JPH07126432A - Antimicrobial and antifungal resin composition and masterbatch - Google Patents

Antimicrobial and antifungal resin composition and masterbatch

Info

Publication number
JPH07126432A
JPH07126432A JP5276471A JP27647193A JPH07126432A JP H07126432 A JPH07126432 A JP H07126432A JP 5276471 A JP5276471 A JP 5276471A JP 27647193 A JP27647193 A JP 27647193A JP H07126432 A JPH07126432 A JP H07126432A
Authority
JP
Japan
Prior art keywords
resin
antibacterial
antifungal
resin composition
complex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5276471A
Other languages
Japanese (ja)
Inventor
Yukiyoshi Kinoshita
幸慶 城ノ下
Munehiro Oda
宗宏 小田
Yasunori Suzuki
靖徳 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink Mfg Co Ltd
Meiji Dairies Corp
Original Assignee
Meiji Milk Products Co Ltd
Toyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiji Milk Products Co Ltd, Toyo Ink Mfg Co Ltd filed Critical Meiji Milk Products Co Ltd
Priority to JP5276471A priority Critical patent/JPH07126432A/en
Priority to EP94929019A priority patent/EP0727427A4/en
Priority to US08/635,958 priority patent/US5792793A/en
Priority to PCT/JP1994/001684 priority patent/WO1995012602A1/en
Publication of JPH07126432A publication Critical patent/JPH07126432A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an antimicrobial and antifungal resin composition, having low toxicity, reduced in skin and mucosal irritancies, excellent in persistence of activities and safety and useful as fiber, films, etc., by dispersing a complex in which a thiol group-containing compound is coordinated with silver ions in a resin. CONSTITUTION:This antimicrobial and antifungal resin composition is obtained by dispersing a complex in which a thiol group-containing compound such as thiosalicylic acid is coordinated with silver ions in a resin such as PE. Furthermore, this masterbatch is prepared by dispersing preferably 10-80wt.% complex in the resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、抗菌抗かび性を有する
樹脂組成物に関する。更に詳しくは、抗菌抗かび性を有
するチオール基含有化合物が銀イオンに配位してなる錯
体を分散させてなる樹脂組成物に関する。
TECHNICAL FIELD The present invention relates to a resin composition having antibacterial and antifungal properties. More specifically, it relates to a resin composition in which a complex in which a thiol group-containing compound having antibacterial and antifungal properties is coordinated with silver ions is dispersed.

【0002】[0002]

【従来の技術】近年、生活者の衛生指向の高まりと共
に、種々の樹脂に抗菌抗かび剤を添加し抗菌抗かび性を
付与し、得られた樹脂を抗菌抗かび性の繊維、フィル
ム、容器等として生活環境で用いられる種々の製品に応
用する試みがなされている。従来、これらの樹脂に添加
される抗菌抗かび剤としては、ベンズイミダゾール系、
チアベンダゾール系、チアゾリン系、トリアジン系、フ
ェノールエーテル系、アルキルアミン系、有機スズ系等
の化合物が多く用いられてきた。
2. Description of the Related Art In recent years, with the increasing hygiene of consumers, antibacterial and antifungal agents are added to various resins to impart antibacterial and antifungal properties, and the obtained resins are antibacterial and antifungal fibers, films and containers. Attempts have been made to apply it to various products used in the living environment. Conventionally, as antibacterial and antifungal agents added to these resins, benzimidazole-based,
Many compounds such as thiabendazole-based, thiazoline-based, triazine-based, phenol ether-based, alkylamine-based, and organic tin-based compounds have been used.

【0003】しかしながら、上記抗菌抗かび剤は菌の種
類によっては抗菌作用を示さず、十分な効果を得られな
いものが多い。また、抗菌抗かび作用の長期持続性や、
急性経口毒性、皮膚刺激性、粘膜刺激性等の安全性にお
いても問題が多くあった。このため、これらの抗菌抗か
び剤を添加して抗菌抗かび作用を付与した樹脂において
も、上記と同様の問題が多く見られた。
However, the above-mentioned antibacterial and antifungal agents do not show an antibacterial effect depending on the type of bacteria, and many cannot obtain a sufficient effect. Also, the long-lasting antibacterial and antifungal action,
There were many problems in terms of safety such as acute oral toxicity, skin irritation and mucous membrane irritation. Therefore, many problems similar to the above were found in the resins to which these antibacterial and antifungal agents were added to impart the antibacterial and antifungal effect.

