JPH07108836B2 - Low pressure CVD equipment - Google Patents

Low pressure CVD equipment

Info

Publication number
JPH07108836B2
JPH07108836B2 JP3033709A JP3370991A JPH07108836B2 JP H07108836 B2 JPH07108836 B2 JP H07108836B2 JP 3033709 A JP3033709 A JP 3033709A JP 3370991 A JP3370991 A JP 3370991A JP H07108836 B2 JPH07108836 B2 JP H07108836B2
Authority
JP
Japan
Prior art keywords
chamber
heated
ring
low pressure
shaped holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3033709A
Other languages
Japanese (ja)
Other versions
JPH04254489A (en
Inventor
康明 五味
正晴 加納
廣一 小野寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatani Corp
Original Assignee
Iwatani Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatani Corp filed Critical Iwatani Corp
Priority to JP3033709A priority Critical patent/JPH07108836B2/en
Publication of JPH04254489A publication Critical patent/JPH04254489A/en
Publication of JPH07108836B2 publication Critical patent/JPH07108836B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ウエハー等の表面にタ
ングステン膜やシリコン膜を成膜する減圧CVD装置に
関し、とくに加熱源としてランプを使用する急速加熱型
CVD装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low pressure CVD apparatus for forming a tungsten film or a silicon film on the surface of a wafer or the like, and more particularly to a rapid heating type CVD apparatus using a lamp as a heating source.

【0002】[0002]

【従来技術】従来、ランプを加熱源とした急速加熱型C
VD装置として、減圧チャンバー内に配置されたリング
状ホルダーに被加熱物を支持し、この被加熱物に対向さ
せて加熱用ランプのランプユニットを配置し、このラン
プユニットから照射した熱線を被加熱物に作用させるこ
とにより被加熱物を600〜1000℃に加熱するよう
に構成し、減圧チャンバー内に処理ガスを供給して被加
熱物の表面に金属薄膜を成膜するように構成したものが
提供されている。そして、この装置では、減圧チャンバ
ーとランプユニットとの間にクオーツウインドウが配置
してあった。
2. Description of the Related Art Conventionally, a rapid heating type C using a lamp as a heating source
As a VD device, an object to be heated is supported by a ring-shaped holder arranged in a decompression chamber, a lamp unit of a heating lamp is arranged so as to face the object to be heated, and heat rays emitted from the lamp unit are heated. What is configured to heat an object to be heated to 600 to 1000 ° C. by acting on an object, and to supply a processing gas into a decompression chamber to form a metal thin film on the surface of the object to be heated. It is provided. And in this apparatus, the quartz window was arrange | positioned between the decompression chamber and the lamp unit.

【0003】[0003]

【発明が解決しようとする課題】ところが、従来の急速
加熱型CVD装置では、減圧チャンバーを1室で形成し
ていたことから、減圧チャンバー内に供給した処理ガス
が高温化したクオーツウインドウのチャンバーへの露出
面に接触して、クオーツウインドウと化学反応してしま
い、クオーツウインドを曇らせることがあった。そし
て、クオーツウインドウが曇ると、ランプユニットから
の熱供給量が低下して被加熱物を十分に加熱することが
できず、成膜性能が低下するという問題があった。本発
明は、このような点に着目してなされたもので、クオー
ツウインドウを曇らせない急速加熱型CVD装置を提供
することを目的とする。
However, in the conventional rapid heating type CVD apparatus, since the decompression chamber is formed by one chamber, the processing gas supplied into the decompression chamber is transferred to the quartz window chamber where the temperature becomes high. When it touched the exposed surface of the, it could chemically react with the quartz window and cloud the quartz window. When the quartz window becomes cloudy, the amount of heat supplied from the lamp unit is reduced, and the object to be heated cannot be heated sufficiently, resulting in a problem that the film forming performance is deteriorated. The present invention has been made in view of such a point, and an object thereof is to provide a rapid heating type CVD apparatus which does not cloud the quartz window.

