, since insert molding is performed in a state where the IC package is supported by the center of the mold by the terminal, the speed sensor is embedded inside the housing while being completely shielded from the outside. In addition, since the IC package is covered with the elastic member, it is not affected by the temperature change of the housing. The vertical portion has the same operation as the vertical portion of claim 1.

According to a sixth aspect of the present invention, since the difference in thermal expansion and contraction between the housing and the terminal of the second, third, fourth or fifth aspect of the present invention is absorbed by the elastic body of the crank part, the terminal. It is possible to prevent thermal stress from acting on other parts of the.

[0018]

Embodiments of the speed sensor of the present invention will be described below with reference to the drawings. In the embodiments described below, the same components as those in the above-described conventional technique are designated by the same reference numerals, and the description thereof will be omitted.

1 to 4 show an embodiment of the present invention, in which reference numeral 21 denotes a speed sensor of this embodiment. A resin housing 22 is fixed to the upper portion of the case 2 of the speed sensor 21, and the IC package 7 and the terminal 23 are integrally embedded in the housing 22 by insert molding.
The IC package 7 is formed in a rectangular parallelepiped shape and is arranged at a position facing the magnet 6 in the case 2. From the side surface 7a of the IC package 7, three ICs are horizontally arranged.
The C terminal 8 is protruding. A base end portion 23a of a terminal 23 is fixed to each of these IC terminals 8 by spot welding, and a tip portion 23b of the terminal extends horizontally on the side opposite to the IC terminal 8 and is formed at the tip of the housing 22. It is exposed in the enclosed space 10. A crank portion 23c is formed near the tip of the terminal 23. The crank portion 23c is obliquely inclined with respect to the horizontal plane, and as shown in FIG. 3, the outer periphery of the crank portion is preliminarily coated with the elastic material 24,
At the time of insert molding, the resin is surrounded around the elastic material 24. As the elastic material 24, a foaming agent, rubber, EPDM or the like may be used. As shown in FIG. 2, the tip of the base end portion 23a of the terminal 23 is bent vertically to form a vertical portion 23d. The vertical portion 23d has a structure fixed inside the resin of the housing 22. Has become. Further, the elastic material 14 is potted after insert molding in the die cutting space 13 formed in contact with the side surface 7a of the IC package 7. Other configurations are similar to those of the conventional technique.

The speed sensor 20 of this embodiment, which is constructed as described above, has a resin housing 2 depending on the temperature change.
Even if the terminal 2 or the metal terminal 23 expands or contracts, the difference in the amount of expansion or contraction is absorbed by the crank portion 23c. That is, since the housing 22 and the vertical portion 23d of the terminal 23 exert a large resistance to the horizontal movement, the vertical portion 23d does not move in the horizontal direction, and the vertical portion 2d does not move.
The difference in the amount of expansion and contraction with the terminal starts from 3d and moves to the crank portion 23c side. Then, as shown in FIG. 4, the crank portion 23c moves left and right inside the elastic member 24 surrounded by the molding resin, and the elastic member 24 absorbs the amount of expansion and contraction. Therefore, the base end portion 23a of the terminal, which is slightly separated from the vertical portion 23d,
Almost no thermal stress acts on the fixing point of the IC terminal, and the base end portion 23a of the terminal and the IC terminal 8 are not separated. Furthermore, from the IC terminal 8 to the IC package 7
It is also possible to prevent the IC element 11 inside from peeling off or breaking due to an external force acting inside.

Next, a second embodiment of the speed sensor of the present invention will be described with reference to FIG. In the speed sensor 31 of the second embodiment, the outer circumference of the IC package 7 is the elastic body 3
2 is pre-coated with 2 and the upper and lower surfaces of the IC package 7 are filled with adhesive in the supporting holes 32a and 32b of the vertical positioning mold used in insert molding. In a state where the base end portion 33a of the terminal 33 is spot-welded to the IC terminal 8,
It is embedded in the housing 34. The terminal 33 is once bent downward before the crank portion 33c, while the tip of the base end portion 33a is bent vertically to form a vertical portion 33d. The elastic body 32 may be formed by coating a preformed silicone rubber or the like,
It may be wrapped by taping or the like. Further, the adhesive filled in the support holes does not need to be an elastic body, and may be a hard one having excellent adhesiveness. The elastic member 24 used in the above embodiment may be provided around the diagonal crank portion 33c of the terminal 33.

