JPH07169063A - Optical head - Google Patents

Optical head

Info

Publication number
JPH07169063A
JPH07169063A JP5315256A JP31525693A JPH07169063A JP H07169063 A JPH07169063 A JP H07169063A JP 5315256 A JP5315256 A JP 5315256A JP 31525693 A JP31525693 A JP 31525693A JP H07169063 A JPH07169063 A JP H07169063A
Authority
JP
Japan
Prior art keywords
light
objective lens
semiconductor laser
light receiving
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5315256A
Other languages
Japanese (ja)
Inventor
Toshihiro Ogata
利廣 尾方
Shiyouhei Kobayashi
章兵 小林
Tsuneo Yanagida
恒男 柳田
Haruhiko Takemura
治彦 竹村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP5315256A priority Critical patent/JPH07169063A/en
Publication of JPH07169063A publication Critical patent/JPH07169063A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an optical head which can increase the utilization efficiency of-light and detect with high accuracy the emission light amount of a semiconductor laser and a positional signal in the tracking direction of an objective lens with a simple and low-priced constitution. CONSTITUTION:In the optical head which irradiates an optical recording medium 6 with a laser beam from a semiconductor laser 1 which is displaceable at least in the tracking direction, reflection parts 5a, 10b for reflecting a part of a laser beam from the semiconductor laser 1 is provided in the objective lens 5 and its lens holder 10. There is provided in a light path between the semiconductor laser 1 and the objective lens 5 a semiconductor substrate 4 which has a mirror surface 4a for reflecting light from the semiconductor laser 1 and a light receiving part 4b having a light receiving area which is split into at least two parts in the tracking direction so as to receive reflected light from the reflection parts 5a, 10b.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、光記録媒体に対して
情報の記録、再生を行うための光ヘッド、特に対物レン
ズのトラッキング方向における位置信号および半導体レ
ーザの出射光量を検出するようにした光ヘッドに関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is designed to detect an optical head for recording and reproducing information on an optical recording medium, and particularly to detect a position signal in the tracking direction of an objective lens and the amount of light emitted from a semiconductor laser. It relates to an optical head.

【0002】[0002]

【従来の技術】従来の光ヘッドとして、例えば特開平4
−206046号公報に開示されているものがある。こ
の光ヘッドにおいては、図9に示すように、半導体レー
ザ21からの出射光を、受光素子22で反射させて、対
物レンズ23を経て光ディスクの記録面(図示せず)に
照射し、その記録面でのピットの変調を受けた反射光を
対物レンズ23を経て受光素子22で受光するようにし
ている。
2. Description of the Related Art As a conventional optical head, for example, Japanese Patent Laid-Open No.
There is one disclosed in Japanese Patent Publication No. -206046. In this optical head, as shown in FIG. 9, the light emitted from the semiconductor laser 21 is reflected by the light receiving element 22, is irradiated onto the recording surface (not shown) of the optical disc through the objective lens 23, and the recording is performed. The reflected light that has undergone pit modulation on the surface is received by the light receiving element 22 via the objective lens 23.

【0003】受光素子22は、図10に示すように、2
つの検出部22a,22bを有し、光ディスクの記録面
での反射光を検出部22aで受光して、その出力に基づ
いてRF信号、フォーカスエラー信号、トラッキングエ
ラー信号を検出し、半導体レーザ21からの出射光を検
出部22bで受光して出射光量を検出し、その出力に基
づいて半導体レーザ21の出射光量を制御するようにし
ている。
As shown in FIG.
The detector 22a has two detectors 22a and 22b, and the detector 22a receives the reflected light on the recording surface of the optical disc, and detects the RF signal, the focus error signal, and the tracking error signal based on the output, and outputs from the semiconductor laser 21. The emitted light is detected by the detector 22b to detect the emitted light amount, and the emitted light amount of the semiconductor laser 21 is controlled based on the output.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来の光ヘッドでは、受光素子22の検出部22aに
おいて、往路では半導体レーザ21からの光の一部を対
物レンズ23に向けて反射させ、復路では光ディスクの
ピットの変調を受けた光を受光するようにしているた
め、受光素子22の反射率をあまり高くできない。この
ため、光の利用効率が低下し、検出部22bにおいて半
導体レーザ21の出射光量を高精度で検出できないとい
う問題がある。
However, in the above-described conventional optical head, in the detecting section 22a of the light receiving element 22, a part of the light from the semiconductor laser 21 is reflected toward the objective lens 23 in the forward path, and the return path is returned. However, since the light modulated by the pits of the optical disk is received, the reflectance of the light receiving element 22 cannot be increased so much. For this reason, there is a problem that the light use efficiency is lowered, and the amount of light emitted from the semiconductor laser 21 cannot be detected with high accuracy in the detection unit 22b.