【0004】[0004]

【課題を解決するための手段】上述の目的を達成するた
めに、本発明は、減圧チャンバー内に隔壁を形成し、こ
の隔壁に開設した開口部にリング状ホルダーを設置し、
リング状ホルダーに装着した被加熱物と隔壁とで減圧チ
ャンバー内を区画することにより反応室と加熱室とを形
成し、加熱室の内圧が反応室の内圧よりもわずかに高く
なるように両室の内圧を設定し、反応室に処理ガス供給
路の先端部を開口し、被加熱物と対向する加熱室の壁面
にクオーツウインドウを形成し、このクオーツウインド
ウに臨ませてランプユニットを配置したことを特徴と
し、また、減圧チャンバーとランプユニットとの間に配
置したクオーツウインドウを微小間隔へだてて積層した
複数枚の石英ガラスで構成し、石英ガラス同士間の微小
間隙に冷却液を高速で流通させるように構成したことを
特徴としている。
In order to achieve the above-mentioned object, the present invention forms a partition in a decompression chamber, and installs a ring-shaped holder in the opening formed in this partition,
The reaction chamber and the heating chamber are formed by partitioning the inside of the decompression chamber with the object to be heated mounted on the ring-shaped holder and the partition wall, and both chambers are set so that the internal pressure of the heating chamber becomes slightly higher than the internal pressure of the reaction chamber. The internal pressure of the chamber was set, the tip of the process gas supply path was opened in the reaction chamber, a quartz window was formed on the wall of the heating chamber facing the object to be heated, and the lamp unit was placed facing this quartz window. In addition, the quartz window arranged between the decompression chamber and the lamp unit is composed of a plurality of quartz glasses laminated with a minute interval, and the cooling liquid is circulated at high speed in the minute gaps between the quartz glasses. It is characterized by being configured as follows.

【0005】[0005]

【作用】本発明では、減圧チャンバー内に隔壁を形成
し、この隔壁に開設した開口部にリング状ホルダーを嵌
着固定し、リング状ホルダーに装着した被加熱物と隔壁
とで減圧チャンバー内を区画することにより反応室と加
熱室とを形成し、加熱室の内圧が反応室の内圧よりもわ
ずかに高くなるように両室の内圧を設定し、反応室に処
理ガス供給路の先端部を開口し、被加熱物と対向する加
熱室の壁面にクオーツウインドウを形成し、このクオー
ツウインドウに臨ませてランプユニットを配置している
ので、反応室に供給した処理ガスは加熱室側に流れ込む
ことがなくなる。これにより、クオーツウインドウが高
温になっても、処理ガスとの化学反応が生じることがな
くなり、クオーツウインドウを曇らせることがない。
In the present invention, the partition wall is formed in the decompression chamber, the ring-shaped holder is fitted and fixed in the opening formed in this partition wall, and the inside of the decompression chamber is surrounded by the object to be heated and the partition wall mounted on the ring-shaped holder. The reaction chamber and heating chamber are formed by partitioning, and the internal pressure of both chambers is set so that the internal pressure of the heating chamber is slightly higher than the internal pressure of the reaction chamber, and the tip of the processing gas supply path is set in the reaction chamber. Since the quartz window is formed on the wall of the heating chamber facing the object to be heated, and the lamp unit is arranged facing the quartz window, the processing gas supplied to the reaction chamber must flow into the heating chamber. Disappears. As a result, even if the quartz window has a high temperature, a chemical reaction with the processing gas does not occur, and the quartz window is not clouded.

【0006】また、減圧チャンバーとランプユニットと
の間に配置したクオーツウインドウを微小間隔へだてて
積層した複数枚の石英ガラスで構成し、石英ガラス同士
間の微小間隙に冷却液を高速で流通させるように構成し
ているので、クオーツウインドウが冷却されて高温化す
ることがなく、処理ガスとの化学反応を抑制することが
できる。これにより、クオーツウインドウが曇ることは
なくなる。
Further, a quartz window arranged between the decompression chamber and the lamp unit is made up of a plurality of quartz glasses laminated with a minute interval, and the cooling liquid is passed at a high speed in a minute gap between the quartz glasses. With this configuration, the quartz window will not be cooled to a high temperature, and the chemical reaction with the processing gas can be suppressed. This will prevent the quartz window from becoming cloudy.

