JPH07122340A - Structure of holding ic package in socket - Google Patents

Abstract

PURPOSE:To lower the height of a socket, accompanying the needs of downsizing and thinning of apparatuses on the market. CONSTITUTION:A contact part housing recess 10 is dug in a socket base 3, and insertion holes 11 are provided on both sides of the socket base 3. A contactor 4 is inserted in the insertion hole 11, and the contact part 6 is positioned on the bottom of the contact part housing recess 10, and also connections 7 are projected outward from both sides of the socket base 3. Press- fitting and fixing part 8 provided between the contact parts 6 and the connections 7 are press-fit and fixed on both sides of the socket base 3. An IC package 2 is placed on the socket base 3 in such a way as to put the bottom of the IC package 2 into the package storage recess 12 of the socket base 3. The lead feet 1 on both sides of the IC package 2 are inserted in the contact part housing recesses 10, and also the bottoms of the lead feet 1 are brought into contact with the contact parts 6. Press parts 13 at the bottoms on both sides of frames 5 are inserted into the contact part housing recesses 10, and also the lower parts of the lead feet 1 are pressed to the contact part 6 by means of the press part 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure used to hold an SOP type IC package in a socket.

[0002]

2. Description of the Related Art Conventionally, a SOP type IC package is held in a socket as shown in FIG. An IC package 2 having a large number of lead legs 1 protruding from both sides is placed on a socket base 3, and a large number of contacts 4 are provided on both sides of the socket base 3 and the contacts 4 are brought into contact with the lead legs 1. The lead legs 1 are pressed by the frame 5 fitted on the outer periphery of the IC package 2 and the frame 5 is coupled to the socket base 3. The contactor 4 is shown in FIG.
As shown in (b), it is formed into a forked shape by cutting and raising, and has a contact portion 6, a connecting portion 7, and a press-fitting fixing portion 8. The contactor 4 is mounted on the socket base 3 by press-fitting the press-fitting fixing portions 8 of the contactor 4 into the press-fitting grooves 9 formed on the outer surfaces of both sides of the socket base 3, and the circuit of the printed circuit board of the contactor 4 is mounted. The connecting portion 7 connected by soldering is substantially flush with the lower surface of the socket base 3, and the contact portion 6 is located above the upper surface of the socket base 3. Then, the lower portion of the lead leg 1 of the IC package 2 placed on the socket base 3 is brought into contact with the contact portion 6 of the contactor 4, and the lower portion of the lead leg 1 is pressed by the frame 5 so that the lower portion of the lead leg 1 is contacted with the contactor 4. Is contacted with the contact portion 6.

[0003]

However, in the structure of the above-mentioned conventional example, the height h of the contact 4 becomes high, and the height H of the IC package holding socket including the IC package 2 becomes high. There is. Specifically, the height h of the contactor 4 is 2.45 mm and the height H of the socket is 5.0 mm.
However, there is a problem in that it cannot meet the needs for downsizing and thinning of devices such as personal computers and HDDs in the market.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce the height of sockets in accordance with the needs for downsizing and thinning of devices in the market. It is possible to provide a structure for holding an IC package in a socket.

[0005]