【0004】[0004]

【発明が解決しようとする課題】本発明者は、上記問題
点を解決すべく鋭意検討を行なった結果、チオール基含
有化合物が銀イオンに配位してなる錯体を樹脂中に分散
してなる樹脂組成物は、広範な抗菌抗かび性を示し、ま
たこれらの作用の持続性があり、さらに毒性や皮膚刺激
性、粘膜刺激性が著しく低減され安全性が高いことを見
出し、本発明に至った。
DISCLOSURE OF THE INVENTION The inventors of the present invention have conducted extensive studies to solve the above-mentioned problems, and as a result, a complex in which a thiol group-containing compound is coordinated with silver ions is dispersed in a resin. The resin composition exhibits a wide range of antibacterial and antifungal properties, has a long-lasting effect of these, and is further highly safe with toxicity, skin irritation, and mucous membrane irritation being significantly reduced, leading to the present invention. It was

【0005】[0005]

【課題を解決するための手段】本発明は、チオール基含
有化合物が銀イオンに配位してなる錯体を樹脂中に分散
してなる抗菌抗かび性樹脂組成物を提供する。
The present invention provides an antibacterial and antifungal resin composition in which a complex in which a thiol group-containing compound is coordinated with silver ions is dispersed in a resin.

【0006】樹脂中に分散される錯体の配位子となるチ
オール基含有化合物としては、チオール基を含有するも
のであればよく、該分子中にカルボキシル基、水酸基、
アミノ基等の官能基を有していても問題はない。例え
ば、チオサリチル酸及びその塩、p−トルエンチオー
ル、2−ナフタレンチオール、チオリンゴ酸、チオグリ
コール酸、α−チオ乳酸、β−チオ乳酸、システイン、
チオグリセロール、5−メルカプト−(1H)テトラゾ
リル酢酸ナトリウム塩、2−メルカプトエタノール、
2,3−ジメルカプトコハク酸、チオフェノール、2−
メルカプトベンズイミダゾール、2−メルカプトベンゾ
チアゾール、チオ尿素、メルカプトニコチン酸、2−チ
オウラシル、2−メルカプトヒポキサンチン等が挙げら
れる。
The thiol group-containing compound serving as the ligand of the complex dispersed in the resin may be any compound containing a thiol group, such as carboxyl group, hydroxyl group,
There is no problem even if it has a functional group such as an amino group. For example, thiosalicylic acid and salts thereof, p-toluenethiol, 2-naphthalenethiol, thiomalic acid, thioglycolic acid, α-thiolactic acid, β-thiolactic acid, cysteine,
Thioglycerol, 5-mercapto- (1H) tetrazolyl acetic acid sodium salt, 2-mercaptoethanol,
2,3-dimercaptosuccinic acid, thiophenol, 2-
Examples thereof include mercaptobenzimidazole, 2-mercaptobenzothiazole, thiourea, mercaptonicotinic acid, 2-thiouracil and 2-mercaptohypoxanthine.

【0007】また、銀イオンの供給源としては、硝酸銀
等の水溶性銀塩が好ましい。
As a source of silver ions, water-soluble silver salts such as silver nitrate are preferable.

【0008】これら例示の化合物より形成される錯体
は、銀/配位子=1mol/0.5〜2molであることが好まし
い。
The complex formed from these exemplified compounds is preferably silver / ligand = 1 mol / 0.5 to 2 mol.

【0009】樹脂は、天然樹脂及び半合成樹脂、合成樹
脂のいずれをも含み、熱可塑性、硬化性のいずれであっ
てもよい。熱可塑性樹脂としては、ポリエチレン、ポリ
プロピレン、塩化ビニル、アクリロニトリル−ブタジエ
ン−スチレン共重合樹脂、エチレン−酢酸ビニル共重合
樹脂、ナイロン、ポリエステル、ポリ塩化ビニリデン、
ポリアミド樹脂、ポリスチレン、ポリアセタール、ポリ
ビニルアルコール、ポリカーボネート、アクリル樹脂、
フッ素樹脂、ポリウレタン樹脂、レーヨン、キュプラ等
が挙げられる。
The resin includes a natural resin, a semi-synthetic resin, and a synthetic resin, and may be thermoplastic or curable. As the thermoplastic resin, polyethylene, polypropylene, vinyl chloride, acrylonitrile-butadiene-styrene copolymer resin, ethylene-vinyl acetate copolymer resin, nylon, polyester, polyvinylidene chloride,
Polyamide resin, polystyrene, polyacetal, polyvinyl alcohol, polycarbonate, acrylic resin,
Fluorine resin, polyurethane resin, rayon, cupra and the like can be mentioned.

