JPH07117142A - Antistatic methacrylic resin molding - Google Patents
Antistatic methacrylic resin moldingInfo
- Publication number
- JPH07117142A JPH07117142A JP5267123A JP26712393A JPH07117142A JP H07117142 A JPH07117142 A JP H07117142A JP 5267123 A JP5267123 A JP 5267123A JP 26712393 A JP26712393 A JP 26712393A JP H07117142 A JPH07117142 A JP H07117142A
- Authority
- JP
- Japan
- Prior art keywords
- antistatic
- methacrylic resin
- resin molding
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、照明カバー、ディスプ
レイ用拡散板、看板、発光式スイッチボタン、展示品表
装用カバー、自動車の内外装部品や家庭用電気機器の外
装部品等に供する帯電防止性メタクリル樹脂成形体に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antistatic treatment for a lighting cover, a diffusion plate for a display, a signboard, a light-emitting switch button, a cover for an exhibit display, an interior / exterior part of an automobile, an exterior part of a household electric appliance, and the like. Methacrylic resin molded article.
【0002】[0002]
【従来の技術】メタクリル樹脂は、その卓越した透明
性、良好な機械的性質、加工性並びに成形品の美麗さに
よって、照明器具、看板、各種装飾品および銘板等に広
く利用されているが、その表面電気固有抵抗が大きいた
め、接触または摩擦等で誘起された静電気が逃散、消失
しにくく、そのため使用中の樹脂表面にほこり等が付着
して汚れ易く折角の美しい外観を損う結果となってい
る。BACKGROUND OF THE INVENTION Methacrylic resin is widely used for lighting equipment, signboards, various ornaments, nameplates, etc. due to its excellent transparency, good mechanical properties, processability and beauty of molded products. Due to its large surface electrical resistivity, static electricity induced by contact or friction is unlikely to escape and disappear, and as a result dust and other substances are likely to adhere to the resin surface during use and stain easily, resulting in a loss of its beautiful appearance. ing.
【0003】そこでアクリル樹脂に、各種帯電防止剤を
混在させた組成物が種々提案されている。例えば、特開
昭47-26438号公報には、スルホン酸基を有する芳香族化
合物とポリエーテルを含む樹脂組成物が、特開平1-1975
52号公報には、スルホン酸基を有するアルキルベンゼン
とグリセリン脂肪酸エステルを含む樹脂組成物が、特開
平4-108846号公報には、ノルマルパラフィンスルホン酸
塩を含む組成物が開示されている。また、特開平5-1252
47号公報には、グリセリンモノ脂肪酸エステル、トリア
ルキルホスファイト、架橋微細ビーズを含む樹脂組成物
が開示されている。Therefore, various compositions have been proposed in which various antistatic agents are mixed in an acrylic resin. For example, JP-A-47-26438 discloses a resin composition containing an aromatic compound having a sulfonic acid group and a polyether, as disclosed in JP-A-1-1975.
Japanese Unexamined Patent Publication (Kokai) No. 4-108846 discloses a resin composition containing alkylbenzene having a sulfonic acid group and glycerin fatty acid ester, and Japanese Unexamined Patent Publication No. 4-108846 discloses a composition containing normal paraffin sulfonate. In addition, JP-A-5-1252
Japanese Patent Publication No. 47 discloses a resin composition containing glycerin monofatty acid ester, trialkyl phosphite and crosslinked fine beads.
