JPH0716889B2 - Polishing sheet having hard abrasive grains and method for manufacturing the same - Google Patents

Description

TECHNICAL FIELD The present invention relates to an improvement in the structure of a flexible type polishing sheet and the manufacturing method thereof.

More specifically, the present invention relates to an improvement in a structure using a conductive adhesive for bonding hard abrasive grains for a polishing sheet used when polishing a hard material such as new ceramics, an ultra-hard material and glass, and a fixing method thereof.

[Conventional technology]

As a conventional example of this type, the invention described in Japanese Patent Laid-Open No. 59-161267 is known, and in this publication, when fixing abrasive grains to a base material, a conductive material such as DOTITE D-500 is formed on the base material. Adhesive is applied, and the abrasive grains are exposed to about 90%, the abrasive grains are adhered on the base material in a temporarily fixed state via the above-mentioned conductive adhesive, and after the adhesive is dried, the Nickel plating is applied by the plating method, etc., and the grain size is 50-60%.
It is described to be coated with nickel to a certain extent.

[Problems to Solve the Invention]

The above-mentioned electrodeposition method such as diamond abrasive grains and products based on the method, the electroconductive adhesive is preliminarily adhered to the base material prior to electrodeposition of the abrasive particles on the base material, and the electroconductive adhesive is used to polish the abrasive particles. Is temporarily fixed, and then the so-called electrodeposition means is used to fix the abrasive grains to the base material, so that the dispersion of the abrasive grains by landing plating compared to the generally widely used electrodeposition method.・ Can fix disadvantages such as non-adhesion of abrasive grains to the substrate due to gas generation during fixing, uneven distribution of abrasive grains due to non-uniform stirring, and fixing to the substrate compared to conventional general methods It can be appreciated that it has an advantage that the loss of the abrasive grains can be reduced without necessarily requiring a large amount of the abrasive grains as compared with the amount.

However, in the method of adopting this conductive adhesive for temporary fixing of abrasive grains, since the adhesive is applied to a considerable portion of the base material to carry out electrodeposition of the abrasive grains, There was a problem in that it was adhered to a considerable portion, resulting in the fixing of excessive abrasive grains, and the loss of abrasive grains was still small.

Further, in this conventional technique, since the temporary fixing of the abrasive grains by so-called pattern plating is performed only by the conductive adhesive, there is a disadvantage that the pattern is easily dropped.

This invention is intended to solve the above problems, by fixing the effective minimum abrasive grain group necessary for polishing to the substrate, to reduce the loss of use of abrasive grains, The purpose is to effectively use the grains.

Furthermore, the purpose is to further secure the fixing of the abrasive grains to the base material and make it difficult for the abrasive grains to fall off.

[Means for Solving the Problems]

In order to achieve the above object, according to the present invention, innumerable non-masking portions are formed on a base material, and hard abrasive grains are adhered to the area smaller than the area of the non-masking portions via a conductive adhesive. At the same time, the invention of the product in which the non-adhesive part of the conductive adhesive in the non-maskink part is hung on the hard abrasive grains and plated, and a myriad of non-masking part groups are formed in spots, A conductive adhesive is coated in each of these non-masking parts with an area smaller than the area of each non-masking part, and hard abrasive grains are adhered through the conductive adhesive to dry the conductive adhesive, and then It is an invention of a method in which the hard abrasive grains are electrodeposited.

Example 1 This example will be described with reference to the drawings, and as shown in FIG. 1, a polishing sheet made of a fabric constituting a base material.
A hard particle layer 12 is provided on one side face of the hard particle 20 in order to prevent the hard abrasive grains 20 described later from being buried under a grinding load and to improve the grinding effect. However, this particle layer 12
The inventor intends to omit the case.

And in order to provide the conductive layer 16 in the next step on the hard particle layer 12 to improve the adhesion when coated with a conductive agent and the conductive layer 16 to prevent the hard particle layer 12 from seeping into the primer coat 14 The thickness is about 5 to 50μ.

