JPH0713013A - Formation of color filter and black mask - Google Patents

Abstract

PURPOSE:To efficiently form color filters and a black mask with small times of resist coating and small times of exposure and development. CONSTITUTION:A conductive base film 12 is formed on a substrate 11. After the base film 12 is divided according to the colors of color filters, a photosensitive black resist is applied on the substrate 11 and this black resist film 16 is exposed and developed to form a black mask 16a. Voltage is applied on the devided base film 12a where the color filter of one color is to be formed so that the filter material of the color is formed by electrodeposition on the base film 12a. This process is repeated to successively form red, green and blue color filters 17R, 17G, and 17B, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a color filter and a black mask provided on one transparent substrate of a liquid crystal display device.

[0002]

2. Description of the Related Art A liquid crystal display device for displaying a multi-color image such as a full-color image has transparent electrodes for display formed on a pair of transparent substrates facing each other with a liquid crystal layer interposed therebetween, and one of the substrates is used. In addition, color filters of a plurality of colors and a black mask for light shielding corresponding to a gap between these color filters are provided.

A color filter and a black mask provided on one substrate of the above liquid crystal display element are conventionally formed by the following method. FIG. 10 is a cross-sectional view in each step showing a conventional method of forming a color filter and a black mask. Here, an example of forming three color filters of red, green and blue as color filters is shown. .

[Step 1] First, as shown in FIG. 10A, a transparent conductive base film 2 made of ITO or the like is formed on a transparent substrate 1 made of glass or the like over substantially the entire surface thereof. To do.

[Step 2] Next, a photosensitive resist is coated on the substrate 1, and the resist film is exposed and developed to form red, green, and blue as shown in FIG. 10 (b). A first resist mask 3a having an opening corresponding to a color filter formation region of one of the colors, for example, a red filter formation region is formed.

[Step 3] Next, as shown in FIG. 10C, a red filter material (a transparent resin with a red color) is formed on the base film 2 exposed in the opening of the resist mask 3a. A mixture of pigments) is electrodeposited to a desired thickness to form a red filter 4R.

The electrodeposition of the filter material is carried out by immersing the substrate 1 in an electrodeposition solution in which the filter material is dissolved in an electrolytic solution, and then immersing the base film 2 on the substrate 1 in the electrodeposition solution. The voltage is applied to a certain counter electrode to deposit the filter material in the electrodeposition solution on the exposed portion of the base film 2, and the thickness of the filter material deposited on the base film 2 is measured. Is controlled by the applied voltage.

[Step 4] Next, as shown in FIG. 10D, the first resist mask 3a is peeled off, and then a photosensitive resist is coated on the substrate 1 again to form this resist film. By exposure / exposure processing, as shown in (e) of FIG. 10, the second resist mask 3b in which a portion corresponding to a color filter forming region of another color, for example, a green filter forming region is opened. To form.

[Step 5] Next, as shown in FIG. 10 (f), a green filter material (a transparent resin of green is formed on the base film 2 exposed in the opening of the resist mask 3b). A mixture of pigments) is electrodeposited to a desired thickness to form a green filter 4G.

[Step 6] Next, as shown in FIG. 10G, the second resist mask 3b is peeled off, and then a photosensitive resist is coated on the substrate 1 again to form this resist film. By exposure / exposure processing, as shown in FIG. 10H, a third resist mask 3c is formed in which a portion corresponding to a color filter forming region of the remaining color, for example, a blue filter forming region is opened. To do.

[Step 7] Next, as shown in (i) of FIG. 10, on the base film 2 exposed in the opening of the resist mask 3c, a blue filter material (transparent resin with blue A mixture of pigments) is electrodeposited to a desired thickness to form a blue filter 4B.

[Step 8] After sequentially forming the red, green, and blue color filters 4R, 4G, and 4B in this manner, first, as shown in FIG. 10 (j), the third resist mask 3c is formed. After peeling, as shown in FIG. 10K, a photosensitive black resist is applied on the substrate 1 to form a black resist film 5.

