JPH07176649A - Stem for semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To facilitate the work for fixing a lead to a stem and to prevent the lead from bending at the time of plating. CONSTITUTION:In the method for manufacturing a stem for semiconductor device where leads 14 are inserted into lead insertion holes made in a stem body 10 and sealed through an electric insulator, the leads 14 are patterned integrally on the frame in accordance with the planar arrangement of lead insertion holes on the stem body 10. The leads 14 are bent substantially perpendicularly at the forward ends thereof to obtain a lead frame having bent parts which are then inserted into the lead holes of the stem body 10 and sealed through an electric insulator.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device stem used for mounting a laser element and the like and a method for manufacturing the same.

[0002]

2. Description of the Related Art There are various types of stems for semiconductor devices, depending on the type of chip components and packages mounted in a device such as a laser device, but generally the leads are attached to the stem body by glass sealing. . In the case of manufacturing a semiconductor device stem in which the leads are glass-sealed in this manner, in the conventional method, a lead insertion hole is provided in the metal eyelet that becomes the stem body, and the lead is inserted into the lead insertion hole using a sealing jig. As a result, a method of combining and sealing glass is performed. However, since the method of handling the leads one by one and sealing the leads with glass is inferior in workability, a method of integrally assembling the leads in a metal frame and glass-sealing them in a frame state is a method. Proposed (JP-A-58-66275).

[0003]

The method of using the above-mentioned leads connected to a metal frame is one method of using the leads.
Workability can be improved compared to the method of handling books one by one,
Since the conventional frame has a structure in which the leads are extended outward from one side edge and the extended ends of the leads are glass-sealed, it cannot be used for products in which many leads are attached to the eyelet. was there. Further, in manufacturing a stem for a semiconductor device, after the lead is glass-sealed, the eyelet and the lead outer surface are plated.
Conventionally, since plating is performed by barrel plating, the leads are bent during the plating, and there is a problem in that work to correct the bending of the leads is necessary.

The present invention has been made to solve these problems, and an object of the present invention is to easily handle the leads to facilitate the assembly of the apparatus, and the leads may bend during plating. SUMMARY OF THE INVENTION It is an object of the present invention to provide a stem for a semiconductor device and a method for manufacturing the same, which can prevent such a problem, provide a non-defective product with no bending of leads, and facilitate plating work.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in a stem for a semiconductor device in which a lead is sealed in a lead insertion hole provided in a stem body through an electrical insulator, a bent portion obtained by bending one end of the lead at a substantially right angle is inserted into the lead insertion hole. It is sealed through an electrical insulator, and the other end side of the lead is provided so as to extend from the bent portion to the outside of the stem body substantially parallel to the lower surface of the stem body. To do. Further, glass is used as the electrical insulator, and the bent portion of the lead is glass-sealed at the lead insertion hole portion. Further, a heat radiator portion for mounting a laser element is integrally formed on the stem body. Also,
In a method of manufacturing a stem for a semiconductor device, in which a lead is sealed in a lead insertion hole provided in a stem body via an electrical insulator, the lead is integrated with a frame as the lead according to a planar arrangement of the lead insertion hole of the stem body. A lead frame having a bent portion which is bent at a substantially right angle so as to insert the lead tip into the lead insertion hole, and the lead bent portion of the lead frame is It is characterized in that it is sealed to the lead insertion hole of the stem body via an electrical insulator. In addition, the bent portion of the lead formed on the lead frame is aligned with the lead insertion hole of the stem body through the powder-molded sealing glass, and the lead bent portion is glass-sealed in the lead insertion hole by heating. It is characterized by wearing.

[0006]

Since the semiconductor device stem according to the present invention is formed in a shape in which the lead end is extended to the side of the stem body, it is provided as a semiconductor device stem that can be easily surface-mounted. Further, since the heat radiator is integrally formed with the stem, it can be suitably used as a laser element mounting device.
Further, when manufacturing a stem for a semiconductor device, by manufacturing the stem body by setting it on a frame in which the leads are integrally formed with a pattern, it becomes easy to handle the lead during manufacturing, and bending of the lead may occur. It is possible to prevent this, and it is possible to easily plate the lead and the stem body.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. 1 to 3 are explanatory views showing a method for manufacturing an embodiment of a semiconductor device stem according to the present invention. The stem for a semiconductor device of the embodiment is an example of a stem on which a laser element is mounted. A metal body eyelet 10 which is a stem body is formed by erecting a radiator portion 12 on which a laser element is mounted, and leads 14 are attached to the eyelet 10. It is made by sealing glass.