【0010】硬化性樹脂としては、フェノール樹脂、ユ
リア樹脂、メラミン樹脂、不飽和ポリエステル樹脂、エ
ポキシ樹脂、ポリビニルアルコール、アクリルポリオー
ル、ポリイソシアネート、官能基含有ポリエステル等が
挙げられる。硬化性樹脂の硬化機構は熱によるものであ
ってもエネルギー線によるものであってもよい。
Examples of the curable resin include phenol resin, urea resin, melamine resin, unsaturated polyester resin, epoxy resin, polyvinyl alcohol, acrylic polyol, polyisocyanate and functional group-containing polyester. The curing mechanism of the curable resin may be heat or energy rays.

【0011】上記樹脂にチオール基含有化合物−銀イオ
ン錯体を分散した抗菌抗かび性樹脂組成物の調製方法
は、樹脂に直接所定量の該錯体を分散する方法を用いて
もよいが、分散性をより高めるためには、マスターバッ
チ方式を用いることが好ましい。すなわち、樹脂に対し
て該錯体を必要であれば通常用いられる分散剤と共に予
め高濃度に分散しておき(マスターバッチ)、さらにこ
のマスターバッチを同一の樹脂またはその樹脂と相溶性
の高い樹脂で希釈することにより所定の濃度に調整す
る。マスターバッチにおける該錯体の含有量は、 5重量
%以上、さらには10〜80重量%が好ましい。
As a method for preparing the antibacterial and antifungal resin composition in which the thiol group-containing compound-silver ion complex is dispersed in the above resin, a method of directly dispersing a predetermined amount of the complex in the resin may be used. It is preferable to use the masterbatch method in order to further increase the temperature. That is, if necessary, the complex is previously dispersed in a high concentration with a dispersant that is usually used for a resin (master batch), and the master batch is made of the same resin or a resin having high compatibility with the resin. Adjust to the specified concentration by diluting. The content of the complex in the masterbatch is preferably 5% by weight or more, more preferably 10 to 80% by weight.

【0012】また、樹脂が液状なしは溶液状の場合に
も、マスターバッチ方式に準じた方法(この場合には該
錯体高濃度含有ペースト)を用いることが好ましい。本
発明の抗菌抗かび性樹脂組成物において、樹脂中に分散
されるチオール基含有化合物−銀イオン錯体の添加量に
対する制限は特になく、使用される用途に応じて任意に
選択することができる。
Further, even when the resin is in a liquid state or in a liquid state, it is preferable to use a method according to the masterbatch system (in this case, the complex high-concentration paste). In the antibacterial and antifungal resin composition of the present invention, there is no particular limitation on the addition amount of the thiol group-containing compound-silver ion complex dispersed in the resin, and it can be arbitrarily selected according to the intended use.

【0013】本発明の抗菌抗かび性樹脂組成物は、上記
チオール基含有化合物−銀イオン錯体の少なくとも一種
類及び樹脂の少なくとも一種類を、二本ロールや三本ロ
ール、ニーダー、エクストルーダー、コロイドミル、ホ
モミキサー、ボールミル等の剪断力を加えることが可能
な種々の機械を用いて、熱可塑性樹脂の場合には、その
樹脂の融点または軟化点等を考慮して適宜加熱しなが
ら、また、熱またはエネルギー線硬化性樹脂の場合に
は、加熱しない条件下で剪断力のみを加えて分散するこ
とにより得ることができる。
In the antibacterial and antifungal resin composition of the present invention, at least one kind of the above-mentioned thiol group-containing compound-silver ion complex and at least one kind of resin are used in a two-roll, three-roll, kneader, extruder or colloid. Mill, homomixer, using various machines capable of applying shearing force such as a ball mill, in the case of a thermoplastic resin, while appropriately heating considering the melting point or softening point of the resin, In the case of a heat or energy ray-curable resin, it can be obtained by applying only a shearing force and dispersing under the condition of not heating.

【0014】[0014]