【0007】[0007]

【実施例】図面は本発明の実施例を示し、図1は要部の
取出し拡大図、図2はCVD装置のチャンバー部断面図
である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings show an embodiment of the present invention. FIG. 1 is an enlarged view of a main portion taken out, and FIG. 2 is a sectional view of a chamber portion of a CVD apparatus.

【0008】このCVD装置は、減圧チャンバー(1)の
上方にランプユニット(2)を配置し、このランプユニッ
ト(2)から熱線を減圧チャンバー(1)内に表面を下向き
にした状態で支持させたウエハー基板等の被加熱物(3)
に照射することにより被加熱物(3)を裏面側から加熱す
るように構成し、減圧チャンバー(1)内にシランガス等
の処理ガスを下側から噴出供給して、被加熱物(3)の表
面に薄膜を成膜するに構成した急速加熱型CVD装置で
ある。
In this CVD apparatus, a lamp unit (2) is arranged above the decompression chamber (1), and heat rays are supported from the lamp unit (2) in the decompression chamber (1) with its surface facing downward. To be heated such as wafer substrate (3)
The object to be heated (3) is heated from the back side by irradiating the surface of the object, and a processing gas such as silane gas is jetted and supplied from the lower side into the decompression chamber (1) to supply the object to be heated (3). This is a rapid heating type CVD device configured to form a thin film on the surface.

【0009】減圧チャンバー(1)内は伏椀状に形成した
石英製の隔壁(4)で上下二室に区画してあり、この隔壁
(4)に頂部に開口部(5)が開設してある。そして、この
開口部(5)に被加熱物(3)を支持するリング状ホルダー
(6)が安定に設置してある。このリング状ホルダー(6)
は石英等の耐熱材料で形成してあり、被加熱物(3)を表
面(処理面)を下向きにした状態で装着することにより、
リング状ホルダー(6)に支持された被加熱物(3)の表面
が隔壁(4)で区画された下側の部屋に露出するように構
成してある。
The inside of the decompression chamber (1) is divided into upper and lower chambers by a quartz partition wall (4) formed in the shape of a bowl.
There is an opening (5) at the top of (4). Then, a ring-shaped holder for supporting the object to be heated (3) in the opening (5)
(6) is installed stably. This Ring Holder (6)
Is made of a heat-resistant material such as quartz, and by mounting the object to be heated (3) with the surface (treated surface) facing downward,
The surface of the object to be heated (3) supported by the ring-shaped holder (6) is exposed to the lower room defined by the partition wall (4).

【0010】そして、減圧チャンバー(1)内での隔壁
(4)の上側に位置する部屋(7)でのチャンバー周側壁に
被加熱物(3)を給排する開口部(8)を開設し、この開口
部(8)を被加熱物(3)の搬送装置(9)が出退移動するよ
うにしてある。また、この隔壁(4)よりも上側に位置す
る部屋(7)に窒素や水素等のパージ用ガスを導入する導
入路(10)と室内気体を外部に排出するための排気路とが
連通させてある。
A partition in the decompression chamber (1)
An opening (8) for supplying / discharging the object to be heated (3) is provided in the chamber peripheral side wall in the room (7) located above (4), and this opening (8) is provided to the object to be heated (3). The transport device (9) is moved in and out. In addition, an introduction path (10) for introducing a purging gas such as nitrogen or hydrogen and an exhaust path for discharging the indoor gas to the outside are connected to the room (7) located above the partition wall (4). There is.

