JPH07133663A - Vibration absorbable woody board - Google Patents

Vibration absorbable woody board

Info

Publication number
JPH07133663A
JPH07133663A JP28106293A JP28106293A JPH07133663A JP H07133663 A JPH07133663 A JP H07133663A JP 28106293 A JP28106293 A JP 28106293A JP 28106293 A JP28106293 A JP 28106293A JP H07133663 A JPH07133663 A JP H07133663A
Authority
JP
Japan
Prior art keywords
vibration
wood
board
absorbing material
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28106293A
Other languages
Japanese (ja)
Other versions
JP2580522B2 (en
Inventor
Toru Ebihara
徹 海老原
Hideaki Koma
秀昭 高麗
Shuzo Sueyoshi
修三 末吉
Mario Sotozaki
真理雄 外崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RINYACHIYOU SHINRIN SOGO KENKY
RINYACHIYOU SHINRIN SOGO KENKYUSHO
Original Assignee
RINYACHIYOU SHINRIN SOGO KENKY
RINYACHIYOU SHINRIN SOGO KENKYUSHO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RINYACHIYOU SHINRIN SOGO KENKY, RINYACHIYOU SHINRIN SOGO KENKYUSHO filed Critical RINYACHIYOU SHINRIN SOGO KENKY
Priority to JP5281062A priority Critical patent/JP2580522B2/en
Publication of JPH07133663A publication Critical patent/JPH07133663A/en
Application granted granted Critical
Publication of JP2580522B2 publication Critical patent/JP2580522B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To enhance the vibration damping ability and the shock absorbing ability by mixing small wood pieces, a vibration energy absorbing material having a specific particle size and an adhesive together at specific weight ratios, and then heating and pressing thus obtained mixture into a planar shape. CONSTITUTION:25 to 150wt.% of vibration energy absorbing particulate made polyvinyl chloride or the like and having a particle size of 1 to 5mm is mixed with 100wt.%; of small wood pieces. Then, 5 to 15% of an adhesive is mixed with thus obtained mixture, with respect the completely dried weight of the wood piece, and then, the mixture is heated and pressed so as to be formed into a plate-like member. Thus obtained plate-like member is used for a floor, a roof or a wall base material. Accordingly, the noise insulation ability of housing can be enhanced, and the vibration absorbability can be adjusted by changing the mixing ratio, the particle size and kinds of materials to be used and the like. Further, it is possible to use wood having a small diametrical size, scrapped wood from the dismantled housing, waste plastic or the like.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、優れた振動吸収性を有
し、床衝撃音の少ない振動吸収性木質ボードに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration-absorbing wood board which has excellent vibration-absorbing properties and produces less floor impact sound.

【0002】[0002]

【従来技術】近年、ダニの発生など衛生的な面及び自然
志向から、床仕上げ材としてカーペットに替わり木質系
の仕上げ材(一般に「木質フローリング」と称される)
が集合住宅、戸建て住宅に多用されるようになってい
る。
2. Description of the Related Art In recent years, from the viewpoint of hygiene such as generation of mites and the intention of nature, a wood-based finishing material (generally referred to as "wood flooring") instead of a carpet as a floor finishing material.
Is often used for multi-family houses and detached houses.

【0003】ところが、この木質フローリングブームに
伴って、特に集合住宅などにおいて問題となる上階の歩
く音などが響くという騒音公害が発生し、社会的な問題
となった。
However, along with the wooden flooring boom, noise pollution such as the noise of walking on the upper floor, which is a problem particularly in apartments, has occurred, which has become a social problem.

【0004】このため、木質フローリングである合板表
面にナラなどのツキ板を貼ったものに、更に制振ゴムシ
ート、樹脂発泡体などのクッション材を裏貼りした防音
性の床板が開発され、マンションなどの集合住宅、およ
び戸建て住宅の上階の床衝撃音対策のために用いられて
きている。木材は、金属材料に比べると振動吸収性能
(制振性能)に優れるが、防音床板、制振鋼板などのよ
うに、振動吸収材(制振材)を積層することにより振動
吸収性を持たせた材料は知られているが、これらの積層
構造の素材はその適用対象等において制約がある。しか
し、木質系ボードそれ自身の制振性能を高めた木質系の
素材は従来提供されていない。
For this reason, a soundproof floorboard has been developed in which a wood flooring plywood surface is covered with a wood board such as oak, and a cushioning material such as a vibration-damping rubber sheet or resin foam is attached to the back. It has been used as a countermeasure against floor impact noise on the upper floors of multi-family houses and detached houses. Wood is superior to metal materials in vibration absorption performance (vibration damping performance), but it is made to have vibration absorption performance by laminating vibration absorbing materials (vibration damping materials) such as soundproof floor boards and vibration damping steel plates. Although known as such materials, the materials of these laminated structures are limited in their application targets. However, wood-based materials that have improved the vibration-damping performance of the wood-based board itself have not been provided so far.

