JPH07124866A - Heat resist resin bound grinding wheel - Google Patents

Abstract

PURPOSE:To provide the heat resistant resin bound grinding wheel which is excellent in molding properties, is sufficiently heat resistant, and is also excellent in a grinding ratio and motive power by using compound powder mixture containing vinyl benzyl ester groups combined with aromatic residue in molecules. CONSTITUTION:Compound ingredients are heated and compressed so as to be molded into a heat resistant resin bound grinding wheel, in this case, 100 parts of the aforesaid compound ingredients by volume include 2 to 60 parts of abrasive grains by volume and 10 to 90 parts of compound powder by volume, which is represented by a formula [where, X represents aromatic residues (residues formed by removing hydroxy groups from polyhydric phenol), and (y) represents integers of equal to or more than 2], and contains more than two of vinyl benzyl eter groups combined with aromatic residues in a molecule. By this constitution, the grinding wheel can thereby be formed, which has an abrasive grain layer easily formed, is excellent in grinding performance, and is also excellent in heat resistance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat resistant resin bonded grinding in which abrasive grains are bonded with a specific heat resistant resin, a grinding wheel wear amount is small, and a grinding surface having excellent smoothness can be obtained with low power consumption. Regarding the whetstone.

[0002]

2. Description of the Related Art Conventionally, a combination of cubic boron nitride (hereinafter abbreviated as CBN), cemented carbide abrasive grains such as diamond, and a specific heat-resistant phenol resin, bismaleimide resin, or aromatic polyimide resin. using,
It is known to manufacture grindstones using as binder a thermosetting resin having an abrasive grain layer to which CBN or diamond abrasive grains are bound.

As the resin generally used here, phenol novolac powder containing hexamethylenetetramine as a curing agent is used as the heat-resistant phenol resin, and amine-modified N, N 'is used as the bismaleimide resin.
Examples of aromatic polyimide resins containing -diaminodiphenylmethane bismaleimide include polyimide resins obtained from pyromellitic dianhydride and 4,4'-diaminodiphenyl ether.

These known heat-resistant phenolic resins, bismaleimide resins, or grindstones having an abrasive grain layer in which abrasive grains are bound with an aromatic polyimide resin are used in the resin which is the binder to generate heat during grinding. It withstands mechanical stress and relatively well and is suitable for fields requiring such grinding.

However, heat-resistant phenolic resin and bismaleimide resin-bonded grindstones are not sufficiently satisfactory in terms of grinding ratio and grinding power, and their heat resistance is insufficient, so that they do not become too hot. Limited to use.

Further, although the aromatic polyimide resin is very excellent in heat resistance, it has a drawback that the molding temperature is high, the molding time is long, and the productivity is poor because the second-order transition temperature is extremely high. .

When a precursor polyamine acid is used to further improve moldability, there has been a problem that the dehydration step for ring closure of the polyimide requires a long time.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to develop a conventional heat-resistant resin-bonded grindstone which has excellent formability, sufficient heat resistance, and excellent grinding ratio and grinding power. It is a thing.

[0009]

The present invention uses a compound powder having two or more vinylbenzyl ether groups bonded to an aromatic residue in a molecule or a compound containing an aromatic residue in a molecule as a binder for abrasive grains. By using a mixture of a compound powder having two or more bound vinylbenzyl ether groups and a compound powder having two or more maleimide groups in the molecule,
An object of the present invention is to provide a grindstone in which an abrasive grain layer can be easily formed, has excellent grinding (polishing) performance, and is also excellent in heat resistance.

Thus, the present invention relates to 100 parts by volume of the formulation,
Abrasive grain 2 to 60 parts by volume, and general formula (I)

[Chemical 3] [In the formula, X represents an aromatic residue (a residue obtained by removing a hydroxy group from a polyhydric phenol compound), and y represents a number of 2 or more. ]
Compound powders 10 to 90 having two or more vinylbenzyl ether groups represented by
The present invention relates to a heat-resistant resin-bonded grindstone obtained by heat-compressing a compound containing a volume part, and further, in 100 parts by volume of the compound,
2 to 60 parts by volume of abrasive grains, and 5 to 90 parts by volume of compound powder having two or more vinylbenzyl ether groups bonded to an aromatic residue in the molecule represented by the general formula (I) and the general formula (I
I)

[Chemical 4] (Wherein R represents hydrogen or a methyl group, and Z represents a divalent aromatic residue or a xylylene residue.) A compound containing 5 to 90 parts by volume of a compound powder having a maleimide group in the molecule. The above-mentioned object was achieved by developing a heat-resistant resin-bonded grindstone that was heat compression molded from a material.