[Step 9] Next, the black resist film 5 is exposed and developed to color filters 4R, 4G, 4
The black resist film 5 on B is removed as shown in FIG. 10 (l), and the black resist film left between the color filters 4R, 4G and 4B of the respective colors is used as a black mask 5a.

The black resist is a negative resist whose non-photosensitive portion is removed by a developing process, and the exposure process of the black resist film 5 is performed by the color filters 4R and 4G which have already been formed. , 4B is used as an exposure mask to irradiate light from the lower surface side of the substrate 1.

[0015]

However, according to the conventional method of forming a color filter and a black mask described above, a base film 2 for electrodeposition of a filter material is formed on a substrate 1 and then a color of one color is formed. A resist mask (one of 3a, 3b, and 3c) having an opening corresponding to the filter formation region is formed, and one color filter material is formed on the underlying film 2 exposed in the opening of the resist mask. The process of electrodeposition is repeated to obtain the color filters 4R, 4 for each color.
Since the black mask 5a is formed by sequentially forming G and 4B, then applying a black resist and exposing / developing the black resist film 5, the number of times the resist is applied and the exposure / developing process is performed. Since the number of times was large, the color filters 4R, 4G, 4B and the black mask 5a could not be efficiently formed.

That is, in the above-mentioned conventional forming method, each time a color filter of each color is formed, a photosensitive resist is applied and the resist film is exposed and developed to form a resist mask which is an electrodeposition mask of the filter material. Therefore, the resist must be formed the same number of times as the number of colors of the color filter to be formed (three times when forming the color filters 4R, 4G, and 4B of three colors of red, green, and blue as described above). It is necessary to perform coating and its exposure / development processing, and in addition, coating of a photosensitive black resist which becomes the black mask 5a and its exposure / development processing.

According to the present invention, a color filter and a black filter capable of efficiently forming a plurality of color filters and a black mask corresponding to a gap between these color filters with a small number of times of resist coating and exposure / development processing. It is intended to provide a mask forming method.

[0018]

A first method for forming a color filter and a black mask of the present invention is to form a transparent conductive underlayer film for electrodepositing a filter material on a substrate,
After forming this base film in a pattern separated according to the color of the color filter formed thereon, a photosensitive black resist is applied on the substrate and the black resist film is exposed and developed to form a gap between the color filters. Then, a voltage is applied to a portion of the base film that forms a color filter of one of the separated base films to form a black mask corresponding to the black mask. The step of electrodepositing the above filter material is repeated to sequentially form color filters of a plurality of colors.

In the second method for forming a color filter and a black mask of the present invention, a transparent conductive underlayer film for electrodepositing a filter material is formed on a substrate, and a positive type photosensitive film is formed thereon. After applying the black resist, the black resist film is exposed and developed to form an opening corresponding to a color filter forming region of one color, and the one of the ones is formed on the underlying film exposed in the opening. The process of electrodepositing color filter materials is repeated to sequentially form color filters of a plurality of colors, and the black resist film left between the color filters is used as a black mask.

[0020]

According to the first method described above, when the base film formed on the substrate is separated according to the colors of the color filters formed thereon, the application of a photosensitive resist that serves as an etching mask and the exposure and exposure thereof are performed. In addition to the development process, only the application of a photosensitive black resist and the exposure / development process are performed when forming the black mask. After that, a voltage is selectively applied to each of the separated base films to filter material. Since the color filters of a plurality of colors can be formed by repeating the process of electrodeposition, the number of times of resist application and the number of times of exposure / development treatment may be two each.

Further, according to the second method, it is sufficient to apply the photosensitive black resist as the black mask once on the base film formed on the substrate, and to apply the resist only once. When the openings for electrodepositing the filter material are formed on the resist film on the resist film, the finally left black resist film directly becomes a black mask corresponding to the gap between the color filters.
The exposure / development process need only be performed to form an opening in the black resist film each time when the filter material of each color is electrodeposited. Just enough.

