JPH07174943A - Stem for mounting optical semiconductor and optical semiconductor device - Google Patents

Abstract

PURPOSE:To provide an optical semiconductor device with which easy positioning of an optical semiconductor is possible and easy alignment of a lens and an optical fiber is possible and which permits mass production at a low cost. CONSTITUTION:A stem is constituted to have a mounting part 15 for the optical semiconductor which projects from one surface 14, has an area slightly larger than the area of the optical semiconductor 12 to be mounted and is suitable for mounting the optical semiconductor with its outer edge as a marker at the time of mounting the optical semiconductor. The optical semiconductor device is constituted to have the stem for mounting the optical semiconductor, a lens supported on the central axial line of the optical semiconductor with respect to the stem, a flange for fixedly supporting the stem and a ferrule for holding the optical fiber to be fixed on the central axial line of the optical semiconductor to this flange.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor mounting stem and an optical semiconductor device used in a communication line using an optical fiber, for example.

[0002]

BACKGROUND OF THE INVENTION To use optical fibers, optical semiconductors are used to convert optical signals into electrical signals and to convert electrical signals into optical signals. In telephone lines, optical semiconductors are attached to parts called stems. Further, a lens is arranged between the optical fiber and the optical semiconductor so that the light emitted from the optical fiber is converged on one point of the optical semiconductor. Therefore, the optical fiber, the lens, and the optical semiconductor must be arranged on the same optical axis.

[0003]

In telephone lines, optical fibers have come to be widely used between central offices, but optical fibers are not so much used between central offices and individual subscribers at present. not being used. However, the widespread use of optical fibers between central offices and subscribers is seen as a matter of time.

A problem in using the optical fiber between the central office and the subscriber is that the current technology cannot provide an inexpensive optical device for each subscriber. Conventionally, in the case of a subscriber optical fiber, an optical fiber, a lens, and an optical semiconductor are separately supported, and these parts are aligned while being relatively moved, and are separately fixed. Therefore, it can be said that the cost is high and the spread is delayed.

Further, as described above, the optical semiconductor is attached to the stem. The stem has a flat surface with plated chip bonding areas. Markers engraved on the chip bonding area may be attached for positioning the optical semiconductor. However, if you put a marker on the chip bonding area,
When attaching the optical semiconductor to the stem, the brazing material may flow out and the marker may disappear. Further, the optical semiconductor may be positioned relative to the outer edge of the stem by using a cross scale of a microscope, but such a method is not effective unless the size of the stem is standardized.

Further, there is a work called lead rotation in order to rotate the optical semiconductor with respect to the electric device to which it is attached and set it at an appropriate position, but it is required that the stem is suitable for such lead rotation. Has been.

An object of the present invention is to provide an optical semiconductor body mounting stem capable of easily positioning an optical semiconductor. Another object of the present invention is to provide an optical semiconductor device in which the optical semiconductor, the lens and the optical fiber can be easily aligned with each other and which can be mass-produced at low cost.

[0008]

The stem for mounting an optical semiconductor according to the present invention has an area slightly larger than the area of the optical semiconductor 12 to be mounted and protruding from one surface 14, and its outer edge when mounting the optical semiconductor. It is characterized by having an optical semiconductor mounting portion 15 suitable for mounting an optical semiconductor as a marker.

The optical semiconductor device according to the present invention further includes a stem 10 for mounting an optical semiconductor, a lens 36 supported on the central axis of the optical semiconductor 12 with respect to the stem.
A flange 30 for fixedly supporting the stem and an optical fiber holding ferrule 40 fixed on the central axis of the optical semiconductor are provided on the flange 30.

[0010]

In the optical semiconductor mounting stem having the above structure, the optical semiconductor can be mounted with the outer edge of the mounting portion of the optical semiconductor as a marker when mounting the optical semiconductor, and the optical semiconductor can be mounted very easily and accurately. Is now possible. Further, in the optical semiconductor device having the above-described configuration, since it is possible to manufacture each module as a module integrated with each other, it is possible to reduce the manufacturing cost. Furthermore, the optical fiber, the lens, and the optical semiconductor are fixed to the respective support members in a fixed relationship, and the alignment of these parts can be performed easily and reliably. Conventionally, all the XYZ alignments were required, but the present invention makes it possible to achieve the desired performance by aligning only the XY (horizontal direction).

[0011]

1 and 2 are views showing an optical semiconductor mounting stem 10 according to an embodiment of the present invention. Stem 10
Comprises a stem base 11 fixed to a flange 30 (FIG. 5) described later, and a stem header 13 on which an optical semiconductor 12 is mounted. An optical semiconductor mounting portion 15 is provided on the flat surface 14 of the stem header 13. The optical semiconductor mounting portion 15 projects from the flat surface 14 and has an area slightly larger than the area of the optical semiconductor 12 to be mounted, and when mounting the optical semiconductor 12, the optical semiconductor 12 is mounted on the optical semiconductor 12 using the outer edge 16 as a marker. It can be attached to the mounting portion 15.

