JPH07180084A - Plating shielding device - Google Patents

Plating shielding device

Info

Publication number
JPH07180084A
JPH07180084A JP34473293A JP34473293A JPH07180084A JP H07180084 A JPH07180084 A JP H07180084A JP 34473293 A JP34473293 A JP 34473293A JP 34473293 A JP34473293 A JP 34473293A JP H07180084 A JPH07180084 A JP H07180084A
Authority
JP
Japan
Prior art keywords
plating
shield
shielding
cylinder
float
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34473293A
Other languages
Japanese (ja)
Other versions
JP3072453B2 (en
Inventor
Osamu Yoshioka
修 吉岡
Shigemitsu Yamada
重光 山田
Takashi Hama
隆 浜
Isamu Tsuyuki
勇 露木
Koji Sawara
浩二 佐原
Kenji Sasaki
賢二 佐々木
Eizo Yagiu
栄三 柳父
Manabu Kuramoto
学 倉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOMURA TOKIN KK
JFE Engineering Corp
Original Assignee
NOMURA TOKIN KK
NKK Corp
Nippon Kokan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOMURA TOKIN KK, NKK Corp, Nippon Kokan Ltd filed Critical NOMURA TOKIN KK
Priority to JP5344732A priority Critical patent/JP3072453B2/en
Publication of JPH07180084A publication Critical patent/JPH07180084A/en
Application granted granted Critical
Publication of JP3072453B2 publication Critical patent/JP3072453B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To shorten the plating preparatory operation, to save manpower and to secure its safety by providing the new constitution of a shielding device to be used in the partial plating of a material such as a rolling roll. CONSTITUTION:A shielding cylinder 1 of a nonconductive material provided with a float 11, floating on a plating soln., covering the journal of a roling roll in plating and sunk in the soln. by the weight of the roll is furnished.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、鍍金設備における部
分鍍金作業に於いて電極と被鍍金材との間に取り付ける
鍍金遮蔽装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating shield device mounted between an electrode and a material to be plated in a partial plating operation in a plating facility.

【0002】[0002]

【従来の技術】圧延ロール等を縦型鍍金槽で部分鍍金す
る場合、通常は図8に示すように、ロール軸両端に固定
遮蔽材31を取り付け、且つその他端を、図9に示すよ
うな吊り治具6で固定して水平吊りから垂直吊りとす
る。
2. Description of the Related Art When partially rolling a rolling roll or the like in a vertical plating tank, usually, as shown in FIG. 8, fixed shields 31 are attached to both ends of the roll shaft, and the other end is shown in FIG. It is fixed by the hanging jig 6 to change from horizontal hanging to vertical hanging.

【0003】この吊り治具6自身には鍔60が設けられ
ており、図10に示すように、鍍金槽4上の周囲に設け
られたフレーム体50の集電面51に該鍔60を接触さ
せながら該フレーム体50に支持させ、鍍金槽4中に懸
垂せしめる。そのような状態で電解洗浄、電気鍍金が施
される。
The hanging jig 6 itself is provided with a collar 60, and as shown in FIG. 10, the collar 60 is brought into contact with the current collecting surface 51 of the frame body 50 provided around the plating tank 4. While being supported, it is supported by the frame body 50 and suspended in the plating tank 4. Electrolytic cleaning and electroplating are performed in such a state.

【0004】[0004]

【発明が解決しようとする課題】鍍金を施す際、例えば
圧延ロール3であれば、両端のジャーナル部30(軸受
け部)は鍍金不要であり、それどころか鍍金がかえって
都合の悪い方に作用するため、通常ロール3と電極5と
の間に遮蔽材100を取り付けて鍍金作業が行われる。
When plating is applied, for example, if the rolling roll 3 is used, the journal portions 30 (bearing portions) at both ends do not need to be plated. On the contrary, the plating acts rather on the inconvenient side. Usually, the shielding material 100 is attached between the roll 3 and the electrode 5 and the plating operation is performed.

【0005】従来この遮蔽材100の取付は、 水平状態で上記ジャーナル部30にビニールテープを
巻き付け、 電解洗浄後ロール3をクレーンで吊り上げて、図11
に示すように垂直状態にし、作業者が吊り荷の傘下に入
って遮蔽筒100を固定遮蔽材31にボルト締めして取
り付けたり、或いはフランジインロー等の引っ掛けによ
り取り付けが行われていた。
Conventionally, the shielding member 100 is mounted by wrapping a vinyl tape around the journal portion 30 in a horizontal state, and after electrolytic cleaning, the roll 3 is lifted by a crane, as shown in FIG.
In the vertical state as shown in FIG. 2, an operator enters under a suspended load and attaches the shield cylinder 100 to the fixed shield member 31 by bolting it, or by attaching a flange inlay or the like.

