JPH07115106A - Tape for tab - Google Patents

Abstract

PURPOSE:To obtain a tape for TAB having excellent heat-resisting property, high insulating reliability and also having small curling and warpage by a method wherein the polyimide, having a specific linear expansion coefficient, is used for an organic insulating film layer. CONSTITUTION:A TAB tape consists of an organic insulating film, an adhesive layer and a protective layer. The organic insulating film is a polyimide film having the linear expansion coefficient which is 1.0 to 1.6 times of the linear expansion coefficient of copper. The organic insulating film consists of pyromellitic dianhydride or its derivative and one kind selected from benzophenonetetracarboxylic dianhydride, oxydiphthalic dianhydride and biphenyltetracarboxylic dianhydride, or a plurality of acid anhydride components, one or more kinds of linear diamine and refractive diamine. The adhesive layer consists of a compound having two or more epoxy radicals in a molecule, epoxy denatured polyamide resin, a compound having one or more epoxy radical, a diamine compound, an acid anhydride, a compound having one or more phenolic hydroxyl group, and cyanate ester resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a TAB (Tape Automat).
Regarding the tape used in the ed bonding method (hereinafter referred to as TAB tape), more specifically, in the process of assembling a semiconductor device, a protective layer, an adhesive, which is attracting attention when the device has multiple pins, is miniaturized, and has a high density mounting. The present invention relates to a TAB tape having a three-layer structure of an agent layer and an organic insulating film.

[0002]

PRIOR ART AND PROBLEMS TO BE SOLVED BY THE INVENTION TAB
Tape for slitting, punching, copper foil laminating, adhesive curing, pattern formation (resist coating, copper etching, resist peeling), plating treatment,
Inner lead bonding, resin sealing, punching, outer lead bonding are packaged and mounted on a device by the above processing steps.

In these processing steps, since the adhesive layer and the organic insulating film remain in the peripheral circuit and the sealing resin, the insulation reliability between the patterns of the copper foil is increasing while the density is further increased. And ionic impurities that affect the corrosion resistance and corrosion of the aluminum wiring of the chip become a problem. Insulation reliability is often attributed to the characteristics of the adhesive. For TAB tape, etching liquid (containing acid and chlorine ions), resist stripping liquid (containing alkali and potassium ions), plating liquid (containing chlorine ions and sulfate ions), etc. As a result, the ionic impurities may be incorporated into the adhesive or contained in the adhesive itself.

Conventionally, epoxy / polyamide (nylon) type adhesives have been widely used as adhesives which have been used for substrate materials such as flexible printed circuit boards. However, this has a property that ionic impurities (especially chlorine ions) are easily taken in during processing and is easily hydrolyzed, so that insulation deterioration such as metal migration between patterns has been a problem.

Further, in the inner lead bonding process, heat from the bonding tool is transferred to the adhesive layer, so that heat resistance (high adhesiveness at high temperature) is required. The decline was a problem.

Further, in the processing step, the warp of the tape may become a problem. The warp of the tape largely depends on the degree of curing shrinkage of the adhesive and the linear expansion coefficient of the organic insulating film as the base material.

In the process of processing the TAB tape, many processes including stress and temperature change are included.
Therefore, it is generally desired that the organic insulating film as the base material has a small dimensional change due to stress or temperature change. In order to reduce the dimensional change due to stress, it is effective that the film has a high elastic modulus, and in order to reduce the dimensional change due to temperature change, it is generally effective that the linear expansion coefficient of the film is small. is there. However, TA
In the case of B application, etc., since the film, the copper foil, and the adhesive have a three-layer laminated structure, if the coefficient of linear expansion becomes too small, the amount of expansion and contraction of copper due to heat becomes larger than that of the film. Will occur. More specifically, in the process of cooling from the bonding temperature or the curing temperature of the adhesive to room temperature, warpage and curling occur due to the difference in the coefficient of linear expansion from that of the copper foil. From this viewpoint, it can be said that the linear expansion coefficient of the film is preferably equal to that of copper.

