JPH07152442A - Device and method for monitoring and controlling temperature of electronic device - Google Patents

Abstract

PURPOSE:To appropriately generate an alarm even if the characteristic of an electronic circuit package loaded into an electronic device is different or the number of loading stages to a shelf is changed. CONSTITUTION:A control part 17 and a temperature monitoring unit 14 are installed in the electronic device, and the temperature monitoring unit 14 is provided with temperature sensors 15 in accordance with mounting positions at which each electronic circuit package 1 is packaged, and a temperature information detection circuit, an electrically rewritable memory device, a microprocessor, and an alarm transmission circuit are provided in the control part 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature monitoring / controlling apparatus and a temperature monitoring / controlling method for detecting a temperature abnormality during operation of an electronic device and sending an alarm signal of the temperature abnormality.

[0002]

2. Description of the Related Art FIG. 10 is a rack mounting diagram of an electronic device system having a conventional temperature monitoring mechanism. Here, 1 is an electronic circuit package, 2 is a package mounting shelf, 3 is a fan unit, 4 is a fan, 5 is an alarm line housing, 6 is a temperature monitoring unit, 7 is a temperature sensor, and 8 is a temperature sensor.
Is a lamp provided on the front surface of the electronic circuit package 1, 9 is an insertion / extraction lever used when the electronic circuit package 1 is inserted / extracted, 10 is a rack for accommodating an electronic device, 11 is a cable for accommodating an alarm line in the rack, and 12 is an alarm for the outside. An alarm line 13 for sending out represents a monitoring device installed at a distant place.

As in the present configuration, in the conventional electronic device, the temperature sensor 7 employs a lead-lead switch or the like. When the temperature of the lead-lead switch exceeds a preset temperature, the internal circuit becomes conductive and turns on. Taking advantage of this, an abnormal temperature alarm was sent out. That is, when the internal circuit of the ferile switch is turned on and turned on, the alarm line accommodating portion 5 sends a temperature abnormality alarm to the monitoring device 13 installed remotely via the alarm line 12.

[0004]

However, in the conventional electronic device system, although the temperature sensor 7 is mounted, it is treated as binary data only capable of discriminating whether the temperature is abnormal or normal. . That is, there is a problem that the external monitoring device 13 can only know whether or not the inside of the electronic device is above a certain abnormal temperature.

Further, in the electronic device in actual operation, the temperature distribution in the vicinity of each electronic circuit package 1 becomes non-uniform according to the amount of heat generated. Therefore, the threshold value is determined by further stacking a certain temperature on the basis of the temperature data of the electronic circuit package 1 in the normal state, which is expected to have the highest temperature in the conventional configuration. Was there. For this reason, as shown in FIG. 11, the low heat generation package causes some abnormality, and even if the temperature of the air in the vicinity of the package rises, it may not be detected, and the alarm signal is generated even though urgent measures are required. There was a problem that was not sent.

Further, as shown in FIG. 10, the temperature sensor 7 is not configured to be mounted at all the mounting positions of each electronic circuit package 1. Therefore, the electronic circuit package 1 in which the neighborhood air temperature has risen due to some abnormality
There is a problem that the abnormal temperature detection accuracy differs depending on the mounting position, and the temperature abnormality cannot be detected depending on the mounting position of the electronic circuit package 1 having a high temperature. In order to show this, FIG. 12 shows the relationship between the mounting position of the electronic circuit package 1 and the mounting position of the temperature sensor 7 and the ambient air temperature.

Further, even if the temperature abnormality can be detected,
There is a problem that the electronic circuit package 1 in which the temperature abnormality has occurred cannot be specified and only ambiguous information that a certain area is abnormal can be transferred to the monitoring device 13.
Therefore, there is a problem that the cause of the temperature abnormality cannot be identified.

In addition, electronic devices are often added. However, when using a temperature sensor 7 such as a lead switch, the set temperature cannot be changed for each extension, so the threshold temperature is generally set assuming that the temperature sensor 7 is fully mounted. . Therefore, for example, 4
Assuming a rack 10 capable of mounting the shelves 2 of stages, there is a problem that the threshold value cannot be exceeded even if a temperature abnormality occurs, that is, the temperature abnormality cannot be detected if only one shelf 2 is mounted in the initial stage. .