【0005】また、合板、パーティクルボードなどの木
質の板材料が、床・屋根・壁下地材として住宅などに多
用されている。
Further, woody board materials such as plywood and particle board are widely used in houses as floor, roof and wall base materials.

【0006】[0006]

【発明が解決しようとする課題】本発明者は、上記した
床衝撃音問題を解決するためには、例えば床下地材等に
振動吸収性を持たせれば、床の遮音性能は著しく改善さ
れること、また、従来のパーティクルボード、ファイバ
ーボードなどの木質ボードと同様の強度的性質を有しか
つ振動吸収性を持つ木質ボードが開発されれば、下地ば
かりでなく多用な用途に利用出来ることから、ボード自
体が優れた振動吸収性をもつ木質系ボードを提供するこ
とを目的として本発明を開発したものである。
In order to solve the above-mentioned floor impact sound problem, the present inventor remarkably improves the sound insulation performance of the floor by providing the floor base material with a vibration absorbing property. In addition, if a wood board with the same strength properties and vibration absorption as conventional wood boards such as particle boards and fiber boards is developed, it can be used not only for substrates but also for various purposes. The present invention was developed for the purpose of providing a wooden board having excellent vibration absorption.

【0007】[0007]

【課題を解決するための手段】上記の目的を達成する本
発明よりなる振動吸収性木質ボードの特徴は、木材小片
中に、1〜5mmの粒状に成形した振動エネルギー吸収
材と、接着剤を分散含有させ、板状に熱圧成形してなる
ところにある。
Means for Solving the Problems A characteristic of a vibration-absorbing wood board according to the present invention that achieves the above-mentioned object is that a vibration energy-absorbing material formed into granular particles of 1 to 5 mm and an adhesive are contained in a small piece of wood. It is contained by being dispersed and thermoformed into a plate shape.

【0008】上記の木材小片(パーティクル)は、小径
木、工場廃材のほか、住宅解体材、廃パレットなどを原
料として得ることができ、その大きさは特に限定される
ものではないが、例えば厚さ0.2〜0.6mm,長さ
数mm〜70mm,好ましくは10〜30mm程度の大
きさのものを、我国の原料事情、製造ラインを考えると
用いることができる。
The above-mentioned small pieces of wood (particles) can be obtained by using not only small-diameter wood, industrial waste materials, but also house dismantling materials, waste pallets, etc. as raw materials, and the size thereof is not particularly limited. A size of 0.2 to 0.6 mm, a length of several mm to 70 mm, and preferably about 10 to 30 mm can be used considering the circumstances of raw materials in Japan and the production line.

【0009】上記振動エネルギー吸収材は、ブチルゴ
ム,ポリノルボルネン,ポリ塩化ビニル系の樹脂を素材
として製造することができるが、経済性、加工性からポ
リ塩化ビニル系樹脂が好ましく用いることができる。ポ
リ塩化ビニル系樹脂は、塩化ビニル単独重合体、および
塩化ビニルと酢酸ビニル、エチレンとの共重合体などを
素材として挙げることができる。またこの樹脂と共に、
可塑材,石油樹脂などを混合して用いることもできる。
The vibration energy absorbing material can be manufactured by using butyl rubber, polynorbornene, or polyvinyl chloride resin as a raw material, but polyvinyl chloride resin can be preferably used from the viewpoint of economy and processability. Examples of the polyvinyl chloride resin include vinyl chloride homopolymers, copolymers of vinyl chloride and vinyl acetate, ethylene and the like. Also with this resin,
It is also possible to mix and use a plastic material, petroleum resin, or the like.

【0010】これらの樹脂素材を用いて、押し出し加工
製造した後、例えば1〜5mm程度、好ましくは1〜2
mm程度の粒径として、上記の振動エネルギー吸収材と
することができ、木材小片100重量部に対して、25
〜150重量部の範囲、好ましくは40〜150重量部
の範囲で配合することができる。配合量が25重量部未
満では、振動吸収性が十分でないという問題があり、反
対に配合量が150重量部を越えると強度,剛性が低下
するという問題を招いて好ましくない。
After extrusion manufacturing using these resin materials, for example, about 1 to 5 mm, preferably 1 to 2
With a particle size of about mm, the above vibration energy absorbing material can be used, and it is 25
To 150 parts by weight, preferably 40 to 150 parts by weight. If the blending amount is less than 25 parts by weight, there is a problem that the vibration absorption is insufficient, and conversely, if the blending amount exceeds 150 parts by weight, the strength and rigidity are deteriorated, which is not preferable.

