JPH07111723A - Grounding material at cable joint - Google Patents

Abstract

PURPOSE:To facilitate grounding at a cable joint by providing a layer of low temperature solder for a ground wire lead-out metal being wound around a copper shield tape and then heating the solder at low temperature from the outside. CONSTITUTION:In a cable join of a CV cable, for example, a ground wire lead-out metal 20 is wound around the cable at a part where a copper shield tape 4 is exposed and a solder provided integrally on the surface of the metal 20 contacting the copper shield tape 4 is then fused thus bonding them. The low temperature solder provided on the inner face of the plate body is composed of a material fusible at 100-120 deg.C so that the soldering work can be performed by heating at a low temperature from the outside of the ground wire lead-out metal. A flexible member, e.g. a ribbon heater member 40, as well as an arcuate heating member can be employed as a heating member for the ground wire lead-out metal 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grounding member used for grounding a connecting portion such as a CV cable, and in particular, a grounding wire drawing metal fitting is wound around a shielding copper tape of the cable connecting portion. The present invention relates to a cable connection part grounding processing member that facilitates grounding processing by melting low-temperature solder.

[0002]

2. Description of the Related Art For safety reasons, it is obliged to ground a shield metal body of a cable at a terminal end portion or an intermediate connection portion of a cable, such as a high voltage CV cable, for use as a safety measure. ing. The processing of the connecting terminal portion of the cable is performed as shown in FIG. 8. At the connecting portion of the cable 1, the sheath 3 is stripped off to expose the shielding copper tape 4, and the tip portion thereof is processed. Then, a section for exposing the semiconductive tape 5 and the cable semiconductive layer 6 is formed over a predetermined length. Further, a stress cone 8 is arranged at the tip of the exposed portion of the cable semi-conductive layer 6, and a connection terminal is arranged at the tip to connect the conductor of the cable. In addition, as shown in the drawing, an insulating layer 9 formed by winding an insulating tape is provided around the base of the cable and the end of the stress cone with respect to the portion where the conductor of the cable is connected. There is.

When the terminal portion of the cable connecting portion is treated as described above, the bracket member 10 is fixed to a predetermined position of the base portion where the sheath 3 is stripped off, and the ground wire is connected to the bracket member 10. At the same time, the ground lead wire 11 is provided between the shield copper tape 4 as the shield metal body of the cable. The grounding lead wire 11 forms a fixing portion 13 by soldering a winding portion 12 wound around the shielding copper tape 4 a plurality of times at a predetermined position with respect to the shielding copper tape 4 to form a fixing portion 13. A means for fixing the electrical conductivity to the bracket member 10 with the fixing screw 14 or the like is used. The bracket member 10 provided at the base of the connecting portion of the cable is connected to the ground to constitute a means for grounding the cable connecting portion.

As the ground lead wire used for the grounding, an annealed copper wire, a flat braided copper wire or the like is used, and the number and size of the ground lead wires are determined in consideration of the ground capacity of the power feeding system and the like. . In addition, when the ground lead wire is wound around the shielding metal of the cable, the electrical conduction state of both members can be set well, but when energized for a long time, the contact state between the ground lead wire and the shielding copper tape May become unstable. Therefore, in order to ensure electrical and mechanical connection at the winding portion of the ground lead wire, it is common practice to use a method by soldering.

[0005]

However, as shown in the above-mentioned conventional example, with respect to the shielding copper tape of the cable,
Soldering the ground lead wire is a relatively skill-intensive operation, and the connection state can be improved only by connecting a part of the lead wire to the shielding copper tape which is a very thin metal plate. There is a problem that it is hard to be reliable.
When soldering is incomplete, the cable repeats expansion and contraction by energizing the cable, and the semiconductive tape and cable semiconductive layer follow the expansion and contraction. As a result, the effect of impairing the electrical conductivity occurs in the portion where the ground lead wire is soldered to the shielding tape. There is also a problem that expansion and contraction due to heat cycle repeatedly act on the connection portion of the ground lead wire, so that the connection portion easily peels off.

Therefore, in order to solve the above-mentioned problems, it is conceivable to use a connecting means as disclosed in, for example, Japanese Utility Model Laid-Open No. 5-4724. In the above-mentioned conventional example, a conductive metal band is wound around the surface of the shield, and the metal band is fastened to the surface of the shielding copper tape so that the connection portion of the cable can be grounded. There is. However, as shown in the above-mentioned conventional example, when a means for obtaining a predetermined contact pressure by winding a metal member is used, expansion and contraction of the connection portion due to heat cycle when the cable is energized It tends to occur that the metal member for grounding cannot accurately follow the action. In addition, if a means for bringing the metal member into contact with the shielding copper tape with a strong pressure is used, the insulating layer may be uneven, and the surface shape of the insulating layer may change, resulting in a change in the insulating property. However, such inconvenience may occur. Further, when the contact pressure of both members is set to be weak, the contact portions of both members are affected by the heat cycle and come into contact with and separate from each other, and an oxide film is formed on the contact portions to maintain good conductivity. The problem arises that you cannot do it.

