JPH07129987A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate the manufacture by wrapping an optical semiconductor substrate in a holding body, and preventing the dew condensation on an emitting surface of a semiconductor laser, thereby making possible miniaturization and forming a fitting part for fitting the holding body to a pickup device. CONSTITUTION:A semiconductor substrate 10 forming a semiconductor chip 15 and plural photodetectors 17 is wrapped in the holding body 25 made of transparent resin. Then, an optical semiconductor device 20 is constituted so that a cylinder part 26 provided with a fitting surface 26a for fitting the holding body 25 to an optical pickup device is formed integrally on the upper surface of the holding body 25, and a holding surface 27 of a ring band shape mounting a hologram optical element 30 in the inner peripheral side is formed. Thus, the dew condensation on the laser-emitting surface is prevented, and manufacturing work is facilitated, and the device is miniaturized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device used in an optical pickup device for recording and / or reproducing information using an optical recording medium.

[0002]

2. Description of the Related Art Conventionally, various types of optical pickup devices have been proposed. In order to reduce the size and weight of the optical pickup devices, for example, Japanese Patent Laid-Open No. 1-237935 discloses an optical recording medium using a hologram (hereinafter, referred to as an optical recording medium). An optical pickup device for detecting a signal (referred to as an optical disk) is disclosed. The configuration and operation of the optical pickup device disclosed in this publication will be briefly described below with reference to FIG.

As shown in FIG. 7, a lens barrel holding a diffraction grating and a holographic grating adjacent to each other is fixed to a collar portion of a substrate provided with a light source and a light receiving element. The substrate to which the lens barrel is fixed is inserted into the housing portion of the lens barrel holder that holds the collimating lens, and the flange portion of the substrate is fitted to the fitting portion formed at the lower end of the lens barrel holder. Thus, the lens barrel is rotatably supported with respect to the lens barrel holder. On the upper surface of the lens barrel holder,
An objective lens driving unit that holds the objective lens is held, and the objective lens is driven so that the laser beam is focused on the optical disc.

The operation of this optical pickup device will be briefly described. The laser light emitted from the light source passes through the diffraction grating to read the pit signal on the optical disk and the zero-order light for reading the focus shift. Then, it is divided into ± first-order light for reading the tracking shift. After passing through the holographic grating, the divided light is made into parallel light by a collimator lens, and three light spots are projected on an optical disc through an objective lens. Then, the reflected light from the optical disk returns to the same path again, passes through the collimator lens, and then enters the holographic grating while becoming convergent light. The return light that has entered the holographic grating is diffracted and enters the light receiving element formed on the substrate. In this light receiving element, a focus error signal by the wedge prism method, a tracking error signal by the three beam method, and an RF signal of the optical disk are detected.

Further, Japanese Patent Laid-Open No. 4-139628 discloses an optical semiconductor device for an optical pickup device using a hologram. The optical semiconductor device disclosed in this publication will be briefly described below with reference to FIG.

On the silicon substrate, a flat surface to which the semiconductor laser chip is bonded by etching and a V groove for reflecting the laser beam emitted from the semiconductor laser chip upward are formed. Further, a transparent film that transmits laser light is coated on the silicon substrate, and a hologram is formed on the surface of this transparent film by a photolithography technique. And
The light emitted from the semiconductor laser chip is reflected by the V-groove reflection mirror, passes through the hologram, is emitted upward, and is condensed on the optical disc by the objective lens. The reflected light from the optical disk is incident on the hologram again and diffracted, and is condensed on the light receiving element formed on the silicon substrate,
Various signals from the optical disc are detected.

According to such an optical semiconductor device, the V-groove type reflection mirror, the bonding position of the semiconductor laser chip, and the mutual positional relationship between the light receiving element and the hologram can be controlled in units of 1 μm by the photolithography technique. become.

[0008]

However, the above-mentioned prior art has the following problems. JP-A-1-
In the technique disclosed in No. 237935, a light source, a light receiving element, a diffraction grating, and the like are attached to a tubular member. Therefore, when a semiconductor laser is used as the light source, it is necessary to seal the inside of the cylindrical member in order to prevent condensation on the emitting surface of the semiconductor laser. In other words, the diffraction grating must be completely adhered to the tubular member without any gap, which requires a great deal of work.