[0022]

【Example】

(Embodiment of First Method) An embodiment of the first method of the present invention will be described below with reference to FIGS. 1A to 1C are cross-sectional views in each step showing a method of forming a color filter and a black mask. Here, as a color filter, red,
An example is shown in which three color filters, green and blue, are arranged in a mosaic pattern.

[Step 1] First, as shown in FIG. 1A, a transparent conductive base film 12 made of ITO or the like is formed on a transparent substrate 11 made of glass or the like. The base film 12 is formed by a sputtering method, a vapor deposition method, or the like.

[Step 2] Next, the base film 12 is patterned by photolithography, and the base film 12 is formed.
Are separated into the color filter patterns to be obtained, as shown in FIG. In the figure, reference numeral 12a denotes each of the separated base films (hereinafter, referred to as separated base films).

FIG. 2 is a plan view of the state of FIG. 1 (b),
In this embodiment, the separation base film 12 is formed with red,
While forming the same pixel shape as that of the green and blue color filters, the separation base films 12a forming the color filters of the same color are short-circuited by the conductive lines 13, 14 and 15, respectively.

This embodiment is an example in which color filters of the same color are formed on the separation base films 12a of the same row, and the conductive lines 13, 14 and 15 are all the separation base films of the same row. It is formed for each row by connecting 12a.

The conductive lines 13, 14, 15 in each of these rows
Are led out to one side edge of the substrate 11, and of the conductive lines 12b of each row, a separation base film 12a forming a color filter of one color of red, green, and blue, for example, a red filter. The conductive line 13 is led out the longest and is connected to the power supply line 13b having the first voltage application terminal portion 13a formed along the side edge of the substrate.

The lead length of the conductive line 14 of the separation base film 12a forming another color filter, for example, the green filter, is the length of the conductive line 13 of the separation base film 12a forming the red filter. The lead-out length of the conductive line 15 of the separation base film 12a which is shorter than the length and forms a color filter of the remaining color, for example, a blue filter, is set to be shorter.

The conductive lines 14 and 15 are independent lines for each row, and the second voltage application terminal portion 14a is provided at each lead-out end of the conductive line 14 of the separation base film 12a forming the green filter. The conductive line 15 of the separation base film 12a that is formed and forms the blue filter
A third voltage application terminal portion 15a is formed at each of the lead-out ends.

The conductive lines 13, 14, 15 and the power supply line 13b and the voltage applying terminal portions 13a, 14 are described.
The a and 15a are formed from the base film 12 at the same time when the base film 12 is patterned by the photolithography method to form each separation base film 12a.

[Step 3] Next, as shown in FIG. 1C, a photosensitive black resist is applied onto the substrate 11 by a spin coating method or the like to form a black resist film 16, and this black resist is formed. The film 16 is exposed and developed to form a black mask 16a corresponding to the gap between the color filters, as shown in FIG. At this time, the unnecessary portion of the black resist film 16, that is, the portion outside the display area is also removed by the exposure / development process to remove the conductive lines 13, 14, 15 and the voltage application terminal portions 13a, 14a, 15a. Expose.

[Step 4] Next, as shown in FIG. 1 (e), a voltage is applied to all separation base films 12a forming a color filter of one of red, green, and blue, for example, a red filter. Is applied, and a red filter material (a transparent resin mixed with a red pigment) is electrodeposited on the separation base film 12a to a desired thickness to form a red filter 17R.

The electrodeposition of the filter material is carried out by immersing the substrate 11 in an electrodeposition solution in which the filter material is dissolved in an electrolytic solution, and separating the separation base film 12a and the counter electrode immersed in the electrodeposition solution. Is applied to the surface of the separation base film 12a to deposit the filter material in the electrodeposition solution, and the thickness of the deposited filter material is controlled by the applied voltage.

FIG. 3 is a plan view of the state (e) of FIG.
The electrodeposition of the red filter material is performed by the first voltage applying terminal 13a.
An electrodeposition power source 18 is connected to the electrodes, and a voltage is applied to all of the separation base films 12a forming the red filter via the power supply line 13b and the conductive line 13. In addition, in FIG.
In (e) and FIG. 3, the + voltage is applied to the separation base film 12a, but the polarity of the voltage applied to the separation base film 12a is determined according to the property of the electrodeposited filter material.