【0011】振動エネルギー吸収材と共に配合される接
着剤としては、ユリア樹脂、ユリア−メラミン樹脂、フ
ェノール樹脂、イソシアネート樹脂系接着剤などを使用
することができ、特に好ましくはイソシアネート樹脂で
ある。この接着剤の添加量は、パーティクルの全乾重量
に対して5〜15%以下程度とすることがよく、通常1
0%程度の添加で良好な性能が得られる。
As the adhesive compounded with the vibration energy absorbing material, urea resin, urea-melamine resin, phenol resin, isocyanate resin adhesive, etc. can be used, and isocyanate resin is particularly preferable. The amount of the adhesive added is preferably about 5 to 15% or less based on the total dry weight of the particles, and is usually 1
Good performance can be obtained by adding about 0%.

【0012】これらの各原料を用いて熱圧成形した木質
ボードの製造は、従来から知られている方法、例えば木
材小片(パーティクル),木材繊維(ファイバー)にユ
リア樹脂やユリア−メラミン共縮合樹脂接着剤などを添
加し熱圧成形して得られるパーティクルボード、ファイ
バーボードの製造法に準拠して行うことができる。
The production of a wood board thermoformed using each of these raw materials is carried out by a conventionally known method, for example, wood pieces (particles), wood fibers (fibers), urea resin or urea-melamine co-condensation resin. It can be carried out in accordance with the method for producing a particle board or fiber board obtained by adding an adhesive or the like and thermoforming.

【0013】すなわち、その製造法を一例的に説明すれ
ば、木材チップよりリングフレーカで切削し調整した木
材小片(パーティクル)と、粒状の振動エネルギー吸収
材とを所定割合で混合し、この混合物に接着剤をブレン
ダー中で撹拌しながら噴霧塗布し、接着剤塗布後振動吸
収材が木材パーティクル中に均一に分散するようにフォ
ーミングし、熱圧締により成板することができる。
That is, to explain the manufacturing method as an example, small pieces (particles) of wood cut and adjusted from a wood chip with a ring flaker and granular vibration energy absorbing materials are mixed at a predetermined ratio, and this mixture is mixed. The adhesive can be spray-coated with stirring in a blender, and after the adhesive is applied, the vibration absorbing material is formed so as to be uniformly dispersed in the wood particles, and the plate can be formed by hot pressing.

【0014】[0014]

【作用】本発明の木質ボードの制振性能は、振動エネル
ギーを吸収材自身が吸収して熱エネルギーに変換する能
力、すなわち、通常材料の粘弾性測定によって求められ
る損失係数(tanδ=損失弾性率(E”)/貯蔵弾性
率(E’))で表され、振動エネルギー吸収性は損失係
数が大きいほど良い。したがって、振動エネルギー吸収
材を多く含有した本発明の木質ボードは、優れた振動吸
収性を有する。また、振動エネルギー吸収材の含有程度
を制御することによって振動吸収の程度を選択出来る。
The vibration damping performance of the wood board of the present invention is the ability of the absorber itself to absorb vibration energy and convert it into heat energy, that is, the loss coefficient (tan δ = loss elastic modulus) usually obtained by viscoelasticity measurement of the material. (E ″) / storage modulus (E ′)), and the larger the loss coefficient, the better the vibration energy absorption. Therefore, the wood board of the present invention containing a large amount of the vibration energy absorbing material has excellent vibration absorption. Further, the degree of vibration absorption can be selected by controlling the content of the vibration energy absorbing material.

【0015】[0015]

【実施例】【Example】

実施例1 以下の素材を用い、以下の条件で振動吸収性の木質ボー
ドを製造した。
Example 1 A vibration absorbing wood board was manufactured under the following conditions using the following materials.

【0016】素材: 木材小片 …アカマツパーティクル(長さ約20mm、
巾4mm、厚さ0.5mm) 振動吸収材…ポリ塩化ビニル系樹脂(東ソー(株)社
製) 接着剤 …イソシアネート樹脂(NLE−4002:
日本化成(株)社製) 熱圧成形の条件 熱板温度180℃、圧締圧力35kg/cm2 とし、熱
圧時間10分で厚さ15mmのボードを成形した。
Material: Small pieces of wood ... Red pine particles (length about 20 mm,
Width 4 mm, thickness 0.5 mm) Vibration absorber ... Polyvinyl chloride resin (manufactured by Tosoh Corp.) Adhesive ... Isocyanate resin (NLE-4002:
Nihon Kasei Co., Ltd.) Hot-pressing conditions A hot plate temperature of 180 ° C. and a pressing pressure of 35 kg / cm 2 were used, and a board having a thickness of 15 mm was formed at a hot pressing time of 10 minutes.