FIG. 13 is a diagram for clarifying the above-mentioned problems, in which a temperature abnormality occurred in the initial operation state,
Temperature sensor 7 detects temperature abnormalities that occur during full mounting after expansion.
Electronic circuit package 1 to show whether or not
3 shows the relationship between the mounting position and the air temperature in the vicinity. If a temperature abnormality occurs in the low heat generation electronic circuit package and the initial (in this case, assuming that only one shelf 2 is mounted) operation state, the threshold temperature (at full mounting , Which is the maximum air temperature of the electronic circuit package with the highest heat generation).

Further, in control system devices and the like, the processor board is often upgraded, and generally, the power consumption tends to increase in the electronic circuit package 1 by the upgrade. In the control system device, the processor board has the highest heat generation. For this reason, using the conventional technology, if the temperature abnormality alarm occurrence temperature is set at the temperature threshold value before upgrade, after the upgrade, the temperature abnormality alarm may be sent even though it is not abnormal. However, there was also a problem that the reliability of system operation was lacking due to the fact that power consumption was originally increasing. On the other hand, if the temperature threshold value is set on the assumption that the product will be upgraded, there is a problem in that even if a temperature abnormality occurs before the upgrade, the alarm cannot be sent out, as in the problem at the time of expansion described above.

An object of the present invention is to send an alarm signal when a temperature abnormality occurs in an electronic device and to transfer detailed information such as a mounting position of an electronic circuit package where the abnormality has occurred. Equipment temperature monitoring
It is to provide a control device and a temperature monitoring / control method. Furthermore, even if the system configuration is changed due to expansion or upgrade of some electronic circuit packages, the temperature monitoring / control device and temperature of the electronic device can transfer detailed information corresponding to the new operating system configuration. It is to provide a monitoring / control method.

[0012]

A temperature monitoring / controlling device for an electronic device according to the present invention is capable of stacking a plurality of shelves capable of mounting a large number of electronic circuit packages in a plurality of stages, and a cooling fan mounted fan unit. Is a temperature monitoring / controlling device for an electronic device configured to be forcedly air-cooled, wherein the electronic device is provided with a control part and a temperature monitoring unit provided on the upper part of the shelf. A temperature sensor is provided corresponding to the mounting position where the circuit package is mounted, and a temperature information detection circuit, an electrically rewritable memory device, a microprocessor connected to a data bus, and an alarm transmission circuit are provided in the control unit. In addition, the temperature monitoring unit and the temperature information detection circuit are connected by a temperature information transfer line.

Further, according to the temperature monitoring / controlling method for an electronic device of the present invention, a plurality of shelves capable of mounting a large number of electronic circuit packages can be stacked in a plurality of stages, and these are forcedly cooled by a fan unit equipped with a cooling fan. A temperature monitoring / controlling method for an electronic device having a configuration, wherein a temperature monitoring unit is provided on an upper part of the shelf, and the temperature monitoring unit is provided with a temperature sensor corresponding to a mounting position where each electronic circuit package is mounted. The temperature sensor information in the state where the system is normally operated is stored in the memory device as temperature distribution information in the initial state of the electronic device system, and during operation, the temperature is measured at regular intervals. The sensor information is read, and this temperature distribution data is compared with the initial temperature distribution data at each position stored in the memory device, If the temperature difference is equal to or greater than a predetermined value, it is obtained so as to deliver an alarm signal.

Further, when the initial temperature distribution data at each position is stored in the memory device, the address for storing the temperature information corresponding to each electronic circuit package is previously determined, and the temperature difference is equal to or more than the determined value. The position information of the electronic circuit package that has become abnormal is calculated based on the address information, and the mounting position information of the electronic circuit package having the abnormal temperature is also transmitted.

Further, when the temperature data is collected at the initial stage of system operation, temperature measurement is performed for a certain period of time, the central value information t ° C. is accumulated, and at the same time, a slight temperature fluctuation value Δt due to load fluctuations during operation. C. is also stored in the memory device, and a predetermined abnormal temperature rise value ΔtE is set.
Then, the temperature data t ′ sampled by each temperature sensor provided in the temperature monitoring unit is t ′> t + Δt / 2
When + ΔtE is reached, an alarm signal is sent out.

In addition, when an electronic device is added by mounting at least one new electronic circuit package on a part of the shelf of the electronic device, the new system operates normally after the addition work. Temperature data in the temperature monitoring unit inside the temperature monitoring unit at a certain time interval when the new temperature data is newly stored in the memory device and the new temperature data is newly stored in the memory device. It is to be compared with the data.