The speed sensor 31 of the second embodiment is
The IC package 7 is covered with the elastic body 32 in advance and I
By connecting the terminal 33 to the C terminal 8 and further supporting the upper and lower surfaces of the IC package 7 by a mold (support member) not shown, the IC package 7 and the terminal 3
After placing 3 and 3 inside the mold, the housing 34 is molded by insert molding. And the housing 34
After solidifying, the mold is removed and the supporting holes 32a and 32b formed in the upper and lower surfaces of the IC package 7 are filled with an adhesive having good adhesiveness to complete the housing 33. Is. In addition, Terminal 3
The vertical portion 33d of No. 3 exerts a large resistance to the thermal expansion and contraction in the horizontal direction, so that the vertical portion 33d is located near the vertical portion 33d.
Almost no thermal stress is generated in the C terminal 8, and the IC package 7 is hardly affected by heat due to the synergistic effect with the elastic body 32. The other structure of the second embodiment is similar to that of the above-mentioned conventional technique.

In the speed sensor 31 of the second embodiment configured as described above, since the IC package 7 and the terminal 33 can be arranged in the center of the mold by the mold during insert molding, the IC package 7 Can be completely embedded inside the housing 34. By filling the inside of the support hole formed after the housing is solidified and the mold is removed with an adhesive, the IC package 7 can be completely shielded from the outside. As a result, no gap is formed at the interface between the IC package 7 and the housing 34, and the waterproof effect can be enhanced. Further, the IC package 7 is made of the elastic body 3
Since it is covered with 2, the displacement amount is absorbed by the elastic body 32 even if the housing 34 expands or contracts due to a temperature change, and the force does not directly act on the IC package 7, and the IC package 7 is destroyed. Can be prevented.

Next, a third embodiment of the speed sensor of the present invention will be described with reference to FIGS. The speed sensor 41 shown in FIG. 6 includes the IC package 7 and the terminal 4.
2 is integrally embedded in the housing 43. Then, as described below, the base end portion 42a of the terminal 42 forms a space 45 between the terminal end portion 42a and the side surface 7a of the IC package, and the first side portion 42a1 is bent vertically upward along the side surface 7a. A second side portion 42a2 that is horizontally bent along the upper surface 7b of the IC package 7 continuously from the first side portion, and upward from the upper surface 7b of the IC package 7 that is continuous from the second side portion 42a2. And a vertical portion 42a3 bent vertically to
The side surface 7a of the package 7 is filled with the same elastic material 14 as in the first embodiment after insert molding. The elastic member 24 used in the above embodiment may be provided around the diagonal crank portion 42c of the terminal 42.

Then, the speed sensor 41 of this embodiment
In order to manufacture the housing 43 of the base package, the base end portion 42 can be arranged in advance along the upper surface 7b of the IC package 7.
a is the terminal 42 bent as described above,
It is fixed to the IC terminal 8 of the C package 7 by spot welding. Then, the integrated IC package 7 to which the terminals 42 are connected is integrated into a mold 44 as shown in FIG.
Insert molding is performed in a state where the IC package 7 and the first side portion 42a1 of the terminal are mounted.
Since the resin does not flow into the space 45 formed on the side surface 7a of the IC package 7 by the second side portion 42a2 and the mold 44, the side surface 7a of the IC package has a space 45 after the resin is cured. Is completely separated from the housing 43. The elastic material 14 is potted into the space 45, so that the side surface 7 a of the IC package 7 is covered with the elastic material 14.
As a result, even if the housing 43 and the terminal 42 expand or contract due to temperature change, the thermal displacement is absorbed by the elastic material 14 and the IC package 7 is not affected by the thermal displacement. Further, the elastic substance 14 is an IC
Since it is filled on the side surface of the package 7, it also has a water blocking effect. Furthermore, since the vertical portion 42a3 of the terminal 42 exerts a large resistance to the thermal expansion and contraction in the horizontal direction,
Almost no thermal stress is generated in the IC terminal 8 located near the vertical portion 42a3, and due to the synergistic effect with the elastic material 14, the IC package 7 is hardly affected by heat.