As described above, when a voltage is applied only to the separation base film 12a forming the red filter to perform electrodeposition of the filter material, the filter material is red only on the surface of the separation base film 12a to which the voltage is applied. This filter material is electrodeposited to form the red filter 17R.

In this case, since the conductive line 13 is covered with the black mask 16a made of black resist, no filter material is electrodeposited on the conductive line 13 and the black mask of the conductive line 13 is not deposited. If the above electrodeposition is performed without immersing the lead-out portion extending outward from 16a in the electrodeposition solution, the conductive line 1
No filter material is electrodeposited on the lead-out portion of No. 3 or the power supply line 13b.

[Step 5] Next, after cleaning the substrate 11,
As shown in FIG. 1 (f), all separation base films 1 forming a color filter of another color, for example, a green filter.
By applying a voltage to 2a, a green filter material (a transparent resin mixed with a green pigment) on these separation base films 12a
To a desired thickness to form a green filter 17G.

FIG. 4 is a plan view of the state (f) of FIG.
For electrodeposition of the green filter material, the connector member 19 connected to the electrodeposition power source 18 is brought into contact with the second voltage application terminal 14a, and all of the separation base films 12a forming the green filter are connected via the conductive line 14. It is performed by applying a voltage.

In this case, since the connector member 19 contacts not only the second voltage application terminal 14a but also the conductive line 13 led out between these terminals, the separation member formed by electrodeposition of the red filter material is separated. A voltage is also applied to the ground film 12a, but since the separation base film 12a is already covered with the red filter 17R, the green filter material is not electrodeposited on it.

[Step 6] Next, after cleaning the substrate 11 again, as shown in FIG. 1 (g), all separation base films 1 for forming color filters of the remaining colors, for example, blue filters, are formed.
A blue filter material (a transparent resin mixed with a blue pigment) is applied on the separation base film 12a by applying a voltage to 2a.
Is electrodeposited to a desired thickness to form a blue filter 17B.

FIG. 5 is a plan view of the state (g) of FIG.
The electrodeposition of the blue filter material is performed by bringing the above-mentioned connector member 19 into contact with the third voltage application terminal 15a and forming all of the separation base films 12a forming the blue filter through the conductive line 15.
Voltage is applied to.

In this case, since the connector member 19 contacts not only the third voltage application terminal 15a but also the conductive lines 13 and 14 led out between these terminals, the red and green filter materials are electrically connected. A voltage is also applied to the deposited separation base film 12a.
a is already a red filter 17R and a green filter 17G
Since it is covered with, no blue filter material is electrodeposited on it.

That is, in the method of forming the color filter and the black mask, the transparent conductive underlayer film 12 for electrodepositing the filter material is formed on the substrate 11, and the underlayer film 12 is formed thereon. After separating the color filters by color, a photosensitive black resist is applied on the substrate 11, and the black resist film 16 is exposed and developed to form a black mask 16a corresponding to a gap between the color filters. After that, each of the separated base films 1
2a, a voltage is applied to a part of the base film 12a where a color filter for one color is formed, and the base film 12a is separated.
By repeating the process of electrodepositing the filter material of one color on the above, red, green and blue color filters 17R, 17G, 1
7B are sequentially formed.

According to this method, when the base film 12 formed on the substrate 11 is separated according to the colors of the color filters formed thereon, the application of a photosensitive resist that serves as an etching mask and the exposure and development thereof are performed. When the black mask 16a is formed, the photosensitive black resist is applied and the exposure / development process is performed, and then a voltage is selectively applied to each of the separated base films 12a to perform the filter. By repeating the process of electrodepositing the material, red,
Since the green and blue color filters 17R, 17G, and 17B can be formed, the number of times of resist application and the number of times of exposure / development processing are each required to be two, and therefore, the red, green, and blue color filters 17R, 17G, 17
B and the black mask 16a corresponding to the gap between these color filters can be efficiently formed with a small number of times of resist coating and a number of times of exposure and development processing.