In the method for manufacturing a stem for a semiconductor device according to the present invention, the number of leads to be attached to the stem body is formed as a lead frame in a predetermined pattern for each number required for one stem body, and the stem body is formed separately. It is characterized in that a stem for a semiconductor device is manufactured in combination with a lead frame. FIG. 2 shows a lead frame 20 used in combination with the eyelet 10. In the semiconductor device stem of the embodiment, ten leads 14 are attached to one eyelet 10, so that ten leads 14 are patterned for each section of the lead frame 20.

Further, in the semiconductor device stem of the embodiment, the leads 14 are attached to the eyelet 10 in an arcuate array, so that the lead frame 20 has five lead frames 20 facing each other from both side edges of the frame, as shown in FIG. 2A. Lead 14 each
And the extended end position of the lead 14 is moved to the eyelet 10
In accordance with the arrangement position of the connecting portion of the lead 14 in the above, that is, the position of the lead insertion hole, an arcuate array is formed. Since one end of the lead 14 is inserted into a lead insertion hole provided in the eyelet 10 and is sealed with glass, the extending end is bent upward at a substantially right angle as shown in FIG. 2 (b). To do.

The eyelet 10 to be combined with the lead frame 20 is formed by pressing a plate material having a predetermined thickness as in the conventional processing method. The eyelet 10 is provided with a lead insertion hole and a radiator portion 12, which are formed as individual pieces having a predetermined outer shape. In addition, the radiator portion 12
Are integrally formed in a rising shape by several pressing steps. When setting the eyelet 10 on the lead frame 20, the lead 14 is attached to each section of the lead frame 20.
The eyelet 10 is set according to the arrangement position of.

When the lead frame 20 and the eyelet 10 are set, the tips of the leads 14 are inserted into the lead insertion holes of the eyelet 10 and the glass for glass sealing is sandwiched between the leads 14 and the eyelet 10. To do. FIG. 3 shows a state in which glass for glass sealing is set by being sandwiched between the lead 14 and the eyelet 10. Since the eyelet 10 is set on the lead 14 as shown in the figure, in the embodiment, the lower surface of the eyelet 10 and the lead 1 are set.
The eyelet 10 was set by sandwiching the powder-molded sealing glass 30 between the eyelets 10. Further, as shown in FIG. 5, the lead insertion hole portion of the eyelet 10 was provided with a hole for passing the bent portion 14a at the tip of the lead 14, and the powder-molded sealing glass 30 was inserted therein.

Therefore, when the eyelet 10 is set on the lead frame 20, first, the sealing glass 30 is set on the lead frame 20, and then the eyelet 10 is set on the sealing glass 30. After the glass for sealing 30 and the eyelet 10 are set in the same manner for each section of the lead frame 20, the leads 14 are glass-sealed by heating the whole. Lead 1
After glass 4 is sealed with glass, the entire lead frame 20 to which the eyelet 10 is attached is plated, and the leads 14 are separated from the lead frame 20 to obtain a semiconductor device stem that is separated into individual pieces.

FIG. 4 shows a sectional view of an embodiment of a semiconductor device stem. In the semiconductor device stem of the embodiment, the bent portion 1 at the tip of the lead 14 is inserted into the lead insertion hole of the eyelet 10.
4a is glass-sealed, and the lower surface of the eyelet 10 and the lead 14 are electrically insulated by the glass 32, so that the lead 14 extends outside the eyelet 10. Since the lead 14 is formed so as to extend in parallel with the lower surface of the eyelet 10, it can be obtained as a semiconductor device stem having a form suitable for surface mounting. In the embodiment, the leads 14 are extended from the outer periphery of the eyelet 10 to both sides by extending the leads 14 from opposite side edges of the frame of the lead frame 20, but the arrangement of the leads 14 depends on the design of the lead frame 20. It can be set appropriately. For example, the leads 14 may be designed to extend radially from the stem body.