The present invention will be described in detail below. The compound having two or more vinylbenzyl ether groups bonded to an aromatic residue in the molecule, which is a component of the heat resistant resin of the present invention, can be represented by the general formula (I).

In the general formula (I), X represents an aromatic residue (a residue obtained by removing a hydroxy group from a polyhydric phenol compound), and a typical aromatic residue thereof is a hydroquinone residue. , Resorcinol residue, catechol residue,
A diphenyl residue, a bisphenol F residue, a bisphenol A residue, a bisphenol S residue, a condensate residue of dichlorodiphenyl sulfone represented by the general formula (III) and bisphenol A,

[Chemical 5] Examples thereof include a tetramethylbisphenol A residue, a bisphenol thioether residue, a bisphenol ether residue and a benzophenol residue.

Further, in the case where X is a compound residue usually called novolac phenol, which is a condensation product of phenol, alkylphenol or bisphenol A with formaldehyde, for example, phenol novolac or cresol novolac has the following general formula: (IV)

[Chemical 6] Compounds such as are naturally included in the compounds of general formula (I).

The compound represented by the general formula (I) is a vinylbenzyl halide and the above compound in the presence of an alkali metal hydroxide described in, for example, JP-A-3-93818 or Japanese Patent Application No. 4-271905. It is easily synthesized by reacting with a polyhydric phenol.

Represented by the general formula (II) used in the present invention,
The compound having a maleimide group in the molecule means N, N'-
Phenylene bismaleimide, N, N'-xylene bismaleimide, N, N'-tolylene bismaleimide, N,
N'-diphenyl methane bismaleimide, N, N'-diphenyl ether bismaleimide, N, N'-diphenyl sulfone bismaleimide, N, N'-diphenyl methane bismethyl maleimide, N, N'-diphenyl ether bismethyl maleimide can be mentioned. . Furthermore,
An example is a compound having a maleimide group, which is an adduct of an amino compound such as diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenyl ether or an amino compound modified with an epoxy resin, with these bismaleimides.

Further, monofunctional maleimides such as phenylmaleimide, alkylmaleimide and the like can be used in combination within a range that does not significantly lower the heat resistance.

When the powder of the compound represented by the general formula (II) having a maleimide group in these molecules is used in combination, the general formula (A) having two or more vinylbenzyl ether groups bonded to an aromatic residue in the molecule ( The strength of the powder of compound I) is further improved.

The compound of the general formula (I) having at least two vinylbenzyl ether groups bonded to an aromatic residue in the molecule used in the present invention, and the general formula (II) having a maleimide group in the molecule. The average particle diameter of the powder of the compound represented by is in the range of about 0.5 to 100 μm, and particularly preferably about 1 to 50 μm from the viewpoint of workability and moldability.

The heat-resistant resin-bonded grindstone of the present invention comprises, in the first invention, 2 to 60 parts by volume of abrasive grains in 100 parts by volume of the compound and two vinylbenzyl ether groups bonded to an aromatic residue in the above-mentioned molecule. A formulation containing 10 to 90 parts by volume, preferably 20 to 80 parts by volume, of the powder of the compound represented by the general formula (I) having the above, and the formulation 10 in the second invention.
In 0 volume part, 2 to 60 volume parts of abrasive grains, 5 to 90 volume parts of powder of a compound represented by the general formula (I) having two or more vinylbenzyl ether groups bonded to an aromatic residue in the molecule, and molecules The powder of the compound represented by the general formula (II) having a maleimide group therein is 5 to 90 parts by volume, preferably 10
To 80 parts by volume, and if necessary, a filler is added to these compositions at most 60 parts by volume, preferably not more than 40 parts by volume, by heating and compression molding to obtain a grindstone base (for example, Wheels, etc.) are molded.