[0007]

SUMMARY OF THE INVENTION The present invention solves the problems of the conventional grounding means as described above, and a low temperature solder is applied to the entire inner surface of a grounding wire lead-out fitting arranged around the shielding copper tape. It is possible to easily perform the connecting work by covering the ground wire, heating it at a low temperature from the outside of the ground wire drawing metal fitting, and connecting the entire contact portion between the shielding copper tape and the ground wire drawing metal fitting with solder. It is an object of the present invention to provide such a cable connection portion grounding member.

[0008]

SUMMARY OF THE INVENTION According to the present invention, a bracket member is fixed to a base portion of a cable connection portion where a sheath of a cable is stripped off, and a ground lead wire is provided between a shielding copper tape of the cable and the bracket member. The present invention relates to a ground processing device to be connected using. In the present invention, the ground wire drawing metal fitting is wound around the exposed portion of the shielding copper tape of the cable, and the low temperature solder integrally provided on the ground wire drawing metal fitting is heated and melted from the outside to be fixed, A means for connecting the ground wire lead-out metal fitting and the bracket member by using a ground lead wire is used. Further, in the present invention, a commercially available low-temperature solder or the like is used as the low-temperature solder provided on the surface of the plate member of the grounding wire drawing metal, and a recess is formed in the plate member to hold the low-temperature solder on the surface of the plate member. It is also possible to use a means for assisting the holding action of the low temperature solder.

[0009]

As described above, in the cable connecting portion, the conductive plate-like ground wire drawing metal fitting is wound around the exposed portion of the cable shielding copper tape, and heated at a low temperature from the outside. With this, it is possible to melt the low temperature solder and connect the entire ground wire lead-out metal fitting. Therefore, the low temperature solder provided on the ground wire lead-out fitting is
By using low temperature solder that melts at 00 to 120 ° C, there is no extra heating of the cable,
It is possible to maintain a good electrical continuity. Further, in the present invention, by using a means for melting the low temperature solder at a low temperature, for example, a heating means for supplying power from a battery can be used to connect the ground wire drawing metal fitting to the shielding copper tape. It can be done easily.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cable connecting portion grounding member according to the present invention will be described with reference to the illustrated example. In the example shown in FIG. 1, the cable connection part grounding member of the present invention is applied,
FIG. 3 shows a state in which a ground lead wire is connected to a cable connecting portion. When the exposed lead wire 28 is connected between the exposed portion of the shielding copper tape 4 and the bracket member 10 as in the case of FIG. Is shown. In the present invention, a process for forming a connection end is performed on the cable 1, the ground wire drawing metal fitting 20 is wound around the exposed surface of the shielding copper tape 4, and the ground wire drawing metal fitting 20 is provided so as to project from the ground wire drawing metal fitting 20. The grounding lead wire 28 is attached to the connecting tongue 23 using a fixing screw or the like, and is attached to the bracket member 10.
The lower terminal of the ground lead wire is connected using a fixing screw 14. Further, in the cable connecting portion 2 shown in FIG. 1, similarly to the connecting portion shown in FIG. 8, the sheath 3 is stripped from the connecting end portion of the cable 1 to expose the shielding copper tape 4. Then, a section for exposing the semiconductive tape 5 and the cable semiconductive layer 6 is formed at the tip portion thereof. Further, a stress cone 8 is arranged at the tip of the exposed portion of the cable semi-conductive layer 6 and a connecting terminal is arranged at the tip to connect the conductor of the cable, and an insulating layer 9 is provided around the connection. Is provided.

The ground wire drawing metal fitting 20 arranged around the shielding copper tape 4 of the cable 1 in a state of being wound around the shielding copper tape 4 is fixed by adhering and fixing the entire surface in contact with the surface of the shielding copper tape 4 with low temperature solder. As the ground wire lead-out fitting 20, a member having a structure as shown in FIGS. 2 and 3 can be used. 2, 3
In the grounding wire drawing metal fitting 20 shown in FIG. 2, the plate member 21 is made of a tin-plated annealed copper band, and the connecting tongue 23 is provided integrally with the connecting tongue 23 so as to connect the grounding lead wire 28. Screw holes 24 are provided. In the ground wire lead-out metal fitting 20, the thickness t of the metal plate forming the plate member 21 is set to about 0.1 to 0.3 mm so that it can be easily wound around the cable. The width W of the member 21 can be formed to be 20 mm or less, and the length L can be formed to be substantially the same as the outer peripheral length of the shielding copper tape of the cable. The length L of the ground wire lead-out fitting is set according to the cable size and the like, but since the metal plate member is relatively thin, it can be easily cut using a cutter or the like. Therefore, it can be configured so as to correspond to a large cable size, and can be cut into a required length and used for a small cable size.