【実施例】以下、実施例に基づき本発明を更に詳細に説
明する。なお、実施例中、部および%は、重量部および
重量%をそれぞれ表す。 〔実施例1、2及び比較例1〕(熱可塑性樹脂の例) ポリエチレンワックス(三洋化成社製「サンワックス 1
31-P」、軟化点 108℃)60部に対し、あらかじめ加熱乾
燥した表1に示す抗菌抗かび剤40部を、 110〜120 ℃に
加熱した三本ロール上で溶融分散し、マスターバッチを
作成した。さらに、得られたマスターバッチ 2.5部と低
密度ポリエチレン(旭化成社製「サンテックF-1920」、
軟化点 220℃)97.5部とを、 210〜230 ℃に加熱した二
本ロール上で混練希釈した。これを 210〜230 ℃で 0.5
分、150Kg/m2で加圧し、厚さ1mmの試験試料を作成し
た。
The present invention will be described in more detail based on the following examples. In the examples, parts and% represent parts by weight and% by weight, respectively. [Examples 1 and 2 and Comparative Example 1] (Example of thermoplastic resin) Polyethylene wax ("Sun Wax 1" manufactured by Sanyo Kasei Co., Ltd.)
31-P ", softening point 108 ° C) 60 parts, 40 parts of the antibacterial / antifungal agent shown in Table 1 which has been preliminarily heated and dried is melt-dispersed on a three roll heated to 110 to 120 ° C to prepare a masterbatch. Created. Furthermore, 2.5 parts of the obtained masterbatch and low density polyethylene (“Suntech F-1920” manufactured by Asahi Kasei)
97.5 parts of the softening point of 220 ° C) were kneaded and diluted on a two-roll roll heated to 210 to 230 ° C. 0.5 at 210-230 ℃
The pressure was applied at 150 kg / m 2 for 1 minute to prepare a test sample having a thickness of 1 mm.

【0015】〔実施例3、4及び比較例2〕(熱可塑性
樹脂の例) ポリプロピレン(宇部興産社製「J-109G」、軟化点 260
℃)99部に対し、あらかじめ加熱乾燥した表1に示す抗
菌抗かび剤1部を、加圧ニーダー中で 250℃付近にて溶
融分散した。これを 260〜280 ℃で 0.5分、150Kg/m2
加圧し、厚さ1mmの試験試料を作成した。
[Examples 3 and 4 and Comparative Example 2] (Example of thermoplastic resin) Polypropylene ("J-109G" manufactured by Ube Industries, Ltd., softening point 260)
1 part of the antibacterial and antifungal agent shown in Table 1 which had been heated and dried in advance, was melt-dispersed in the pressure kneader at around 250 ° C. This was pressed at 260 to 280 ° C. for 0.5 minutes at 150 Kg / m 2 to prepare a test sample having a thickness of 1 mm.

【0016】〔実施例5、6及び比較例3〕(熱硬化性
樹脂の例) エポキシ樹脂(チバ・ガイギー社製「アラルダイトGY-2
60」)50部に対し、あらかじめ加熱乾燥した表1に示す
抗菌抗かび剤50部を、三本ロールにて混練分散し、抗菌
抗かび剤高濃度含有ペーストを作成した。さらに、この
高濃度ペースト2部と上記エポキシ樹脂88.1部とを三本
ロールにて混練希釈し、硬化剤(チバ・ガイギー社製
「HY-951」)9.9部を混合した。これを型枠に流し込み硬
化させ、厚さ1mmの試験試料を作成した。
[Examples 5 and 6 and Comparative Example 3] (Example of thermosetting resin) Epoxy resin ("Araldite GY-2 manufactured by Ciba Geigy")
60 "), 50 parts of the antibacterial and antifungal agent shown in Table 1 which had been heated and dried in advance was kneaded and dispersed by a three-roll to prepare a paste containing a high concentration of the antibacterial and antifungal agent. Further, 2 parts of this high-concentration paste and 88.1 parts of the epoxy resin were kneaded and diluted with a three-roll mill, and 9.9 parts of a curing agent (“HY-951” manufactured by Ciba-Geigy) was mixed. This was poured into a mold and cured to prepare a test sample having a thickness of 1 mm.

【0017】〔実施例7、8及び比較例4〕(熱硬化性
樹脂の例) アクリルポリオール(大日本インキ化学工業社製「アク
リディック A-850」、固形分70%)100部に対し、あらか
じめ加熱乾燥した表1に示す抗菌抗かび剤 1部をマーラ
ーにて練り込み、ポリイソシアネート(大日本インキ化
学工業社製「バーノックDN-950」、固形分75%)40部を
混合した。これを型枠に流し込み硬化させ、厚さ1mmの
試験試料を作成した。
Examples 7 and 8 and Comparative Example 4 (Example of Thermosetting Resin) Acrylic polyol (“Acridic A-850” manufactured by Dainippon Ink and Chemicals, Inc., solid content 70%) was added to 100 parts by weight. 1 part of the antibacterial and antifungal agent shown in Table 1 which had been heated and dried in advance was kneaded with a muller, and 40 parts of polyisocyanate (“Bernock DN-950” manufactured by Dainippon Ink and Chemicals, Inc., solid content 75%) was mixed. This was poured into a mold and cured to prepare a test sample having a thickness of 1 mm.