In the first and second aspects of the invention, when the mixing ratio of the abrasive grains is less than 2 parts by volume, the grinding ratio is remarkably reduced, and when the abrasive grains are more than 60 parts by volume, the mechanical strength of the grindstone is insufficient. Further, in the first and second inventions, if the compounding ratio of the compound represented by the general formula (I) is less than 10 parts by volume and less than 5 parts by volume, the moldability is deteriorated, and
If it is larger than the capacity part, the grinding ratio is lowered.

In the second invention, if the compounding ratio of the powder of the compound represented by the general formula (II) having a maleimide group in the molecule is less than 5 parts by volume, the effect is the same as that of the first invention and more than 90 parts by volume. In this case, the grinding ratio and grinding power are inferior.

As a method for molding the heat-resistant resin-bonded grindstone according to the present invention, the above-mentioned compound is filled in an appropriate mold for grinding the grindstone, and the temperature is 150 to 250 ° C. and the pressure is 100 to 7.
A heat-resistant resin-bonded grindstone can be easily obtained by taking out from the press and cooling after molding at 00 Kg / cm ^{2 for} a molding time of 3 to 60 minutes.

Further, the heat-resistant resin-bonded grindstone thus obtained is molded for the purpose of imparting sufficient heat resistance.
It is preferable to perform after-curing at 0 ° C to 270 ° C for about 2 to 10 hours.

The cemented carbide grains used in the present invention include, for example, CBN, natural or artificial diamond, and the average grain size of the grains is about 1 to 100.
It is preferably 0 μm, particularly preferably about 2 to 500 μm.

In addition to the above formulations, fillers, lubricants,
Known fillers that are generally used in the production of resin-bonded grindstones can be added for the purpose of modifying agents and the like (hereinafter collectively referred to as fillers). For example, Al ₂ O
₃ , SiC, SiO ₂ , graphite, Sn, Fe ₂ O
₃ , Ag, Cu, MoS ₂ , hexagonal boron nitride and the like and mixtures thereof, and the average particle size of the filler in that case is about 0.1 to 500 μm, and particularly 0.5 to 200 μm. preferable.

In the present invention, the abrasive grain layer may contain the abrasive grains in the proportion of 2 to 60 parts by volume as described above, but in particular, the composition is abrasive grains: 5 to 50 parts by volume, and the general formula (I Powder of the compound having two or more vinyl benzyl ether groups represented by the formula: 20 to 80 parts by volume, or the powder of the vinyl benzyl ether compound represented by the general formula (I) and the general formula (II)
The total powder of the compound having a maleimide group represented by is:
It is preferably 20 to 80 parts by volume and the filler: 40 parts by volume or less.

[0027]

EXAMPLES Examples of the present invention will be shown below to more specifically describe the present invention.

Example 1 In the presence of sodium hydroxide,
59 parts by volume of bisphenol S divinylbenzyl ether powder (average particle size: 40 μm, melting point 135 ° C., specific gravity after molding 1.23) obtained by reacting vinylbenzyl chloride and bisphenol S, and an average particle size of 120
μm (120-140 mesh) nickel alloy coating C
BN (true specific gravity: 5.4 / Showa Denko KK: SBN-
KN) 31 parts by volume, and an average particle diameter of 30 μm as a filler
A mixture prepared by dry-mixing 10 parts by volume of (600 mesh) alumina was filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and 500 kg / cm for 10 minutes at a temperature of 220 ° C. After pressure molding at a pressure of ^2, the mold was released. Then, after-curing was performed for 5 hours in a hot air drying oven at 250 ° C. to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone is
This corresponds to a CBN concentration of 75. A wet grinding test as shown below was conducted on this grindstone, and the results are shown in Table 1.