Further, the electronic device is provided with a cooling fan, and the temperature data collected at a constant time interval during operation of the electronic device is compared with the initial temperature data stored in the memory device so that the temperature difference between them can be determined in advance. When it becomes higher than a predetermined value, control is performed to increase the rotation speed of the fan.

[0018]

In the temperature selecting / controlling device of the electronic device according to the present invention, the temperature detecting circuit detects the information of each temperature sensor of the electronic device when the electronic device is normal, and the memory device is electrically rewritable as the temperature distribution information. When the abnormal temperature is found by reading out the temperature sensor information at fixed time intervals, the alarm sending circuit issues an alarm.

In the temperature monitoring / controlling method of the electronic device according to the present invention, the temperature distribution information at the normal time can be obtained from the output from the temperature sensor corresponding to the mounting position of each electronic circuit package,
The abnormality is determined by comparing the temperature distribution information with the temperature sensor information read at a constant time interval.

Further, the alarm not only reports the abnormality, but also reports the position information of the electronic circuit package in which the abnormality has occurred.

Further, by setting the abnormal temperature rise value ΔtE ° C. and the temperature fluctuation value Δt ° C., the alarm generation is appropriately controlled.

Further, even if the number of shelves of the electronic device is increased, the temperature distribution information up to this point is replaced with new information, so that a false alarm due to the increase can be prevented.

Further, the number of rotations of the fan is controlled based on the temperature data, and wasteful consumption of electric power is prevented.

[0024]

1 is a diagram showing a first embodiment according to the present invention, and is a mounting diagram when a temperature monitoring and control device according to the present invention is applied to a communication device rack. 2 is a block diagram showing the internal configuration of the control unit 17 in the embodiment of FIG. In these figures, 1 is an electronic circuit package, 2 is a package mounting shelf, 3 is a fan unit, 4 is a fan, 8 is a lamp provided on the front surface of the electronic circuit package 1, and 9 is used when the electronic circuit package 1 is inserted and removed. Insertion / extraction lever, 10 is a rack for housing an electronic device, 12 is an alarm line for sending an alarm to the outside, 13
Is a monitoring device installed at a distant place, 14 is a temperature monitoring unit provided above the package mounting shelf 2, and 1 is a temperature monitoring unit.
5 is a temperature sensor, 16 is a temperature information transfer line, 17 is a control unit provided under the rack 10, 18 is a microprocessor for performing control based on monitoring information, and 19 is an electrically rewritable memory. A device, 20 is a temperature information detection circuit,
Reference numeral 21 is a data bus, and 22 is an alarm transmission circuit. Next, the operation will be described. First, when the communication device starts to operate the system, the temperature distribution data in a normal state obtained by measuring the temperature distribution in the rack 10 of the communication device with each temperature sensor 15 in the temperature monitoring unit 14 is transferred to the temperature information transfer line 16 And is transferred to the temperature information detection circuit 20 via.

The data transferred to the temperature information detection circuit 20 is stored in the electrically rewritable memory device 19 as the temperature distribution data under normal conditions. At this time, the temperature data of the system initial operation state is taken in as data including the load fluctuation of the system over a certain period of time, and the central value information t ° C. thereof is stored in the electrically rewritable memory device 19 and operated. A slight temperature fluctuation value Δt ° C. due to a load fluctuation at the time is also stored in the electrically rewritable memory device 19, and a predetermined abnormal temperature rise value ΔtE is set.

On the other hand, at the time of system operation, each temperature sensor 1 provided in the temperature monitoring unit 14 at a constant time interval T.
5 is used for temperature sampling. At this time, a temperature abnormality occurs and the collected temperature data t ′ is t ′> t + Δt.
When the microprocessor 18 determines that it becomes / 2 + ΔtE, a temperature abnormality alarm is transmitted via the alarm transmission circuit 22 to the monitoring device 13 set at a distant place.

FIG. 3 shows temperature distribution data in a normal state accumulated in the electrically rewritable memory device 19 and temperature abnormalities sampled at a constant time interval in order to easily understand the above operation. It shows the temperature distribution data.

As is apparent from the figure, since the temperature abnormality threshold value is determined based on the temperature distribution in the electronic device, the position of the abnormal electronic circuit package is determined in advance for each electronic circuit. The temperature information corresponding to the package is calculated based on the address information, and not only the temperature abnormality alarm signal but also the mounting position information of the temperature abnormality electronic circuit package can be transmitted, so more detailed monitoring data can be sent remotely. It can be transferred to the installed monitoring device 13, and the maintenance person can easily take the next action based on this information.