Further, in the ground wire lead-out fitting 20, a low temperature solder 25 having a predetermined thickness is integrally provided on a surface (inner surface) of the plate member 21 located inside when wound around the cable. As the low temperature solder 25, for example,
It is possible to use a commercially available low temperature solder, and it is possible to use one having a melting temperature in the range of 90 to 140 ° C., but preferably 100 to 120.
If the one set at ℃ is used, the action of adhering the ground wire lead-out fitting to the shielding copper tape can be exhibited in a good state. As described above, in order to maintain the state in which the low-temperature solder 25 is integrally applied to the bonding surface of the ground wire drawing metal fitting, the strip-shaped recess 22 is formed on the inner surface of the plate member 21 as shown in the figure. A means for improving the performance of holding the low temperature solder can be used. Then, at a position corresponding to the concave portion 22, a protrusion 26 is formed in a part of the layer of the low temperature solder 25 that is thinly formed to increase the amount of solder in the protrusion 26 of the low temperature solder. To be able to

As means for forming a recess in the plate member, in addition to forming a single groove as shown in FIG. 3, a plurality of grooves 22, as shown in FIG. Two
It is also possible to dispose 2a and 22b in parallel and provide a plurality of ridges for the low temperature solder 25. When forming a large number of ridges with a large amount of solder on the low temperature solder applied to the inner surface of the plate member, the action of connecting the ground wire lead-out fitting to the shielding copper tape should be performed in a good state. Can be demonstrated. Therefore, even if the shielding copper tape repeatedly expands and contracts due to the heat cycle that occurs when the cable is energized, it is possible to maintain good conductivity with respect to the ground wire drawing metal. further,
In order to form a recess in the plate member, in addition to the groove in the length direction of the plate member, it is possible to form a recess of any shape, the depth and width of the groove is When the low-temperature solder is bonded, it can be arbitrarily set as long as it can maintain a good connection state.

The ground wire lead-out fitting 20 constructed as described above can be wound around the shield copper tape 4 of the cable and positioned as shown in FIG. 5, and holds the low temperature solder. The inner surface is curved in an arc shape so as to face inward, and is arranged around the shielding copper tape 4. Since the ground wire lead-out fitting is made of a relatively thin metal plate, it can be molded by being pressed by hand when wound around the shielding copper tape so as to be along the periphery of the shielding copper tape. . Then, after positioning the ground wire pullout fitting, a means for adhering the ground wire pullout fitting by melting the low temperature solder by heating while pressing the ground wire pullout fitting from the outside with the heating means is used. As the heating means, as shown in FIG. 6, a heating device 30 provided with arcuate heating arm members 35 and 36 can be used. In the heating device 30 shown in FIG. 6, heating arm members 35 and 36 are swingably provided on a base portion 32 located at a tip end portion of a main body 31 configured as a handle portion via hinge portions 33 and 33a. A spring member 34 for arranging the heating arm members 35, 36 at the base
Is biased in the closing direction.

The heating arm members 35 and 36 provided in the heating device 30 have a heater member arranged on the inner surface of an arc, and can perform the action of heating by pressing the plate member of the ground wire drawing metal fitting from the outside. However, as the heater member, a member that can perform a heating action at about 120 to 140 ° C. is used. Therefore, when the heating arm member is pressed from the outer surface of the plate member to be heated and the low temperature solder is melted, heat of 120 ° C. or less is transferred to the insulator of the cable arranged inside the shielding copper tape. Therefore, it is possible to prevent the influence of heating from occurring even on the insulator having polyethylene as a base material. Further, as shown in the drawing, the heating arm members 35, 36 are made of a long rigid member having a substantially arc shape, and if the inner surface of the arc has a shape that matches the outer diameter of the shielding copper tape of the cable, soldering is performed. Can be done efficiently. Other,
The heater member used in the heating device of the present invention can be configured by connecting a large number of short arc-shaped members via a hinge. For example, a hinge is provided at the center of the heating arm member and is biased by a spring. By configuring the means, it can be used to melt the low temperature solder to different size cables.