【0005】また、かかる光ヘッドにおいては、光ヘッ
ド全体を移動させてトラッキング制御を行うようにして
いるため、例えば対物レンズ23のトラッキング方向に
おける位置を光学的に検出しようとすると、半導体レー
ザ21とは別の光源を設けて位置検出手段を構成する必
要がある。このため、構成が複雑になり、コスト高にな
るという問題がある。
Further, in such an optical head, tracking control is performed by moving the entire optical head. Therefore, for example, when the position of the objective lens 23 in the tracking direction is optically detected, the semiconductor laser 21 is detected. It is necessary to provide another light source to configure the position detecting means. Therefore, there is a problem that the configuration becomes complicated and the cost becomes high.

【0006】この発明は、このような従来の問題点に着
目してなされたもので、光の利用効率を有効に向上で
き、半導体レーザの出射光量および対物レンズのトラッ
キング方向における位置信号を、簡単かつ安価な構成で
高精度に検出できるようにした光ヘッドを提供すること
を目的とする。
The present invention has been made by paying attention to such conventional problems, and can effectively improve the light utilization efficiency, and can easily output the emitted light amount of the semiconductor laser and the position signal in the tracking direction of the objective lens. It is also an object of the present invention to provide an optical head which can be detected with high accuracy by an inexpensive structure.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するた
め、この発明では、半導体レーザからのレーザ光を、少
なくともトラッキング方向に変位可能な対物レンズを経
て光記録媒体に照射するようにした光ヘッドにおいて、
前記対物レンズまたはこれを保持するレンズホルダに、
前記半導体レーザからのレーザ光の一部を反射させる反
射部を設けると共に、前記半導体レーザおよび対物レン
ズ間の光路中に、前記半導体レーザからの光を反射させ
るミラー面と、前記反射部からの反射光を受光するよう
に、トラッキング方向に少なくとも2分割された受光領
域を有する受光部とを具える半導体基板を設ける。
In order to achieve the above object, according to the present invention, an optical head is adapted to irradiate an optical recording medium with laser light from a semiconductor laser through at least an objective lens which can be displaced in the tracking direction. At
In the objective lens or a lens holder holding this,
A reflecting portion for reflecting a part of the laser light from the semiconductor laser is provided, and a mirror surface for reflecting the light from the semiconductor laser in the optical path between the semiconductor laser and the objective lens, and a reflection from the reflecting portion. A semiconductor substrate having a light receiving portion having at least two light receiving regions in the tracking direction is provided so as to receive light.

【0008】[0008]

【作用】かかる構成において、半導体レーザからのレー
ザ光は、半導体基板のミラー面で反射された後、対物レ
ンズを経て光記録媒体に照射されると共に、その一部は
対物レンズまたはそのレンズホルダに設けられた反射部
で反射されて、トラッキング方向に少なくとも2分割さ
れた受光領域を有する半導体基板の受光部に入射するこ
とになる。
In this structure, the laser light from the semiconductor laser is reflected by the mirror surface of the semiconductor substrate and then radiated to the optical recording medium through the objective lens, and a part of the laser light is transmitted to the objective lens or its lens holder. The light is reflected by the reflection portion provided and is incident on the light receiving portion of the semiconductor substrate having the light receiving region divided into at least two in the tracking direction.

