JPH07115154A - Computer cooling system - Google Patents

Abstract

PURPOSE:To partially cool down coolant adjacent to a cooling module without producing dew on a coolant piping system to efficiently cool a semiconductor device of high heat generation by a method wherein a coolant cooling means is provided in front of the cooling module. CONSTITUTION:In a computer cooling system, a computer cooling module 3 and a heat exchanger 4 are connected together with low-boiling point coolant circulating pipings 27 to 30 so as to circulate low-boiling point coolants 23 to 25, a coolant storage tank 9 where a low-boiling point coolant 25 is temporarily stored is provided to the piping at a point between the heat exchanger 4 and the cooling module 3. Inert gas is made to blow into the coolant storage tank 9 to promote the evaporation of low-boiling point coolant 29 so as to cool the low-boiling point coolant 25 again by evaporation heat, and coolant 25 is fed to the cooling module 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer cooling system, and more particularly to a cooling system in which a semiconductor element is directly or indirectly cooled with a low boiling point refrigerant.

[0002]

2. Description of the Related Art Conventionally, as means for cooling an integrated circuit mounted on a circuit board such as a printed circuit board wiring or a ceramic board of a super large computer, for example, Japanese Patent Laid-Open No. 59-1455.
As described in Japanese Patent Laid-Open No. 48, a method of circulating a low boiling point refrigerant directly in an integrated circuit for computer cooling is known. Further, as a method of further increasing the cooling capacity, there is a method of utilizing heat of vaporization due to boiling of the liquid refrigerant for cooling.

[0003]

In a computer cooling system according to the prior art, a low boiling point refrigerant circulates through a cooling module having a semiconductor element as a heating element and a heat exchanger, and a semiconductor mounted inside the cooling module. The low boiling point refrigerant heated by the heat generated by the element is cooled by the heat exchanger for heat dissipation. At this time, since the heat exchanger and the cooling module are separated from each other, excessive cooling in the heat exchanger causes dew condensation in the refrigerant piping system from the heat exchanger to the cooling module, which is fatal to the electronic device. There is a risk of causing damage such as a short circuit. Therefore, the heat exchanger can only cool the refrigerant piping system to such an extent that dew condensation does not occur. An object of the present invention is to provide a technique for efficiently cooling a semiconductor element, which is a heating element, by supplying a low-temperature low-boiling-point refrigerant in a cooling module without causing dew condensation in the refrigerant piping system.

[0004]

A cooling system for a computer according to the present invention comprises a cooling module of the computer and a heat exchanger which are connected by a refrigerant flow pipe so that a low boiling point refrigerant circulates. A cooling medium storage tank for temporarily storing a low boiling point cooling medium is provided in the middle of the pipe from the cooling module to the cooling module, and means for blowing an inert gas into this storage tank is additionally provided. In this case, it is effective to provide a gas-liquid separator after the heat exchanger and use the gas separated by the gas-liquid separator as the inert gas.

[0005]

According to the above technical means, the refrigerant cooled to such an extent that the refrigerant piping system is not condensed by the heat exchanger for radiating the refrigerant is transferred to the refrigerant storage tank provided in the middle of the piping from the heat exchanger to the cooling module. Store temporarily. By blowing an inert gas into the low boiling point refrigerant stored in the refrigerant storage tank, vaporization of the low boiling point refrigerant is promoted, and the low boiling point refrigerant cooled by the heat of vaporization is supplied to the cooling module. When the refrigerant is cooled by its own latent heat of vaporization, the lower the boiling point of the refrigerant, the greater the effect. By this method, it is possible to partially cool the refrigerant in the vicinity of the cooling module on which the semiconductor element that is the heat generating element is mounted, and to supply a lower boiling point refrigerant having a lower temperature to the cooling module, and to cool the semiconductor element with high heat generation. Cooling becomes highly efficient. Also,
Since the recooling means is provided immediately before the cooling module, there is no fear of dew condensation on the refrigerant piping system. Furthermore, since a gas-liquid separator is provided in the latter stage of the heat exchanger and the gas separated by the gas-liquid separator is used as the inert gas blown into the refrigerant storage tank, the inert gas can be circulated and effectively used.