In order to provide the conductive layer 16, a polymer resin having conductivity is used as the conductive agent.

Specific examples include doped polyacetylene and polyparaphenylene. The insulating polymer resin may be kneaded with conductive powder, and specific examples are kneaded products of resin such as phenol, epoxy, urethane, polyester, polyimide and powder of Ag, Cu, Ni, C and the like. Is mentioned.

These conductive agents are provided in a thickness of about 2 ~ 100μ,
It is carried out by a method such as roll coating, knife coating, gravure coating and screen printing.

After drying the primer coat 14, this primer coat 14
After the conductive layer 16 is provided on the conductive layer 16, the conductive layer 16 is locally masked on the conductive layer 16 with an insulating material 18 such as polyester, vinyl chloride, epoxy, urethane, cellulose, or SBR having a thickness of about 2 to 200 μm. Has been applied.

This masking treatment is for the purpose of locally adhering the hard abrasive grains 20 described later, and its specific method is performed by so-called pattern coating, such as screen printing, gravure printing, offset printing, and photoresist printing. It can be done by a technique.

When the specific example of the above-mentioned masking process is carried out by the screen printing method, FIG. 2, FIG. 3 and FIG.
It will be described with reference to the drawings.

A lower screen made on the base material 10 based on a predetermined manuscript
Abut 22.

Naturally, the lower screen 22 has an emulsion 24 of a certain shape and a certain interval for forming the non-masking portion 32 on the substrate 10.
Is applied in a lot of spots.

Then, as shown in FIG. 3, the lower screen 22 coated with the emulsion 24 is applied to the base material 10, and the masking agent is applied from the lower screen 22 side toward the base material 10 side.

Thus, since the non-emulsion coated portion 27 between the emulsions 24 is not coated with the emulsion 24, it remains as the screen portion as it is.

Therefore, the insulating agent 18 is applied through the non-emulsion coated portion 27 to the underlying substrate 10 in spots to form the masking portion 33 on the coated portion.

Next, on the other hand, separately from the above-mentioned lower screen 22, an emulsion 23
An upper screen 26 is prepared by applying a uniform pattern and a certain interval, but the center of the opening 28 formed between the adjacent emulsions 23 is aligned with the center of the unmasked portion 32 of the lower screen 22 described above. However, the area is smaller than the area of the non-masking portion 32 of the lower screen 22.

Therefore, the center of the opening 28 of the upper screen 26 is aligned with the center of the non-masking portion 32 of the lower screen 22, and then the conductive adhesive 30 is applied from the upper screen 26 side.

Thus, the base material 10 has a non-masking portion 32 and a masking portion 33.
Thus, the conductive adhesive 30 is applied within the non-masking portion 32 in an area smaller than that area.

Thus, by performing pattern coating, an innumerable group of non-masking portions 32 are formed on the conductive layer 16 (see FIGS. 2 to 4).

Further, as the pattern, any shape such as a circle, a square, a rhombus, and a hexagon is adopted.

Therefore, depending on the application, the non-masking part 32 should have 0.3 to 700
Diamond, borazon, BC, Ti depending on the size of μ
Hard abrasive grains 20 such as N, SiC, Al ₂ O ₃ , TiC, and ZrO ₂ are obtained by kneading conductive powder and polymer resin, and are generally called Ag paste, Cu paste, and C paste. About 10% of the grain size of the abrasive grains 20 is adhered through the converted adhesive 30 so that the grains are buried. The composition of the adhesive 30 is basically the same as the composition of the conductive layer 16 described above.

It is not particularly necessary to specify the electric resistance value of the conductive adhesive 30.

The conductive adhesive 30 here is composed of a conductive filler, a resin binder, and a curing agent, and a metal powder is adopted as the filler, and as described above as the metal, Ag, Cu, Al, Ni, etc. Can be mentioned. Further, epoxy resin, acrylic resin, urethane resin or the like is adopted as the binder, and the curing agent needs to be examined in terms of physical properties, but in the case of the epoxy resin binder, acid anhydride, polyamine or the like is adopted.