The color filters 17R and 17R
Substrate 11 on which G, 17B and black mask 16a are formed
Is used for a liquid crystal display device by forming a transparent insulating film on the entire substrate and forming a transparent electrode on the insulating film. In this case, the transparent electrodes are formed corresponding to the color filters 17R, 17G, 17B, and the terminals of these transparent electrodes are the conductive lines 13, 14, 1 described above.
5 are arranged on the side edge of the substrate leading out.

(Embodiment of Second Method) Next, one embodiment of the second method of the present invention will be described with reference to FIGS. 6 to 9.
FIG. 5 is a cross-sectional view in each step showing a method for forming a color filter and a black mask. Here, three color filters of red, green and blue are alternately arranged in the row direction as color filters. An example is shown.

[Step 1] First, as shown in FIG. 6A, a transparent conductive base film 22 made of ITO or the like is formed on a transparent substrate 21 made of glass or the like by a sputtering method or an evaporation method. As shown in FIG. 6B, a photosensitive black resist made of a positive type resist (a resist whose exposed portion is removed by development) is applied thereon by a spin coating method or the like to form a black resist. The film 23 is formed.

[Step 2] Next, as shown in FIG.
The black resist film 23 is exposed and developed using an exposure mask (not shown) corresponding to the formation pattern of the color filter of one of the red, green, and blue color filters to be formed. In the black resist film 23, a first opening 24a corresponding to a formation region of a color filter of one of red, green and blue, for example, a red filter is formed.

In this way, the first black resist film 23 is formed on the black resist film 23.
When the opening 24a of the black resist film 2 is formed.
The portion left between the openings 24a of the black mask 2 corresponds to the gap between the red filters 25R to be formed next.
3a (see FIG. 7).

[Step 3] Next, as shown in FIG.
Using the black resist film 23 as an electrodeposition mask, a red filter material is electrodeposited to a desired thickness on the surface of the base film 22 exposed in the first openings 24a of the black resist film 23 to form a red filter 25R. Form. FIG. 7 shows FIG.
It is a top view of the state of (d).

The electrodeposition of the filter material is performed by immersing the substrate 21 in an electrodeposition solution in which the filter material is dissolved in an electrolytic solution, and forming the base film 22 and the counter electrode immersed in the electrodeposition solution. A voltage is applied between them to deposit the filter material in the electrodeposition solution on the surface of the base film 22,
The applied thickness of the filter material is controlled by the applied voltage.

[Step 4] Next, the above-mentioned exposure mask is placed at a predetermined pitch (red, green,
The black resist film (positive resist film) 23 is again exposed and developed by shifting the arrangement of the blue color filters, and the black resist film 23 is formed on the black resist film 23 as shown in FIG. 6 (e). , The second opening 24b corresponding to the formation region of the other color filter, for example, the green color filter.

As described above, the second resist is formed on the black resist film 23.
When the opening 24b of the black resist film 2 is formed.
The portions left between the second openings 24b of No. 3 become the black masks 23a corresponding to the gaps between the green filters 25G to be formed next, and the above-mentioned first openings 24b.
The portion left between a and the second opening 24b becomes the black mask 23a corresponding to the gap between the red filter 25R and the green filter 25G (see FIG. 8).

[Step 5] Next, as shown in FIG.
Using the black resist film 23 and the red filter 25R already formed as an electrodeposition mask, the black resist film 23
A green filter material is electrodeposited to a desired thickness on the surface of the base film 22 exposed in the second opening 24b of the green filter 2
5G is formed. FIG. 8 is a plan view of the state of FIG. 6 (f).

[Step 6] Next, the above-mentioned exposure mask is arranged at a position further displaced from the arrangement position in [Step 4] by a predetermined pitch, and the black resist film (positive resist film) 23 is again exposed and developed. Then, Fig. 6
As shown in (g), the black resist film 23 is provided with a third opening 24c corresponding to the formation region of the color filter of the remaining color, for example, the blue filter.