[0006]

1 is a system diagram showing an embodiment of a computer cooling system according to the present invention. This embodiment comprises two blocks, a processor unit A and a coolant supply unit B. One or a plurality of semiconductor elements 2 are mounted on an integrated circuit board 1 inside a computer housing and are directly immersed in a low boiling point refrigerant 23. The low boiling point refrigerant is supplied to the cooling module 3 and the heat exchanger 4 by the pump 7.
And is circulating. A refrigerant storage tank 9 for temporarily storing a low-boiling-point refrigerant is provided in front of the cooling module 3, and an inert gas is blown into the low-boiling-point refrigerant 25 in the refrigerant storage tank 9 via the compressor 8. At this time, the inert gas is formed into bubbles 13 appropriately dispersed by the bubble generation nozzle 12, and the amount of gas blown in is controlled by the control valve 10. Further, the refrigerant storage tank 9 is provided with a bellows 11 for alleviating a pressure fluctuation caused by blowing an inert gas. By blowing an inert gas into the low boiling point refrigerant 25, the vaporization of the low boiling point refrigerant 25 is promoted, and the low boiling point refrigerant cooled by the heat of vaporization is supplied to the pipe 27.
Is supplied to the cooling module 3. The low boiling point refrigerant is heated by the heat generated by the semiconductor element 2 mounted inside the cooling module 3, and is partially vaporized into a gas-liquid two-phase state and discharged from the cooling module. The gas-liquid two-phase low boiling point refrigerant is the pipe 2
At 8 the heat is introduced into the heat exchanger 4 for heat dissipation, where it is condensed. The low-boiling-point refrigerant 24 and the inert gas 26 are separated by the gas-liquid separator 6 provided in the latter stage of the heat exchanger 4, and the low-boiling-point refrigerant is supplied to the refrigerant storage tank 9 via the pipe 29 and the pump 7. The inert gas is blown into the refrigerant storage tank 9 through the pipe 30 and the compressor 8. Here, since the inert gas 26 is stored together with the low boiling point refrigerant 24 in the gas-liquid separator 6, the safety valve 5 is provided as a measure against pressure fluctuation.

FIG. 2 is a system diagram showing a second embodiment of the computer cooling system according to the present invention. This embodiment comprises two blocks, a processor unit A and a coolant supply unit B. One or a plurality of semiconductor elements 2 are mounted on an integrated circuit board 1 inside a computer housing and are indirectly cooled by a low boiling point refrigerant 23. The low boiling point refrigerant is circulated through the cooling module 3 and the heat exchanger 4 by the pump 7. A refrigerant storage tank 9 for temporarily storing a low-boiling-point refrigerant is provided in front of the cooling module 3, and an inert gas is blown into the low-boiling-point refrigerant 25 in the refrigerant storage tank 9 via the compressor 8. At this time, the inert gas is formed into bubbles 13 appropriately dispersed by the bubble generation nozzle 12, and the amount of gas blown in is controlled by the control valve 10. Further, the refrigerant storage tank 9 is provided with a bellows 11 for alleviating a pressure fluctuation caused by blowing an inert gas. By blowing an inert gas into the low boiling point refrigerant 25, the vaporization of the low boiling point refrigerant 25 is promoted, and the low boiling point refrigerant cooled by the heat of vaporization is pipe 2
At 7, the cooling module 3 is supplied. The low boiling point refrigerant is heated by the heat generated by the semiconductor element 2 mounted inside the cooling module 3, and is partially vaporized into a gas-liquid two-phase state and discharged from the cooling module. The gas-liquid two-phase low boiling point refrigerant is introduced into the heat exchanger 4 for heat dissipation through the pipe 28, and is condensed therein. The low-boiling-point refrigerant 24 and the inert gas 26 are separated by the gas-liquid separator 6 provided in the latter stage of the heat exchanger 4, and the low-boiling-point refrigerant is supplied to the refrigerant storage tank 9 through the pipe 29 and the pump 7, The inert gas is blown into the refrigerant storage tank 9 through the pipe 30 and the compressor 8. Here, since the inert gas 26 is stored together with the low boiling point refrigerant 24 in the gas-liquid separator 6, the safety valve 5 is provided as a measure against pressure fluctuation.