【0004】[0004]
【発明が解決しようとする課題】しかし、これらの樹脂
組成物を成形体として、実用に供した際の帯電防止性の
発現は、これら帯電防止剤が表面にブリードしている状
態で起こる。一方、該成形体の使途の多くは、美感を維
持するため、その表面の汚れ、ゴミを払拭する。この払
拭を特に水性のものを用いて行うと、ブリードしている
帯電防止剤が除かれ、帯電防止性が消滅する。また、帯
電防止剤のなかでも、例えばポリオール(ポリアルキレ
ンオキサイド化合物)のごとく、これを添加することに
よりアクリル樹脂の耐熱性を下げることになる。However, the expression of antistatic properties when these resin compositions are used as molded articles for practical use occurs when these antistatic agents bleed on the surface. On the other hand, most of the uses of the molded body are to wipe off dirt and dust on the surface thereof in order to maintain a beautiful appearance. If this wiping is carried out using a water-based material, the bleeding antistatic agent is removed and the antistatic property disappears. Further, among the antistatic agents, for example, a polyol (polyalkylene oxide compound) such as a polyol is added to reduce the heat resistance of the acrylic resin.
【0005】そこで本発明は、表面を払拭しても、帯電
防止性能を喪失することなく持続して発揮し、しかも耐
熱性も維持されているメタクリル系樹脂成形体を提供す
るものである。Therefore, the present invention provides a methacrylic resin molded product which can be continuously exerted without losing its antistatic property even if the surface is wiped off and the heat resistance is maintained.
【0006】[0006]
【課題を解決するための手段】すなわち本発明は、メタ
クリル酸メチル系重合体100重量部に対して、スルホ
ン酸塩基を有する炭化水素化合物、高級脂肪酸モノグリ
セライド、ポリアルキレングリコールから選ばれた少な
くとも一種の帯電防止剤を0.5〜5重量部含有してな
るメタクリル系樹脂からなり、かつその表面の十点平均
粗さ(Rz)が1〜30μm,平均山間隔(Sm)が1
0〜300μmである帯電防止性メタクリル系樹脂成形
体を提供するものである。Means for Solving the Problems That is, the present invention is based on 100 parts by weight of a methyl methacrylate polymer, and at least one selected from a hydrocarbon compound having a sulfonate group, a higher fatty acid monoglyceride, and a polyalkylene glycol. It is made of a methacrylic resin containing 0.5 to 5 parts by weight of an antistatic agent, and its surface has a ten-point average roughness (Rz) of 1 to 30 μm and an average mountain interval (Sm) of 1.
The present invention provides an antistatic methacrylic resin molded product having a thickness of 0 to 300 μm.
【0007】本発明で用いられるメタクリル酸メチル系
重合体とは、メタクリル酸メチル単独重合体あるいはメ
タクリル酸メチルを50重量%以上含み、メタクリル酸
メチルと共重合性単量体、例えばメタクリル酸エチル、
メタクリル酸ブチル、メタクリル酸シクロヘキシル、メ
タクリル酸フェニル、メタクリル酸ベンジル、メタクリ
ル酸2−エチルヘキシル、メタクリル酸2−ヒドロキシ
エチル、等のメタクリル酸エステル類、アクリル酸メチ
ル、アクリル酸エチル、アクリル酸ブチル、アクリル酸
シクロヘキシル、アクリル酸フェニル、アクリル酸ベン
ジル、アクリル酸2−エチルヘキシル、アクリル酸2−
ヒドロキシエチル、等のアクリル酸エステル類、メタク
リル酸、アクリル酸等の不飽和酸類、スチレン、α−メ
チルスチレン、アクリロニトリル、メタクリロニトリ
ル、無水マレイン酸、フェニルマレイミド、シクロヘキ
シルマレイミド等との共重合体であるが、これらに限定
されるものではない。また、ポリブタジエンまたはブタ
ジエン/アクリル酸ブチル共重合体、ポリアクリル酸ブ
チル共重合体等のエラストマー成分や無水グルタル酸単
位、グルタルイミド単位をさらに含んでいても良い。The methyl methacrylate polymer used in the present invention includes methyl methacrylate homopolymer or methyl methacrylate in an amount of 50% by weight or more, and methyl methacrylate and a copolymerizable monomer such as ethyl methacrylate,
Butyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, benzyl methacrylate, 2-ethylhexyl methacrylate, 2-hydroxyethyl methacrylate, and other methacrylate esters, methyl acrylate, ethyl acrylate, butyl acrylate, acrylic acid Cyclohexyl, phenyl acrylate, benzyl acrylate, 2-ethylhexyl acrylate, 2-acrylic acid
Acrylic ester such as hydroxyethyl, unsaturated acid such as methacrylic acid, acrylic acid, styrene, α-methylstyrene, acrylonitrile, methacrylonitrile, maleic anhydride, phenylmaleimide, cyclohexylmaleimide, etc. However, the present invention is not limited to these. Further, it may further contain an elastomer component such as polybutadiene, a butadiene / butyl acrylate copolymer, a polybutyl acrylate copolymer, a glutaric anhydride unit, or a glutarimide unit.