Further, in the technique disclosed in Japanese Patent Laid-Open No. 4-139628, an optical semiconductor device including a silicon substrate having a semiconductor laser chip and a light receiving element and a transparent film having a hologram has a very small shape (usually silicon). Since the substrate thickness is about 0.4 to 0.6 mm) and there is a concern about deformation and the like, the shape as it is cannot be mounted on the optical pickup body.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide an optical semiconductor device in which the optical pickup device can be downsized and its fabrication is easy.

[0011]

In order to solve the above problems, an optical semiconductor device of the present invention includes a semiconductor substrate having a semiconductor laser and a plurality of photodetectors, and a transparent resin so as to wrap the semiconductor substrate. And a holding body insert-molded by using the holding body, and the holding body is provided with a fitting portion to be used when the holding body is attached to another component.

[0012]

The optical semiconductor substrate on which the semiconductor laser and the plurality of photodetectors are formed is in the state of being wrapped in the transparent resin holder, and no condensation occurs on the emitting surface of the semiconductor laser. In addition, the holder that encloses the optical semiconductor substrate has a fitting portion that is attached to the optical pickup device, and can be easily mounted on the optical pickup device main body.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be specifically described below with reference to the accompanying drawings. (First Embodiment) FIG. 1A is a sectional view of an element in which a light emitting / receiving portion is formed. The structure of the element 1 will be described below. An optically flat V-shaped rising mirror 12 is formed on the surface 10a of the silicon substrate 10 by anisotropic etching, and a portion facing the rising mirror 12 is flattened by etching. 10b is formed. A semiconductor laser chip 15 is mounted on this flat surface 10b. The laser light emitted from the semiconductor laser chip 15 is reflected at right angles by the rising mirror 12, as shown in the figure. Surface 10a
A photodetector 17 is formed on the optical disk 17 to detect light reflected from an optical disk (not shown) after being emitted from the semiconductor laser chip 15.

1B and 1C are a cross-sectional view and a top view of an optical semiconductor device 20 in this embodiment, respectively. The element 1 is mounted on a flat substrate 21, and the holding body 2 made of a transparent resin is wrapped around the substrate 21.
5 is insert-molded. As shown in (b), since the element 1 including the semiconductor laser chip is wrapped with the transparent resin holder, dew condensation does not occur on its emission surface.

The holding body 25 has a fitting surface 26a on its upper surface.
The cylindrical portion 26 having the above is integrally formed, and a ring-shaped holding surface 27 having a predetermined height is formed on the inner peripheral side of the cylindrical portion 26. A hologram optical element 30 having a first hologram 30a and a second hologram 30b formed on the upper surface and the lower surface of a substantially cubic shape is mounted on the ring-shaped holding surface 27. The relationship between the members is such that the laser light emitted from the semiconductor laser chip 15 provided on the silicon substrate 10 passes through the second hologram 30b and the first hologram 30a as shown in FIG. 1 (b). It is precisely aligned. The first hologram 3
Reference numeral 0a has a function of diffracting reflected light from an optical disc (not shown) toward the photodetector 17, whereby the photodetector 17 can obtain an information signal, a focus error signal, and the like. The second hologram 30b has a function of dividing the laser light emitted from the semiconductor laser chip 15 into 0th order light and ± 1st order light to generate a sub beam for detecting a track error signal and the like.

Optical semiconductor device 20 formed in this way
Using the fitting surface 26a which is the outer peripheral surface of the cylindrical portion 26,
It is easily mounted on the main body of the optical pickup device. Figure 2
The general outline of an optical pickup device 32 in which the optical semiconductor device 20 is mounted is shown. In the optical pickup device 32, a cylindrical mounting portion 33a is formed, a main body 33 into which the cylindrical portion 26 of the optical semiconductor device 20 is fitted, an actuator 35 provided in the main body 33, a focusing direction and a tracking direction by the actuator 35. The objective lens 37 movably supported on the main body 33 is provided on the fitting surface 26a of the cylindrical portion 26 shown in FIG.
Is fitted to the mounting portion 33a.