FIG. 3 is a system diagram showing a third embodiment of the computer cooling system according to the present invention. This embodiment comprises two blocks, a processor unit A and a coolant supply unit B. One or a plurality of semiconductor elements 2 are mounted on an integrated circuit board 1 inside a computer housing and are directly immersed in a low boiling point refrigerant 23. The low boiling point refrigerant is circulated through the cooling module 3 and the heat exchanger 4 by the pump 7. The inside of the cooling module 3 is divided into a refrigerant supply flow path 20 and a refrigerant return flow path 21, and the refrigerant is ejected toward the semiconductor element 2 from a refrigerant ejection nozzle 22 for ejecting the refrigerant. A refrigerant storage tank 9 for temporarily storing a low-boiling-point refrigerant is provided in front of the cooling module 3, and an inert gas is blown into the low-boiling-point refrigerant 25 in the refrigerant storage tank 9 via the compressor 8. At this time, the inert gas is formed into bubbles 13 appropriately dispersed by the bubble generation nozzle 12, and the amount of gas blown in is controlled by the control valve 10. Further, the refrigerant storage tank 9 is provided with a bellows 11 for alleviating a pressure fluctuation caused by blowing an inert gas. By blowing an inert gas into the low boiling point refrigerant 25, the vaporization of the low boiling point refrigerant 25 is promoted, and the low boiling point refrigerant cooled by the heat of vaporization is supplied to the pipe 27.
Is supplied to the cooling module 3. The low boiling point refrigerant is heated by the heat generated by the semiconductor element 2 mounted inside the cooling module 3, and is partially vaporized into a gas-liquid two-phase state and discharged from the cooling module. The gas-liquid two-phase low boiling point refrigerant is the pipe 2
At 8 the heat is introduced into the heat exchanger 4 for heat dissipation, where it is condensed. The low-boiling-point refrigerant 24 and the inert gas 26 are separated by the gas-liquid separator 6 provided in the latter stage of the heat exchanger 4, and the low-boiling-point refrigerant is supplied to the refrigerant storage tank 9 via the pipe 29 and the pump 7. The inert gas is blown into the refrigerant storage tank 9 through the pipe 30 and the compressor 8. Here, since the inert gas 26 is stored together with the low boiling point refrigerant 24 in the gas-liquid separator 6, the safety valve 5 is provided as a measure against pressure fluctuation.

FIG. 4 is a block diagram showing a fourth embodiment of the computer cooling system according to the present invention. In this embodiment, the processor unit A and the coolant supply unit B are composed of two blocks. One or a plurality of semiconductor elements 2 are mounted on an integrated circuit board 1 inside a computer housing and are directly cooled by a low boiling point refrigerant 23. The low boiling point refrigerant is circulated through the cooling module 3 and the heat exchanger 4 by the pump 7. The inside of the cooling module 3 is separated into a refrigerant storage portion 14 and a gas flow passage 15, and an inert gas is blown into the refrigerant storage portion 14 from the gas flow passage 15. At this time, the inert gas is made into bubbles 13 appropriately dispersed by the bubble generation nozzle 12, and the amount of gas blown in is controlled by the control valve 10. A bellows 11 is provided in the coolant reservoir 14 in order to reduce pressure fluctuations caused by blowing bubbles 13 into the coolant reservoir 14. Low boiling point refrigerant inside the cooling module 2
3 is heated by the heat generation of the semiconductor element 2, but by blowing the bubbles 13 of the inert gas into the refrigerant reservoir 14, the vaporization of the low boiling point refrigerant 23 in the refrigerant reservoir 14 is promoted, and the vaporization heat of the semiconductor The cooling efficiency of the element 2 is improved. Furthermore, since the bubble-like inert gas is blown directly into the refrigerant reservoir 14 inside the cooling module, it is possible to cool only the refrigerant inside the cooling module, and there is also the effect of forced convection. The low boiling point refrigerant is heated by the heat generation of the semiconductor element 2 mounted inside the cooling module 3, and is partially vaporized into a gas-liquid two-phase state and discharged from the cooling module. The gas-liquid two-phase low boiling point refrigerant is introduced into the heat exchanger 4 for heat dissipation through the pipe 28, and is condensed therein. The low-boiling-point refrigerant 24 and the inert gas 26 are separated by the gas-liquid separator 6 provided at the subsequent stage of the heat exchanger 4, and the low-boiling-point refrigerant 24 passes through the pipe 29 and the pump 7 and the refrigerant reservoir 14 of the cooling module 3. On the other hand, the inert gas 26 is supplied to the gas flow path 15 of the cooling module 3 via the pipe 30 and the compressor 8. Here, since the inert gas 26 is stored together with the low boiling point refrigerant 24 in the gas-liquid separator 6, the safety valve 5 is provided as a measure against pressure fluctuation.