Wet grinding test Grinding wheel shape (dimension mm) 14A1 type 150 ^D × 10 ^T × 5 ^U × 3 ^X × 7
6.2 ^HD D: Diameter of grindstone base T: Thickness of grindstone base U: Thickness of abrasive grain layer X: Width of abrasive grain layer H: Inner diameter of hole of grindstone substrate Grinding method: Wet surface traverse grinding method Grinder: Okamoto Machine Tool Horizontal axis surface grinder PSG-63AN type Grinding wheel shaft motor 3.7KW Grinding conditions: Grinding wheel peripheral speed 1500m / min, table speed 15m / min, cross feed 2mm / p
ass, incision 20 μm Work material: SKH-51 (HRC62 to 64) Surface to be ground 200 mm long x 100 mm width Grinding fluid: JIS W2 type (Soluble type
CBN exclusive liquid) 50 times liquid supply 9 liters / min Truing: Diamond tool Dressing with impregnator: Waste grinding with WA bit stick: Grinding under the same conditions as this test until the grinding power value became stable.

(Example 2) In the presence of sodium hydroxide,
Bisphenol S divinylbenzyl ether powder obtained by reacting vinylbenzyl chloride and bisphenol S (average particle size: 40 μm, melting point 135 ° C., specific gravity after molding 1.23) 29.5 parts by volume, N, N′- Diphenylmethane bismaleimide powder (average particle size 40 μm, melting point 135 ° C.) 29.5 parts by volume and the average particle size 120 μm
(120-140 mesh) nickel alloy coated CBN
(True specific gravity: 5.4 / manufactured by Showa Denko KK) 31 parts by volume,
And an average particle size of 30 μm (600 mesh) as a filler
The mixture prepared by dry mixing 10 parts by volume of alumina was filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and the temperature was 220 ° C. for 10 minutes at 500 kg /
After pressure molding at a pressure of cm ^2, the mold was released. Then, after-curing was performed for 5 hours in a hot air drying oven at 250 ° C. to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base.
The abrasive grain layer of this grindstone corresponds to a CBN concentration of 75. A wet grinding test was performed on this grindstone in the same manner as in Example 1, and the results are shown in Table 1.

Comparative Example 1 A novolak type heat resistant phenolic resin containing hexamethylenetetramine as a commercially available hardener commonly used as a binder for grinding wheels was used in place of the bisphenol S divinylbenzyl ether of Example 1. The compound is filled into a cavity in a predetermined mold incorporating an aluminum grindstone base, and the temperature is set to 1
Pressure molding at 80 ° C and pressure of 500 kg / cm ² (120 ° C
Degas, and demold when the mold temperature reaches 180 ° C), 1
Post-curing was performed for 10 hours in a hot air drying oven at 95 ° C to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a CBN concentration of 75. A wet grinding test was performed on this grindstone in the same manner as in Example 1, and the results are shown in Table 1.

(Comparative Example 2) A commercially available amine-modified bismaleimide (diaminodiphenylmethane-modified N, N'-diphenylmethane bismaleimide) commonly used as a binder for heavy grinding wheels was used as the bisphenol S of Example 1.
The formulation used instead of divinyl benzyl ether,
It is filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and the temperature is 200 ° C and the pressure is 500 Kg /
After pressure molding at cm ² for 30 minutes, the mold was removed, and post-curing was performed for 10 hours in a hot air drying oven at 250 ° C. to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a CBN concentration of 75. A wet grinding test was performed on this grindstone in the same manner as in Example 1, and the results are shown in Table 1.

[0033]

[Table 1]

(Example 3) In the presence of sodium hydroxide,
Bisphenol A divinylbenzyl ether powder obtained by reacting vinylbenzyl chloride and bisphenol A (average particle diameter: 40 μm, melting point 135 ° C., specific gravity after molding 1.23) 19.5 parts by volume and Mitsui Toatsu Co., Ltd. Bismaleimide M-20 (average particle size: 50 μm, melting point 1)
50 ° C) 19.5 parts by volume and an average particle size of 120 μm
(120-140 mesh) nickel alloy coated CBN
(True specific gravity: 5.4 / manufactured by Showa Denko KK) 31 parts by volume,
And hBN (hexagonal boron nitride, 2 as a heat resistant lubricant,
22.5 parts by volume, average particle size of 70μ as a filler
A dry-mixed mixture of 7.5 parts by volume of copper powder of m or less (200 mesh or less) was filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and the temperature was 220 ° C. for 10 minutes. After pressure molding at a pressure of 500 Kg / cm ^2, the mold was released. Then, after-curing was carried out for 5 hours in a hot air drying oven at 250 ° C. to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone is CB
It corresponds to the N concentration of 75. This grindstone was subjected to a dry grinding test as shown below, and the results are shown in Table 2.