【0008】これらのメタクリル系樹脂は、塊状重合
法、懸濁重合法、乳化重合法、溶液重合法等の公知の重
合法で得られる。メタクリル樹脂の形状はいわゆるペレ
ット、パウダー、ビーズと称せられるもの、あるいは、
粉砕した無定形物、あるいは、溶融状態のもの等を用い
ることができる。These methacrylic resins can be obtained by known polymerization methods such as bulk polymerization method, suspension polymerization method, emulsion polymerization method and solution polymerization method. The shape of methacrylic resin is so-called pellet, powder, beads, or
It is possible to use a pulverized amorphous product or a molten product.
【0009】本発明で用いられるスルホン酸塩基を有す
る炭化水素化合物とは、下記式〔化1〕で示される化合
物であり、各種熱可塑性樹脂の帯電防止剤として周知の
ものである。The hydrocarbon compound having a sulfonate group used in the present invention is a compound represented by the following formula [Chemical formula 1], which is well known as an antistatic agent for various thermoplastic resins.
【0010】[0010]
【化1】R−SO3 X[Chemical formula 1] R-SO 3 X
【0011】式中Rは、脂肪族炭化水素、芳香族炭化水
素いずれでもよい。なかでも炭素数12〜18の直鎖型
炭化水素基のものが好ましい。またXは、ナトリウム、
カリウム、リチウム等のアルカリ金属である。In the formula, R may be either an aliphatic hydrocarbon or an aromatic hydrocarbon. Of these, straight-chain hydrocarbon groups having 12 to 18 carbon atoms are preferable. X is sodium,
Alkali metals such as potassium and lithium.
【0012】本発明の高級脂肪酸モノグリセライドは、
高級脂肪酸の炭素数が12〜22のものである。The higher fatty acid monoglyceride of the present invention is
The higher fatty acid has 12 to 22 carbon atoms.
【0013】ポリアルキレングリコールとしては、下記
〔化2〕で表わされるものである。The polyalkylene glycol is represented by the following [Chemical formula 2].
【化2】R2 O(R1 O)n R3 (式中、R1 :炭素数2〜4の炭化水素基、R2 、
R 3:炭素数1〜10の炭化水素基、n:50以上10
0を表わす。)Embedded image R 2 O (R 1 O) n R 3 (wherein R 1 is a hydrocarbon group having 2 to 4 carbon atoms, R 2 ,
R 3 : a hydrocarbon group having 1 to 10 carbon atoms, n: 50 or more 10
Represents 0. )
【0014】これら帯電防止剤のなかでも、〔化1〕に
示されるスルホン酸基を含有する炭化水素化合物がより
好ましい。これら帯電防止剤の量は、メタクリル酸メチ
ル系重合体100重量部に対して、0.5〜5重量部、
好ましくは1〜3重量部である。0.5重量部より少な
いと、帯電防止性の発現が充分でない。また、5重量部
より多いと成形体に加工する際、加工機を汚染すること
になり、さらに成形体表面がベトつくことになる。Among these antistatic agents, a hydrocarbon compound containing a sulfonic acid group represented by [Chemical Formula 1] is more preferable. The amount of these antistatic agents is 0.5 to 5 parts by weight, based on 100 parts by weight of the methyl methacrylate polymer.