This finding is based on, for example, Japanese Unexamined Patent Publication No. 5-07059.
No. 1, which discloses a film having a coefficient of linear expansion equivalent to that of a copper foil and a high elastic modulus. However, when a film having a coefficient of linear expansion equivalent to that of a copper foil is used, there is no warp only immediately after being cooled to room temperature, and thereafter, the film warps or curls as it stretches due to moisture absorption. It will be. For this reason, in order to obtain a laminate with small warpage and curl after absorbing moisture to the saturated state, it is necessary to have a coefficient of linear expansion slightly larger than that of the copper foil.

Therefore, the present inventors have proposed a TA which does not cause the above problems in the conventional TAB tape.
As a result of intensive studies aimed at providing a tape for B, the present invention has been achieved.

[0010]

The gist of the TAB tape according to the present invention is that the TAB tape comprises an organic insulating film layer, an adhesive layer, and a protective layer.
The organic insulating film layer is a polyimide film having a linear expansion coefficient of 1.0 to 1.6 times the linear expansion coefficient of copper, and the polyimide film is pyromellitic dianhydride or a derivative thereof, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4
4'-oxydiphthalic dianhydride, 3,3 ', 4,4'
An imide polyamic acid synthesized from any one or a plurality of acid dianhydride components selected from biphenyltetracarboxylic dianhydride, one or more linear diamines, and one or more flexible diamines It has become a reality.

In the TAB tape, the adhesive layer is obtained by reacting a compound having at least two epoxy groups in the molecule with a dicarboxylic acid-terminated polyamide oligomer starting from dimer acid. Epoxy modified polyamide resin, one or more epoxy group-containing compounds and diamine compounds, acid anhydrides, compounds having one or more phenolic hydroxyl groups, and one or more curing agent components selected from cyanate ester resins It is to mix and.

Another aspect of the TAB tape according to the present invention is that in the TAB tape comprising an organic insulating film layer, an adhesive layer, and a protective layer, the adhesive layer is at least in the molecule. An epoxy-modified polyamide resin obtained by reacting a compound having two or more epoxy groups with a dicarboxylic acid-terminated polyamide oligomer using dimer acid as a raw material, a compound having one or more epoxy groups, a diamine compound, and an acid anhydride Compound, a compound having one or more phenolic hydroxyl groups, and one or more curing agent components selected from cyanate ester resins.

In the TAB tape, the hardener component in the adhesive layer is a cyanate ester resin.

[0014]

EXAMPLE A TAB tape according to the present invention has a three-layer structure in which an organic insulating film, a semi-cured (B-stage state) adhesive layer, and a protective film serving as a protective layer are sequentially laminated. It First, each component of the TAB tape according to the present invention will be described.

The organic insulating film in the present invention is a polyimide film having a coefficient of linear expansion of 1.0 to 1.6 times that of copper, and a thickness of preferably 25 to 190 μm.
It is more preferably 50 to 125 μm.
Such a polyimide film includes pyromellitic dianhydride or a derivative thereof (hereinafter referred to as pyromellitic dianhydride), 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, and 3,3 ′. Any one or more acid dianhydride components selected from ', 4,4'-oxydiphthalic dianhydride and 3,3', 4,4'-biphenyltetracarboxylic dianhydride (hereinafter, referred to as 3, 3 ′, 4,4′-benzophenone tetracarboxylic acid dianhydride and other acid dianhydride components), one or more linear diamines, and one or more flexible diamines synthesized from polyamic acid. Obtained by imidization.

The polyimide film is prepared by first dissolving or diffusing the linear diamine and the flexible diamine in an organic solvent in an atmosphere of an inert gas such as argon or nitrogen to obtain the pyromellitic dianhydride and the pyromellitic dianhydride. A mixture of acid dianhydride components such as 3,3 ′, 4,4′-benzophenonetetracarboxylic acid dianhydride in the form of a solution or a slurry with a solid or organic solvent is added, and a polyamic acid which is a precursor of polyimide is added. After obtaining a solution, it is obtained by forming a film and thermally and / or chemically performing dehydration ring closure (imidization).