Next, a fourth embodiment of the speed sensor of the present invention will be described with reference to FIG. In the speed sensor 51 of this embodiment, an IC package 7 in which an elastic body 53 is previously coated is provided inside a housing 52, and a terminal 54 is connected to an IC terminal 8 of this IC package 7. Then, the base end portion 54a of the terminal 54
Has a vertical portion 54d formed on the end side of the connection point.
Further, a dish-shaped sealing member 5 is provided under the IC package 7.
5 is provided, and the IC package 7 is supported inside the housing 52 by the sealing member 55. The sealing member 55 is arranged so as to cover the entire upper portion of the magnet 6, and the end portion supports the central portion of the terminal 54. The sealing member 55 is made of a material having a melting point slightly lower than that of the resin of the housing 52. For example,
When the material of the housing 52 is a general grade PBT, the material of the sealing member 55 is a low remote point grade PBT. Further, an O-ring 15 is arranged on the outer peripheral edge of the sealing member 55, and the O-ring 15 enhances the water blocking effect. The elastic member 24 used in the above embodiment may be provided around the diagonal crank portion 54c of the terminal 54.

The speed sensor 51 is an IC
After the package 7 is covered with the elastic body 53, the terminal 54 is fixed to the IC terminal 8 by spot welding, and the IC package 7 and the terminal 54, which are integrally connected to each other, are connected to each other by a sealing member 55, which is formed in a mold (not shown). After being supported inside, the housing 52 is formed by insert molding.
Is molded. At that time, since the material forming the sealing member 55 has a lower melting point than the resin forming the housing 52, the boundary surface between the sealing member 55 and the housing 52 is melted during insert molding, and the sealing member 55 is separated from the housing 52. Become one. Therefore, the IC package 7 has the housing 5
It is completely buried in the inside of 2 in a state of being shielded from the outside, and has a reliable waterproofing effect. Further, the O-ring 15 can further enhance the water blocking effect. Further, since the IC package 7 is covered with the elastic body 53, even if the housing 52 is deformed due to temperature change, the displacement is absorbed by the elastic body 53, so that the IC package 7 is directly affected by the influence. Absent. Further, since the vertical portion 54d of the terminal 54 exerts a large resistance to the thermal expansion and contraction in the horizontal direction, almost no thermal stress is generated in the IC terminal 8 located near the vertical portion 54d. Due to the synergistic effect with the elastic body 53, the IC package 7 is hardly affected by heat.

Next, a fifth embodiment of the speed sensor of the present invention will be described with reference to FIGS. The speed sensor 61 of this embodiment has an IC package 7 in which the entire outer periphery is covered with an elastic body 63 inside a housing 62.
Is provided, and the IC terminal 8 of this IC package 7
Three terminals 64 are spot-welded to each other.
The upper and lower two of the terminals 64 have a structure that holds the upper portion of the IC package 7 by bending the base end portions 64a thereof in a convex shape. That is, the base end portion 64a of the terminal 64 is the side surface 7a of the IC package.
Vertical portion 64a1 vertically bent upward along the
And the upper surface 7 of the IC package 7 continuously from the vertical portion.
After being horizontally bent along b, it is further folded vertically downward to form a U-shaped loop between the first side 64a2 and the first side 64a2. Second side portion 64a3, which is horizontally bent along the upper surface 7b of the IC package 7 and then vertically bent along the other side surface of the IC package, and horizontally continuously from the second side portion 64a3. It has a structure including the folded back third side portion 64a4. A seal coat material 65 is applied near the ends of the terminals 64. The diagonal crank part 64 of the terminal 64
The elastic material 24 used in the above embodiment may be provided around c.

The speed sensor 61 having the above-described structure includes the vertical portion 64 of the upper and lower terminals 64.
a1, the first side portion 64a2 and the second side portion 64a3 hold the upper half of the IC package 7 so that the IC package 7 is located in the center of the mold and the third side portion 64a4 of the terminal 64 and the terminal Insert molding is performed with the tip 64b attached to the mold. In addition, after the insert molding is performed, the portion where the third side portion 64a4 of the terminal 64 is exposed from the housing 62 is not shown in FIG.
The broken line 64x shown in FIG. for that reason,
The IC package 7 and the terminal 64 are embedded in the housing 62 in a state of being completely shielded from the outside, and the entire outer periphery of the IC package 7 is covered with the elastic body 63. Never receive. Since the third side portion 64a4 at the base end portion of the terminal 64 and the vicinity of the crank portion 64c of the terminal 64 are covered with the seal coat material 65, water does not enter the inside from the interface between the terminal 64 and the housing 61. . Further, since the IC package 7 is covered with the elastic body 63, even if the housing 62 is displaced due to a temperature change, the thermal displacement is absorbed by the elastic body 63 and does not directly affect the IC package 7. The material of the elastic body 63 is the same as that of the second embodiment.

