JPH07144271A - Soldering iron - Google Patents

Soldering iron

Info

Publication number
JPH07144271A
JPH07144271A JP29172293A JP29172293A JPH07144271A JP H07144271 A JPH07144271 A JP H07144271A JP 29172293 A JP29172293 A JP 29172293A JP 29172293 A JP29172293 A JP 29172293A JP H07144271 A JPH07144271 A JP H07144271A
Authority
JP
Japan
Prior art keywords
solder
soldering
iron tip
iron
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29172293A
Other languages
Japanese (ja)
Inventor
Naoyuki Hashimoto
尚之 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP29172293A priority Critical patent/JPH07144271A/en
Publication of JPH07144271A publication Critical patent/JPH07144271A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a soldering iron tip which does not melt in solder and is not corroded by a flux by solving the problem with the soldering iron of a point soldering device that the front end part of an iron tip base body made of copper is alloyed with the solder and eventually melts into the solder. CONSTITUTION:The front end of the iron tip base body 1 made of ceramic is provided with a metallic film 2 having good wettability with the solder, by which the melting of the ceramic of the iron tip base body 1 into the solder and the wear thereof are averted and the corrosion and wear by the flux are prevented. In addition, only the part of the metallic film 2 is wetted with the solder and, therefore, the stable soldering with high quality and high grade is attained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品等の半田接合
に使用する半田コテに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron used for soldering electronic components and the like.

【0002】[0002]

【従来の技術】近年、半田付け工法は、フロー、リフロ
ーをはじめ、多点の半田を一括に、高品質に半田付けを
する手法が進歩して来ている。しかし、フロー、リフロ
ー等で処理できないポイント半田付けが残り、これらの
半田付けを、ロボット等を用いたポイント自動半田付け
装置を使用するか、あるいは作業者が一点一点半田付け
をしているのが実状であり、この半田付けにはコテ半田
が多く使用されている。
2. Description of the Related Art In recent years, as a soldering method, a method of soldering a plurality of points of solder in a high quality including a flow and a reflow has been improved. However, point soldering that cannot be processed by flow, reflow, etc. remains, and these soldering are done by using a point automatic soldering device using a robot or the like, or the operator solders point by point. However, iron solder is often used for this soldering.

【0003】以下にポイント半田付けに使用する、従来
の半田コテのコテ先について説明する。
The tip of a conventional soldering iron used for point soldering will be described below.

【0004】図2は従来のコテ先を示すものである。図
2において、3はセラミックヒータ、4は銅製のコテ先
基体、5は鉄メッキ層、6はクロムメッキ層、7は半田
メッキ層である。
FIG. 2 shows a conventional iron tip. In FIG. 2, 3 is a ceramic heater, 4 is a copper tip base, 5 is an iron plating layer, 6 is a chrome plating layer, and 7 is a solder plating layer.

【0005】以上のように構成された半田コテのコテ先
について、以下その働きについて説明する。
The function of the soldering iron tip having the above-described structure will be described below.

【0006】まず、セラミックヒータ3を発熱させ、銅
製のコテ先基体4を加熱し、蓄熱する。そして、半田メ
ッキ層7の部分に外部より半田を供給し、半田を銅製の
コテ先基体4の熱で溶解させ半田付け作業を行う。この
時、クロムメッキ層6は、クロムの半田濡れ性が悪い事
を利用して、半田メッキ層7以外へ半田が着かないよう
にしている。
First, the ceramic heater 3 is caused to generate heat to heat the iron tip base body 4 made of copper to store heat. Then, the solder is supplied from the outside to the portion of the solder plating layer 7, and the solder is melted by the heat of the iron tip base body 4 made of copper to perform the soldering work. At this time, the chrome-plated layer 6 uses the fact that the solder wettability of chrome is poor, so that the solder does not adhere to areas other than the solder-plated layer 7.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、半田メッキ層7を通して鉄メッキ層5に
半田が触れ、鉄メッキ層5が半田へ溶食してしまった後
は、銅製のコテ先基体4と、外部から供給される半田が
直接触れるため、銅が半田と合金化し、半田の中へ溶解
して入ってしまい、銅製のコテ先基体4の先端部分が溶
解摩耗し、コテ先形状が変化して半田付け品質に悪影響
を与える。
However, in the above-mentioned conventional structure, after the solder contacts the iron plating layer 5 through the solder plating layer 7 and the iron plating layer 5 is eroded into the solder, the iron tip made of copper is used. Since the base 4 and the solder supplied from the outside come into direct contact, the copper alloys with the solder and melts into the solder, and the tip portion of the copper tip base 4 melts and wears, resulting in the iron tip shape. Change and adversely affect the soldering quality.