In order to achieve the above object, the structure for holding an IC package in a socket according to the present invention is such that an IC package 2 having a plurality of lead legs 1 projecting from both sides is placed on a socket base 3. Then, a large number of contacts 4 are provided on both sides of the socket base 3, the contacts 4 are brought into contact with the lead legs 1, and the lead legs 1 are held down by the frame 5 fitted on the outer periphery of the IC package 2 and the frame 5 is attached to the socket base. In the structure for holding the IC package coupled to the socket 3 in the socket, the contact portion accommodating recesses 10 are provided on both sides of the socket base 3 and the contact portion accommodating recesses 10 are communicated from the lower surfaces of both sides of the socket base 3 to the contact portion accommodating recesses 10. The hole 11 is provided and the contact 4
Through the insertion hole 11 to position the contact portion 6 of the contactor 4 at the bottom of the contact portion housing recess 10 and project the connecting portion 7 of the contactor 4 outward from both sides of the socket base 3 Press-fitting fixing part 8 provided between the contact part 6 and the connecting part 7 of FIG.
By press-fitting to both sides of the socket base 3 from the outer surface of both sides,
The IC package 2 is placed on the socket base 3 so that the lower part of the C package 2 is placed in the package storage recess 12 of the socket base 3, and the substantially L-shaped lead legs 1 on both sides of the IC package 2 are stored in the contact portion. The lower part of the lead leg 1 is brought into contact with the contact part 6 of the contactor 4 while being inserted into the recess 10, and the pressing parts 13 projecting downward from the lower surfaces of both sides of the frame 5 are inserted into the contact part storage recess 10 and pressed. It is characterized in that the lower portion of the lead leg 1 is pressed against the contact portion 6 by the portion 13.

[0006]

According to the above structure, the height between the connecting portion 7 and the contact portion 6 of the contactor 4 can be reduced and the IC package 2
The height of the socket mounted on the socket base 3 can be reduced, the height of the socket including the IC package 2 can be reduced, and the height can be reduced as compared with the conventional case. This makes it possible to meet the needs for downsizing and thinning of devices.

[0007]

EXAMPLE A socket for holding an IC package is shown in FIG.
As shown in FIG. 2, the socket base 3, the frame 5, the contacts 4
And a holder 19 for hooking. Contact portion storage recesses 10 having open upper surfaces are provided in front of both sides of the rectangular socket base 3, and contact portion storage recesses 10 on both sides are provided.
A package storage recess 12 is provided between them. Notches 18 are provided on the lower surfaces of both sides of the socket base 3,
The notch 18 and the bottom portion of the contact portion accommodating concave portion 10 form the insertion hole 1
It communicates with 1. Press-fit grooves 9 are formed on the outer surfaces of both sides of the socket base 3, and locking grooves 14 are provided at lower ends of both ends of both sides of the socket base 3 in the longitudinal direction. A guide slope 15 is provided. The contactor 4 is formed by punching out a metal plate,
The contact part 6, the connecting part 7, and the press-fitting fixing part 8 are integrally provided. The contact portion 6 is horizontally provided at one end of the contactor 4, and the connection portion 7 is horizontally provided at the other end of the contactor 4, and the height between the lower surface of the connection portion 7 and the upper surface of the contact portion 6 is increased. The h is much lower than the conventional one, specifically, 0.66 mm. Two contact protrusions 16 are provided on the upper surface of the contact portion 6, and a rising portion 17 is provided on the base portion of the contact portion 6. The rising portion 17 provides elasticity to the contact portion 6. I have it. The contactor 4 is attached to the socket base 3 by press-fitting the press-fitting fixing part 8 into the press-fitting groove 9 from the lateral direction, and the contacting part 6 is located at the bottom of the contact part storing recess 10 via the notch 18 and the insertion hole 11. The connection portion 7 is positioned so as to project to the outside of the socket base 3. In this way, a large number of contacts 4 are attached to both sides of the socket base 3.
The frame 5 is formed in a rectangular frame shape, and pressing portions 13 project downward from the inner peripheral sides on both sides of the frame 5, and press-fit grooves 20 are formed on the upper surfaces on both sides of the frame 5. There is. The holding tool 19 is formed by providing substantially U-shaped holding pieces 22 on both sides of the upper piece 21, and by pressing the press-fitting piece 23 hanging from the upper piece 21 into the press-fitting groove 20 of the frame 5, the holding tool 19 is formed. Is attached to the frame 5. Holder 1
A locking claw 24 is provided at the lower end of the holding piece 22 of No. 9. I
A large number of substantially L-shaped lead legs 1 are provided on both sides of the C package 2.