【0011】一方、減圧チャンバー(1)内での隔壁(4)
よりも下側に位置する部屋(11)でのチャンバー周側壁に
被加熱物(3)をリング状ホルダー(6)に案内装着するた
めの被加熱物装着具(12)の差し込み口(13)が開口してお
り、この差し込み口(13)に被加熱物装着具(12)が装着し
てある。この被加熱物装着具(12)はロッドの先端部をリ
ング部分(14)に形成し、このリング部分(14)に周方向適
当間隔おきにピン(15)を立設形成してあり、このピン(1
5)の上端部分はリング状ホルダー(6)の被加熱物支持台
(17)部分に形成した孔に進退昇降可能に装着してある。
また、被加熱物装着具(12)は昇降機構(16)の作動で上下
に移動して、上側室(7)に被加熱物搬送装置(9)で搬入
された被加熱物(3)をリング状ホルダー(6)に位置決め
装着、或いはリング状ホルダー(6)から被加熱物搬送装
置(9)に受け渡すように構成してある。また、この隔壁
(7)よりも下側に位置する部屋(11)にシランガス等の処
理ガスの供給路(18)と排気路が連通させてあり、反応用
ガス導入路(18)の先端部はリング状ホルダー(6)よりも
下側部分で、噴出させた反応用ガスが被加熱物(3)の表
面に接触できる適当な個所に位置して開口している。
On the other hand, the partition wall (4) in the decompression chamber (1)
An insertion port (13) for an object-to-be-heated fitting (12) for guiding and mounting the object-to-be-heated (3) on the ring-shaped holder (6) on the peripheral wall of the chamber in the room (11) located below Is opened, and the article-to-be-heated attachment (12) is attached to the insertion port (13). In this object-to-be-heated fitting (12), the tip of the rod is formed in a ring portion (14), and pins (15) are vertically formed on the ring portion (14) at appropriate intervals in the circumferential direction. Pin (1
The upper end of 5) is the object support base of the ring-shaped holder (6)
It is attached to the hole formed in part (17) so that it can move back and forth.
Further, the object-to-be-heated fitting (12) moves up and down by the operation of the lifting mechanism (16) to load the object-to-be-heated (3) carried into the upper chamber (7) by the object-to-be-heated conveying device (9). The ring-shaped holder (6) is positioned and mounted, or is transferred from the ring-shaped holder (6) to the heated object transfer device (9). Also, this partition
A chamber (11) located below (7) is connected to a supply passage (18) for a processing gas such as silane gas and an exhaust passage, and the tip of the reaction gas introduction passage (18) is a ring-shaped holder. The lower part of (6) is opened at an appropriate position where the ejected reaction gas can come into contact with the surface of the object (3) to be heated.

【0012】したがって、本実施例の減圧チャンバー
(1)では隔壁(4)の下側に位置する部屋(11)が反応室と
なり、隔壁(4)の上側に位置する部屋(7)が加熱室とな
る。そして、成膜作業時には、加熱室(7)側の内圧を
1.0〜数十Torr程度になるように減圧するとともに、
反応室(11)側での内圧を0.1〜10Torr程度になるよ
うに減圧して、加熱室(7)と反応室(11)とで内圧差を持
たせる。このように両室(7)(11)の内圧に圧力差を持た
せることにより、反応室(11)内の処理ガスが加熱室(7)
側に流れ込むことがなくなる。
Therefore, the decompression chamber of this embodiment
In (1), the room (11) located below the partition (4) becomes the reaction chamber, and the room (7) located above the partition (4) becomes the heating chamber. During the film forming work, the internal pressure on the heating chamber (7) side is reduced to about 1.0 to several tens Torr, and
The internal pressure on the reaction chamber (11) side is reduced to about 0.1 to 10 Torr so that the heating chamber (7) and the reaction chamber (11) have a difference in internal pressure. In this way, by making a pressure difference between the internal pressures of the two chambers (7) and (11), the processing gas in the reaction chamber (11) can be treated by the heating chamber (7).
It will not flow to the side.

