JPH0716181U - IC measurement and sorting device - Google Patents

Abstract

(57) [Abstract] [Purpose] To simplify the cleaning mechanism of the IC socket for measurement in the IC measurement and sorting device, to save space in the cleaning mechanism and to reduce the manufacturing cost. [Configuration] In an IC measurement / selection device for measuring / selecting an IC by bringing an IC to be measured into contact with a measurement IC socket connected to a tester, an IC 7 to be measured is placed on a measurement IC socket 4 connected to the tester. A hand 1 for adsorbing and conveying and connecting it to the measurement IC socket 4 in a conductive manner, a brush unit attached to the hand installed in a movable area of the hand 1, and a hand 1 freely moving in the XY directions. And an XY stage 2 to be operated. At the time of cleaning, the hand 1 attracts the brush unit 3 and operates on the IC socket 4, thereby removing the solder scraps attached to the contactor 4a.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC measurement / selection device for automatically inspecting the electrical characteristics of an IC, and more particularly to a structure for automatically cleaning and removing solder scraps and the like adhering to the contacts of an IC socket connected to an IC measurement tester. belongs to.

[0002]

[Prior art]

 As a cleaning mechanism for a measuring IC socket in a conventional IC measuring and sorting apparatus, there is a technique disclosed in the specification of Japanese Patent Application No. 3-26785 previously disclosed by the applicant of the present application. That is, the technology disclosed here is that when the IC to be measured is pressed against the measurement IC socket connected to the tester at the time of high temperature measurement and the solder plating of the IC adheres to the measurement IC socket, In order to prevent short-circuiting between adjacent contacts, the cleaning brush is moved by an actuator to remove the solder scraps from the contacts of the measuring IC socket.

[0003]

[Problems to be solved by the device]

 However, according to this method, in an IC socket for measurement such as QFP, the contacts are arranged in four directions, so the brush is used to remove the solder scraps accumulated between the contacts. -Must move in the Y direction. Although the above problem can be solved by increasing the number of actuators, there is a problem that not only the mechanism becomes complicated, but also the manufacturing cost of the device becomes high when the number of actuators is increased.

This invention has been proposed in view of the above problems of the prior art, in which an IC to be measured is carried to a measurement IC socket by a hand that can move freely in the XY directions, and the IC is measured. In the IC measurement / sorting device that carries out IC measurement to the specified position by hand after the measurement is completed by pressing it against the IC IC socket for cleaning, the brush unit is adsorbed to the hand to clean the measurement IC socket. This aims to save space in the cleaning mechanism and to provide the cleaning mechanism at low cost.

[0005]

[Means for Solving the Problems]

 In order to achieve this object, the present invention connects an IC7 to be measured to an tester in an IC measurement selection device for measuring and selecting an IC by bringing the IC7 to be measured into contact with a measurement IC socket connected to the tester. A hand 1 for adsorbing and transporting it onto the measured IC socket 4 for conductive connection to the measuring IC socket, a brush unit installed in the movable area of the hand 1 for adhering to the hand, and a hand. The measurement IC socket 4 is regularly brushed by the movement of the hand 1 provided with the XY stage 2 which freely moves the battery 1 in the XY directions.

[0006]

[Action]

 According to this invention having the above-mentioned configuration, the brush unit is adsorbed to the hand that adsorbs the IC to be measured, and the hand is operated according to the position of the contact of the IC socket for measurement, thereby periodically brushing the IC socket. Therefore, it is possible to remove the solder scraps adhering to the measuring IC socket.

[0007]

【Example】

 Next, an embodiment according to the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, in the IC measurement / sorting apparatus, a hand 1 is mounted on an XY stage 2 so as to be freely movable in the XY directions. The hand 1 is also configured to be movable in the vertical direction by the cylinder 5. A suction nozzle 1a is provided at the lower end of the hand 1 so that the IC 7 and the brush unit 3, which will be described later, can be sucked. The suction nozzle 1a is connected to a suction device such as a vacuum pump (not shown).

On the table T, there are provided an IC socket 4 for measurement, which is conductively connected to the IC 7 when the IC 7 is inspected and measured, an IC supply stage 6 for adsorbing the IC 7 onto the hand 1, and a positioning table 8.

A brush unit 3 for cleaning the measurement IC socket 4 that is suction-held by the suction nozzle 1 a of the hand 1 is placed on the positioning table 8. On the suction side of the brush unit 3, a groove 3a having a size into which the suction nozzle 1a is fitted is formed.

Since the suction nozzle 1a is fitted in the groove portion 3a, the brush unit 3 does not shift and fall out of the suction nozzle 1a even if a lateral force is applied by brushing described later.