In addition to the heating device, a ribbon heater member 40 as shown in FIG. 7 can be used in the present invention. As the ribbon heater member 40, a commercially available ribbon heater with a thermostat is used. be able to. Then, for example, a material having a heating performance of 100 to 120 ° C. is wound around the ground wire drawing metal fitting 20 and energized from the terminals 41 and 42 to melt the low temperature solder provided in the ground wire drawing metal fitting. , Soldering work can be performed. The ribbon heater member has a function of radiating heat to the entire circumference of the ribbon, but in the present invention, since it is necessary to exert a heating function only in a portion in contact with the circumference of the plate member, It is also possible to provide a commercially available ribbon heater member with means for preventing heat radiation from an extra surface so that the heating effect can be favorably performed. Also in the heating device shown in FIG. 6, it is also possible to attach a ribbon heater member-shaped heating means to the inner surface of the heating arm member to improve the degree of freedom in designing the heating arm member. When the arm member is not made of a rigid body but is made of a flexible member, if a ribbon heater member such as a heating member is used, the arm member can be easily adapted to the surface of the plate member. Allows the heating action to be performed in good condition.

[0017]

As described above, the cable connecting portion grounding treatment member of the present invention is one in which low temperature solder is integrally provided on the inner surface of the grounding wire drawing metal fitting to connect the entire plate member to the shielding copper tape. Therefore, the grounding portion at the cable connecting portion can be easily formed. Further, by connecting the ground wire lead-out fitting to the shielding copper tape of the present invention, the heat cycle when energizing the cable was affected by thermal expansion and contraction of the connection portion of the ground wire lead-out fitting. Even in this case, the grounded state does not become unstable. Further, since the low temperature solder provided in the grounding wire lead-out metal fitting of the present invention uses the low temperature solder, it is possible to exert an adhesive action by heating at a relatively low temperature and reduce the influence of heat on the insulator and the like. can do. Then, even when the ground wire drawing metal fitting is attached to the shielding copper tape, the connection work can be easily performed by heating from the outer peripheral portion of the plate member using a heating device or the like.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of a cable connecting portion.

FIG. 2 is a plan view of a ground wire drawing metal fitting used in the present invention.

FIG. 3 is a side view of the ground wire drawing metal fitting of FIG. 2.

FIG. 4 is a side view of another example of the ground wire lead-out fitting used in the present invention.

FIG. 5 is an explanatory view showing a state in which a ground wire drawing metal fitting is attached to a cable.

FIG. 6 is an explanatory diagram of a heating device used in the present invention.

FIG. 7 is an explanatory view showing the relationship between the ribbon heater member used in the present invention and the ground wire drawing metal fitting.

FIG. 8 is an explanatory diagram showing a connection of a ground lead wire at a general cable connecting portion.

[Explanation of symbols]

1 cable, 2 cable connection part, 4 shielding copper tape, 5 semi-conductive tape, 10 bracket member, 11 ground lead wire, 12 winding part, 20 ground wire drawing metal fitting, 21 plate member,
22 groove, 23 connection tongue, 25 low temperature solder, 26 protrusion, 28 ground lead wire, 3
0 heating device, 33 hinge, 34 spring, 35/36 heating arm member, 40 ribbon heater member.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akiyoshi Ueda 1008 Shinbori, Kumagaya, Saitama Prefecture Mitsubishi Cable Industries, Ltd.Kumagaya Manufacturing (72) Inventor Katsumi Sakasegawa 1008 Shinbori, Kumagaya, Saitama Mitsubishi Cable Industries, Ltd. Kumagaya Works (72) Inventor Yujiro Mu, 1008 Shinbori, Kumagaya City, Saitama Mitsubishi Cable Industries, Ltd. Kumagaya Works

Claims (2)

[Claims] 1. A grounding device in which a bracket member is fixed to a base portion of a cable connecting portion where a sheath of a cable is stripped off, and a shielding copper tape of the cable and the bracket member are connected by using a grounding lead wire. , Around the exposed portion of the shielded copper tape of the cable, wrap the ground wire lead-out metal fitting, and heat the low temperature solder integrally provided on the ground wire lead-out metal fitting from the outside to fix it to the copper shield tape A cable connection part grounding member, characterized in that the ground wire lead-out metal fitting and the bracket member are connected using a ground lead wire. 2. A low temperature solder member is used as the solder provided on the bonding surface of the plate member of the grounding wire drawing metal fitting, and a recess is formed in the plate member to hold the low temperature solder on the surface of the plate member. The cable connection part grounding member according to claim 1, which assists the holding action of the.