In the reaction for obtaining a polyamic acid solution, contrary to the above, first, pyromellitic dianhydride and 3,
A solution of an acid dianhydride component such as 3 ′, 4,4′-benzophenonetetracarboxylic acid dianhydride is prepared, and a mixture of a linear diamine and a flexible diamine is added to the solution, which is a solution of a solid or an organic solvent, or It may be added in the form of a slurry.

A method of thermally and / or chemically performing dehydration ring closure (imidization) will be described with reference to an example. In the thermal method, the polyamic acid solution is used as a support plate, an organic film such as PET, a drum or an endless film. It is cast or coated on a support such as a belt to form a film, and dried to obtain a film having self-supporting properties. This drying is preferably carried out at a temperature of 150 ° C. or lower for about 5 to 90 minutes. Next, this is further heated and dried to imidize to obtain a polyimide film used in the present invention. The temperature during heating is 150-500
Temperatures in the range of ° C are preferred. There is no limitation on the rate of temperature increase during heating, but it is preferable that the maximum temperature reaches the above temperature by gradually heating. The heating time varies depending on the film thickness and the maximum temperature, but is generally preferably in the range of 10 seconds to 5 minutes after the maximum temperature is reached. When the film having self-supporting properties is heated, it is preferable to peel it off from the support and fix the ends in this state to heat it, so that a film having a small linear expansion coefficient can be obtained.

In the chemical method, a dehydrating agent in a stoichiometric amount or more and a catalytic amount of a tertiary amine are added to the polyamic acid solution, and the same treatment as in the case of thermal dehydration is carried out.
The desired polyimide film can be obtained in a shorter time than when thermally dehydrated.

Comparing the thermal imidization method and the chemical imidization method, the chemical method has the advantages that the mechanical strength of the obtained polyimide is large and the linear expansion coefficient is small. . In addition, it is also possible to use the method of thermally imidizing and the method of chemically imidizing together.

Thus, the polyimide film used in the present invention can be obtained by thermally and / or chemically imidizing the above polyamic acid solution.

The term "linear diamine" as used herein means a diamine having a structure that does not include a bending group such as an ether bond and the direction of the main chain of the diamine coincides with the straight line connecting two nitrogen atoms. 1

[Chemical 1] (However, X is F, Cl, Br, CH ₃ , CH ₃ O,
Examples thereof include diamines such as CF ₃ and CF ₃ O).

On the other hand, the flexible diamine is a diamine having a structure containing a flexible group such as an ether bond or a carbonyl group in the main chain, or a straight line connecting two nitrogen atoms does not coincide with the main chain direction of the diamine. A diamine having a different structure, for example, chemical formula 2, chemical formula 3, chemical formula 4

[Chemical 2]

[Chemical 3]

[Chemical 4] (However, X is F, Cl, Br, CH ₃ , CH ₃ O,
Examples thereof include diamines such as CF ₃ and CF ₃ O).

The ratio of the above-mentioned acid dianhydride is preferably 5 to 70 mol% of pyromellitic dianhydride in the total acid dianhydride and 3,3 ', 4,4'-benzophenonetetra Acid dianhydride component such as carboxylic acid dianhydride is 3
It is preferably 0 to 95 mol%, more preferably 10 to 50 mol% of pyromellitic dianhydride,
The acid dianhydride component such as 3 ′, 4,4′-benzophenonetetracarboxylic acid is preferably 50 to 90 mol%.
If the amount of pyromellitic dianhydride is too large, the linear expansion coefficient becomes too small, while if the amount of the acid dianhydride component such as 3,3 ′, 4,4′-benzophenonetetracarboxylic acid is too large, the elastic modulus becomes small. Therefore, the above ratio is preferable.

The ratio of the above-mentioned diamine is preferably 30 to 90 mo of linear diamine in all diamines.
1%, and the flexible diamine is preferably 10 to 70 mol%.

The combination of the above components is suitable for obtaining a film having a high elastic modulus and a coefficient of linear expansion slightly larger than that of copper. Among them, the acid dianhydride component is pyromellitic dianhydride. Things and 3,3 ',
It is more preferable to use 4,4′-benzophenone tetracarboxylic acid dianhydride and, as the diamine component, paraphenylenediamine for the linear diamine and 4,4′-diaminodiphenyl ether for the flexible diamine in terms of the property balance. .