Further, the vertical portion 64a1 of the terminal 64
Has a large resistance to the thermal expansion and contraction in the horizontal direction, the IC terminal 8 located near the vertical portion 64a1 is
Almost no thermal stress is generated, and the IC package 7 is hardly affected by heat due to the synergistic effect with the elastic body 63.

As described above, in the speed sensor of this embodiment, the IC package embedded in the housing is not affected by the temperature change and is not destroyed, and the terminal and the IC terminal are not separated. In addition, the waterproof effect inside the housing can be further enhanced. Materials such as elastic substances, elastic bodies, and elastic materials are
The present invention is not limited to the one shown in the above embodiment, and it is arbitrary to make appropriate changes.

[0032]

As described above, according to the speed sensor of the present invention, since the vertical portion is formed at the base end portion of the terminal, the vertical portion exerts a great resistance force to the horizontal movement. Further, since the fixing portion for the IC terminal is provided at the base end portion, even if a difference in thermal expansion and contraction between the housing and the terminal occurs, the fixing portion is less affected by the thermal stress. Therefore, the difference in the amount of expansion and contraction between the housing and the terminal concentrates on the diagonal crank part, but since the elastic body is provided along this crank part, the crank part can move freely inside the elastic body. It is possible to absorb the amount of expansion and contraction.

In the speed sensor according to the second aspect, since the entire surface of the IC package is covered with the elastic body in advance, the elastic body can absorb the deformation amount of the housing due to heat. Also, since the IC package is insert-molded while being supported by the supporting member, the supporting hole of the die of the supporting member is filled with the adhesive, so that the IC package is completely blocked from the outside. Since it will be buried inside, the water blocking effect can be fully exerted. Further, not only does the vertical portion have the effect of claim 1, but the synergistic effect of the elastic body results in I
The C package has almost no influence by thermal stress.

According to the speed sensor of claim 3,
The first side of the terminal is bent along the side surface of the IC package, and the second side is bent along the upper surface of the IC package.
A space is formed between the second side and the side surface of the IC package in the axial direction. The resin does not enter the space during insert molding, and the resin does not adhere to the side surface of the IC package. The IC package is less affected by the expansion and contraction due to. Further, not only does the vertical portion have the effect described in claim 1, but the IC package is hardly affected by thermal stress due to the synergistic effect with the elastic material filled in the space.

In the speed sensor according to the fourth aspect, since the IC package is supported in the mold by the sealing member, the IC package is located in the center of the mold, whereby the IC package is completely embedded in the housing. Has been
The water blocking effect can be enhanced. Further, since the surface of the IC package is previously covered with the elastic member, the IC package is less affected by the expansion and contraction of the housing due to heat. Further, not only does the vertical portion have the effect of claim 1, but the IC package is hardly affected by thermal stress due to the synergistic effect with the elastic member.

In the speed sensor according to the fifth aspect, since the IC package is held in the center of the mold by the terminal, the IC package is completely embedded in the housing, and a sufficient water blocking effect can be exhibited. it can. Also,
Since the IC package is covered with the elastic body in advance, even if the housing is thermally expanded and contracted, the expansion and contraction is absorbed by the elastic body, so that the IC package is less affected by the expansion and contraction. Further, not only does the vertical portion have the effect of claim 1, but the IC package is hardly affected by thermal stress due to the synergistic effect with the elastic body.

In the speed sensor according to the sixth aspect, the difference in thermal expansion and contraction between the housing and the terminal of the speed sensor according to the second, third, fourth or fifth aspect is absorbed by the elastic body of the crank portion, and therefore the terminal. It is possible to prevent thermal stress from acting on other portions, and it is possible to prevent the IC package and the connection portion between the IC terminal and the terminal provided in each housing from being destroyed.

[Brief description of drawings]

FIG. 1 is a sectional front view of a speed sensor according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a terminal having a vertical portion formed at a base end is fixed to an IC terminal of an IC package according to an embodiment of the present invention.

FIG. 3 is a perspective view of a terminal coated with an elastic material according to an embodiment of the present invention.

FIG. 4 is a perspective view of a terminal coated with an elastic material according to an embodiment of the present invention.

FIG. 5 is a sectional front view of a speed sensor according to a second embodiment of the present invention.