A taper portion 3b is formed on a wall surface defining the groove portion 3a so that the suction nozzle 1a can easily enter the groove portion 3a. Further, the positioning unit 8 on which the brush unit 3 is mounted has a taper portion 8a formed in the brush unit accommodation port, which serves as a guide when the brush unit 3 is returned to the positioning unit 8 after brushing is completed.

Next, the measurement operation of the IC 7 will be described with reference to FIGS. 1 to 3. In FIG. 1, the IC 7 to be measured is placed on the IC supply stage 6, and the hand 1 is positioned above the IC 7 on the IC supply stage 6 by the movement of the XY stage 2. After that, the hand 1 is lowered by the lowering operation of the cylinder 5, and the IC 7 is sucked by the suction nozzle provided at the tip thereof. When the adsorption of the IC 7 is completed, the cylinder 5 is operated and the hand 1 is raised as shown in FIG.

Next, the XY stage 2 is moved to transfer the IC 7 onto the IC socket 4, and the cylinder 5 is operated to connect the IC 7 to the contactor 4 a of the measurement IC socket 4 in a conductive manner. Press down. In FIG. 3, the IC 7 is in contact with the IC socket 4. The measurement IC socket 4 is connected to a tester (not shown), and the IC 7 is measured by connecting the IC 7 to the contact 4a of the measurement IC socket 4 in a conductive manner. With such a procedure, the IC 7 supplied to the IC supply stage 6 is sequentially carried to the measurement IC socket 4 and measured.

By the way, when measuring the high temperature of the IC 7, solder scraps such as solder plating of the IC may adhere to the contacts 4 a of the measurement IC socket 4. Therefore, it is necessary to prevent the solder scraps from adhering or to remove the adhered solder scraps in order to prevent the contactor 4a of the measuring IC socket 4 from being short-circuited and not hindering the measurement. For this reason, when the measurement of a predetermined number of ICs 7 set in advance is completed, the XY stage 2 is moved so that the hand 1 is positioned on the brush unit 3 as shown in FIG.

Next, the cylinder 5 is lowered, and the hand 1 is lowered so as to contact the brush unit 3. Then, a suction device (not shown) is operated to suck the brush unit 3 by the suction nozzle 1a.

After that, the XY stage 2 is moved in order to move the brush unit 3 sucked by the suction nozzle 1 a onto the measurement IC socket 4 to be cleaned. Then, when the brush unit 3 is positioned on the IC socket 4, the cylinder 5 is operated to lower the brush unit 3 and bring it into contact with the measurement IC socket 4, and at the same time, the hand 1 is operated to operate the IC. The contactor 4a of the socket 4 is brushed to remove the solder chips attached to the contactor 4a. FIG. 5 shows a state in which the brush unit 3 is brushing the IC socket 4.

After the cleaning of the contactor 4a is completed, that is, after a predetermined number of times of brushing is performed, the brush unit 3 is returned to the positioning base 8 and the hand 1 is again measured and sorted by I C. In order to do so, the IC 7 is adsorbed and transferred to the measuring IC socket 4 to be connected, and the IC 7 is measured.

[0019]

[Effect of device]

 According to this invention, since the hand for transferring the IC to the IC socket transfers the brush unit for cleaning the IC socket, it is not necessary to separately provide an actuator, and an inexpensive and small cleaning mechanism can be provided as compared with the conventional cleaning mechanism. .

Further, according to the present invention, the measuring IC socket is cleaned regularly and automatically. Therefore, it is possible to surely prevent the contact of the measuring IC socket from being short-circuited due to the adhesion of solder dust or the like. The measurement reliability can be improved without causing measurement error.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a state diagram in which the hand 1 adsorbs an IC 7 and rises.

FIG. 3 is a diagram showing a state where an IC 7 is in contact with an IC socket 4.

FIG. 4 is a state diagram in which the hand 1 is located on the brush unit 3.

FIG. 5 is a diagram showing a state where the brush unit 3 is brushing the IC socket 4.

[Explanation of symbols]

 1 Hand 1a Suction Nozzle 2 XY Table 3 Brush Unit 3a Groove 3b Tapered Part 4 IC Socket 4a Contactor 5 Cylinder 6 Supply Stage 7 Device 8 Positioning Stand 8a Tapered Part

Claims (2)

[Scope of utility model registration request] 1. An IC for automatically inspecting the electrical characteristics of the IC.
IC socket for measurement by sucking and transporting IC (7) to be measured in the measurement / sorting device
A hand (1) electrically connected to (4), a brush unit (3) attracted by the hand (1), and an XY stage (2) that freely moves the hand (1) in the XY directions. An IC measurement / selection device, characterized in that the measurement IC socket (4) is brushed by moving a hand. 2. The IC measuring and sorting apparatus according to claim 1, wherein a groove portion (3a) having a size into which the suction nozzle (1a) is fitted is formed on the suction side of the brush unit (3).