【0009】[0009]

【実施例】以下、図面を参照してこの発明の実施例につ
いて説明する。図1は、この発明の第1実施例を示すも
のである。この実施例では、半導体レーザ1から出射さ
れたレーザ光を、コリメータレンズ2で平行光に変換し
た後、ビームスプリッタ3に入射させ、このビームスプ
リッタ3を透過するレーザ光を半導体基板4で反射させ
た後、矢印で示すトラッキング方向に変位可能な対物レ
ンズ5を経て光ディスク6にスポットとして照射する。
また、光ディスク6での反射光(戻り光)は、対物レン
ズ5を経て半導体基板4で反射させた後、ビームスプリ
ッタ3に入射させ、このビームスプリッタ3で反射され
る光ディスク6からの戻り光を、図2に図1の矢印A方
向から見た図を示すように、集光レンズ7およびシリン
ドリカルレンズ8を経て光検出器9で受光し、この光検
出器9の出力に基づいて公知の方法によりRF信号およ
びサーボ処理に必要なフォーカスエラー信号、トラッキ
ングエラー信号を得るようにする。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. In this embodiment, the laser light emitted from the semiconductor laser 1 is converted into parallel light by the collimator lens 2 and then incident on the beam splitter 3, and the laser light transmitted through the beam splitter 3 is reflected on the semiconductor substrate 4. After that, the optical disc 6 is irradiated as a spot through the objective lens 5 which can be displaced in the tracking direction shown by the arrow.
The reflected light (return light) from the optical disk 6 is reflected by the semiconductor substrate 4 through the objective lens 5 and then incident on the beam splitter 3, and the return light from the optical disk 6 reflected by the beam splitter 3 is reflected. As shown in FIG. 2 as viewed from the direction of arrow A in FIG. 1, the light is received by a photodetector 9 through a condenser lens 7 and a cylindrical lens 8, and a known method is performed based on the output of the photodetector 9. Thus, the RF signal and the focus error signal and tracking error signal necessary for servo processing are obtained.

【0010】半導体基板4には、図3に図1の矢印B方
向から見た図を示すように、ミラー部4aと、対物レン
ズ5のトラッキング方向に2分割した2つの受光領域を
有する受光部4bとを設ける。また、対物レンズ5に
は、図4に図3の矢印C方向から見た図を示すように、
その外周面の一部に反射部5aを設け、この反射部5a
を、対物レンズ5を保持するレンズホルダ10の一部に
切り欠き部10aを設けて、この切り欠き部10aから
露出させる。
As shown in FIG. 3 as viewed from the direction of arrow B in FIG. 3, the semiconductor substrate 4 has a mirror portion 4a and a light receiving portion having two light receiving regions divided in two in the tracking direction of the objective lens 5. 4b and. In addition, as shown in FIG. 4 as viewed from the direction of arrow C in FIG.
The reflection portion 5a is provided on a part of the outer peripheral surface of the reflection portion 5a.
Is provided in a part of the lens holder 10 that holds the objective lens 5 and is exposed from the notch 10a.

【0011】このようにして、半導体基板4のミラー部
4aにおいて、往路ではビームスプリッタ3を透過する
レーザ光を対物レンズ5側に反射させ、復路では対物レ
ンズ5を経て入射する光ディスク6からの戻り光をビー
ムスプリッタ3側に反射させる。また、対物レンズ5の
反射部5aでは、往路においてレーザ光の一部を半導体
基板4側に反射させ、その反射光を半導体基板4の受光
部4bで受光する。この受光部4bの2つの受光領域の
出力は、差動増幅器11および加算器12にそれぞれ供
給し、差動増幅器11の出力に基づいて対物レンズ5の
トラッキング方向の位置を検出し、また加算器12によ
り、半導体レーザ1の出射光量を検出して、それに基づ
いて半導体レーザ1の出射光量を制御するようにする。
In this way, in the mirror portion 4a of the semiconductor substrate 4, the laser beam transmitted through the beam splitter 3 is reflected to the objective lens 5 side in the outward path, and returned from the optical disk 6 which enters through the objective lens 5 in the return path. The light is reflected to the beam splitter 3 side. Further, in the reflecting portion 5a of the objective lens 5, a part of the laser light is reflected to the semiconductor substrate 4 side in the outward path, and the reflected light is received by the light receiving portion 4b of the semiconductor substrate 4. The outputs of the two light receiving regions of the light receiving unit 4b are supplied to the differential amplifier 11 and the adder 12, respectively, and the position of the objective lens 5 in the tracking direction is detected based on the output of the differential amplifier 11, and the adder is also added. The amount of emitted light of the semiconductor laser 1 is detected by 12, and the amount of emitted light of the semiconductor laser 1 is controlled based on the detected amount.