According to the manufacturing method of the embodiment, the leads 14 are patterned on the lead frame 20, the eyelet 10 is set on the lead frame 20 and glass-sealed. Eyelet 1
Even when it is attached to 0, it can be easily handled. Further, when forming the leads 14 on the lead frame 20, it is possible to easily attach a large number of leads 14 to one eyelet 10 by patterning the leads 14 according to the planar arrangement of the leads 14 on the eyelet 10. It became possible.

Since the lead 14 is glass-sealed and then plated with the eyelet 10 attached to the lead frame 20, the lead 14 does not bend during plating and a good product without lead bending can be easily manufactured. can do. When electrolytic plating is performed, the lead frame 20 and the eyelet 10 can be plated together by electrically connecting one of the leads 14 to the eyelet 10. In this case, regarding the portion of the lead 14 connected to the eyelet 10, the lead 14 may be brought into contact with the lower surface of the eyelet 10 without providing a lead insertion hole in the eyelet 10. The eyelet 10 can be set to the ground potential by using the lead pin as the ground pin.

In the above-described embodiment, when the lead frame 20 and the eyelet 10 are combined, the eyelets 10 are separated and set into individual pieces. Alternatively, the leads 14 of each section of the lead frame 20 and the eyelets 10 connected to each other may be aligned and set in sequence. By attaching the eyelet 10 to the frame in this manner, it is possible to handle the eyelet 10 more easily than when the eyelet 10 is separated into individual pieces.

Although the lead 14 is glass-welded to the eyelet 10 in the above-described embodiment, a material having electrical insulation other than glass may be used if airtightness between the lead 14 and the eyelet 10 is not so required. it can.

[0018]

Since the semiconductor device stem according to the present invention has leads extending substantially parallel to the lower surface of the stem body with respect to the stem body, it can be provided as a semiconductor device stem that can be easily surface-mounted. . Further, according to the method for manufacturing a stem for a semiconductor device according to the present invention, since the lead frame on which the leads are formed and the eyelet body are manufactured in combination, even if a large number of leads are attached to one stem body, efficiency is improved. It becomes possible to work on a regular basis.
Further, even when plating is applied, the lead is not bent, and the work can be easily performed.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a method of manufacturing a stem for a semiconductor device.

FIG. 2 is an explanatory diagram of a lead frame on which leads are used for manufacturing a stem for a semiconductor device.

FIG. 3 is an explanatory diagram showing a state in which an eyelet is set on a lead.

FIG. 4 is a cross-sectional view of a semiconductor device stem.

FIG. 5 is a perspective view of a glass for sealing.

[Explanation of symbols]

 10 Eyelet 12 Heat Dissipator 14 Lead 14a Bent 20 Lead Frame 30 Glass for Sealing 32 Glass

Claims (5)

[Claims] 1. A stem for a semiconductor device in which a lead is sealed in a lead insertion hole provided in a stem body through an electrical insulator, and a bent portion is formed by bending one end of the lead into the lead insertion hole at a substantially right angle. And seal it with an electrical insulator.
A stem for a semiconductor device, wherein the other end side of the lead is provided so as to extend outward of the stem body substantially parallel to the lower surface of the stem body from the bent portion. 2. The stem for a semiconductor device according to claim 1, wherein glass is used as the electrical insulator, and the bent portion of the lead is sealed with glass at the lead insertion hole portion. 3. The stem for a semiconductor device according to claim 1, wherein a heat radiator portion for mounting a laser element is integrally formed on the stem body. 4. A method for manufacturing a stem for a semiconductor device, in which a lead is sealed in a lead insertion hole provided in a stem body via an electrical insulator, wherein the lead is a planar arrangement of the lead insertion hole of the stem body. In addition, a pattern formed integrally with the frame and formed as a lead frame provided with a bent portion at which the lead tip is bent at a substantially right angle so as to be inserted into the lead insertion hole is used. A method of manufacturing a stem for a semiconductor device, characterized in that a bent portion is sealed in a lead insertion hole of the stem body via an electrical insulator. 5. The bent portion of the lead formed on the lead frame is aligned with the lead insertion hole of the stem body through the powder-molded sealing glass, and heated to make the bent portion of the lead into the lead insertion hole. The method for manufacturing a stem for a semiconductor device according to claim 4, wherein the method is a glass sealing.