Therefore, the IC package 2 is held in the socket as follows. The socket base 3 is mounted on a printed circuit board, and the connection portion 7 of the contactor 4 is connected to the circuit of the printed circuit board by soldering. When mounting the IC package 2 on the socket base 3, the IC package 2
The lower part of the lead is stored in the package storage recess 12, and the lower part of the lead leg 1 is brought into contact with the contact portion 6 of the contactor 4. In this state, the frame 5 is placed on the socket base 3 so as to surround the IC package 2 with the frame 5, and the state shown in FIG. 3A is obtained.
Inserted at 0. In this state, the frame 5 is pressed downward, and as shown in FIG. 3B, the locking claw 24 of the holder 19 is locked in the locking groove 14 so that the frame 5 and the socket base 3 are coupled and pressed. The lower portion of the lead foot 1 is pressed by the portion 13 and the lower portion of the lead foot 1 is elastically brought into contact with the contact portion 6. In this way, the IC package 2 is held in the socket as shown in FIG. 1A, but the height H of the socket including the IC package 2 at this time is lowered. Specifically, the height H of the socket is 2.5 mm or less.

Next, a more detailed comparison between the example of the present invention and the conventional example is as follows. Figure 4 (a)
Is a detailed view of the contactor 4 of the present invention, and FIG. 4B is a detailed view of the contactor 4 of the conventional example. In the case of the conventional contactor 4, since the contactor 4 is formed by cutting and raising as shown in FIGS. 4B and 5B, the lower surface of the connection portion 7 and the contact portion 6 are formed.
The height h between the contact protrusion 16 and the upper end of the contact protrusion 16 is specifically 2.
It becomes as high as 45 mm. However, since the contactor 4 of the present invention has the structure as shown in FIG. 4A and is formed by punching, the height h between the lower surface of the connection portion 7 and the upper end of the contact protrusion 16 is specifically set. Can be made as low as 0.70 mm, and when the contactors 4 are punched out from the hoop material 25 as shown in FIG.

Further, in the conventional contactor 4, the edge-shaped contact protrusion 16 is crushed in order to be formed by cutting and raising, so that only one contact protrusion 16 can be processed.
When contacted with the lead foot 1 as shown in (b), the contact reliability is low. In addition, bronze that is easy to process must be used as the material of the contactor 4. However, in the case of the present invention, since the edge-shaped contact protrusions 16 can be punched out at two points because they are processed by punching, the contact reliability with the lead foot 1 is improved as shown in FIG. Further, as the contactor 4, phosphor bronze having a spring property can be used.

Further, in the case of the conventional contactor 4, as shown in FIG. 7 (b), a rising part 17 is provided at the base of the contact part 6 (specifically, the height a is 0.3 mm), and it is straight. The spring property is better than the state, and it also functions as a solder crawl up prevention mechanism. Also in the case of the contactor 4 of the present invention, as shown in FIG. 7A, a rising portion 17 is provided at the base of the contact portion 6 (specifically, the height a is 0.3 mm), which is different from the conventional one. Similarly, the spring property is improved and the solder creep-up prevention mechanism is provided.

Further, in the conventional case, as shown in FIG. 8B, the intermediate portion of the contactor 4 is raised by the rising portion 26 with respect to the surface of the connecting portion 7 and lifted by 0.3 mm or more (specifically, It has a height b of 0.4 mm) to prevent solder creep-up and flux creep-up. Also, in the contactor 4 of the present invention, as shown in FIG. 8A, the intermediate portion of the contactor 4 is raised by the rising portion 26 and lifted by 0.3 mm or more with respect to the surface of the connecting portion 7 (specifically, Has a height b of 0.4 m
m) Yes, the creep of solder and flux can be prevented as in the conventional case.