【0012】この実施例によれば、半導体基板4のミラ
ー部4aは、往路および復路ともレーザ光を反射させる
だけで、信号検出のための受光は行わないので、この部
分の反射率を上げることができる。したがって、光の利
用効率を向上することができるので、このミラー部4a
および対物レンズ5の反射部5aで順次反射されて受光
部4bに入射するレーザ光として、十分な光量を得るこ
とができ、これにより対物レンズ5のトラッキング方向
の位置および半導体レーザ1の出射光量を高精度で検出
することができる。
According to this embodiment, the mirror portion 4a of the semiconductor substrate 4 only reflects the laser beam on both the forward and backward paths and does not receive light for signal detection. Therefore, the reflectance of this portion should be increased. You can Therefore, since the light utilization efficiency can be improved, the mirror portion 4a
Also, a sufficient amount of light can be obtained as the laser light that is sequentially reflected by the reflecting portion 5a of the objective lens 5 and is incident on the light receiving portion 4b, whereby the position of the objective lens 5 in the tracking direction and the emitted light amount of the semiconductor laser 1 can be obtained. It can be detected with high accuracy.

【0013】また、従来の光ヘッドにおいては、受光素
子の検出部において、往路では半導体レーザからの光を
対物レンズに向けて反射させ、復路では光ディスクのピ
ットの変調を受けた光を受光するようにしているため、
往路および復路でのレーザ光の干渉が生じて、RF信
号、フォーカスエラー信号、トラッキングエラー信号を
正確に検出できないという問題があるが、この実施例で
は、復路のレーザ光のみを受光する光検出器9の出力に
基づいてこれらの信号を検出するようにしているので、
往路とのレーザ光の干渉を受けることがない。したがっ
て、光の利用効率を向上できるという効果ともあいまっ
て、RF信号、フォーカスエラー信号、トラッキングエ
ラー信号をより正確に検出することができる。
Further, in the conventional optical head, in the detecting portion of the light receiving element, the light from the semiconductor laser is reflected toward the objective lens on the outward path, and the light subjected to the pit modulation of the optical disk is received on the return path. Because
There is a problem that the RF signal, the focus error signal, and the tracking error signal cannot be accurately detected due to the interference of the laser light on the forward path and the return path. However, in this embodiment, the photodetector that receives only the laser light on the backward path is used. Since these signals are detected based on the output of 9,
The laser light does not interfere with the outward path. Therefore, the RF signal, the focus error signal, and the tracking error signal can be detected more accurately in combination with the effect that the utilization efficiency of light can be improved.

【0014】図5は、この発明の第2実施例の要部を示
すもので、図1の矢印B方向から見た図である。この実
施例は、対物レンズ5にレーザ光の一部を反射させる反
射部5aを設ける代わりに、図6に図5を矢印D方向か
ら見た図をも示すように、レンズホルダ10の一部に反
射部10bを設け、この反射部10bでの反射光を半導
体基板4の受光部4bに入射させるようにしたもので、
その他の構成は第1実施例と同様である。
FIG. 5 shows an essential part of the second embodiment of the present invention and is a view as seen from the direction of arrow B in FIG. In this embodiment, instead of providing the reflecting portion 5a for reflecting a part of the laser light on the objective lens 5, a part of the lens holder 10 is shown as shown in FIG. A reflecting portion 10b is provided on the light receiving portion 4b of the semiconductor substrate 4, and the light reflected by the reflecting portion 10b is incident on the light receiving portion 4b of the semiconductor substrate 4.
Other configurations are similar to those of the first embodiment.

【0015】この実施例によれば、反射部10bを、対
物レンズ5に設ける場合に比べ、より容易に、しかも高
反射率で形成することができるので、受光部4bに入射
する光量をより多くでき、したがって対物レンズ5のト
ラッキング方向の位置および半導体レーザ1の出射光量
をより高精度で検出することができる。
According to this embodiment, the reflecting portion 10b can be formed more easily and with a high reflectance as compared with the case where the reflecting portion 10b is provided on the objective lens 5, so that the amount of light incident on the light receiving portion 4b is increased. Therefore, the position of the objective lens 5 in the tracking direction and the amount of light emitted from the semiconductor laser 1 can be detected with higher accuracy.