FIG. 5 is a system diagram showing a fifth embodiment of the computer cooling system according to the present invention. In this embodiment, the processor unit A and the coolant supply unit B are composed of two blocks. One or a plurality of semiconductor elements 2 are mounted on an integrated circuit board 1 inside a computer housing and are directly immersed in a low boiling point refrigerant 23.
The inert gas passes through the compressor 8 and the pipes 28, 30.
Is circulated through the cooling module 3 and the heat exchanger 4. The inside of the cooling module 3 is separated into a refrigerant storage portion 14 and a gas flow passage 15, and an inert gas is blown into the refrigerant storage portion 14 from the gas flow passage 15. The inert gas is made into bubbles 13 dispersed appropriately by the bubble generation nozzle 12, and the amount of gas blown in is controlled by the control valve 10. A bellows 11 is provided in the coolant reservoir 14 in order to reduce pressure fluctuations caused by blowing bubbles 13 into the coolant reservoir 14. The low-boiling-point refrigerant 23 inside the cooling module is heated by the heat generated by the semiconductor element 2, but the low-boiling-point refrigerant 2 inside the refrigerant reservoir 14 is blown by blowing the bubbles 13 of the inert gas into the refrigerant reservoir 14.
3 is promoted to be vaporized, and the heat of vaporization improves the cooling efficiency of the semiconductor element 2. Furthermore, since the bubble-like inert gas is blown directly into the refrigerant storage portion 14 inside the cooling module, it becomes possible to cool only the refrigerant inside the cooling module, and there is also the effect of forced convection. A part of the low boiling point refrigerant is vaporized by heating the semiconductor element 2 mounted inside the cooling module 3 with heat and blowing an inert gas. Therefore, the vapor of the low boiling point refrigerant and the inert gas coexist in the vapor phase of the refrigerant reservoir 14. The vapor of the low-boiling-point refrigerant and the inert gas rise in the pipe 28, and the heat exchanger 4
Are introduced into the reactor and only the refrigerant vapor is condensed there. The low-boiling-point refrigerant 24 is supplied to the gas-liquid separator 6 provided after the heat exchanger 4.
And the inert gas 26 are separated. Liquefied low boiling point refrigerant 2
4 flows through the pipe 29 by gravity, and the cooling module 3
Is supplied to the refrigerant reservoir 14. On the other hand, the inert gas 26
Is supplied to the gas flow path 15 of the cooling module 3 via the compressor 8 and the pipe 30. Here, the gas-liquid separator 6
Since the low boiling point refrigerant 24 and the inert gas 26 are stored therein, the safety valve 5 is provided as a measure against pressure fluctuation.

FIG. 6 is a sectional view of the refrigerant storage tank 9 in the first embodiment. The refrigerant storage tank 9 has a refrigerant supply port 17 for supplying the refrigerant at one end and a refrigerant discharge port 18 for discharging the refrigerant at the other end. The tip of the bubble generation nozzle 12 for ejecting the inert gas into the low boiling point refrigerant 25 temporarily stored in the refrigerant storage tank 9 is composed of the porous body 16, and the low boiling point refrigerant 25 has a plurality of uniform and fine particles. It is possible to generate bubbles 13. Further, the refrigerant storage tank 9 is provided with a bellows 11 for alleviating pressure fluctuations.