【0006】また鍍金が完了すると、鍍金槽4より取り
外し、クレーンの吊り荷の傘下で作業者がボルトを弛
め、前記遮蔽筒100の取り外しが行われる。
When the plating is completed, the shield cylinder 100 is removed from the plating tank 4, and the operator loosens the bolts under the umbrella of the crane to remove the shield cylinder 100.

【0007】以上の方法であると、遮蔽筒100の取り
付け・取り外しに時間が掛かる。鍍金終了時の遮蔽筒1
00の取り外しに於いて鍍金液の残留した遮蔽筒100
を取り扱うため、作業者の安全性に問題があった。
With the above method, it takes a long time to attach and remove the shield cylinder 100. Shielding cylinder 1 at the end of plating
Shielding cylinder 100 where plating liquid remains when removing 00
However, there was a problem with the safety of the operator.

【0008】本発明は従来技術の以上のような問題に鑑
み創案されたもので、圧延ロール等の被鍍金材の部分鍍
金に使用される遮蔽装置の新たな構成につき提案し、以
て鍍金準備作業の短縮化、省力化及びその安全性の確保
を図らんとするものである。
The present invention has been made in view of the above problems of the prior art, and proposes a new structure of a shielding device used for partial plating of a material to be plated such as a rolling roll, thereby preparing for plating. It aims to shorten work, save labor, and ensure its safety.

【0009】[0009]

【課題を解決するための手段】そのため本発明の鍍金遮
蔽装置は、鍍金液上に浮き(それ自身の浮力で浮く場合
の他、フロートを備えていてそれによって浮く場合も含
む)、且つ鍍金時に被鍍金材の一部を覆った状態で該被
鍍金材の重さにより鍍金液中に沈む非電気伝導材質の遮
蔽筒を備えたことを基本的特徴としている。
Therefore, the plating shield device of the present invention floats on the plating liquid (in addition to the case where it floats by its own buoyancy, but also when it is equipped with a float and floats by it), and during plating. The basic feature is that a shielding cylinder made of a non-electrically conductive material is provided so as to cover a part of the material to be plated and sink into the plating solution due to the weight of the material to be plated.

【0010】また第2発明は上記構成に加え、前記遮蔽
筒の周囲にリンクを介して接続された芯出し用ガイドフ
ロートを備えた構成である。但し第2発明における遮蔽
筒については、それ自身の浮力により或いはそれに備え
られたフロートの構成により鍍金液上に浮く構成でも良
いし、又は前記ガイドフロートにより鍍金液上に浮く構
成であっても良い。
The second aspect of the invention is, in addition to the above configuration, a configuration including a centering guide float connected to the periphery of the shielding tube via a link. However, the shielding cylinder according to the second aspect of the invention may be configured so as to float above the plating liquid due to its own buoyancy or the configuration of the float provided therein, or may be above the guide float to float above the plating liquid. .

【0011】[0011]

【作用】上記遮蔽筒は(それ自身の浮力により、或いは
それに備えられたフロートにより、又は前記ガイドフロ
ートにより)鍍金液上に浮いている。そして被鍍金材が
クレーン等により鍍金槽中央部に運搬され、徐々に鍍金
液中に沈められると該遮蔽筒に(或いは事前に取り付け
られている固定遮蔽材等に)接触してこの遮蔽筒によっ
てその一部が覆われながら更に沈むことになる。即ち、
該遮蔽筒に作用する浮力が上記被圧延材の重さに負け、
この遮蔽筒は鍍金液中に沈む。その後鍍金処理がなされ
ている間、遮蔽筒はこれによって覆われた被鍍金材の部
分と電極との間を遮蔽し、この覆われた部分が鍍金され
ないようにする。鍍金終了後被鍍金材を徐々に吊り上げ
ていくと、遮蔽筒もそれに追従して浮上し、鍍金液上に
浮き上がる。
The shielding cylinder is floated on the plating liquid (by its own buoyancy, by the float provided therein, or by the guide float). When the material to be plated is transported to the central part of the plating tank by a crane or the like and gradually submerged in the plating solution, it comes into contact with the shield cylinder (or a fixed shield material etc. which is attached in advance), and this shield cylinder Part of it will be covered and it will sink further. That is,
The buoyancy acting on the shielding cylinder is lost by the weight of the rolled material,
This shield tube is submerged in the plating solution. During the subsequent plating treatment, the shield tube shields the portion of the material to be plated covered by the shield tube and the electrode so that the covered portion is not plated. When the material to be plated is gradually lifted after the plating is completed, the shielding tube also follows the surface and floats above the plating solution.