Dry Grinding Test Grinding Wheel Shape (Dimension mm) 100 ^D × 35 ^T × 3 ^U × 2 ^X × 38.1 ^H 6A2 Type (JIS Standard) Grinding Method: Dry Traverse Grinding Method Grinder: Makino Milling Automotive Tool Grinding Disk CF1A-40 type Grinding wheel shaft motor 1.5KW Grinding conditions: Grinding wheel peripheral speed 1180m / min, table speed 3m / min, depth of cut 75μm Work material: SKH-51 (HRC62 to 64) Grinding surface 5mm length x 40mm width 200 pieces of 7 objects
Attached to an mφ cutter base and ground. Truing: Diamond tool Dressing with an implied dresser: Waste grinding with a WA bit stick: Grinding under the same conditions as this test until the grinding power value was stable.

COMPARATIVE EXAMPLE 3 A novolak type heat resistant phenolic resin containing hexamethylenetetramine as a commercially available hardener which is generally used as a binder for a heavy grinding wheel is prepared from the bisphenol A divinylbenzyl ether powder of Example 3 and bismaleimide. The formulation used instead of powder,
Fill the void in a predetermined mold incorporating an aluminum grindstone base, temperature 180 ° C, pressure 500 kg / cm ²
Molding (degassing at 120 ° C, demolding when the mold temperature reaches 180 ° C), then demolding, and post-curing for 10 hours in a hot air drying oven at 195 ° C to directly form an abrasive grain layer on the periphery of the grindstone base. A grindstone having an integral structure was obtained. The abrasive grain layer of this grindstone corresponds to a CBN concentration of 75. This grindstone was subjected to a dry grinding test in the same manner as in Example 3, and the results are shown in Table 2.

[0037]

[Table 2]

Example 4 In the presence of sodium hydroxide,
42 parts by volume of bisphenol S divinylbenzyl ether powder (average particle size: 40 μm, melting point 135 ° C., specific gravity after molding 1.23) obtained by reacting vinylbenzyl chloride and bisphenol S, and an average particle size of 120 μm
m (120-140 mesh) 38 parts by volume of nickel alloy-coated diamond (RVG-W) and 20 parts by volume of silicon carbide having an average particle size of 25 μm (GC 600 mesh) as a filler were dry-mixed to prepare a composition. Fill a cavity in a predetermined mold incorporating an aluminum grindstone base, and at a temperature of 220 ° C for 10 minutes, 500 kg /
After pressure molding at a pressure of cm ^2, the mold was released. Then, post-curing was carried out for 5 hours in a hot air drying oven at 250 ° C to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a diamond concentration of 100. A wet grinding test as shown below was conducted on this grindstone, and the results are shown in Table 3.

Wet grinding test Grinding stone shape (dimension mm): 14A1 type 150 ^D ×
10 ^T x 5 ^U x 3 ^x x 76.2 ^H Grinding method: Wet surface traverse grinding method Grinder: Okamoto Machine Tool horizontal axis surface grinder PSG-63AN type grinding wheel spindle motor 3.7KW Grinding condition: Grinding wheel peripheral speed 1500m / Min, table speed 15m / min, cross feed 2mm / p
ass, depth of cut 20 μm Work material: cemented carbide (V10) Surface to be ground 100 mm x 100 mm Grinding fluid: JIS W2 type (Soluble type
Diamond-only liquid) 30 times liquid supply 9 liters / min Truing: Dressing with diamond rotary dresser Dressing: Waste grinding with WA bit stick: Grinding under the same conditions as this test until the grinding power value became stable.