FIG. 4 is a principle diagram showing a second embodiment according to the present invention, in which the electronic circuit package mounting position and the air temperature distribution (stored in the electrically rewritable memory device 19) when the system is expanded. (Information that has been provided). In addition, FIGS. 5A and 5B are electronic device rack mounting diagrams at the time of initial installation (only one stage of the package mounting shelf 2 is mounted)
And the electronic device rack mounting diagram after installation (4 stages mounted).

In the second embodiment, the temperature distribution data corresponding to each electronic circuit package 1 is sampled at the time of initial operation for each expansion, and this is used as new initial data. Therefore, since the temperature threshold value data also changes according to the configuration of the device, a fine alarm signal can be sent to the new system after the expansion as in the first embodiment, and an electronic circuit in which an abnormality has occurred The mounting position information of the package 1 can also be transferred.

FIG. 6 is a principle view showing a third embodiment according to the present invention, which is a partial electronic circuit package 1 in an electronic device.
2 shows the electronic circuit package mounting position before and after the upgrade, and the air temperature distribution (information stored in the electrically rewritable memory device 19).

7 (a) and 7 (b) show an electronic device rack mounting diagram of a part of the electronic circuit package 1 before the upgrade and an electronic device rack mounting diagram after the upgrade, and 23 is upgraded. 2 shows an electronic circuit package.

In the third embodiment, the temperature distribution data corresponding to the upgraded electronic circuit package 23 (mainly the processor board and the like are often upgraded and generally the power consumption thereof is also increased),
After the upgrade, data is sampled during the initial operation, and this is used as new initial data. For this reason, the temperature abnormality threshold value data also changes according to the configuration of the electronic device, so that a fine alarm signal can be sent to the new system after the upgrade as in the first embodiment, and an abnormality has occurred. The mounting position information of the electronic circuit package 1 can also be transferred.

Further, FIG. 8 is a rack mounting view showing a fourth embodiment according to the present invention. 9 is a block diagram showing the internal configuration of the control unit 17 in the embodiment of FIG. In these figures, 24 is a fan power supply control circuit, 25 is a fan power supply, and 26 is a fan power supply line connecting the fan power supply 25 and the fan 4.

In this embodiment, when a temperature abnormality alarm is generated, the microprocessor 18 increases the voltage applied to the fan 4 to the fan power supply control circuit 24 connected on the data bus 21 to increase the rotation speed. Issue a command signal to The fan power supply 25 connected to the fan power supply control circuit 24 increases the voltage applied to the fan 4 in accordance with the instruction to increase the rotation speed. As a result, the air velocity in the electronic device can be increased, and as a result, the air temperature in the device can be lowered below the abnormal temperature. Generally, the fan 4 has a built-in circuit (not shown) for detecting an abnormality in the number of revolutions. Normally, fan control is performed based on the alarm signal. Regardless, it is an effective means when the circuit for detecting the abnormal rotation speed does not operate.

[0036]

As described above, the temperature monitor / control device for an electronic device according to the present invention enables stacking of a plurality of shelves capable of mounting a large number of electronic circuit packages.
A temperature monitoring / control device for an electronic device configured to forcibly air-cool this with a fan unit equipped with a cooling fan,
A control unit and a temperature monitoring unit provided on the upper part of the shelf are provided in the electronic device, and the temperature monitoring unit is provided with a temperature sensor corresponding to a mounting position where each electronic circuit package is mounted, The control unit includes a temperature information detection circuit, an electrically rewritable memory device, a microprocessor connected to a data bus, and an alarm transmission circuit, and the temperature monitoring unit and the temperature information detection circuit include a temperature information transfer line. The temperature distribution information is obtained based on the output of each temperature sensor during normal operation, and the abnormal temperature can be detected based on this temperature distribution information.Therefore, the temperature characteristics of the electronic circuit package are not the same. Can also accurately detect abnormalities. Further, even if the number of stacked shelves is changed, the changed temperature distribution information of the electronic device in the normal state can be immediately replaced by replacing the temperature distribution information up to that time.