A metallic pattern 17 formed by plating is formed on the flat surface 14 of the stem header 13 and the surface of the optical semiconductor mounting portion 15, and the optical semiconductor 12 has a metallic pattern 17 on the surface of the optical semiconductor mounting portion 15.
Attached to. The metallic pattern 17 on the surface of the mounting portion 15 corresponds to a region covered with the optical semiconductor 12 and is smaller than the surface area of the mounting portion. The outer edge 16 does not flow to the outer edge 16, and the outer edge 16 can be reliably used as a reference. The stem base 11 and the stem header 13 are provided with, for example, four through holes 18,
In the illustrated embodiment, the leads 19 are inserted and fixed in two of the through holes. The metallic pattern 17 on the flat surface 14 of the stem header 13 extends so as to be connected to one lead 19. The other lead 19 is connected to a terminal of the optical semiconductor. In the illustrated embodiment,
Another lead 19 is attached to the bottom surface of the stem base 11.

The shape of the outer peripheral portion 20 of the stem header 13 is formed so as to match the shape of the inner peripheral portion of the lens support cap 35 described later. Further, the shape of the outer peripheral portion 21 of the stem base 11 is larger than that of the outer peripheral portion 20 of the stem header 13 and coincides with the fitting concave portion of the flange 30.

The stem header 13 is made of ceramic such as alumina, the stem base 11 is made of metal, and the stem header 13 is integrated with the stem base 11. The stem header 13 is obtained by molding ceramic in a mold. Therefore, the center of the mounting portion 15 of the optical semiconductor and the center of the outer peripheral portion 20 of the stem header 13 coincide with each other with a precision equivalent to the precision of molding. Therefore, when the optical semiconductor 12 is attached to the optical semiconductor mounting portion 15 by using the outer edge 16 as a marker, the result is that the optical semiconductor 12 is entirely concentric with the outer peripheral portion 20 of the stem header 13 within φ0.05 mm. There is. Since the lens 36 described later is arranged with the outer peripheral portion 20 of the stem header 13 as a reference, the lens 36 is arranged substantially on the same axis with respect to the optical semiconductor 12.

FIGS. 5 and 6 are views showing an optical semiconductor device using the optical semiconductor mounting stem 10 of FIGS. This optical semiconductor device includes a stem 10 for mounting an optical semiconductor 12, and an optical semiconductor 12 for the stem 10.
The lens 36 supported on the central axis of the
And a flange 30 for fixedly supporting 0 and this flange 3
0 and an optical fiber holding ferrule 40 fixed on the central axis of the optical semiconductor 12.

The structure of the stem 10 is as described above.
The lens 36 is a lens support cap 3 having a central opening.
This lens support cap 3 is attached to the center of the lens 5.
The legs of 5 are fitted to the stem 10. That is, the shape of the inner peripheral portion of the leg portion of the lens support cap 35 matches the shape of the outer peripheral portion 20 of the stem header 13, and the leg portion of the lens support cap 35 is fitted to the stem header 13. The leg portion of the lens support cap 35 contacts the stem base 11 and is fixed to the stem base 11 by resistance welding. In this way, the arrangement of the optical semiconductor 12 and the lens 36 on the same axis, and the constant positional relationship between the optical semiconductor 12 and the lens 36 in the axial direction are achieved.

The flange 30 is formed in a bell shape having a dome portion 37 having a central opening 36 and a flange portion 38 extending outward from the bottom of the dome portion 37 in the radial direction. A hole 38a is provided in the peripheral portion of the collar portion 38, so that the entire device shown in FIG. 5 can be attached to an electric device such as a telephone exchange.

The flange portion 38 of the flange 30 is the stem base 1.
1 has a fitting recess 39 that matches the shape of the outer peripheral portion 21,
The stem base 11 is fitted to the flange 30 in a state where the optical semiconductor mounting portion 15 and the lens support cap 35 are inserted into the dome portion 37. The stem base 11 is fitted to the flange 30 and then fixed by laser welding or the like.

As shown in FIG. 1, the stem base 11
The outer peripheral portion 21 has a regular octagonal shape, and as shown in FIG. 6, the fitting recess 39 of the flange portion 38 of the flange 30 also has a regular octagonal shape. The user is within the range of a regular octagon,
The stem rotation can be performed by rotating the stem base 11 with respect to the flange 30. The shapes of the outer peripheral portion 21 of the stem base 11 and the fitting recess 39 are not limited to regular octagons, but may be regular hexagons, for example. The lead rotation can be surely determined every 45 ° for the regular octagon and every 60 ° for the regular hexagon.

Further, an optical fiber holding ferrule 40 is fixed to the dome portion 37 of the flange 30. The ferrule 40 has an optical fiber 41 fixed therein by an adhesive 42, and a core wire 43 of the optical fiber 41 is fixed to the ferrule 40.
Is a member that guides the tip surface of the. The core wire 43 of the optical fiber 41 faces the lens 36 through the central opening 36 of the dome portion 37. The tip surface of the ferrule 40 is the flange 3
The outer surface of the zero dome portion 37 is brought into contact with the outer surface of the dome portion 37, whereby a fixed axial positional relationship between the core wire 43 of the optical fiber 41 and the lens 36 is achieved. Therefore, in assembly, the ferrule 40 can be positioned in the X, Y, and Z directions by aligning it with the marker provided on the dome portion 37 of the flange 30. The ferrule 40 is fixed to the dome portion 37 of the flange 30 by laser welding or the like. Ferrule 40
A rubber protective cover 44 is attached around the periphery.