As in this embodiment, since the coupling portion between the optical semiconductor device 20 and the optical pickup device 32 is formed by the cylindrical fitting surface, the three-beam method is used for detecting the tracking error signal. In such a case, there is an advantage that the rotation of the entire optical semiconductor device 20 can be easily adjusted.

(Second Embodiment) FIGS. 3A and 3B are a sectional view and a top view of an optical semiconductor device 40 according to this embodiment. In the following embodiments, the same components as those in the above embodiment are designated by the same reference numerals.

Similar to the above embodiment, the element 1 having the light emitting / receiving portion is mounted on a flat substrate 21.
The transparent resin holder 41 is insert-molded so as to wrap around. A columnar portion 43 is integrally formed on the upper surface of the holder 41, and a hologram pattern 45 is formed at the center of the upper surface of the columnar portion 43. This hologram pattern 45 is simultaneously produced by injection molding during insert molding. The hologram pattern 45 has a function of diffracting the reflected light from the optical disk (not shown) toward the photodetector of the element 1, and thereby the information signal, the focus error signal,
A track error signal is obtained.

The optical semiconductor device 40 thus formed
Using the fitting surface 43a, which is the outer peripheral surface of the columnar portion 43,
As shown in FIG. 2, the optical pickup device is easily mounted on the cylindrical mounting portion 33a.

According to the structure of this embodiment, in addition to the effect obtained in the above embodiment, the holder 41 made of transparent resin is further provided.
Since the hologram pattern 45 is directly formed on the substrate, the number of parts can be reduced and the hologram element assembling process becomes unnecessary.

(Third Embodiment) FIGS. 4A and 4B are a sectional view and a top view of an optical semiconductor device 50 according to this embodiment. Similar to the second embodiment, the element 1 having a light emitting / receiving part
Is mounted on a flat substrate 21, and the transparent resin holder 51 is insert-molded so as to surround the substrate 21. A prism 52 is integrally formed on the upper surface of the holder 51, and a hologram pattern 53 is formed in the center of the upper surface of the prism 52. This hologram pattern 53 is simultaneously produced by injection molding during insert molding. The relationship between the respective members and the function of the hologram pattern 53 are the same as those in the second
Same as the embodiment.

The optical semiconductor device 50 thus formed
Using the fitting surface 52a which is the outer peripheral surface of the prismatic portion 52,
As shown in FIG. 2, the optical pickup device main body is easily mounted on the mounting portion 33a. In this case, the mounting portion 33 a of the optical pickup device main body has the fitting surface 52 of the prismatic portion 52.
It is formed so that a is fitted.

According to the structure of this embodiment, since the coupling portion between the optical semiconductor device 50 and the optical pickup device 32 is formed by the prism-shaped fitting surface, the optical semiconductor device 50.
It is possible to move the whole in parallel in one direction and adjust the optical axis.

(Fourth Embodiment) FIGS. 5A and 5B are a sectional view and a top view of an optical semiconductor device 60 in this embodiment. This embodiment has substantially the same configuration as that of the second embodiment described above, in which the element 1 having the light receiving and emitting portion is mounted on a flat substrate 21, and the substrate 21 is wrapped so that it is made of a transparent resin. The holder 61 is insert-molded.
On the upper surface of the cylindrical portion 62 formed on the holding body 61, a hologram pattern 68 formed on a layer 67 made of an ultraviolet curable resin is arranged. The optical semiconductor device 60 formed in this manner has the fitting surface 6 that is the outer peripheral surface of the cylindrical portion 62.
2A and 2B, the optical pickup device main body can be easily mounted on the cylindrical mounting portion 33a as shown in FIG. 2, and the same effect as that of the second embodiment can be obtained.

A method of manufacturing the hologram pattern 68 will be described with reference to FIG. In this case, the hologram pattern 68 is produced by the so-called two-pie method. A mold 70 of a hologram pattern 68, which transmits ultraviolet rays and has a predetermined function, is placed on the upper surface of the cylindrical portion 62 toward the surface of the cylindrical portion. An ultraviolet curable resin 67 is filled between the mold 70 and the upper surface of the columnar portion 62, and in this state, ultraviolet rays are irradiated to irradiate the ultraviolet curable resin 6
Harden 7. Thereafter, when the mold 70 is removed, a hologram pattern 68 made of an ultraviolet curable resin 67 is formed on the transparent resin holder 61. At this time, the light emitted from the semiconductor laser chip provided in the element 1 and transmitted through the pattern of the mold 70 is monitored by an optical system including a half mirror 71, a condenser lens 72 and a CCD 73 as shown in the figure. When the position of the mold 70 is adjusted so that the center of the hologram pattern 68 and the optical axis of the light emitted from the semiconductor laser chip coincide with each other, very precise alignment becomes possible. The production of such a hologram pattern can be applied to the above-mentioned embodiment.