【0016】図7は、この発明の第3実施例を示すもの
である。この実施例では、第1実施例において、半導体
基板4上に、受光部4bと分離して、往路でのレーザ光
の一部を受光するように受光素子4cを設け、受光部4
bの2つの受光領域の出力に基づいて差動増幅器11を
介して対物レンズ5のトラッキング方向の位置を検出
し、また受光素子4cの出力に基づいて増幅器13を介
して半導体レーザ1の出射光量を検出するようにしたも
のである。なお、レンズホルダ10には、ここでの反射
光が受光素子4cに入射しないように、図8に図7の矢
印E方向から見た図をも示すように、傾斜部10cを形
成する。
FIG. 7 shows a third embodiment of the present invention. In this embodiment, in the first embodiment, a light receiving element 4c is provided on the semiconductor substrate 4 so as to be separated from the light receiving portion 4b so as to receive a part of the laser light in the outward path.
The position of the objective lens 5 in the tracking direction is detected via the differential amplifier 11 based on the outputs of the two light receiving regions b, and the amount of light emitted from the semiconductor laser 1 via the amplifier 13 based on the output of the light receiving element 4c. Is detected. The lens holder 10 is formed with an inclined portion 10c so that the reflected light here does not enter the light receiving element 4c, as shown in FIG. 8 as seen from the direction of arrow E in FIG.

【0017】この実施例によれば、半導体基板4上に、
往路でのレーザ光の一部を、対物レンズ5やレンズホル
ダ10で反射させることなく受光する受光素子4cを設
け、この受光素子4cの出力に基づいて半導体レーザ1
の出射光量を検出するようにしたので、対物レンズ5が
トラッキング方向に大きく移動しても、受光部4cに入
射するレーザ光の光量が変化せず、したがって出射光量
をより高精度で検出することができる。
According to this embodiment, on the semiconductor substrate 4,
A light receiving element 4c is provided for receiving a part of the laser beam on the outward path without being reflected by the objective lens 5 or the lens holder 10, and the semiconductor laser 1 is output based on the output of the light receiving element 4c.
Since the amount of emitted light is detected, even if the objective lens 5 largely moves in the tracking direction, the amount of laser light incident on the light receiving portion 4c does not change, and therefore the amount of emitted light can be detected with higher accuracy. You can

【0018】[0018]

【発明の効果】以上のように、この発明によれば、半導
体レーザからのレーザ光を、半導体基板のミラー面で反
射させて、対物レンズを経て光記録媒体に照射させると
共に、その一部を対物レンズまたはそのレンズホルダに
設けられた反射部で反射させて、トラッキング方向に少
なくとも2分割された受光領域を有する半導体基板の受
光部に入射させるようにしたので、半導体基板のミラー
面の反射率を上げることができる。したがって、半導体
基板の受光部に十分な光量のレーザ光を得ることができ
るので、この受光部の出力に基づいて対物レンズのトラ
ッキング方向の位置や半導体レーザの出射光量を高精度
で検出することができ、しかも構成を簡単にできると共
に、全体を安価にできる。
As described above, according to the present invention, the laser light from the semiconductor laser is reflected by the mirror surface of the semiconductor substrate and irradiated onto the optical recording medium through the objective lens, and a part of the laser light is irradiated. Since the light is reflected by the reflecting portion provided on the objective lens or its lens holder and is made incident on the light receiving portion of the semiconductor substrate having at least two light receiving regions in the tracking direction, the reflectance of the mirror surface of the semiconductor substrate Can be raised. Therefore, since a sufficient amount of laser light can be obtained at the light receiving portion of the semiconductor substrate, the position of the objective lens in the tracking direction and the emitted light amount of the semiconductor laser can be detected with high accuracy based on the output of this light receiving portion. In addition, the structure can be simplified and the cost can be reduced as a whole.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の第1実施例を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.

【図2】図1の矢印A方向から見た図である。FIG. 2 is a diagram viewed from the direction of arrow A in FIG.

【図3】同じく、矢印B方向から見た図である。FIG. 3 is a view similarly seen from the direction of arrow B.

【図4】図3の矢印C方向から見た図である。FIG. 4 is a view as seen from the direction of arrow C in FIG.

【図5】この発明の第2実施例を示す図である。FIG. 5 is a diagram showing a second embodiment of the present invention.

【図6】図5の矢印D方向から見た図である。6 is a view seen from the direction of arrow D in FIG.