Next, as the adhesive layer, a thermosetting type and a semi-cured type (B-stage state) is used. This adhesive layer comprises an epoxy-modified polyamide resin obtained by reacting a compound having two or more epoxy groups in the molecule with a dicarboxylic acid-terminated polyamide oligomer starting from dimer acid, and one epoxy group. It is obtained by blending the above compound with one or more curing agent components selected from diamine compounds, acid anhydrides, compounds having one or more phenolic hydroxyl groups, and cyanate ester resins. The thickness of the adhesive layer is preferably 5 to 40 μm, more preferably 10 to 30 μm.

In the adhesive layer, the epoxy-modified polyamide resin is a dicarboxylic acid-terminated polyamide using an organic solvent such as toluene or chlorobenzene as a reaction solvent.
Add an epoxy resin having two or more epoxy groups, and preferably add a slight excess amount of the epoxy resin so that the abundance ratio of the epoxy groups is higher than the dicarboxylic acid group, and react under heating. Obtained by
At this time, the yield can be further increased by using a reaction catalyst such as triethylamine. It is important to use dicarboxylic acid terminated polyamide for this reaction. If an amine-terminated polyamide is used, the secondary amine formed by reacting with the epoxy will further react with the epoxy, and the resulting tertiary amine will accelerate the reaction between the epoxy and the amine, leading to a complicated reaction. Therefore, it is necessary to use a dicarboxylic acid-terminated polyamide for the synthesis of the epoxy-modified polyamide resin.
These epoxy resins may be used alone or as a mixture of two or more kinds.

The dicarboxylic acid-terminated polyamide can be obtained by reacting dimer acid with diamine or diisocyanate. By using dimer acid as a monomer, a polyamide having low hygroscopicity can be obtained. The diamine can be obtained by adding an excessive amount of diamine to the carboxylic acid using a known method. Further, diisocyanate can be obtained by using an organic solvent such as N-methyl-2-pyrrolidone or dimethylformamide as a reaction solvent and adding an excessively small amount of diisocyanate to a carboxylic acid and reacting with heating.

As the diamine or diisocyanate to be reacted with the dimer acid, various kinds can be used, but isophorone diisocyanate is particularly preferable from the viewpoint of hygroscopicity and heat resistance.

The dimer acid may be any dimer acid as long as it is made of unsaturated fatty acid as a raw material, and may contain monomer acid, trimer acid and the like. Further, hydrogenated dimer acid in which the double bond is saturated may be used.

The molecular weight of the dicarboxylic acid terminated polyamide is preferably 1,000 to 30,000. If it is smaller than this, flexibility as a polyamide is not sufficiently expressed. On the other hand, if it is larger than this, the reaction becomes difficult when epoxidizing the dicarboxylic acid terminated polyamide.

As the epoxy resin to be reacted with the dicarboxylic acid terminated polyamide, a bifunctional epoxy resin having two epoxy groups in its molecular skeleton, as represented by a bisphenol A type epoxy resin, is easy to control the reaction. Yes preferred.

A part of a polyfunctional epoxy resin having three or more epoxy groups on the molecular skeleton can also be used. For example, phenol novolac type epoxy resin, cresol novolac type epoxy resin, tetraglycidyl amine type tetrafunctional epoxy resin, triglycidyl amine type 3
A functional epoxy resin, a naphthalene-based trifunctional epoxy resin, or the like can be used. However, if the number of functional groups (epoxy groups) in the polyfunctional epoxy resin is too large, branching of the molecular chain becomes too complicated and the viscosity becomes too high, which causes problems in handling and may cause gelation in extreme cases. There is not preferable. Also, regarding the amount used, when a polyfunctional epoxy resin is used, it is 1/5 of the number of moles of the bifunctional epoxy resin.
The following is preferable. When the amount of the polyfunctional epoxy resin is larger than this, crosslinking is too complicated to cause gelation at the synthesis stage, which is difficult to handle, and flexibility is extremely lowered, which is not preferable. .