Further, in the conventional case, since the contactor 4 is formed by cutting and raising, the press-fitting fixing portion 8 becomes as shown in FIG. 9B, and when the contactor 4 is attached by press-fitting, the contactor 4 is It becomes weak against the load in the tilt direction. However, in the case of the present invention, since the contactor 4 is formed by punching as shown in FIG. 9A, when the contactor 4 is attached by press fitting, it is strong against the load of the contactor 4 in the inclination direction. .

Further, the height H of the socket holding the conventional IC package 2 is 5 mm or less, but as shown in FIG. 10B, the height is close to 5 mm. However, in the present invention, the height H of the socket including the IC package 2 is as low as 2.5 mm or less.

[0015]

Since the present invention is constructed as described above, it is possible to reduce the height between the contact portion and the contact portion of the contact and also reduce the height to be mounted on the socket stand of the IC package. Therefore, the height of the socket including the IC package can be reduced, and the height can be made lower than before, and it is possible to meet the needs for downsizing and thinning of devices.

[Brief description of drawings]

1A is a sectional view of an embodiment of the present invention, and FIG. 1B is a front view of a contactor.

FIG. 2A is a perspective view of a state where the holder is attached to the frame, and FIG. 2B is a front view of the holder.

3 (a) and 3 (b) are front views for explaining a state of holding the IC package of the above.

4A is a front view of a contactor of the present invention, and FIG. 4B is a front view of a conventional contactor for comparison.

FIG. 5A is a front view illustrating punching of a contact according to the present invention, and FIG. 5B is a side view illustrating processing by cutting and raising a conventional contact.

FIG. 6A is a cross-sectional view illustrating contact with a contact portion of a lead foot according to the present invention, and FIG. 6B is a cross-sectional view illustrating contact with a contact portion of a conventional lead foot.

FIG. 7A is a front view illustrating a rising portion of a contact according to the present invention, and FIG. 7B is a front view illustrating a rising portion of a conventional contact.

8A is a front view illustrating a rising portion of a contactor of the present invention, and FIG. 8B is a front view illustrating a rising portion of a conventional contactor.

FIG. 9A is a front view illustrating a press-fitting and fixing portion of a contact according to the present invention, and FIG. 9B is a plan view illustrating a press-fitting and fixing portion of a conventional contactor.

10A is a cross-sectional view illustrating the height of the socket of the present invention, and FIG. 10B is a cross-sectional view illustrating the height of the conventional socket.

11A is a partially cutaway sectional view of a conventional example, and FIG. 11B is a front view of a contactor.

[Explanation of symbols]

 1 lead foot 2 IC package 3 socket base 4 contact 5 frame 6 contact part 7 connection part 8 press fit fixing part 9 press fit groove 10 contact part storage recess 11 insertion hole 12 package storage recess 13 pressing part

Claims (1)

[Claims] 1. I having a large number of lead legs projecting from both sides
The C package is placed on the socket base, a large number of contacts are provided on both sides of the socket base, the contacts are brought into contact with the lead feet, and the lead feet are held by the frame fitted on the outer periphery of the IC package and the frame is socketed. In a structure for holding an IC package connected to a base in a socket, contact recesses are formed in front of both sides of the socket base, and insertion holes are formed on both sides of the socket base to communicate with the contact recesses from the lower surfaces of both sides. Insert the contactor into the through hole to position the contactor contact portion at the bottom of the contact portion storage recess, and project the contactor contact portion outward from both sides of the socket base to connect to the contactor contact portion. The press-fitting fixing parts provided between the IC block and the socket part are press-fitted and fixed to both sides of the socket base from the outer surfaces of both sides.
Place the IC package on the socket base so that the lower part of the package fits in the package storage recess of the socket base, and
The substantially L-shaped lead legs on both sides of the C package are inserted into the contact portion accommodating recesses, and the lower portions of the lead legs are brought into contact with the contact portions of the contactors, and the pressing portions projecting downward from the lower surfaces on both sides of the frame. Is inserted into the contact portion accommodating recess, and the lower portion of the lead leg is pressed against the contact portion by the pressing portion.