It is preferably 1 to 3 parts by weight. If it is less than 0.5 part by weight, the antistatic property is not sufficiently exhibited. Further, if the amount is more than 5 parts by weight, the processing machine is contaminated when the molded product is processed, and the surface of the molded product becomes sticky.
【0015】メタクリル酸メチル系重合体にこれら帯電
防止剤を混在させる方法としては、ヘンシェルミキサー
等で両者を混合し、押出機や射出成形機で溶融混錬する
周知の方法があるが、いずれにしても後述の成形時に合
せ行えばよい。As a method of mixing these antistatic agents in the methyl methacrylate polymer, there is a known method of mixing both with a Henschel mixer or the like and melt-kneading with an extruder or an injection molding machine. However, it may be adjusted at the time of molding described later.
【0016】本発明において、成形体の表面粗さは、十
点平均粗さ(以下Rz)と平均山間隔(以下Sm)を用
いる。このRz、Smは、いずれもJIS−B0601
−1982の「表面粗さの定義と表示」に説明されたものに
従う。In the present invention, as the surface roughness of the molded product, a ten-point average roughness (hereinafter Rz) and an average mountain interval (hereinafter Sm) are used. Both Rz and Sm are JIS-B0601.
-Follow those described in 1982, "Definition and representation of surface roughness".
【0017】Rzの値は、1〜30μm、好ましくは5
〜20μmである。1μm未満でも30μmを越えて大
きくても、帯電防止剤を保持する能力が低下して、帯電
防止性が低下する。The value of Rz is 1 to 30 μm, preferably 5
Is about 20 μm. If it is less than 1 μm or more than 30 μm and large, the ability to hold the antistatic agent is lowered and the antistatic property is lowered.
【0018】Smの値は、10〜300μm、好ましく
は50〜200μmであり、10μm未満でも、300
μmを越えて大きくても、帯電防止剤を保持する能力が
低下する。The value of Sm is 10 to 300 μm, preferably 50 to 200 μm, and even if it is less than 10 μm, it is 300.
Even if it is larger than μm, the ability to hold the antistatic agent decreases.
【0019】本発明の成形体の表面を所定の粗さとする
には、公知の方法でよく、ことさらに限定されない。例
えば、マット加工、エンボス加工と称される加工方法を
用いる。この方法は、溶融して軟らかい状態の樹脂を、
凹凸の有る硬い材料に押し付け転写させる方法であり、
成形体を得る方法によってそれぞれの手段がある。A known method may be used to make the surface of the molded article of the present invention have a predetermined roughness, and the method is not particularly limited. For example, a processing method called mat processing or embossing is used. This method melts the resin in a soft state,
It is a method of pressing and transferring to a hard material with unevenness,
There are respective means depending on the method of obtaining the molded body.
【0020】成形体が板状であれば、例えば、樹脂をT
ダイから押し出して板状とし、ロールに挟んで冷却する
いわゆる押出成形による樹脂板の製造方法であり、特公
昭47-24475号公報、プラスチック材料講座〔12〕アク
リル樹脂(昭和45年3月25日 日刊工業新聞社刊
行)、特公昭 60-1185号公報に記載のごとく、型付きロ
ールいわゆるシボロールを用いた方法がある。If the molded body is plate-shaped, for example, resin
This is a method for producing a resin plate by so-called extrusion molding in which it is extruded from a die into a plate shape, sandwiched between rolls and cooled, and disclosed in Japanese Examined Patent Publication No. Sho 47-24475, Plastic Material Course [12] Acrylic resin (March 25, 1970). As described in Nikkan Kogyo Shimbun Co., Ltd.) and Japanese Patent Publication No. 60-1185, there is a method using a roll with a mold, so-called chevrolol.
【0021】各種形状の成形体とする射出成形方法にお
いては、シボ付きの内面を有する金型を使用する。In an injection molding method for forming molded articles of various shapes, a mold having a grained inner surface is used.