The second component epoxy resin used as the adhesive layer of the present invention includes bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, tetraglycidyl amine type epoxy resin, triglycidyl amine type. Epoxy resins, naphthalene-based epoxy resins, and other various bifunctional epoxy resins and polyfunctional epoxy resins can be used alone or in combination of two or more.

The curing agent component used in the adhesive layer of the present invention is one or more selected from aromatic diamine compounds, acid anhydrides, compounds having at least one phenolic hydroxyl group, and cyanate ester resins. Although a mixture is possible, a cyanate ester resin is preferable as it can reduce the warp of the tape.

The adhesive layer used in the present invention comprises the above epoxy-modified polyamide resin and an appropriate amount of an epoxy resin and an epoxy resin curing agent component. The compounding ratio is preferably 20 to 80 parts by weight of epoxy-modified polyamide resin and 20 to 80 parts by weight of epoxy resin. The epoxy resin curing agent component is added in an appropriate amount depending on the types of epoxy resin and curing agent. If the epoxy-modified polyamide resin is less than 20 parts by weight, the adhesive lacks flexibility, and if it exceeds 80 parts by weight, properties such as adhesiveness at high temperature deteriorate.

The adhesive layer used in the present invention may contain other components in addition to these three components. For example, acrylic resin, phenolic resin, imide resin, resin component such as rubber resin, curing accelerator for epoxy resin
A curing catalyst, various inorganic / organic fillers, etc. can be considered.
From the viewpoint of workability, it is preferably dissolved in various organic solvents before use. As the solvent to be used, it is necessary to dissolve both the epoxy resin and the polyamide resin, and methyl ethyl ketone, toluene, chlorobenzene, trichloroethylene, methylene chloride, methyl cellosolve, ethyl cellosolve, dimethylformamide, dimethylacetamide, methanol, ethanol, isopropyl alcohol, etc. Can be appropriately mixed and used according to the adhesive composition. However, when a cyanate ester resin is used as a curing agent component, an alcohol solvent is not preferable because it reacts with a cyanate group.

Any protective layer may be used as the protective layer for the adhesive layer in the present invention, as long as it has heat resistance that does not cause softening, deterioration or deterioration when the adhesive is dried. A polyethylene terephthalate or polypropylene film is preferable in terms of balance of peelability, strength, price, and the like.

Next, a method for manufacturing the TAB tape of the present invention will be described. First, an adhesive having a predetermined composition is applied on the protective film so that the film thickness after drying is in the range of 5 to 40 μm, more preferably 10 to 30 μm.
The adhesive layer is dried in a heating condition of 0 to 160 ° C. for 1 to 3 minutes to bring the adhesive layer into a semi-cured state (B-staged state). next,
The adhesive layer applied on the protective film and the organic insulating film are overlaid, and the pressure is 1 kg / cm at a temperature of 20 to 180 ° C.
By pressing under ^two or more conditions, the TA according to the present invention
A tape for B is obtained.

At this time, if the adhesive layer applied on the film is slit and used narrower than the organic insulating film layer, the adhesive layer can be formed only at a predetermined position in the center of the tape. In addition, there is no part where the adhesive is exposed.

The embodiments of the TAB tape according to the present invention have been described above. However, the present invention is not limited to these embodiments, and the present invention is within the scope of those skilled in the art without departing from the spirit thereof. It can be implemented in a mode in which various improvements, changes and modifications are made based on the knowledge.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. In the following description, "part" means "part by weight" unless otherwise specified.

In the examples, PMDA is pyromellitic dianhydride, BTDA is 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, and ODA is oxydianiline (4,4'-diamino). Diphenyl ether), p
-PDA is paraphenylenediamine, BAPP is 2,2
-Bis [4- (4-aminophenoxy) phenyl] propane. Further, NMP represents N-methyl-2-pyrrolidone, MEK represents methyl ethyl ketone, and DMF represents dimethylformamide.

Example 1 First, 71.5 g of dimer acid (manufactured by Unichema PRIPOL 1009) was placed in a flask equipped with a stirrer, a reflux pipe and an exhaust pipe.
Add 120 g of NMP and stir to dissolve. 14g of isophorone diisocyanate was added to this, and 100 ° C for 1 hour,
The reaction was carried out by heating at 150 ° C. for 3 hours and 200 ° C. for 2 hours. NMP was distilled off from this reaction solution to obtain a molecular weight of 12
70 dicarboxylic acid terminated polyamides were obtained.