Then, the abrasive sheet made of cloth, in which the hard abrasive grains 20 subjected to the treatment in the above steps are temporarily fixed with the adhesive 30 described above.
After immersing 10 in a plating bath as is known, the electrodeposition of the diamond abrasive grains described above is carried out in the bath.

The electrodeposition method for fixing the group of abrasive grains 20 is the same as the conventional example.

Example 2 This example will be described with reference to FIG. 5. In this example, the material of the base material is different from Example 1, but the essence of the invention is not different from Example 1. . Therefore, the description of Embodiment 1 can be applied to most of the structures.

A metal foil 38 made of a conductor such as copper is provided on one side of a base material 36 such as cloth.

Next, an insulating material 40 is so-called pattern coated on one side of the metal foil 38 according to the procedure described in the first embodiment, and the insulating material 40 is dried.

Then, the conductive adhesive 42 described in the first embodiment is applied to a myriad of unmasked portions in a range smaller than the area. Then, the hard abrasive grains 44 are adhered in a temporarily fixed state through the adhesive 42 in the non-masking portion.

After that, the group of hard abrasive grains 44 is fixed by the electrodeposition means as in the first embodiment.

〔The invention's effect〕

Since the present invention has the above configuration, it has the following advantages.

(1) Since the hard abrasive grains are fixed only at the local portions of the base material where the conductive adhesive is applied in the non-masking portion, the minimum effective abrasive grain necessary for polishing can be fixed.
Therefore, the abrasive grains are not excessively used, and the loss in production of expensive hard abrasive grains is significantly small.

(2) Since the hard abrasive grains are fixed to the base material by the electrodeposition means through the adhesive after the conductive adhesive is applied with the area smaller than the area in the non-masked portion, the outside of the non-masked portion As a result of the non-masking portion remaining due to some area between the contour and the hard abrasive grain, nickel plating covers the remaining non-masking portion during the electrodeposition process, so that the hard abrasive grain is made to be a stronger base material. Can be fixed.

Therefore, when the abrasive grains are dispersed / fixed by landing plating, hard abrasive grains are not adhered to the substrate due to gas generation, uneven distribution of abrasive grains due to uneven stirring, and abrasive grains on the substrate due to non-contact of the abrasive grains on the substrate. It is possible to further control the non-arrival of
Furthermore, it is possible to further improve the cutting performance and durability of the abrasive grains.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a product schematically shown based on the first embodiment, FIG. 2 is an enlarged plan view of an essential part of the first embodiment, and FIGS. 3 and 4 are enlarged cross-sectional views showing steps of the present invention. FIG. 5 and FIG. 5 are enlarged cross-sectional views of a product schematically shown according to the second embodiment. (Explanation of symbols of main parts) 10, 36 …… Base material 20, 44 …… Hard abrasive grains 32 …… Non-masking part 30, 42 …… Conductive adhesive

Claims (2)

[Claims] 1. A myriad of non-masking portions are formed on a substrate,
Hard abrasive grains are bonded via an electrically conductive adhesive in an area smaller than the area of the non-masking portion, and the non-masking portion is plated on the hard abrasive grains from the non-adhesive portion of the conductive adhesive. A polishing sheet provided with hard abrasive grains. 2. A method for producing a polishing sheet having hard abrasive grains, comprising: fixing hard abrasive grains to a substrate by a conductive adhesive and then bonding the hard abrasive grains to the substrate by electrodeposition means. An innumerable non-masking area is formed, and a conductive adhesive is coated with an area smaller than the area of the non-masking area within each of these non-masking areas. A method for producing a polishing sheet provided with hard abrasive particles, which comprises drying the adhesive and then electrodepositing the hard abrasive particles described above.