As described above, the black resist film 23 has a third
When the opening 24c of the black resist film 2 is formed.
The portions left between the third openings 24c of No. 3 become the black masks 23a corresponding to the spaces between the blue filters 25B to be formed next, and the above-mentioned first openings 24a.
And the portion left between the second opening 24b and the third opening 24c becomes the black mask 23a corresponding to the gap between the red filter 25R and the green filter 25G and the blue filter 25B, and all colors The black mask 23a corresponding to the gap between the filters 25R, 25G and 25B is completed (see FIG. 9).

[Step 7] Next, as shown in FIG.
The black resist film 23 (black mask 23a)
With the red filter 25R and the green filter 25G already formed as an electrodeposition mask, a blue filter material is electrodeposited to a desired thickness on the surface of the base film 22 exposed in the third opening 24c of the black resist film 23. , Blue filter 25
Form B. FIG. 9 is a plan view of the state of FIG. 6 (h).

That is, in the method of forming the color filter and the black mask, the transparent conductive base film 22 for electrodeposition of the filter material is formed on the substrate 21, and the positive type photosensitive black resist is formed thereon. After coating, the black resist film 23 is exposed and developed to form an opening corresponding to a color filter formation region of one color, and the one color is exposed on the underlying film 22 exposed in the opening. Repeat the process of electrodepositing the filter material of
Green and blue color filters 25R, 25G, 25B are sequentially formed, and these color filters 25R, 25G, 25B are formed.
The black resist film 23 left in between is used as a black mask 23a.

According to this method, it is sufficient to apply the photosensitive black resist to be the black mask 23a on the base film 22 formed on the substrate 21 only once, and the black resist film is also applied. 23, openings 24a, 2 for electrodepositing a filter material on the base film 22.
4b and 24c are formed, the black resist film 23 finally left remains as it is in the color filters 25R,
Black mask 23 corresponding to the gap between 25G and 25B
Therefore, the exposure / development process need only be performed to form the openings 24a, 24b, 24c in the black resist film 23 each time when the filter material of each color is electrodeposited. , The same number of times (three times) as the number of colors (three colors of red, green and blue) of the color filters 25R, 25G and 25B to be formed.

Therefore, according to this method, red,
Green and blue color filters 25R, 25G, 25B and a black mask 2 corresponding to the gaps between these color filters
3a can be efficiently formed with a small number of times of resist coating and a number of times of exposure and development processing.

Although the color filters are formed in the order of the red color filter, the green color filter and the blue color filter in each of the above embodiments, the order of forming these color filters may be arbitrary, and the color of the color filters may be different. However, the color is not limited to red, green, and blue, and may be another color.

[0062]

According to the first method of forming a color filter and a black mask of the present invention, when a base film formed on a substrate is formed in a pattern separated according to the color of the color filter formed thereon. , Coating the photosensitive resist to be the etching mask and performing the exposure / development process, and at the time of forming the black mask, coating the photosensitive black resist and the exposure / development process are performed. Since a color filter of a plurality of colors can be formed by repeating the process of selectively applying a voltage to each base film and electrodepositing the filter material, the number of times of resist application and the number of times of exposure / development processing are two times each. Therefore, the number of color filters for a plurality of colors and the black mask corresponding to the gap between these color filters can be reduced. It can be efficiently formed in the number of applications and exposure and development times.

Further, according to the second color filter and black mask forming method of the present invention, one-time resist coating for coating a photosensitive black resist to serve as a black mask on a base film formed on a substrate. All you have to do is
Further, when an opening for electrodepositing the filter material is formed on the base film in the black resist film, the finally left black resist film directly becomes a black mask corresponding to the gap between the color filters. Therefore, the exposure / development process only needs to be performed to form an opening in the black resist film each time when the filter material of each color is electrodeposited, and therefore the number of exposure / development processes is equal to the number of colors of the color filter to be formed. The same number of times is required. Therefore, even by this method, it is possible to efficiently form the color filters of a plurality of colors and the black mask corresponding to the gaps between these color filters with a small number of times of resist coating and exposure / development processing. You can