【0018】(抗菌性試験)実施例1〜8および比較例
1〜4で得られた 5×5cm2の試験試料表面に、表1に示
す菌の菌液を噴霧し、24時間培養した。培養後、菌の増
殖程度を、抗菌抗かび剤を含まない対照の試験試料と比
較し、抗菌活性を評価した。抗菌活性は、菌の増殖が対
照の増殖レベルと同程度の場合を−、対照の増殖レベル
の50%程度までの場合を+、ほぼ完全に抑制された場合
を++とした。結果を表1に示す。
(Antibacterial Test) The surface of the test sample of 5 × 5 cm 2 obtained in Examples 1 to 8 and Comparative Examples 1 to 4 was sprayed with the bacterial solution of the bacteria shown in Table 1 and cultured for 24 hours. After culturing, the antibacterial activity was evaluated by comparing the growth degree of the bacteria with a control test sample containing no antibacterial and antifungal agent. The antibacterial activity was defined as-when the growth of the bacteria was similar to the control growth level, + when up to about 50% of the control growth level, and ++ when the growth was almost completely suppressed. The results are shown in Table 1.

【0019】[0019]

【表1】 [Table 1]

【0020】*1 三愛石油社製 チアベンダゾール *2 大和化学工業社製* 1 Thiabendazole manufactured by San-ai Oil Co., Ltd. * 2 manufactured by Daiwa Chemical Industry Co., Ltd.

【0021】[0021]

【発明の効果】本発明により、広範な抗菌抗かび性を示
し、また毒性や皮膚刺激性、粘膜刺激性が著しく低減さ
れ安全性の高い抗菌抗かび性樹脂組成物が得られた。
Industrial Applicability According to the present invention, an antibacterial and antifungal resin composition exhibiting a wide range of antibacterial and antifungal properties and having significantly reduced toxicity, skin irritation and mucous membrane irritation and having high safety can be obtained.

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08L 101/00 (72)発明者 鈴木 靖徳 神奈川県小田原市成田540番地明治乳業株 式会社細胞工学センター内Continuation of front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical display location C08L 101/00 (72) Inventor Yasunori Suzuki 540 Narita, Odawara-shi, Kanagawa Meiji Dairy Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】チオール基含有化合物が銀イオンに配位し
てなる錯体を、樹脂中に分散してなることを特徴とする
抗菌抗かび性樹脂組成物。
1. An antibacterial and antifungal resin composition, characterized in that a complex in which a thiol group-containing compound is coordinated with silver ions is dispersed in a resin.
【請求項2】樹脂が熱可塑性樹脂であることを特徴とす
る請求項1記載の抗菌抗かび性樹脂組成物。
2. The antibacterial and antifungal resin composition according to claim 1, wherein the resin is a thermoplastic resin.
【請求項3】樹脂が熱またはエネルギー線硬化性樹脂で
あることを特徴とする請求項1記載の抗菌抗かび性樹脂
組成物。
3. The antibacterial and antifungal resin composition according to claim 1, wherein the resin is a heat or energy ray curable resin.
【請求項4】請求項1記載の錯体を樹脂に高濃度に分散
してなるマスターバッチ。
4. A masterbatch obtained by dispersing the complex according to claim 1 in a resin at a high concentration.
JP5276471A 1993-11-05 1993-11-05 Antimicrobial and antifungal resin composition and masterbatch Pending JPH07126432A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP5276471A JPH07126432A (en) 1993-11-05 1993-11-05 Antimicrobial and antifungal resin composition and masterbatch
EP94929019A EP0727427A4 (en) 1993-11-05 1994-10-07 Antibacterial, antifungal and antiviral agent
US08/635,958 US5792793A (en) 1993-11-05 1994-10-07 Antibacterial, antifungal and antiviral agent
PCT/JP1994/001684 WO1995012602A1 (en) 1993-11-05 1994-10-07 Antibacterial, antifungal and antiviral agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5276471A JPH07126432A (en) 1993-11-05 1993-11-05 Antimicrobial and antifungal resin composition and masterbatch

Publications (1)

Publication Number Publication Date
JPH07126432A true JPH07126432A (en) 1995-05-16

Family

ID=17569916

Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5888526A (en) * 1996-04-05 1999-03-30 Mitsubishi Paper Mills Limited Antibacterial antifungal agent and fibrous material containing the same
KR100371799B1 (en) * 1999-08-18 2003-02-11 주식회사 선양 Polystyrene Film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5888526A (en) * 1996-04-05 1999-03-30 Mitsubishi Paper Mills Limited Antibacterial antifungal agent and fibrous material containing the same
KR100371799B1 (en) * 1999-08-18 2003-02-11 주식회사 선양 Polystyrene Film

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