【0017】以上の方法により、比重が0.7で一定
で、振動ネルギー吸収材(制振材)の含有量を変えた種
々の木質ボードを作成し、これらの木質ボードの損失係
数の変化を測定した。結果を図1に示す。
By the above method, various wooden boards having a specific gravity of 0.7 and a constant content of the vibration energy absorbing material (vibration damping material) were prepared, and the change of the loss coefficient of these wooden boards was measured. It was measured. The results are shown in Fig. 1.

【0018】この図1の結果から分かるように、制振材
含量が0の制振材を含まない対照ボードの損失係数に対
し、振動吸収材を分散含有した木質ボードの損失係数は
大きく、また制振材含量の増加に伴い大きくなる傾向を
示した。
As can be seen from the results of FIG. 1, the loss factor of the wooden board containing the vibration absorbing material dispersed is large compared to the loss factor of the control board containing no damping material having a damping material content of 0, and It tended to increase with the increase of the damping material content.

【0019】また、振動エネルギー吸収材含量が40%
の木質ボードを、その比重を種々変化させて上記方法に
より製造し、その動的ヤング係数、損失係数を測定し
て、木質ボードの比重との関係を図2に示した。
Further, the vibration energy absorbing material content is 40%.
The wooden board was manufactured by the above method while changing its specific gravity variously, and its dynamic Young's modulus and loss coefficient were measured, and the relationship with the specific gravity of the wooden board is shown in FIG.

【0020】この図2の結果から、本例の振動エネルギ
ー吸収材を含有する木質ボードのヤング係数は、ボード
比重の増加とともに直線的に大きくなること、損失係数
はボード比重によらず一定であり、対照ボードに比ベ優
れた振動吸収性を示すことが分かる。
From the results of FIG. 2, the Young's modulus of the wooden board containing the vibration energy absorbing material of this example increases linearly with the increase of the board specific gravity, and the loss coefficient is constant regardless of the board specific gravity. It can be seen that, compared with the control board, it exhibits excellent vibration absorption.

【0021】実施例2 振動エネルギー吸収材の粒子径の違いによるボードの損
失係数の変化を確認するために、振動吸収材の粒径を変
えた他は実施例1と同様にして木質ボードを製造し、動
的弾性率、損失係数を測定した。結果を下記表1に示し
Example 2 A wooden board was manufactured in the same manner as in Example 1 except that the particle size of the vibration absorber was changed in order to confirm the change in the loss coefficient of the board due to the difference in the particle size of the vibration energy absorber. Then, the dynamic elastic modulus and the loss coefficient were measured. The results are shown in Table 1 below.

【0022】[0022]

【表1】 [Table 1]

【0023】この表1から分かるように、粒子径が小さ
い方が木質ボードの制振性能は良好であることが分か
る。
As can be seen from Table 1, the smaller the particle size, the better the damping performance of the wooden board.

【0024】[0024]

【発明の効果】本発明の木質ボードは、優れた振動吸収
性を持つので住宅の床、屋根、壁下地材として用いるこ
とにより、遮音性能など住宅の性能向上に寄与すること
ができるという効果があり、更に以下の効果を奏する。
EFFECTS OF THE INVENTION The wood board of the present invention has an excellent vibration absorption property. Therefore, when it is used as a floor, roof or wall base material of a house, it can contribute to improving the performance of the house such as sound insulation. There are the following effects.

【0025】 従来のパーティクルボードと同様の製
造工程で振動吸収性木質系ボードを製造できる。
The vibration-absorbing wood board can be manufactured by the same manufacturing process as that of the conventional particle board.

【0026】 木材パーティクルと振動吸収材の混合
割合を変えることにより、制振性能(振動吸収性)の異
なるボードを製造できる。すなわち制振性能を制御でき
る。
By changing the mixing ratio of the wood particles and the vibration absorbing material, boards having different vibration damping performance (vibration absorbing) can be manufactured. That is, the vibration damping performance can be controlled.

【0027】 振動吸収材の粒子径を変えることによ
っても振動吸収性を変えることができる。
The vibration absorption can also be changed by changing the particle size of the vibration absorbing material.

【0028】 振動吸収材の材質を変えることによっ
てもボードの性能を変えることができる。
The performance of the board can also be changed by changing the material of the vibration absorbing material.