Next, in a flask equipped with a stirrer and a reflux tube, 40.0 g of the dicarboxylic acid-terminated polyamide obtained by the above reaction, 64.3 g of epoxy resin Epicoat 1004 (produced by Yuka Shell Epoxy Co., Ltd.), and chlorobenzene 200 were used.
g and 8.0 g of triethylamine are weighed out, and 1 at 140 ° C.
Refluxing was performed for 0 hours to proceed the reaction. Chlorobenzene and triethylamine were distilled off from this reaction solution to obtain an epoxy-modified polyamide resin.

150 parts of a 40% MEK solution of the epoxy-modified polyamide resin obtained by the above reaction, 70 parts of a 40% MEK solution of Epicoat 1001 (produced by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin, and a shea as a curing agent. A 40% MEK solution of a nato ester resin M-50 (manufactured by Ciba Geigy) was mixed with 35 parts to prepare a solution for an adhesive layer, and the above-mentioned adhesion was performed on a protective film made of a polyethylene terephthalate film having a thickness of 35 μm. Apply the agent layer solution and heat dry at 130 ° C for 2 minutes to obtain a film thickness of 15 μm
The adhesive layer of was formed.

In a 2 liter separable flask, 1000 g of DMF, 37.8 g of p-PDA and ODA2 were added.
3.3 g was taken, mixed well at room temperature until the diamino compound was completely dissolved, and then stirred while cooling with ice.
Next, gradually add powdery powder in the vicinity of the total amount of 16.9 g of PMDA and 123.7 g of BTDA. When the viscosity reached 2500 poise, the addition was stopped, and then the mixture was cooled and stirred for about 30 minutes to prepare a DMF solution of polyamic acid. Obtained.

To 100 g of the polyamic acid solution obtained by the above reaction, 15 g of acetic anhydride and 8 g of isoquinoline were added and mixed, followed by flow casting coating on a glass plate and drying at about 100 ° C. for 5 minutes. It was peeled off and the coating film was fixed to a supporting frame. After that, at about 200 ℃ for about 1 minute,
The polyimide film having a thickness of about 75 μm was obtained by heating at about 300 ° C. for about 1 minute and at about 450 ° C. for about 2 minutes and dehydration ring-closing drying. The elastic modulus and linear expansion coefficient of the obtained polyimide film were examined. For elastic modulus, see ASTM
The temperature was measured according to D882, and the linear expansion coefficient was measured from R.C. The results are shown in Table 1.

[0050]

[Table 1]

Next, the polyimide film having a thickness of 75 μm prepared as described above was slit into a width of 35 mm, and the adhesive layer having a thickness of 15 μm applied on the protective film was slit into a width of 26 mm as described above. The adhesive layer applied on the protective film was placed in the center of the polyimide film and heated and pressed under the conditions of a temperature of 90 ° C. and a pressure of 2 kg / cm ² to obtain a TAB tape according to the present invention.

Peel off the protective layer of the TAB tape,
After arranging a copper foil of 27 mm width (thickness 35 μm) and laminating at 120 ° C., 80 ° C., 100 ° C., 120 ° C., 14
The adhesive was cured by heating at 0 ° C. for 3 hours and at 160 ° C. for 4 hours to obtain a copper foil laminated film. The comb pattern was formed by etching using the copper foil laminated film.