[Brief description of drawings]

FIG. 1 shows a method for forming a color filter and a black mask according to an embodiment of a first method of the present invention, (a) is a cross-sectional view of a state in which a conductive underlayer film is formed on a substrate, (b) Is a cross-sectional view with the underlying film separated, (c) is a cross-sectional view with the black resist applied, (d) is a cross-sectional view with the black mask formed, and (e) is the red filter formed. Cross-sectional view, (f) is a cross-sectional view with the green filter formed,
(g) is a sectional view showing a state where a blue filter is formed.

FIG. 2 is a plan view of the state of FIG. 1 (b).

FIG. 3 is a plan view of the state of FIG.

FIG. 4 is a plan view of the state of FIG.

5 is a plan view of the state of FIG. 1 (g).

FIG. 6 shows a method for forming a color filter and a black mask according to an embodiment of the second method of the present invention, (a) is a cross-sectional view of a conductive underlayer formed on a substrate, (b). Is a cross-sectional view of the state where the black resist is applied, (c) is a cross-sectional view of the state where the first opening is formed in the black resist film, (d)
Is a cross-sectional view of a state in which a red filter is formed, (e) is a cross-sectional view of a state in which a second opening is formed in the black resist film,
(f) is a sectional view with a green filter formed, (g) is a sectional view with a third opening formed in the black resist film, and (h) is a sectional view with a blue filter formed.

FIG. 7 is a plan view of the state of FIG. 6 (d).

FIG. 8 is a plan view of the state of FIG. 6 (f).

9 is a plan view of the state of FIG. 6 (h).

FIG. 10 shows a method of forming a color filter and a black mask by a conventional method, (a) is a cross-sectional view of a state where a conductive underlayer film is formed on a substrate, and (b) is a first resist mask. (C) is a cross section with a red filter formed, (d) is a cross section with the first resist mask removed, and (e) is a second resist mask formed. (F) is a cross-sectional view with a green filter formed, (g) is a cross-sectional view with the second resist mask removed, and (h) is a cross-section with the third resist mask formed. Figure, (i) is a cross-sectional view of the blue filter.
(j) is a cross-sectional view with the third resist mask removed,
(k) is a cross-sectional view of the black resist applied, (l)
Is a cross-sectional view of a state where a black mask is formed,

[Explanation of symbols]

 11, 21 ... Substrate 12, 22 ... Base film 12a ... Separation base film 16, 23 ... Black resist film 16a, 23a ... Black mask 24a, 24b, 24c ... Opening 17R, 25R ... Red filter 17G, 25G ... Green filter 17B, 25B ... Blue filter

Claims (2)

[Claims] 1. A method of forming color filters of a plurality of colors and a black mask corresponding to a gap between these color filters on a transparent substrate, for electrodepositing a filter material on the substrate. Of the transparent conductive underlayer film, the underlayer film is formed into a pattern separated by color of the color filter formed thereon, and then a photosensitive black resist is applied onto the substrate and the black resist film is formed. Is exposed and developed to form a black mask corresponding to the gap between the color filters, and then a voltage is applied to a portion of the base film of the separated base films where a color filter of one color is formed. A color filter characterized in that the step of applying the electrode material and electrodepositing the filter material of one color on the base film is repeated to sequentially form color filters of the plurality of colors. How to form filters and black masks. 2. A method of forming color filters of a plurality of colors and a black mask corresponding to a gap between these color filters on a transparent substrate, the method comprising electrodeposition of a filter material on the substrate. After forming a transparent conductive underlayer film of, and applying a positive-type photosensitive black resist on it, the black resist film is exposed.
By repeating the process of developing to form an opening corresponding to the formation region of the color filter of one color and electrodepositing the filter material of the one color on the base film exposed in the opening, A method of forming a color filter and a black mask, wherein color filters of a plurality of colors are sequentially formed, and the black resist film left between the color filters is used as a black mask.