【0012】一方第2発明のように、芯出し用のガイド
フロートを備えていると、遮蔽筒が鍍金液上に浮いてい
る時に鍍金槽中央部に位置することになる。次に被鍍金
材がクレーン等により鍍金液中に沈められると、遮蔽筒
は該被鍍金材と接触しながらその一部を覆って一緒に沈
むことになる。この時芯出し用のガイドフロートは、前
記リンクを介して傘を閉じるが如く鍍金液上で遮蔽筒周
辺に近寄りつつ、更に沈降していく。鍍金処理終了後被
鍍金材を徐々に吊り上げていくと、遮蔽筒と共に、ガイ
ドフロートも被鍍金材に追従しながら浮上してくる。被
鍍金材を鍍金液上で完全に吊り上げると、ガイドフロー
トが鍍金液面上に達し、次いで遮蔽筒が鍍金液面まで浮
上してくる。この時ガイドフロートは、前記リンクを介
して遮蔽筒を中心に鍍金液面を水平方向に広がってい
く。遮蔽筒が完全に浮上すると、ガイドフロートが鍍金
槽周辺若しくは電極に接し、自動的に遮蔽筒が鍍金槽中
央部に位置することになる。
On the other hand, when the guide float for centering is provided as in the second aspect of the invention, the shield cylinder is located at the center of the plating tank when it is floating above the plating liquid. Next, when the material to be plated is submerged in the plating solution by a crane or the like, the shielding tube will come into contact with the material to be plated and cover a part thereof to sink together. At this time, the guide float for centering is further settled while approaching the periphery of the shield cylinder on the plating liquid as if closing the umbrella via the link. When the material to be plated is gradually lifted after completion of the plating process, the guide float as well as the material to be plated floats along with the shielding cylinder. When the material to be plated is completely lifted on the plating liquid, the guide float reaches the plating liquid surface, and then the shielding cylinder floats up to the plating liquid surface. At this time, the guide float horizontally spreads the plating liquid surface centering on the shield cylinder via the link. When the shield tube completely floats, the guide float contacts the periphery of the plating tank or the electrode, and the shield tube is automatically positioned at the center of the plating tank.

【0013】このように遮蔽筒は鍍金準備作業中に予め
取り付けられるものではなく、被鍍金材が鍍金液中に沈
められる時点でその一部を覆い、電極と該一部の間を遮
蔽することになる(従って必ずしも完全なシールにする
必要はない)。またガイドフロートは遮蔽筒が常に鍍金
槽の中央に位置するように作用し、これによって該遮蔽
筒が沈降・浮上する際に槽周辺及び電極に接触しないよ
うにする。
As described above, the shield tube is not attached in advance during the plating preparation work, but covers a part of the material to be plated when it is submerged in the plating solution, and shields between the electrode and the part. (Thus not necessarily a perfect seal). Further, the guide float acts so that the shielding cylinder is always located in the center of the plating tank, so that the shielding cylinder does not come into contact with the periphery of the tank and the electrode when the shielding cylinder floats.

【0014】[0014]

【実施例】以下本発明の具体的実施例を添付図面に基づ
き説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

【0015】図1は縦型鍍金槽で圧延ロールの部分鍍金
を行う時に使用される本願第1発明に係る鍍金遮蔽装置
の一実施例構成を示す斜視図であり、また図2は該遮蔽
装置を構成する遮蔽筒1の上部部分の拡大断面図であ
る。
FIG. 1 is a perspective view showing the construction of an embodiment of a plating shield device according to the first invention of the present application, which is used when partial plating of a rolling roll is performed in a vertical plating tank, and FIG. 2 is the shield device. FIG. 3 is an enlarged cross-sectional view of an upper portion of the shielding cylinder 1 that constitutes