【0008】本発明は上記従来の問題点を解決するもの
で、半田中に溶解せず、フラックスによっても腐食しな
い半田コテ先を提供することを目的とする。
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a soldering iron tip which is neither dissolved in solder nor corroded by flux.

【0009】[0009]

【課題を解決するための手段】この目的を達成するため
に本発明の半田ごては、コテ先加熱用ヒータにより加熱
され、セラミックスからなる半田コテ先の先端に、半田
濡れ性の良い金属膜を備えたことを特徴とする。
To achieve this object, a soldering iron of the present invention is heated by a heater for heating a soldering iron tip, and a metal film having good solder wettability is formed at the tip of the soldering iron tip made of ceramics. It is characterized by having.

【0010】[0010]

【作用】この構成によって、半田濡れ性の非常に悪いセ
ラミックスをコテ先の基体材料に使用する事により、半
田がコテ先の金属膜の所にしか着かず安定し、高精度、
高品位の半田付けを行うことができる。また、セラミッ
クスは半田にも溶解せず、フラックスによっても腐食し
ないため、コテ先摩耗、コテ先形状変化が少なく、高精
度、高品位の半田付けが可能となる。
With this structure, when ceramics having extremely poor solder wettability is used as the base material of the iron tip, the solder is attached only to the metal film of the iron tip, is stable, and has high accuracy.
High quality soldering can be performed. Further, since ceramics are neither dissolved in solder nor corroded by flux, trowel tip wear and trowel tip shape change are small, and high precision and high quality soldering is possible.

【0011】[0011]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0012】図1において、1はセラミック製のコテ先
基体、2は半田濡れ性の良いたとえばニッケル等の金属
膜、3はセラミックヒータである。
In FIG. 1, 1 is a ceramic iron tip base, 2 is a metal film having good solder wettability, such as nickel, and 3 is a ceramic heater.

【0013】以上のように構成された半田コテ先につい
て、以下その詳細を説明する。まず、セラミックヒータ
3を発熱させ、セラミック製のコテ先基体1を加熱す
る。ここで金属膜2を半田付けするポイントに押し当
て、半田付け対象物を加熱する。使用しているセラミッ
クスは熱伝導性が高いので、セラミック製のコテ先基体
1の熱が急速に半田付け対象物に奪われ温度が下降する
事を防ぐため、大きな熱量を発生するセラミックヒータ
3を細かくスイッチング制御して温度を安定させる。半
田付け対象物が適正温度に達したところで、金属膜2の
部分へ外部より半田を供給し、半田を溶解させて半田付
け作業を行う。この際、セラミック製のコテ先基体1
は、非常に半田濡れ性が悪いので、この特徴により、溶
融した半田は、半田濡れ性の良い金属膜2の部分にしか
着かない。
The details of the soldering iron tip configured as described above will be described below. First, the ceramic heater 3 is heated to heat the ceramic iron tip base 1. Here, the metal film 2 is pressed against the soldering point to heat the soldering object. Since the ceramic used has a high thermal conductivity, the ceramic heater 3 that generates a large amount of heat is used in order to prevent the heat of the iron tip base body 1 made of ceramic from being rapidly taken by the object to be soldered and lowering the temperature. The switching is finely controlled to stabilize the temperature. When the object to be soldered reaches an appropriate temperature, the solder is supplied from the outside to the portion of the metal film 2 and the solder is melted to perform the soldering work. At this time, the ceramic iron tip base 1
Has extremely poor solder wettability, and due to this feature, the melted solder only adheres to the portion of the metal film 2 having good solder wettability.