The obtained TAB tape was subjected to a characteristic evaluation test with respect to the absorptance of the adhesive, the adhesive force, the insulation resistance between lines, the migration resistance and the warpage, and the results are shown in Table 2. About the absorption rate of the adhesive, AST
The absorption rate after 24 hours was examined according to MD-570.
Regarding the adhesive strength, a copper foil laminated film in which an electrolytic copper foil is laminated on a TAB tape is used, and JIS C5016 is used.
Then, the adhesive strength between the polyimide film and the electrolytic copper foil at 20 ° C. and 100 ° C. was examined. Regarding the line insulation resistance, a TAB tape having a line-shaped 1 mm comb pattern formed thereon was used, and a resistance value was measured by applying a DC voltage of 500 V under normal conditions and after moisture absorption. Normal temperature is 20
A sample left for 24 hours under the condition of ° C and a humidity of 65%, and a sample left after left for 96 hours under the condition of a temperature of 40 ° C and a humidity of 90% were used. Regarding migration resistance, a TAB tape with a 50 μm inter-line pattern formed was plated for 10 minutes by Shipley LT34, and insulated at a DC voltage of 100 V under the conditions of a temperature of 130 ° C. and a humidity of 85%. The resistance is measured and the resistance value is 5 x
The time to reach 10 ⁶ Ω was investigated. Regarding the warp, using a copper foil laminated film cooled to room temperature, a temperature of 20 ° C,
After leaving it in an atmosphere of 50% humidity for 48 hours, cut it out to a length of 4 cm, put it on a flat surface, measure how far the four corners are from the plane, and measure the average value of the four points as the warp value. did.

[0054]

[Table 2]

Example 2 165 parts of a 40% MEK solution of an epoxy-modified polyamide synthesized by the same procedure as in Example 1 and 4 of Epicoat 1001 (produced by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin.
45 parts of 0% MEK solution, 25 parts of 40% MEK solution of Epikote 180H65 (produced by Yuka Shell Epoxy Co., Ltd.),
And 40% MEK of Tetrad C (manufactured by Mitsubishi Gas Chemical Co., Inc.)
A solution for an adhesive layer was prepared by mixing 25 parts of the solution, 5.4 parts of 4,4′-diaminodiphenylsulfone as a curing agent and 0.9 part of isophoronediamine to prepare a solution for an adhesive layer. Similarly, a TAB tape and a copper foil laminated film according to the present invention were produced. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Example 3 1000 g of DMF, 37.8 g of p-PDA and 47.8 g of BAPP were placed in a 2 liter separable flask, mixed well at room temperature until the diamine compound was completely dissolved, and then stirred while cooling with ice. Next, BTDA10
About 0.1 g and 33.9 g of PMDA were gradually added in powder form and the addition was stopped when the viscosity reached 2500 poise, and then the mixture was cooled and stirred for about 30 minutes to obtain a DMF solution of polyamic acid. Using the solution, a polyimide film having a thickness of 75 μm was obtained in the same manner as in Example 1. The same physical properties as in Example 1 were examined for the obtained polyimide film, and the results are shown in Table 1.

Other than using the above polyimide film,
In the same manner as in Example 1, a TAB tape according to the present invention and a copper foil laminated film were produced. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Comparative Example 1 30 parts of Epicoat 828 (manufactured by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin and a 20% toluene / isopropyl alcohol mixed solution of dimer acid type polyamide (Marcmelt 6900, manufactured by Henkel Hakusui Co., Ltd.) as a polyamide resin. Same as Example 1 except that an adhesive layer solution containing 300 parts and 40 parts of a 20% methylcellosolve solution of diaminodiphenyl sulfone / dicyandiamide mixed in a ratio of 4: 1 as a curing agent was used. And TA
A tape for B and a copper foil laminated film were produced. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Comparative Example 2 As an epoxy resin, 60 parts of Epicoat 828 (manufactured by Yuka Shell Epoxy Co.) and 5 parts of cresol novolac epoxy (Epicoat 180H, manufactured by Yuka Shell Epoxy Co.) were used.
20% of 0% toluene / isopropyl alcohol mixed solution
Part, 150 parts of a 20% toluene / isopropyl alcohol mixed solution of copolymerized nylon (Platabond M1276, manufactured by Nippon Rilsan Co., Ltd.) as a polyamide resin, and diaminodiphenyl sulfone / dicyandiamide mixed at a ratio of 4: 1 as a curing agent. A TAB tape and a copper foil laminated film were produced in the same manner as in Example 1 except that an adhesive layer solution containing 90 parts of a 20% methyl cellosolve solution was used. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Comparative Example 3 A polyamic acid solution was obtained by using equimolar amounts of ODA and PMDA, and a thickness of 75 μm was obtained in the same manner as in Example 1 using this solution.
m polyimide film was obtained. The physical properties of the obtained polyimide film were examined in the same manner as in Example 1, and the results are shown in Table 1.