FIG. 7 is a diagram showing an example of a telephone line in which the optical semiconductor device of FIGS. 5 and 6 is used. The telephone exchange (exchange) 50 is connected to another telephone exchange 51 by an optical fiber 52. An optical semiconductor device 53 is attached to the end of the optical fiber 52, and this optical semiconductor device 53 is attached to the exchange. Further, the telephone station 51 and the subscriber 54 are connected by an optical fiber 52. Also in this case, the optical semiconductor device 53 is attached to the end of the optical fiber 52, and the optical semiconductor device 53 is attached to the subscriber's telephone. The optical semiconductor device 53 according to the present invention does not necessarily have to be used in a switchboard, but is suitable for being attached to a subscriber's telephone.

FIG. 3 is a view showing a modification of the stem 10. Similar to the embodiment of FIGS. 1 and 2, the stem 10 comprises a stem base 11 and a stem header 13, and an optical semiconductor mounting portion 15 has a flat surface 1 of the stem header 13.
4 is provided so as to project. In FIG. 1, the outer peripheral portion 20 of the stem header 13 has a circular shape. On the other hand, in FIG. 3, the shape of the outer peripheral portion 20 of the stem header 13 is a regular hexagon. In this case, the shape of the inner peripheral portion of the leg portion of the lens support cap 35 is also formed into a regular hexagon, and the lens support cap 35 is fitted to the outer peripheral portion 20 of the stem header 13.

FIG. 4 is a view showing a modified example of the stem 10. The stem 10 is a stem base 11 and a stem header 1
3, the optical semiconductor mounting portion 15 is provided so as to project from the flat surface 14 of the stem header 13. Figure 1
In, the shape of the outer peripheral portion 21 of the stem base 11 is a regular hexagon. On the other hand, in FIG.
The outer peripheral portion 21 of the stem base 11 has a regular hexagonal shape. In this case, the fitting recess 39 of the flange 38 of the flange 30 is also formed in a regular hexagon, and the stem base 11 is fitted to the flange 30.

[0024]

As described above, the optical semiconductor body mounting stem of the present invention has the effect of easily positioning the optical semiconductor. Further, the optical semiconductor device of the present invention is an optical semiconductor,
The lens and the optical fiber can be easily aligned with each other and can be mass-produced at low cost.

[Brief description of drawings]

FIG. 1 is a plan view showing a stem according to an embodiment of the present invention.

2 is a side view of the stem of FIG. 1. FIG.

FIG. 3 is a plan view showing a modified example of a stem.

FIG. 4 is a plan view showing a modified example of a stem.

FIG. 5 is a sectional view showing an optical semiconductor device of an example of the present invention.

FIG. 6 is a bottom view of the flange of FIG.

FIG. 7 is a diagram showing an example of a telephone line.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Stem 11 ... Stem base 12 ... Optical semiconductor 13 ... Stem header 14 ... Surface 15 ... Optical semiconductor mounting part 30 ... Flange 35 ... Lens support cap 36 ... Lens 40 ... Ferrule 41 ... Optical fiber

Claims (6)

[Claims] 1. A stem for mounting an optical semiconductor, the stem protruding from one surface (14) and having an area larger than that of an optical semiconductor to be mounted, and an outer edge of the optical semiconductor (12) when mounted. A stem for mounting an optical semiconductor, which has a mounting portion (15) serving as a marker. 2. A stem (1) for mounting an optical semiconductor
0), a lens (36) supported on the central axis of the optical semiconductor with respect to the stem, a flange (30) fixedly supporting the stem, and fixed to the flange on the central axis of the optical semiconductor. And an optical fiber holding ferrule (40). 3. The optical semiconductor device according to claim 2, wherein the lens is attached to a central portion of a cap-shaped lens supporting member, and legs of the lens supporting member are fitted to the stem. . 4. A flange that fixedly supports the stem has a dome portion having a central opening and a flange portion that extends radially outward from the bottom of the dome portion, and the stem is the optical semiconductor. 4. The optical semiconductor device according to claim 3, wherein the mounting portion and the lens supporting member are fixed to the collar portion while being inserted into the dome portion, and the ferrule is fixed to the dome portion. 5. The stem comprises a stem base fixed to the flange and a stem header on which an optical semiconductor is mounted, and the shape of the outer peripheral portion of the stem header is the same as the shape of the inner peripheral portion of the lens supporting member. The optical semiconductor device according to claim 4, wherein the lens support member is fitted to the stem header. 6. The flange of the flange has a fitting recess that matches the shape of the outer peripheral portion of the stem base, and the stem base is fitted to the flange. Optical semiconductor device.