As described above, since the semiconductor substrate 10 on which the semiconductor laser chip 15 as shown in FIG. 1A is mounted is wrapped with the transparent resin by the insert molding, the semiconductor laser chip 15 does not come into contact with the outside air. No more worrying about condensation. Further, since the transparent resin holder manufactured by insert molding has the fitting portion for the pickup device shown in FIG. 2, the holder can be easily attached to the optical pickup device.

[0028]

As described above, according to the optical semiconductor device of the present invention, the optical pickup device can be downsized,
In addition, it becomes possible to facilitate its production.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of an optical semiconductor device according to the present invention, and FIG. 1 (a) is a cross-sectional view showing a configuration of an element provided with a light emitting / receiving section in the optical semiconductor device, (B)
3A is a cross-sectional view of an optical semiconductor device in which the element shown in FIG. 3A is actually incorporated, and FIG.

FIG. 2 is a diagram showing an overall outline of an optical pickup device in which an optical semiconductor device is mounted.

3A and 3B are views showing a second embodiment of an optical semiconductor device according to the present invention, FIG. 3A is a sectional view of an optical semiconductor device incorporating the element shown in FIG. 1A, and FIG. [FIG. 3] is a top view of an optical semiconductor device.

4A and 4B are views showing a third embodiment of the optical semiconductor device according to the present invention, FIG. 4A is a sectional view of an optical semiconductor device incorporating the element shown in FIG. 1A, and FIG. [FIG. 3] is a top view of an optical semiconductor device.

5A and 5B are views showing a fourth embodiment of an optical semiconductor device according to the present invention, FIG. 5A is a sectional view of an optical semiconductor device incorporating the element shown in FIG. 1A, and FIG. [FIG. 3] is a top view of an optical semiconductor device.

6A and 6B are diagrams showing a method for producing a hologram pattern in the embodiment shown in FIG.

FIG. 7 is a diagram showing a conventional example of an optical pickup device that performs signal detection using a hologram.

FIG. 8 is a diagram showing a conventional example of an optical semiconductor device for an optical pickup device using a hologram.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Element, 10 ... Silicon substrate, 12 ... Stand-up mirror, 15 ... Semiconductor laser chip, 17 ... Photodetector, 2
0, 40, 50, 60 ... Optical semiconductor device, 21 ... Substrate, 2
5, 41, 51, 61 ... Transparent resin holder, 30 ... Hologram optical element, 32 ... Optical pickup device, 45,
53, 68 ... Hologram pattern.

Claims (7)

[Claims] 1. A semiconductor substrate having a semiconductor laser and a plurality of photodetectors, and a holder insert-molded from a transparent resin so as to wrap the semiconductor substrate,
A semiconductor device characterized in that the holding body is provided with a fitting portion to be used when the holding body is attached to another component. 2. The optical semiconductor device according to claim 1, wherein the fitting portion has a cylindrical shape. 3. The optical semiconductor device according to claim 1, wherein the fitting portion has a prismatic shape. 4. The optical semiconductor device according to claim 1, wherein the holder is provided with a hologram element. 5. The optical semiconductor device according to claim 4, wherein the hologram element is manufactured on a holder by injection molding during the insert molding. 6. A semiconductor substrate provided with a semiconductor laser and a plurality of photodetectors, and a fitting portion used for mounting the semiconductor substrate by insert molding using a transparent resin and attaching to another component. An optical semiconductor device comprising: a holder formed by the above method, wherein the holder is provided with a hologram produced by a two-pie method. 7. The optical semiconductor device according to claim 6, wherein the hologram element is aligned by observing the emitted light of the semiconductor laser and the hologram pattern or marking indicating the position.