A TAB tape and a copper foil laminated film were produced in the same manner as in Example 1 except that the above polyimide film was used. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Comparative Example 4 1000 g of DMF, 37.8 g of p-PDA and 23.3 g of ODA were placed in a 2 liter separable flask, mixed well at room temperature until the diamine compound was completely dissolved, and then stirred while cooling with ice. Next, BTDA100.
About 1 g and 33.9 g of PMDA were gradually added in the form of powder, and when the viscosity reached 2500 poise, the addition was stopped, and then the mixture was cooled and stirred for about 30 minutes.
An MF solution was obtained, and this solution was used to obtain a polyimide film having a thickness of 75 μm in the same manner as in Example 1. The physical properties of the obtained polyimide film were examined in the same manner as in Example 1, and the results are shown in Table 1.

Other than using the above polyimide film,
A TAB tape and a copper foil laminated film were produced in the same manner as in Example 1. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

Comparative Example 5 DMF (1000 g), p-PDA (13.6 g) and ODA (37.1 g) were placed in a 2-liter separable flask and mixed well at room temperature until the diamine compound was completely dissolved, and then stirred while cooling with ice. Then PMDA 67.7
Nearly the entire amount of g was gradually added in the form of powder and the addition was stopped when the viscosity reached 2500 poise, and then the mixture was cooled and stirred for about 30 minutes to obtain a DMF solution of polyamic acid, and this solution was used in Example 1 A polyimide film having a thickness of 75 μm was obtained by the same method. The physical properties of the obtained polyimide film were examined in the same manner as in Example 1, and the results are shown in Table 1.

Other than using the above polyimide film,
A TAB tape and a copper foil laminated film were produced in the same manner as in Example 1. The obtained TAB tape was subjected to the same characteristic evaluation test as in Example 1, and the results are shown in Table 2.

[0066]

Industrial Applicability According to the present invention, it is possible to provide a TAB tape which is excellent in heat resistance, has less ionic impurities taken in during processing, has high insulation reliability, and has a small curl / warp.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirosaku Nagano 2-1-1 Hiei Tsuji, Otsu City, Shiga Prefecture Kanebuchi Chemical Co., Ltd. Shiga Factory

Claims (4)

[Claims] 1. A TAB tape comprising an organic insulating film layer, an adhesive layer, and a protective layer, wherein the organic insulating film layer has a linear expansion coefficient of 1.0 to 1.6 times that of copper. A polyimide film having a coefficient of expansion, wherein the polyimide film comprises pyromellitic dianhydride or a derivative thereof, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 3,3 ′, 4 , 4'-oxydiphthalic dianhydride and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, and one or more acid dianhydride components, and one or more linearity A tape for TAB, which is formed by imidizing a polyamic acid synthesized from a diamine and one or more kinds of flexible diamines. 2. The adhesive layer has at least 2 in the molecule.
An epoxy-modified polyamide resin obtained by reacting a compound having at least one epoxy group with a dicarboxylic acid-terminated polyamide oligomer starting from dimer acid, a compound having at least one epoxy group, a diamine compound, an acid anhydride The tape for TAB according to claim 1, wherein the TAB tape comprises a compound having at least one phenolic hydroxyl group, and one or more curing agent components selected from cyanate ester resins. 3. A TAB tape comprising an organic insulating film layer, an adhesive layer, and a protective layer, wherein the adhesive layer comprises a compound having at least two epoxy groups in the molecule and dimer acid. An epoxy-modified polyamide resin obtained by reacting a dicarboxylic acid-terminated polyamide oligomer as a raw material, a compound having at least one epoxy group, a diamine compound, an acid anhydride, a compound having at least one phenolic hydroxyl group, and a cyan A tape for TAB, which is prepared by blending one or more curing agent components selected from nato ester resins. 4. The TAB tape according to any one of claims 1 to 3, wherein the curing agent component in the adhesive layer is a cyanate ester resin.