【0016】本実施例の遮蔽装置は、圧延ロールのジャ
ーナル部を覆って鍍金処理中に該部分と電極の間を遮蔽
するものであるから、筒状の遮蔽筒1で構成されてお
り、且つその上部には、該ジャーナル部に予め設置され
る前記固定遮蔽材先端に接触する段部10aをその内側
に有する拡径開放部10が設けられている。またこの拡
径開放部10周囲には、図2に示すように、フロート1
1が設けられていて遮蔽筒1の浮力を高めている。更に
遮蔽筒1の下部には、鍍金液の出入りが容易になるよう
に液抜き孔の開いた管12が設けられている(該下部は
開放状態であっても良い)。
Since the shielding device of this embodiment covers the journal portion of the rolling roll to shield between the portion and the electrode during the plating process, it is constituted by the cylindrical shielding cylinder 1, and On the upper part thereof, there is provided an expanded diameter opening portion 10 having a step portion 10a inside thereof which comes into contact with the tip of the fixed shielding material previously installed in the journal portion. In addition, as shown in FIG.
1 is provided to enhance the buoyancy of the shield cylinder 1. Further, a tube 12 having a liquid drain hole is provided in the lower part of the shield cylinder 1 so that the plating solution can easily enter and exit (the lower part may be in an open state).

【0017】上記遮蔽筒1は、非電気伝導部材の材質で
あって且つ鍍金液に腐食されない材質、例えば塩化ビニ
ールやFRP等の材質で構成され、またフロート11も
その外面は同様な材質で構成されている。このフロート
11内部は、これを空洞にして鍍金液の浸入を防ぐ全閉
密閉構造のものにしただけの構成や、鍍金液比重より軽
い材質で且つ鍍金液に対し耐食性のある材質、例えば発
泡スチロール等で製作した構成のものとすることができ
る。このフロート11は遮蔽筒1本体に対しリング状の
一体物若しくは数個に分割した構成のものであっても良
く、また遮蔽筒1の垂直方向中央部より上方に取り付け
てあれば、鍍金液上での遮蔽筒1の安定が良くなる。
The shield tube 1 is made of a material which is a non-electrically conductive member and is not corroded by a plating solution, such as vinyl chloride or FRP. The float 11 is also made of a similar material on its outer surface. Has been done. The inside of the float 11 has a structure in which it is a hollow structure to prevent the plating solution from entering, and a material that is lighter than the specific gravity of the plating solution and has corrosion resistance to the plating solution, such as Styrofoam. It is possible to use the structure manufactured in. The float 11 may be a ring-shaped integral body or a structure in which it is divided into several pieces with respect to the main body of the shield cylinder 1. If the float 11 is mounted above the central part of the shield cylinder 1 in the vertical direction, the float 11 can The shielding cylinder 1 is more stable in

【0018】図3乃至図7は本願第2発明に係る鍍金遮
蔽装置の一実施例構成を示しており、略前記実施例と同
じ構成を有している。そのため同一構成を有するものに
は同一番号が付されている。
FIGS. 3 to 7 show the construction of an embodiment of the plating shielding device according to the second invention of the present application, which has substantially the same construction as the above-mentioned embodiment. Therefore, the same numbers are given to those having the same configuration.

【0019】本実施例構成では、遮蔽筒1の拡径開放部
10外面の周囲の3方向に向けて夫々リンク20を介し
てガイドフロート2が設けられている。そして該リンク
20のピン21を中心にガイドフロート2は上下に回動
できるようになっている。このガイドフロート2は、遮
蔽筒1のフロート11と同様な構成及び材質のものでで
きている。またその大きさは前記リンク20及びそのピ
ン21を浮上させることができる大きさとする。その設
置場所については、遮蔽筒1を常に鍍金槽4の中央に位
置させるために、本実施例では上述のように、拡径開放
部10外面の周囲の3方向としているが、それに限定さ
れず、少なくとも周方向等分布に3カ所以上設置するこ
とが望ましい。一方上記リンク20の材質は、遮蔽筒1
と同等のものが良い。尚図6乃至図8に示されるガイド
フロート2側のピン21aは、図4及び図5に示すよう
に省略し固定した構成にしても良い。
In the structure of this embodiment, the guide floats 2 are provided via the links 20 in the three directions around the outer surface of the expanded diameter opening portion 10 of the shield cylinder 1. The guide float 2 can be rotated up and down around the pin 21 of the link 20. The guide float 2 has the same structure and material as the float 11 of the shield cylinder 1. The size is such that the link 20 and the pin 21 thereof can be floated. As for the installation location, in order to always position the shield cylinder 1 at the center of the plating tank 4, in the present embodiment, as described above, there are three directions around the outer surface of the diameter expansion opening portion 10, but not limited to this. It is desirable to install at least 3 places in at least the circumferential distribution. On the other hand, the material of the link 20 is the shield cylinder 1.
Better than The pin 21a on the guide float 2 side shown in FIGS. 6 to 8 may be omitted and fixed as shown in FIGS. 4 and 5.