【0029】 熱圧工程で混合したポリ塩化ビニル樹
脂が溶融するので、木材と塩ビの接着に寄与する。
Since the polyvinyl chloride resin mixed in the hot pressing step melts, it contributes to the adhesion between wood and vinyl chloride.

【0030】 原料である木材パーティクルは、小径
木、工場廃材のほか、住宅解体材、廃パレットなどを原
料とすることができる。
As the raw material, wood particles can be used as a raw material, such as small-diameter trees and factory waste materials, as well as housing dismantling materials and waste pallets.

【0031】 振動吸収材のポリ塩化ピニル系樹脂
は、農業用資材などの廃プラスチックを原料として製造
可能であるので、廃棄物処理間題など環境問題に貢献で
きる。
Since the polypinyl chloride resin as the vibration absorbing material can be manufactured using waste plastic such as agricultural material as a raw material, it can contribute to environmental problems such as waste disposal problems.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明における木質ボードの比重を0.7で一
定とし、振動吸収材(制振材)の含有量を変えたときの
ボードの損失係数の変化を示した図、
FIG. 1 is a diagram showing changes in the loss coefficient of a wooden board according to the present invention when the specific gravity of the wooden board is fixed at 0.7 and the content of the vibration absorbing material (vibration damping material) is changed.

【図2】本発明の実施例1の木質ボードにおいて、制振
材含量を40%とした木質ボードの動的ヤング係数、損
失係数とボード比重の関係を示した図。
FIG. 2 is a diagram showing the relationship between the dynamic Young's modulus, loss coefficient and board specific gravity of the wood board of Example 1 of the present invention in which the damping material content is 40%.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 木材小片中に、1〜5mmの粒状に成形
した振動エネルギー吸収材と、接着剤を分散含有させ、
板状に熱圧成形してなることを特徴とする振動吸収性、
衝撃緩衝性を有する木質ボード。
1. A small piece of wood, in which a vibration energy absorbing material formed into a granular shape of 1 to 5 mm and an adhesive are dispersedly contained,
Vibration absorption, which is characterized by being hot-pressed into a plate shape,
A wooden board with shock-absorbing properties.
【請求項2】 木材小片の100重量部に対して、1〜
5mmの粒状に成形した振動エネルギー吸収材を25〜
150重量部含有すると共に、これに木材小片の全乾重
量に対して5〜15%の接着剤を含有し、熱圧成形され
たことを特徴とする振動吸収性、衝撃緩衝性を有する木
質ボード。
2. 1 to 100 parts by weight of a small piece of wood
The vibration energy absorbing material formed into 5 mm granularity is
A wood board having a vibration absorbing property and a shock absorbing property, which is characterized by containing 150 parts by weight and containing 5 to 15% of an adhesive agent based on the total dry weight of a small piece of wood and being thermocompression molded. .
【請求項3】 請求項1又は2において、振動エネルギ
ー吸収材が、ポリ塩化ビニル系の振動吸収材であること
を特徴とする振動吸収性、衝撃緩衝性を有する木質ボー
ド。
3. The wooden board according to claim 1 or 2, wherein the vibration energy absorbing material is a polyvinyl chloride vibration absorbing material.
JP5281062A 1993-11-10 1993-11-10 Vibration absorbing wood board Expired - Lifetime JP2580522B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5281062A JP2580522B2 (en) 1993-11-10 1993-11-10 Vibration absorbing wood board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5281062A JP2580522B2 (en) 1993-11-10 1993-11-10 Vibration absorbing wood board

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Publication Number Publication Date
JPH07133663A true JPH07133663A (en) 1995-05-23
JP2580522B2 JP2580522B2 (en) 1997-02-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102642229A (en) * 2007-05-30 2012-08-22 富士通株式会社 Manufacturing method of compression molding product using plant materials
JPWO2008146370A1 (en) 2007-05-30 2010-08-12 富士通株式会社 Compression molded product using plant material and method for producing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156712A (en) * 1983-02-25 1984-09-06 Ain Eng Kk Preparation of woody synthetic molding
JPS63197641A (en) * 1987-02-12 1988-08-16 内山工業株式会社 Woody composite board
JPH0631708A (en) * 1992-07-20 1994-02-08 Okura Ind Co Ltd Light-weight particle board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156712A (en) * 1983-02-25 1984-09-06 Ain Eng Kk Preparation of woody synthetic molding
JPS63197641A (en) * 1987-02-12 1988-08-16 内山工業株式会社 Woody composite board
JPH0631708A (en) * 1992-07-20 1994-02-08 Okura Ind Co Ltd Light-weight particle board

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JP2580522B2 (en) 1997-02-12

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