【0014】その上、セラミック製のコテ先基体1は、
半田と合金化して溶融する事がなく、フラックスによっ
ても腐食しないため、コテ先が溶融、腐食摩耗して形状
が変化する事がなく、安定した高精度、高品質の半田付
けが可能である。
In addition, the ceramic iron tip base 1 is
Since it does not alloy with solder to melt and does not corrode even with flux, the soldering iron tip does not melt, corrode and wear, and the shape does not change, and stable, high-precision, high-quality soldering is possible.

【0015】[0015]

【発明の効果】以上のように本発明は、半田コテのコテ
先基体にセラミックスを用いる事により、半田コテ先が
半田中へ溶融摩耗したり、フラックスでの腐食摩耗を起
こす事が無く、また、セラミックスの半田濡れ性が非常
に悪い事によりコテ先先端の半田濡れ性の良い金属膜の
部分のみ半田に濡れるため、安定した高品質、高品位の
半田付けを可能にするものである。
As described above, according to the present invention, by using ceramics for the soldering iron tip base of the soldering iron, the soldering iron tip does not melt and wear into the solder, nor does it cause corrosive wear by the flux. Since the solder wettability of the ceramics is very poor, only the portion of the metal film having good solder wettability at the tip of the iron tip is wetted by the solder, which enables stable high quality and high quality soldering.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の半田ごてのコテ先を示す部
分断面図
FIG. 1 is a partial cross-sectional view showing a soldering iron tip of a soldering iron according to an embodiment of the present invention.

【図2】従来の半田ごてのコテ先を示す部分断面図FIG. 2 is a partial sectional view showing a soldering iron tip of a conventional soldering iron.

【符号の説明】[Explanation of symbols]

1 セラミック製のコテ先基体 2 金属膜 3 セラミックヒータ 1 Ceramic Iron Tip Base 2 Metal Film 3 Ceramic Heater

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 コテ先加熱用ヒータにより加熱され、セ
ラミックスからなる半田コテ先の先端に、メッキ、蒸着
等の手法により半田濡れ性の良い金属膜を備えたことを
特徴とする半田ごて。
1. A soldering iron, which is heated by a heater for heating a soldering iron, and is provided with a metal film having good solder wettability at a tip of a soldering iron soldering tip made of ceramics by a method such as plating or vapor deposition.
【請求項2】 半田コテ先とコテ先加熱用ヒータとを分
離した請求項1記載の半田コテ。
2. The soldering iron according to claim 1, wherein the soldering iron tip and the heater for heating the ironing tip are separated.
JP29172293A 1993-11-22 1993-11-22 Soldering iron Pending JPH07144271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29172293A JPH07144271A (en) 1993-11-22 1993-11-22 Soldering iron

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29172293A JPH07144271A (en) 1993-11-22 1993-11-22 Soldering iron

Publications (1)

Publication Number Publication Date
JPH07144271A true JPH07144271A (en) 1995-06-06

Family

ID=17772552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29172293A Pending JPH07144271A (en) 1993-11-22 1993-11-22 Soldering iron

Country Status (1)

Country Link
JP (1) JPH07144271A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007075825A (en) * 2005-09-09 2007-03-29 Hiroshima Industrial Promotion Organization Soldering iron tip and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007075825A (en) * 2005-09-09 2007-03-29 Hiroshima Industrial Promotion Organization Soldering iron tip and its manufacturing method

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