【0022】これらの方法では、転写するのでそれぞれ
シボロールやシボ付き金型のシボがが成形体表面に前述
の粗さをもたらすものを用いればよい。In these methods, since the transfer is performed, it is sufficient to use those in which the texture of the embossing roll or the embossing die gives the above-mentioned roughness to the surface of the molded body.
【0023】また、他の方法として、例えば、特公昭 5
0-2178号公報または、特開昭57-14650号公報に記載のあ
るごとく、メタクリル系樹脂を溶融混練する温度では溶
融しない有機系の微粒子や無機質の微粒子を混在させ、
その混在させた微粒子が、該成形体の表面に浮き出させ
ることにより、粗面を形成させる方法がある。微粒子が
球状であれば、帯電防止性がさらに向上する。As another method, for example, Japanese Patent Publication No.
As described in 0-2178 or JP-A-57-14650, organic fine particles and inorganic fine particles which are not melted at a temperature at which a methacrylic resin is melt-kneaded are mixed,
There is a method of forming a rough surface by allowing the mixed fine particles to float on the surface of the molded body. If the particles are spherical, the antistatic property is further improved.
【0024】混在させる微粒子としては、有機系粒子で
は、例えばスチレン系重合体、アクリル系重合体、シロ
キサン系重合体で、特に高い分子量のものあるいは、多
官能単量体との共重合体である架橋重合体が該当する。
無機系粒子の具体例としては硫酸バリウム、炭酸カルシ
ウム、シリカ、アルミナ、マグネシア、マイカ、タル
ク、水酸化アルミニウム、炭化チタン、ガラスビーズ、
ケイ酸カルシウム等である。Examples of the fine particles to be mixed include organic particles such as a styrene polymer, an acrylic polymer and a siloxane polymer, which have a particularly high molecular weight or a copolymer with a polyfunctional monomer. Crosslinked polymers are suitable.
Specific examples of the inorganic particles include barium sulfate, calcium carbonate, silica, alumina, magnesia, mica, talc, aluminum hydroxide, titanium carbide, glass beads,
Examples include calcium silicate.
【0025】所定の表面粗さとするには、上記微粒子の
粒径と添加量によって調整する。微粒子の粒径が大きく
なる程、Rz、Sm値は共に大きくなる。添加量が多い
程Sm値は小さくなる。To obtain a predetermined surface roughness, it is adjusted by the particle size of the fine particles and the addition amount. Both the Rz and Sm values increase as the particle size of the particles increases. The larger the added amount, the smaller the Sm value.
【0026】そこで目安として平均粒径が1〜100μ
m程度の粒子を1〜20重量部程度混在させる前提で数
回の試行によって所定の粗さを求めればよい。Therefore, as a guide, the average particle size is 1 to 100 μm.
The predetermined roughness may be obtained by several trials on the assumption that about 1 to 20 parts by weight of particles of about m are mixed.
【0027】これらの粒子を混在させるには、メタクリ
ル酸メチル系重合体と溶融混練する周知の方法でよく、
前述の帯電防止剤とを混合する際に同時に混合すればよ
い。そして押出機や射出成形機を介して、通常の成形方
法で所定の形状に賦形すればよい。なお、この賦形の
後、冷却をゆっくりする程、表面の粗さがはっきりと出
易くなる。To mix these particles, a well-known method of melt-kneading with a methyl methacrylate polymer may be used,
It may be mixed at the same time as the above-mentioned antistatic agent is mixed. Then, it may be shaped into a predetermined shape by an ordinary molding method through an extruder or an injection molding machine. After the shaping, the slower the cooling, the easier the surface roughness becomes.
【0028】[0028]
【発明の効果】本発明のメタクリル系樹脂成形体は、帯
電防止性にすぐれ、しかもその表面を払拭しても、帯電
防止性が喪失することなく維持される。成形体として
は、照明カバー、ディスプレイ用拡散板、看板、発光式
スイッチボタン、展示品表装用カバー、メーターカバー
等自動車の内外装部品や家庭用電気機器の外装部品等に
供される。EFFECT OF THE INVENTION The methacrylic resin molded product of the present invention has excellent antistatic properties, and even when the surface thereof is wiped, the antistatic properties are maintained without loss. The molded product is used for interior and exterior parts of automobiles such as lighting covers, display diffusion plates, signboards, light-emitting switch buttons, covers for display of articles, meter covers, and exterior parts of household electric appliances.