Further, in the temperature monitoring / controlling method of the electronic device according to the present invention, a plurality of shelves capable of mounting a large number of electronic circuit packages can be stacked in a plurality of stages, and these are forcedly cooled by a fan unit equipped with a cooling fan. In the temperature monitoring / controlling method of the electronic device having the configuration described above, a temperature monitoring unit is provided on the upper part of the shelf, and the temperature monitoring unit has temperature sensors corresponding to mounting positions where the electronic circuit packages are mounted. The temperature sensor information in the state where the system is normally operated is provided.
The temperature distribution information in the initial state of the electronic device system is stored in the memory device, and during operation, the temperature sensor information is read out at regular time intervals, and the temperature distribution data and the positions stored in the memory device are stored. The initial temperature distribution data is compared, and if the temperature difference exceeds a predetermined value, an alarm signal is sent, so normal temperature distribution information is created based on the output of each temperature sensor. Since this can be compared with temperature sensor information read at fixed time intervals to detect an abnormality, even if the temperature characteristics of the electronic circuit packages mounted on the shelf are not the same, Since the temperature abnormality threshold value can be uniquely determined according to the operating state, the abnormality can be accurately detected.

Further, when the initial temperature distribution data at each position is stored in the memory device, the address for storing the temperature information corresponding to each electronic circuit package is previously determined, and the temperature difference is equal to or more than the determined value. The position information of the electronic circuit package that has become
Since the mounting position information of the electronic circuit package having the abnormal temperature is also transmitted, not only the alarm is transmitted, but also the abnormal electronic circuit package can be easily known.

Furthermore, when temperature data is collected at the initial stage of system operation, temperature measurement is performed for a certain period of time, the central value information t ° C. is accumulated, and at the same time, a slight temperature fluctuation value Δt ° C. due to load fluctuations during operation. Is also stored in the memory device, and a predetermined abnormal temperature rise value ΔtE is set, and sampling is performed by each temperature sensor provided in the temperature monitoring unit at a constant time interval T during operation of the electronic device. The temperature data t ′ is t ′> t + Δt / 2 +
When ΔtE is reached, an alarm signal is sent out. Therefore, by appropriately setting the temperature fluctuation value Δt ° C. and the abnormal temperature rise value ΔtE, the alarm can be accurately generated.

In addition, when an electronic device is expanded by mounting at least one new electronic circuit package on a part of the shelf of the electronic device, the new system operates normally after the expansion work. Temperature data in the temperature monitoring unit inside the temperature monitoring unit at a certain time interval when the new temperature data is newly stored in the memory device and the new temperature data is newly stored in the memory device. Since the comparison is made with the data, even if the electronic circuit package of the shelf is expanded, it can be dealt with immediately.

Further, the electronic device is provided with a cooling fan, and the temperature data collected at a constant time interval during operation of the electronic device is compared with the initial temperature data stored in the memory device so that the temperature difference between them is in advance. When it becomes higher than a predetermined value, the fan speed is controlled to be increased, so that the wind speed of the cooling air flowing in the electronic device can be increased, and the device in which the temperature abnormality occurs The internal air temperature can be lowered. In addition, since the rotation speed of the fan is increased only when necessary, it is possible to save power.

[Brief description of drawings]

FIG. 1 is a mounting diagram showing a first embodiment according to the present invention.

FIG. 2 is a block diagram showing an internal configuration of a control unit in the embodiment of FIG.

FIG. 3 is a diagram showing temperature distribution data accumulated in an electrically rewritable memory device according to the first embodiment of the present invention and temperature distribution data sampled at regular time intervals.

FIG. 4 is a principle view showing a second embodiment according to the present invention.

FIG. 5 is a diagram showing a rack mounting diagram in the initial stage of the electronic device system and a rack mounting diagram after the addition for explaining the second embodiment according to the present invention.

FIG. 6 is a principle view showing a third embodiment according to the present invention.

FIG. 7 is a rack mounting diagram before upgrading some electronic circuit packages in an electronic device and a rack mounting diagram after upgrading some electronic circuit packages for explaining a third embodiment according to the present invention. FIG.

FIG. 8 is a rack mounting diagram showing a fourth embodiment according to the present invention.

9 is a block diagram showing an internal configuration of a control unit in the embodiment of FIG.

FIG. 10 is a rack mounting diagram when a conventional temperature monitoring system is applied to an electronic device.

FIG. 11 is a diagram showing a relationship between an electronic circuit package mounting position and an air temperature rise when a conventional technique is used.