【0020】以上の2つの実施例構成における作用につ
き以下説明する。まず第1実施例の説明から行う。上記
遮蔽筒1は、それに備えられたフロート11により、鍍
金液上に浮いている。そして圧延ロールがクレーン等に
より鍍金槽中央部に運搬され、徐々に鍍金液中に沈めら
れると、前記遮蔽筒1の拡径開放部10がロール側の固
定遮蔽材に接触し、更にこの遮蔽筒1によってその下端
側ジャーナル部が覆われた状態になって沈むことにな
る。その後鍍金処理がなされている間、遮蔽筒1はこれ
によって下端側ジャーナル部と電極との間を遮蔽し、こ
の部分が鍍金されないようにする。鍍金終了後圧延ロー
ルを徐々に吊り上げていくと、遮蔽筒1もそれに追従し
て浮上し、鍍金液上に浮き上がる。
The operation of the above two embodiments will be described below. First, the description of the first embodiment will be given. The shield cylinder 1 is floated on the plating solution by the float 11 provided therein. When the rolling roll is transported to the center of the plating tank by a crane or the like and gradually submerged in the plating solution, the expanded diameter opening portion 10 of the shielding cylinder 1 comes into contact with the fixed shielding material on the roll side, and further this shielding cylinder. The lower end side journal portion is covered by 1 and sinks. During the subsequent plating process, the shield cylinder 1 shields the lower end journal portion and the electrode from each other so that this portion is not plated. When the rolling roll is gradually lifted after the plating is completed, the shielding cylinder 1 also follows the surface of the shield and floats above the plating liquid.

【0021】一方第2実施例の構成では、芯出し用のガ
イドフロート2を備えているため、遮蔽筒1が鍍金液上
に浮いている時に、図5及び図6に示されるように、鍍
金槽4中央部に位置していることになる。次に圧延ロー
ル3がクレーン等により鍍金液中に沈められると、遮蔽
筒1の拡径開放部10がロール3の下端側ジャーナル部
30に取り付けられた固定遮蔽材31に接触し、該ジャ
ーナル部30が覆われた状態になって一緒に沈むことに
なる。この時前記リンク20がピン21を中心に回動
し、芯出し用のガイドフロート2は、図5又は図7に示
されるように、傘を閉じるが如く鍍金液上で遮蔽筒1周
辺に近寄りつつ、更に沈降していく。鍍金処理終了後圧
延ロール3を徐々に吊り上げていくと、遮蔽筒1と共
に、ガイドフロート2も圧延ロール3に追従しながら浮
上してくる。該ロール3を鍍金液上に完全に吊り上げる
と、ガイドフロート2が鍍金液面上に達し、次いで遮蔽
筒1が鍍金液面まで浮上してくる。この時前記リンク2
0がピン21を支点にして回動し、ガイドフロート2
は、遮蔽筒1を中心に鍍金液面を水平方向に広がってい
く。遮蔽筒1が完全に浮上すると、ガイドフロート2が
鍍金槽4周辺若しくは電極5に接し、自動的に遮蔽筒1
が鍍金槽4中央部に位置することになる。
On the other hand, in the structure of the second embodiment, since the guide float 2 for centering is provided, when the shielding cylinder 1 is floating on the plating solution, as shown in FIGS. It is located in the center of the tank 4. Next, when the rolling roll 3 is submerged in the plating liquid by a crane or the like, the expanded diameter opening portion 10 of the shielding cylinder 1 contacts the fixed shielding material 31 attached to the lower end side journal portion 30 of the roll 3, and the journal portion 30 will be covered and will sink together. At this time, the link 20 rotates around the pin 21, and the guide float 2 for centering moves closer to the periphery of the shield cylinder 1 on the plating liquid as if closing the umbrella as shown in FIG. 5 or 7. Meanwhile, it further sinks. When the rolling roll 3 is gradually lifted after the plating process is completed, the guide float 2 as well as the shielding cylinder 1 floats up while following the rolling roll 3. When the roll 3 is completely lifted on the plating liquid, the guide float 2 reaches the plating liquid surface, and then the shielding cylinder 1 floats up to the plating liquid surface. At this time, the link 2
0 rotates about the pin 21 as a fulcrum, and the guide float 2
Spreads the plating liquid surface in the horizontal direction centering on the shield cylinder 1. When the shielding cylinder 1 is completely floated, the guide float 2 comes into contact with the periphery of the plating tank 4 or the electrode 5, and the shielding cylinder 1 is automatically moved.
Will be located in the center of the plating tank 4.