【0029】[0029]
【実施例】以下実施例によって本発明を更に詳しく説明
するが、本発明はこれら実施例によってなんら限定され
るものではない。なお、評価方法は以下のとおりであ
る。 ・帯電防止性:アクリル樹脂板を23℃、50%湿度の
状態に24時間放置した後、同雰囲気中でスタティクオ
ネストメーター(宍戸商会製)を用いて、印加電圧10
Kv、印加時間1分、テーブル回転数1300rpm 、の
条件で帯電圧の半減期を測定する。 ・耐払拭性:水を含ませたガーゼでアクリル樹脂板を5
回払拭した後、23℃、50%湿度の状態に24時間放
置した後、上記と同様に行って帯電防止性を評価した。 ・表面粗さ:JIS-B0601-1982に準拠して表面粗さ形状測
定機(東京精密製サーフコム550A )により十点平均粗さ(R
z)および平均山間隔(Sm)を測定した。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. The evaluation method is as follows.・ Antistatic property: After leaving the acrylic resin plate at 23 ° C. and 50% humidity for 24 hours, an applied voltage of 10 was applied in the same atmosphere using a static Honest meter (manufactured by Shishido Shokai).
The half-life of the charged voltage is measured under the conditions of Kv, application time of 1 minute and table rotation speed of 1300 rpm.・ Wipe resistance: 5 g of acrylic resin plate with gauze moistened with water
After being wiped off once, and allowed to stand for 24 hours at 23 ° C. and 50% humidity, the antistatic property was evaluated in the same manner as above.・ Surface roughness: In accordance with JIS-B0601-1982, a ten-point average roughness (R
z) and the average mountain interval (Sm) were measured.
【0030】実施例1 メタアクリル樹脂ビーズ(スミペックスEXA、住友化
学工業(株)製)100重量部と、n−ヘキサデシルス
ルホン酸ナトリウム1重量部をヘンシェルミキサーで混
合した後、押出機(一軸、スクリュー径40mm田辺プラ
スチック(株)製)で樹脂温度265℃でTダイから樹
脂シートを押出し、1番ロールがポリシングロール、2
番ロールがRz=50μm、Sm=120μmのパター
ンロール、3番ロールがポリシングロールのロールユニ
ットを用い、1番ロールの表面温度を120℃、2番ロ
ール表面温度を140℃、1番ロールの表面温度130
℃として、2mm厚、巾25cmのシートを得た。得られた
シートの評価結果を表1に示す。Example 1 100 parts by weight of methacrylic resin beads (SUMIPEX EXA, manufactured by Sumitomo Chemical Co., Ltd.) and 1 part by weight of sodium n-hexadecylsulfonate were mixed in a Henschel mixer, and then an extruder (uniaxial, With a screw diameter of 40 mm, manufactured by Tanabe Plastic Co., Ltd., a resin sheet is extruded from a T die at a resin temperature of 265 ° C., and the first roll is a polishing roll, and the second roll is a polishing roll.
No. 1 roll has a pattern unit with Rz = 50 μm and Sm = 120 μm, and No. 3 roll has a polishing roll. The surface temperature of No. 1 roll is 120 ° C., the surface temperature of No. 2 roll is 140 ° C., the surface of No. 1 roll. Temperature 130
A sheet having a thickness of 2 mm and a width of 25 cm was obtained at ℃. The evaluation results of the obtained sheet are shown in Table 1.