FIG. 12 is a diagram showing a relationship between an electronic circuit package mounting position, a temperature sensor mounting position, and an air temperature rise when a conventional technique is used.

FIG. 13 is a diagram showing a relationship between an electronic circuit package mounting position, a temperature sensor mounting position, and an air temperature rise, which accompanies an expansion when a conventional technique is used.

[Explanation of symbols]

 1 Electronic Circuit Package 2 Package Mounted Shelf 3 Fan Unit 4 Fan 5 Alarm Line Housing 6 Temperature Monitoring Unit 7 Temperature Sensor 8 Lamp 9 Insertion / Extraction Lever 10 Frame 11 Alarm Cable Accommodating Cable in Frame 12 Alarm Line 13 Monitoring Device 14 Temperature Monitoring Unit 15 Temperature sensor 16 Temperature information transfer line 17 Control unit 18 Microprocessor 19 Electrically rewritable memory device 20 Temperature information detection circuit 21 Data bus 22 Alarm sending circuit 23 Upgraded electronic circuit package 24 Fan power supply control circuit 25 Fan power supply 26 Fan power line

Claims (6)

[Claims] 1. A temperature monitoring / controlling device for an electronic device, wherein a plurality of shelves capable of mounting a large number of electronic circuit packages can be stacked in a plurality of stages, and these are forcedly cooled by a fan unit equipped with a cooling fan. , In the electronic device,
The temperature monitoring unit is provided on the control unit and the upper part of the shelf, and the temperature monitoring unit is provided with a temperature sensor corresponding to a mounting position where each electronic circuit package is mounted, and temperature information is provided in the control unit. A detection circuit, an electrically rewritable memory device, a microprocessor connected to a data bus, and an alarm transmission circuit, and the temperature monitoring unit and the temperature information detection circuit are connected by a temperature information transfer line. A temperature monitoring and control device for electronic devices. 2. A temperature monitoring / controlling method for an electronic device, comprising a plurality of shelves capable of mounting a large number of electronic circuit packages, which can be stacked in a plurality of stages, and which are forcedly cooled by a fan unit equipped with a cooling fan. The temperature monitoring unit is provided on the upper part of the shelf, and the temperature monitoring unit is provided with temperature sensors corresponding to the mounting positions where the electronic circuit packages are mounted. Each temperature sensor information,
The temperature distribution information in the initial state of the electronic device system is stored in the memory device, and during operation, the temperature sensor information is read out at regular time intervals, and the temperature distribution data and the positions stored in the memory device are stored. A method for monitoring and controlling temperature of an electronic device, comprising: comparing with initial temperature distribution data, and sending an alarm signal when the temperature difference exceeds a predetermined value. 3. When storing initial temperature distribution data at each position in a memory device, an address for storing temperature information corresponding to each electronic circuit package is determined in advance,
The position information of the electronic circuit package whose temperature difference is equal to or more than a predetermined value is calculated based on the address information, and the mounting position information of the electronic circuit package having the abnormal temperature is also transmitted. 2. A method for monitoring and controlling the temperature of an electronic device according to 2. 4. When collecting temperature data at the initial stage of system operation, temperature measurement is performed for a certain period of time, and the central value information t
In addition to accumulating ℃, a small temperature fluctuation value Δt ° C due to load fluctuations during operation is also stored in the memory device, and a predetermined abnormal temperature rise value ΔtE is set. Temperature data t ′ sampled by each temperature sensor provided in the temperature monitoring unit at a constant time interval T is t ′> t + Δt / 2 + Δt
The temperature monitoring / controlling method of the electronic device according to claim 2, wherein an alarm signal is transmitted when the temperature becomes E. 5. When an electronic device is expanded by mounting at least one new electronic circuit package on a part of the shelf of the electronic device, the new system operates normally after the expansion work. Temperature data in the temperature monitoring unit inside the temperature monitoring unit at a certain time interval when the new temperature data is newly stored in the memory device and the new temperature data is newly stored in the memory device. The method for monitoring and controlling the temperature of an electronic device according to claim 2, wherein the method is compared with data. 6. The electronic device is provided with a cooling fan, and temperature data collected at a constant time interval during operation of the electronic device is compared with initial temperature data stored in the memory device, and a temperature difference is obtained. The temperature monitoring / controlling method for an electronic device according to claim 2, wherein control is performed to increase the rotation speed of the fan when the temperature becomes higher than a predetermined value.