【図7】この発明の第3実施例を示す図である。FIG. 7 is a diagram showing a third embodiment of the present invention.

【図8】図7の矢印E方向から見た図である。8 is a view seen from the direction of arrow E in FIG.

【図9】従来の技術を説明するための図である。FIG. 9 is a diagram for explaining a conventional technique.

【図10】同じく、従来の技術を説明するための図であ
る。
FIG. 10 is likewise a diagram for explaining a conventional technique.

【符号の説明】[Explanation of symbols]

1 半導体レーザ 2 コリメータレンズ 3 ビームスプリッタ 4 半導体基板 4a ミラー部 4b 受光部 4c 受光素子 5 対物レンズ 5a 反射部 6 光ディスク 7 集光レンズ 8 シリンドリカルレンズ 9 光検出器 10 レンズホルダ 10a 切り欠き部 10b 反射部 10c 傾斜部 11 差動増幅器 12 加算器 13 増幅器 1 semiconductor laser 2 collimator lens 3 beam splitter 4 semiconductor substrate 4a mirror part 4b light receiving part 4c light receiving element 5 objective lens 5a reflecting part 6 optical disk 7 focusing lens 8 cylindrical lens 9 photodetector 10 lens holder 10a notch part 10b reflecting part 10c Inclined part 11 Differential amplifier 12 Adder 13 Amplifier

───────────────────────────────────────────────────── フロントページの続き (72)発明者 竹村 治彦 東京都渋谷区幡ヶ谷2丁目43番2号 オリ ンパス光学工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Haruhiko Takemura 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 半導体レーザからのレーザ光を、少なく
ともトラッキング方向に変位可能な対物レンズを経て光
記録媒体に照射するようにした光ヘッドにおいて、前記
対物レンズまたはこれを保持するレンズホルダに、前記
半導体レーザからのレーザ光の一部を反射させる反射部
を設けると共に、前記半導体レーザおよび対物レンズ間
の光路中に、前記半導体レーザからの光を反射させるミ
ラー面と、前記反射部からの反射光を受光するように、
トラッキング方向に少なくとも2分割された受光領域を
有する受光部とを具える半導体基板を設けたことを特徴
とする光ヘッド。
1. An optical head configured to irradiate an optical recording medium with laser light from a semiconductor laser through at least an objective lens that can be displaced in a tracking direction, wherein the objective lens or a lens holder holding the optical lens is provided with A reflecting portion for reflecting a part of the laser light from the semiconductor laser is provided, and a mirror surface for reflecting the light from the semiconductor laser in the optical path between the semiconductor laser and the objective lens, and reflected light from the reflecting portion. To receive
An optical head comprising: a semiconductor substrate having a light receiving portion having a light receiving region divided into at least two in the tracking direction.
【請求項2】 前記半導体基板に、前記受光部と分離し
て、前記半導体レーザからのレーザ光の一部を受光する
受光素子を設けたことを特徴とする請求項1記載の光ヘ
ッド。
2. The optical head according to claim 1, wherein the semiconductor substrate is provided with a light receiving element which is separated from the light receiving portion and receives a part of laser light from the semiconductor laser.
JP5315256A 1993-12-15 1993-12-15 Optical head Withdrawn JPH07169063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5315256A JPH07169063A (en) 1993-12-15 1993-12-15 Optical head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5315256A JPH07169063A (en) 1993-12-15 1993-12-15 Optical head

Publications (1)

Publication Number Publication Date
JPH07169063A true JPH07169063A (en) 1995-07-04

Family

ID=18063246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5315256A Withdrawn JPH07169063A (en) 1993-12-15 1993-12-15 Optical head

Country Status (1)

Country Link
JP (1) JPH07169063A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6463023B1 (en) 1998-05-11 2002-10-08 Nec Corporation Optical head and method for monitoring light source output in optical head
KR100557045B1 (en) * 2003-12-18 2006-03-03 엘지전자 주식회사 Apparatus and method for estimating distance and tilt between optical pick-up and media

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6463023B1 (en) 1998-05-11 2002-10-08 Nec Corporation Optical head and method for monitoring light source output in optical head
KR100557045B1 (en) * 2003-12-18 2006-03-03 엘지전자 주식회사 Apparatus and method for estimating distance and tilt between optical pick-up and media

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