【0022】[0022]

【発明の効果】以上詳述した本発明の鍍金遮蔽装置の構
成によれば、遮蔽材の取り付けを予め行うことなく、部
分鍍金を行う際に簡単に且つ作業者の手作業によらず短
時間の内に行うことができる。そのため操業時間の短縮
化が図れ、且つ安全性の向上が図れることになる。
According to the structure of the plating shield device of the present invention described in detail above, the partial plating is performed easily without the need of attaching the shield material in advance and for a short time without the manual work of the operator. Can be done within. Therefore, the operating time can be shortened and the safety can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】縦型鍍金槽で圧延ロールの部分鍍金を行う時に
使用される本願第1発明に係る鍍金遮蔽装置の一実施例
構成を示す斜視図である。
FIG. 1 is a perspective view showing a configuration of an embodiment of a plating shield device according to the first invention of the present application, which is used when performing partial plating of a rolling roll in a vertical plating tank.

【図2】上記遮蔽装置を構成する遮蔽筒の上部部分の拡
大断面図である。
FIG. 2 is an enlarged cross-sectional view of an upper portion of a shielding cylinder that constitutes the shielding device.

【図3】縦型鍍金槽で圧延ロールの部分鍍金を行う時に
使用される本願第2発明に係る鍍金遮蔽装置の一実施例
構成を示す斜視図である。
FIG. 3 is a perspective view showing the configuration of an embodiment of a plating shield device according to the second invention of the present application, which is used when performing partial plating of a rolling roll in a vertical plating tank.

【図4】上記遮蔽装置を構成する遮蔽筒の上部部分の拡
大断面図である。
FIG. 4 is an enlarged cross-sectional view of an upper portion of a shielding cylinder that constitutes the shielding device.

【図5】ガイドフロートの縦型鍍金槽における作動状態
説明図である。
FIG. 5 is an explanatory view of an operating state of a guide float in a vertical plating tank.

【図6】ガイドフロートにより遮蔽筒本体が鍍金槽中央
に浮かんだ状態を示す縦型鍍金槽断面図である。
FIG. 6 is a vertical plating tank cross-sectional view showing a state in which the shielding cylinder main body is floated in the center of the plating tank by the guide float.

【図7】圧延ロールを鍍金液中に沈めて下端側ジャーナ
ル部を前記遮蔽筒で覆い、その時のガイドフロートの鍍
金液中での動きを示す縦型鍍金槽断面図である。
FIG. 7 is a cross-sectional view of a vertical plating tank showing the movement of the guide float in the plating solution by immersing the rolling roll in the plating solution and covering the lower end side journal portion with the shielding cylinder.

【図8】圧延ロール等を縦型鍍金槽で部分鍍金する場合
に、ロール軸両端に取り付ける固定遮蔽材の取り付け状
態を示す説明図である。
FIG. 8 is an explanatory view showing a mounting state of fixed shielding members mounted on both ends of a roll shaft when partially rolling a rolling roll or the like in a vertical plating tank.

【図9】吊り治具の構成を示す斜視図である。FIG. 9 is a perspective view showing a configuration of a hanging jig.

【図10】圧延ロール等を縦型鍍金槽で垂直吊りした鍍
金準備作業の概要を示す説明図である。
FIG. 10 is an explanatory diagram showing an outline of a plating preparation work in which a rolling roll or the like is vertically hung in a vertical plating tank.