【0031】実施例2 実施例1における2番ロールのパターンロールをRz=
5μm、Sm=70μmとして、同様に2mm厚のシート
を得た。評価結果を表1に示す。Example 2 The pattern roll of No. 2 roll in Example 1 was Rz =
A sheet having a thickness of 2 mm was similarly obtained by setting 5 μm and Sm = 70 μm. The evaluation results are shown in Table 1.
【0032】実施例3 実施例1におけるn−ヘキサデシルスルホン酸ナトリウ
ム1部に代えてラウリルベンゼンスルホン酸ナトリウム
3部とした以外は同様に行って2mm厚のシートを得た。
評価結果を表1に示す。Example 3 A 2 mm thick sheet was obtained in the same manner as in Example 1 except that 1 part of sodium n-hexadecylsulfonate was replaced with 3 parts of sodium laurylbenzenesulfonate.
The evaluation results are shown in Table 1.
【0033】実施例4,5、比較例1 メタアクリル樹脂ビーズ(スミペックスMH 住友化学
工業(株)製)100重量部にn−ヘキサデシルスルホ
ン酸ナトリウム、および平均粒径30μmの架橋メタア
クリル樹脂ビーズ(スミペックスXC−1A 住友化学
工業(株)製)を表1に示す量を加え、ヘンシェルミキ
サーで混合した後、二軸脱揮押出機(日本製鋼所(株)
製 TEM−30)を用いて樹脂温度240℃にて樹脂
組成物のペレットを得た。このペレットを射出成形機
(名機製作所(株)製 M-140SJ )により成形温度25
0℃、金型温度60℃で径120mmの丸皿型金型により
成形し、丸皿型の成形品を得た。成形品の底部を切り出
し、板厚2.5mmの試験片を得た。評価結果を表1に示
す。Examples 4, 5 and Comparative Example 1 100 parts by weight of methacrylic resin beads (SUMIPEX MH, manufactured by Sumitomo Chemical Co., Ltd.), sodium n-hexadecylsulfonate, and crosslinked methacrylic resin beads having an average particle size of 30 μm. (SUMIPEX XC-1A manufactured by Sumitomo Chemical Co., Ltd.) was added in an amount shown in Table 1 and mixed with a Henschel mixer, and then a twin-screw devolatilizing extruder (Japan Steel Works, Ltd.) was added.
Pellets of the resin composition were obtained at a resin temperature of 240 ° C. by using TEM-30 manufactured by K.K. The pellets were molded at a molding temperature of 25 with an injection molding machine (M-140SJ manufactured by Meiki Seisakusho Co., Ltd.).
Molding was carried out at 0 ° C. and a mold temperature of 60 ° C. with a round plate mold having a diameter of 120 mm to obtain a round plate molded product. The bottom of the molded product was cut out to obtain a test piece having a plate thickness of 2.5 mm. The evaluation results are shown in Table 1.
【0034】実施例6,7、比較例2,3 実施例4,5、比較例1,2と同様にして得た樹脂ペレ
ットを、実施例1で使用した押出機を用い、溶融樹脂シ
ートを押出し、3本共ポリシングロールからなるロール
ユニットを介した以外は、実施例1と同様に行い、2mm
厚、巾27cmのシートを得た。得られたシートの評価結
果を表1に示す。Examples 6 and 7, Comparative Examples 2 and 3 Resin pellets obtained in the same manner as in Examples 4 and 5 and Comparative Examples 1 and 2 were melted into resin sheets using the extruder used in Example 1. Except for the extrusion, a roll unit consisting of three co-polishing rolls was used.
A sheet having a thickness of 27 cm was obtained. The evaluation results of the obtained sheet are shown in Table 1.
【0035】実施例8 実施例6における帯電防止剤を、ステアリン酸モノグリ
セライト(理研ビタミン(株)ポエムH−100)5重
量部を混合したものに代えた以外は、同様に行い2mm厚
のシートを得た。評価結果を表1に示す。Example 8 The procedure of Example 6 was repeated except that the antistatic agent in Example 6 was changed to a mixture of 5 parts by weight of monoglycerite stearate (RIKEN VITAM CO., LTD. Poem H-100). Got the sheet. The evaluation results are shown in Table 1.