Example 5 In the presence of sodium hydroxide,
21 parts by volume of bisphenol S divinylbenzyl ether powder (average particle diameter: 40 μm, melting point 135 ° C., specific gravity after molding 1.23) obtained by reacting vinylbenzyl chloride and bisphenol S, and N, N′-diphenylmethanebis Maleimide powder (average particle size 40 μm, melting point 13
(5 ° C.) 21 parts by volume, and an average particle size of 120 μm (12
Aluminum alloy was prepared by dry blending 38 parts by volume of nickel alloy coated diamond (RVG-W) of 0 to 140 mesh) and 20 parts by volume of silicon carbide having an average particle size of 25 μm (GC 600 mesh) as a filler. The mold was filled in a cavity in a predetermined mold in which the grindstone base of No. 1 was incorporated, and pressure-molded at a temperature of 220 ° C. for 10 minutes at a pressure of 500 Kg / cm ² and then demolded. Then, post-curing was carried out for 5 hours in a hot air drying oven at 250 ° C to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a diamond concentration of 100. A wet grinding test was performed on this whetstone in the same manner as in Example 4, and the results are shown in Table 3.

(Comparative Example 4) A novolac type heat resistant phenolic resin containing hexamethylenetetramine as a commercially available hardener which is generally used as a binder for a grinding wheel,
The composition used in place of the bisphenol S divinylbenzyl ether of Example 4 was filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and pressure-molded at a temperature of 180 ° C. and a pressure of 500 Kg / cm ^2. (120
(Degassing was carried out at 0 ° C), and when the mold temperature reached 180 ° C, the mold was released. Post-curing was carried out for 10 hours in a hot air drying oven at 195 ° C. to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a C diamond concentration of 100. A wet grinding test was performed on this whetstone in the same manner as in Example 4, and the results are shown in Table 3.

(Comparative Example 5) A commercially available amine-modified bismaleimide (diaminodiphenylmethane-modified N, N'-diphenylmethane bismaleimide), which is generally used as a binder for heavy-duty grinding wheels, was mixed with bisphenol S divinylbenzyl ether of Example 4. The composition used in place of the above is filled in a cavity in a predetermined mold incorporating an aluminum grindstone base, and the temperature is 200 ° C and the pressure is 500K.
After pressure molding at g / cm ² for 30 minutes, the mold was removed. Then 25
After-curing was carried out for 10 hours in a 0 ° C. hot air drying furnace to obtain a grinding wheel having an abrasive grain layer directly integrated with the periphery of the wheel base. The abrasive grain layer of this grindstone corresponds to a diamond concentration of 100. A wet grinding test was performed on this whetstone in the same manner as in Example 4, and the results are shown in Table 3.

[0043]

[Table 3]

[0044]

As shown in the results of the wet grinding test of Tables 1 and 3 and the results of the dry grinding test of Table 2, the heat-resistant resin-bonded grindstone of the present invention has a heat-resistant phenolic resin grindstone and an amine of Comparative Examples. As compared with the modified bismaleimide grindstone, the grinding power is low, the grinding ratio is high, and stable grinding can be performed all the time. Therefore, it can be widely used in the industrial field.

Claims (2)

[Claims] 1. 100 parts by volume of the formulation, 2 to 60 parts by volume of abrasive grains, and general formula (I): [In the formula, X represents an aromatic residue (a residue obtained by removing a hydroxy group from a polyhydric phenol compound), and y represents a number of 2 or more. ]
Compound powders 10 to 90 having two or more vinylbenzyl ether groups represented by
A heat-resistant resin-bonded grindstone obtained by heat-compressing a composition containing a volume part. 2. A compound having 2 to 60 parts by volume of abrasive grains in 100 parts by volume of the formulation, and two or more vinylbenzyl ether groups bonded to an aromatic residue in the molecule represented by the general formula (I). 5 to 90 parts by volume of powder and general formula (II) (R in the formula represents hydrogen or a methyl group, Z represents a divalent aromatic residue or a xylylene residue.) A compound containing 5 to 90 parts by volume of a compound powder having a maleimide group in a molecule. A heat-resistant resin-bonded grindstone heat-compressed and molded from an object.