【図11】圧延ロール等を縦型鍍金槽で部分鍍金する場
合に、吊り治具で固定して垂直吊りにした後遮蔽材を取
り付けた状態を示す説明図である。
FIG. 11 is an explanatory diagram showing a state in which a shielding member is fixed after being vertically hung by a hanging jig when partially rolling a rolling roll or the like in a vertical plating tank.

【符号の説明】[Explanation of symbols]

1 遮蔽筒 2 ガイドフロート 3 圧延ロール 4 鍍金槽 5 電極 1 shield cylinder 2 guide float 3 rolling roll 4 plating tank 5 electrode

フロントページの続き (72)発明者 浜 隆 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内 (72)発明者 露木 勇 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内 (72)発明者 佐原 浩二 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内 (72)発明者 佐々木 賢二 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内 (72)発明者 柳父 栄三 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内 (72)発明者 倉本 学 大阪府大阪市西淀川区歌島3丁目3−16 株式会社野村鍍金内(72) Inventor Takashi Hama 3-16, Utashima Nishiyodogawa-ku, Osaka City, Osaka Prefecture 3-16 Nomura Plating Co., Ltd. (72) Inventor Isamu 3-3-16, Utajima, Nishiyodogawa-ku, Osaka City, Osaka Prefecture Platter (72) Koji Sahara, 3-16 Utajima, Nishiyodogawa-ku, Osaka City, Osaka Prefecture 3-16 Nomura Plating Co., Ltd. (72) Kenji Sasaki, 3-16, Utajima, Nishiyodogawa-ku, Osaka City, Osaka Nomura Platter (72) Inventor Eizo Eizo 3-3-16 Utajima, Nishiyodogawa-ku, Osaka City, Osaka Prefecture 3-16 Nomura Plating Co., Ltd. (72) Manabu Kuramoto 3-16, Utajima, Nishiyodogawa-ku, Osaka City, Osaka Prefecture

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 鍍金液上に浮き、且つ鍍金時に被鍍金材
の一部を覆った状態で該被鍍金材の重さにより鍍金液中
に沈む非電気伝導材質の遮蔽筒を備えたことを特徴とす
る鍍金遮蔽装置。
1. A shield tube made of a non-electrically conductive material that floats on a plating liquid and covers the part of the material to be plated during plating and sinks into the plating liquid due to the weight of the material to be plated. A characteristic plating shielding device.
【請求項2】 鍍金時に被鍍金材の一部を覆った状態で
該被鍍金材の重さにより鍍金液中に沈む非電気伝導材質
の遮蔽筒と、該遮蔽筒の周囲にリンクを介して接続され
た芯出し用ガイドフロートとを備えたことを特徴とする
鍍金遮蔽装置。
2. A shield cylinder made of a non-electrically conductive material, which sinks in the plating liquid due to the weight of the plated material while partially covering the plated material during plating, and a link around the shield tube. A plating shielding device comprising a connected centering guide float.
JP5344732A 1993-12-21 1993-12-21 Plating shielding device Expired - Lifetime JP3072453B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5344732A JP3072453B2 (en) 1993-12-21 1993-12-21 Plating shielding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5344732A JP3072453B2 (en) 1993-12-21 1993-12-21 Plating shielding device

Publications (2)

Publication Number Publication Date
JPH07180084A true JPH07180084A (en) 1995-07-18
JP3072453B2 JP3072453B2 (en) 2000-07-31

Family

ID=18371552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5344732A Expired - Lifetime JP3072453B2 (en) 1993-12-21 1993-12-21 Plating shielding device

Country Status (1)

Country Link
JP (1) JP3072453B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003003294A (en) * 2001-06-26 2003-01-08 Matsushita Electric Ind Co Ltd Full surface electroplating equipment and full surface plated lead frame manufactured by the same
EP1520915A2 (en) * 2003-09-17 2005-04-06 Nippon Platec Co., Ltd Method and apparatus for partially plating work surfaces

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003003294A (en) * 2001-06-26 2003-01-08 Matsushita Electric Ind Co Ltd Full surface electroplating equipment and full surface plated lead frame manufactured by the same
EP1520915A2 (en) * 2003-09-17 2005-04-06 Nippon Platec Co., Ltd Method and apparatus for partially plating work surfaces
EP1520915A3 (en) * 2003-09-17 2006-11-02 Nippon Platec Co., Ltd Method and apparatus for partially plating work surfaces

Also Published As

Publication number Publication date
JP3072453B2 (en) 2000-07-31

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