【0036】[0036]
【表1】 [Table 1]
Claims (1)
に対して、スルホン酸塩基を有する炭化水素化合物、高
級脂肪酸モノグリセライド、ポリアルキレングリコール
から選ばれた少なくとも一種の帯電防止剤を0.5〜5
重量部含有してなるメタクリル系樹脂からなり、かつそ
の表面の十点平均粗さ(Rz)が1〜30μm,平均山
間隔(Sm)が10〜300μmである帯電防止性メタ
クリル系樹脂成形体。1. 0.5 to 5 of at least one antistatic agent selected from a hydrocarbon compound having a sulfonate group, a higher fatty acid monoglyceride, and a polyalkylene glycol based on 100 parts by weight of a methyl methacrylate-based polymer.
An antistatic methacrylic resin molding comprising a methacrylic resin in an amount of 10 parts by weight and having a surface ten-point average roughness (Rz) of 1 to 30 μm and an average pitch (Sm) of 10 to 300 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26712393A JP3264058B2 (en) | 1993-10-26 | 1993-10-26 | Antistatic methacrylic resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26712393A JP3264058B2 (en) | 1993-10-26 | 1993-10-26 | Antistatic methacrylic resin molding |
Publications (2)
Publication Number | Publication Date |
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JPH07117142A true JPH07117142A (en) | 1995-05-09 |
JP3264058B2 JP3264058B2 (en) | 2002-03-11 |
Family
ID=17440395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26712393A Expired - Lifetime JP3264058B2 (en) | 1993-10-26 | 1993-10-26 | Antistatic methacrylic resin molding |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013209669A (en) * | 2007-05-30 | 2013-10-10 | Techno Polymer Co Ltd | Thermoplastic resin composition for blow molding and product of blow molding |
WO2023100400A1 (en) * | 2021-11-30 | 2023-06-08 | 住友化学株式会社 | (meth)acrylic resin composition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0468045A (en) * | 1990-07-10 | 1992-03-03 | Asahi Chem Ind Co Ltd | Antistatic methacrylic resin composition excellent in thermal stability |
JPH05125247A (en) * | 1991-11-08 | 1993-05-21 | Kuraray Co Ltd | Antistatic methacrylic resin composition |
JPH05239305A (en) * | 1992-02-26 | 1993-09-17 | Kuraray Co Ltd | Methacrylic resin composition having antistatic property |
JPH05345848A (en) * | 1991-11-18 | 1993-12-27 | Kuraray Co Ltd | Antistatic methacrylic resin composition |
JPH07113030A (en) * | 1993-10-15 | 1995-05-02 | Lion Corp | Antistatic acrylic resin board |
-
1993
- 1993-10-26 JP JP26712393A patent/JP3264058B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0468045A (en) * | 1990-07-10 | 1992-03-03 | Asahi Chem Ind Co Ltd | Antistatic methacrylic resin composition excellent in thermal stability |
JPH05125247A (en) * | 1991-11-08 | 1993-05-21 | Kuraray Co Ltd | Antistatic methacrylic resin composition |
JPH05345848A (en) * | 1991-11-18 | 1993-12-27 | Kuraray Co Ltd | Antistatic methacrylic resin composition |
JPH05239305A (en) * | 1992-02-26 | 1993-09-17 | Kuraray Co Ltd | Methacrylic resin composition having antistatic property |
JPH07113030A (en) * | 1993-10-15 | 1995-05-02 | Lion Corp | Antistatic acrylic resin board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013209669A (en) * | 2007-05-30 | 2013-10-10 | Techno Polymer Co Ltd | Thermoplastic resin composition for blow molding and product of blow molding |
WO2023100400A1 (en) * | 2021-11-30 | 2023-06-08 | 住友化学株式会社 | (meth)acrylic resin composition |
Also Published As
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JP3264058B2 (en) | 2002-03-11 |
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