FIG. 6 is a sectional front view of a speed sensor according to a third embodiment of the present invention.

FIG. 7 is an IC of an IC package according to a third embodiment of the present invention.
It is a perspective view which shows the state which fixed the base end part of the terminal to the terminal.

FIG. 8A is a perspective view showing a state in which an IC package to which the terminal of the third embodiment of the present invention is connected is fitted in a mold, and FIG. 8B is the terminal of FIG. 8A removed. It is a perspective view showing the state where an IC package in a case was fitted in a metallic mold.

FIG. 9 is a sectional front view of a speed sensor according to a fourth embodiment of the present invention.

FIG. 10 is a front view of the speed sensor of the fifth embodiment of the present invention taken along the line AA of FIG. 11.

FIG. 11 is a diagram showing the state of FIG. 10 seen from below, and is a bottom plan view of the speed sensor of the fifth embodiment of the present invention.

FIG. 12 is a sectional front view of a conventional speed sensor.

FIG. 13 is a perspective view of a chuck jig in a mold of an IC package of a conventional speed sensor.

FIG. 14 is a plan view showing a state in which an elastic material is arranged around an IC package of a conventional speed sensor.

[Explanation of symbols]

 7 IC package 7a Side surface 8 IC terminal 23, 33, 42, 54, 64 Terminal 23a, 33a, 42a, 54a, 64a Base end part 23b, 33b, 42b, 54b, 64b Tip part 22, 34, 43, 52, 62b Housing 21, 31, 41, 51, 61 Speed sensor 23d, 33d, 42a3, 54d, 64a1 Vertical part 23c, 33c, 42c, 54c, 64c Crank part 24 Elastic material 32, 53, 63 Elastic body 44 Support member (mold) ) 32a, 32b Support hole 55 Sealing material 65 Sealing material

Claims (6)

[Claims] 1. An IC terminal integrally projecting from a side surface of an IC package in a horizontal direction and a terminal having a base end fixed to the IC terminal and a tip end extending in a horizontal direction opposite to the IC terminal. A speed sensor having an insert-molded housing, in which a vertical portion is formed at the base end portion of the terminal and an oblique crank portion is formed at the tip end side, and an elastic material is further provided along the crank portion. A speed sensor characterized by being provided. 2. An IC terminal, which horizontally projects from a side surface of an IC package, and a terminal whose base end is fixed to the IC terminal and whose tip extends horizontally opposite to the IC terminal. A speed sensor having an insert-molded housing, wherein a vertical portion is formed at a base end portion of the terminal, the entire surface of the IC package is covered with an elastic body, and the IC package is insert-molded. A speed sensor characterized in that a supporting hole of a supporting member supported on the substrate is filled with an adhesive. 3. An IC terminal projecting horizontally from a side surface of an IC package and a terminal having a base end fixed to the IC terminal and a tip end extending horizontally opposite to the IC terminal. A speed sensor having a housing insert-molded into the first package, wherein the base end portion of the terminal forms a space between the base end portion and a side surface of the IC package, and is vertically bent upward along the side surface. A side portion, a second side portion that is continuously bent from the first side portion along the upper surface of the IC package, and a second side portion that is continuously bent from the second side portion and is vertically bent upward from the upper surface of the IC package. And a vertical portion formed between the first side portion and the second side portion of the terminal and the side surface of the IC package with an elastic material. 4. An IC terminal integrally protruding from a side surface of an IC package and a terminal having a base end portion fixed to the IC terminal and a tip end portion extending in the horizontal direction to the side opposite to the IC terminal. A speed sensor having an insert-molded housing, wherein a vertical portion is formed at a base end portion of the terminal, the outer periphery of the IC package is covered with an elastic body, and the IC package is sealed. A speed sensor characterized by being sealed in a housing with a material. 5. An IC terminal, which projects horizontally from the side surface of the IC package, and a terminal whose base end is fixed to the IC terminal and whose tip extends horizontally to the side opposite to the IC terminal. A speed sensor having an insert-molded housing, wherein a vertical portion vertically bent upward along a side surface of the IC package is formed at a base end portion of the terminal, and the IC package has an entire outer periphery. Is covered with an elastic body, and the entire IC package held by the terminal at the center of the mold and covered with the elastic body is resin-molded. 6. The speed sensor according to claim 2, wherein an inclined crank portion is formed on the tip end side of the terminal, and an elastic member is provided along the crank portion. .