FIG. 7 is a sectional view of another refrigerant storage tank 9 in the first embodiment. The refrigerant storage tank 9 has a refrigerant supply port 17 for supplying the refrigerant at one end and a refrigerant discharge port 18 for discharging the refrigerant at the other end. In the low boiling point refrigerant 25 temporarily stored in the refrigerant storage tank 9, the tip of the bubble generation nozzle 12 for ejecting the inert gas is bent so as to be horizontal to the liquid surface of the refrigerant. Bubble outlet 1
9, it is possible to generate a plurality of uniform and fine bubbles 13 in the refrigerant. Further, the refrigerant storage tank 9 is provided with a bellows 11 for alleviating pressure fluctuations.

[0013]

According to the present invention, since the means for recooling the low boiling point refrigerant is provided in the middle of the piping from the heat exchanger to the cooling module, the refrigerant in the cooling module can be partially cooled without dew condensation on the refrigerant piping system. It becomes possible to cool it. As a result, cooling of the semiconductor element, which is a high heat generating element mounted on the substrate, becomes highly efficient.

Further, according to the fourth embodiment, a pump for circulating the refrigerant is unnecessary, and the computer apparatus as a whole can be downsized.

[Brief description of drawings]

FIG. 1 is a system diagram of an embodiment of a computer cooling system of the present invention.

FIG. 2 is a system diagram of a second embodiment of the computer cooling system of the present invention.

FIG. 3 is a system diagram of a third embodiment of the computer cooling system of the present invention.

FIG. 4 is a system diagram of a fourth embodiment of the computer cooling system of the present invention.

FIG. 5 is a system diagram of a fifth embodiment of the computer cooling system of the present invention.

FIG. 6 is a sectional view of the refrigerant storage tank according to the first embodiment.

FIG. 7 is a sectional view of another refrigerant storage tank according to the first embodiment.

[Explanation of symbols]

A ... Processor unit, B ... Refrigerant supply unit, 1 ...
Integrated circuit board, 2 ... Semiconductor element, 3 ... Cooling module,
4 ... Heat exchanger, 5 ... Safety valve, 6 ... Gas-liquid separator, 7 ... Pump, 8 ... Compressor, 9 ... Refrigerant storage tank, 10 ... Control valve,
11 ... Bellows, 12 ... Air bubble generating nozzle, 13 ... Air bubble,
23 to 25 ... Low boiling point refrigerant, 26 ... Inert gas, 27 to 3
0 ... Piping.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenichi Kasai, No. 1 Horiyamashita, Horiyamashita, Hadano-shi, Kanagawa Prefecture General Computer Division, Hitate Manufacturing Co., Ltd. Machinery Research Laboratory

Claims (4)

[Claims] 1. A cooling system for a computer, comprising a cooling module having a semiconductor element, which is a heating element, and a heat exchanger connected by a refrigerant flow pipe so that a low boiling point refrigerant circulates. A cooling system for a computer, wherein a refrigerant storage tank for temporarily storing the low-boiling-point refrigerant is provided in the middle of a pipe reaching the module, and means for blowing an inert gas into the refrigerant storage tank is additionally provided. 2. The cooling system for a computer according to claim 1, wherein a gas-liquid separator is provided at a stage subsequent to the heat exchanger, and the gas separated by the gas-liquid separator is used as the inert gas. 3. A cooling system for a computer in which a cooling module having a semiconductor element as a heating element and a heat exchanger are connected by a refrigerant flow pipe so that a low boiling point refrigerant circulates. A computer cooling system, characterized in that a means for blowing an inert gas is attached to the storage part. 4. A semiconductor element, which is a heating element, is immersed in a low boiling point refrigerant, and a cooling module having the semiconductor element and a heat exchanger are connected by a refrigerant flow pipe so that the low boiling point refrigerant circulates. In a computer cooling system, a means for directly spraying an inert gas toward each of the semiconductor elements in the cooling module is attached, and a vapor of a low boiling point refrigerant and an inert gas generated in the cooling module are passed through the distribution pipe. A computer cooling system characterized by being circulated.