【0013】また、加熱室(7)の被加熱物(3)と対向す
る上壁にクオーツウインドウ(19)が形成してあり、この
クオーツウインドウ(19)に臨む状態で前述のランプユニ
ット(2)が配置してある。このクオーツウインドウ(19)
は、微小間隔へだてて積層した2枚の石英ガラス(20)(2
0)と、この石英ガラス(20)(20)の外周部分に形成した冷
却液チャンバー(21)とで構成してあり、石英ガラス(20)
(20)同士間の微小間隙(22)に冷却液を高速で流通させる
ように構成してある。
Further, a quartz window (19) is formed on the upper wall of the heating chamber (7) facing the object (3) to be heated, and the lamp unit (2) mentioned above is provided in a state of facing the quartz window (19). ) Is placed. This Quartz Window (19)
Is a pair of fused silica glass (20) (2)
0) and the cooling liquid chamber (21) formed on the outer peripheral portion of the quartz glass (20) (20), the quartz glass (20)
The cooling liquid is configured to flow at high speed through the minute gaps (22) between the (20).

【0014】上述の構成からなるCVD装置では、減圧
チャンバー(1)内を隔壁(4)で反応室(11)と加熱室(7)
とに区画しているうえ、加熱室(7)側の内圧を反応室(1
1)側の内圧よりも高く設定していることから、処理ガス
が加熱室(7)側に流入することがなくなり、クオーツウ
インドウ(19)に嵌め込んだ石英ガラス(20)が高熱化して
も、石英ガラス(20)に処理ガスが作用することがなくな
って石英ガラス(20)と処理ガスが反応して石英ガラス(2
0)を曇らせることがなくなる。これにより、ランプユニ
ット(2)からの熱線が確実に被加熱物(3)に到達するこ
とになるから、加熱効率が向上するうえ、石英ガラス(2
0)の曇りを取るための作業を省略することができる。
In the CVD apparatus having the above structure, the inside of the decompression chamber (1) is divided by the partition wall (4) into the reaction chamber (11) and the heating chamber (7).
In addition, the internal pressure on the heating chamber (7) side is divided into the reaction chamber (1
Since it is set higher than the internal pressure on the 1) side, the processing gas does not flow into the heating chamber (7) side, and even if the quartz glass (20) fitted in the quartz window (19) heats up. , The processing gas no longer acts on the quartz glass (20), and the processing gas reacts with the quartz glass (20),
0) is not clouded. This ensures that the heat rays from the lamp unit (2) reach the object to be heated (3), so that the heating efficiency is improved and the quartz glass (2)
It is possible to omit the work for removing the cloudiness of 0).

【0015】さらに、加熱室(7)とランプユニット(2)
との間に配置したクオーツウインドウ(19)を2重ガラス
で構成し、このガラス同士の間隙に冷却水を高速で流通
させるようにしてあるから、クオーツウインドウ(19)の
ガラス自体が高温化しにくくなり、仮に処理ガスが加熱
室(7)側に漏れることがあっても、ガラス表面温度が低
くなることから、処理ガスとの反応が起こりにくくなっ
てガラスの曇りを抑制することができる。
Further, the heating chamber (7) and the lamp unit (2)
Since the quartz window (19) placed between and is made of double glass, and the cooling water is circulated at high speed in the gap between the glasses, it is difficult for the glass of the quartz window (19) to heat up. Even if the processing gas leaks to the heating chamber (7) side, the temperature of the glass surface is lowered, so that the reaction with the processing gas is less likely to occur, and the fogging of the glass can be suppressed.

【0016】図3は、光CVD装置に適用した例を示
し、これは減圧チャンバー(1)内を隔壁(4)で加熱室
(7)と反応室(11)に区画し、隔壁(4)にリング状ホルダ
ー(6)を介してウエハー等の被加熱物(3)を支持させ、
反応室(11)に反応用ガスを供給するように構成し、反応
室(11)の下側に紫外線発生装置(23)を配置し、この紫外
線発生装置(23)から反応室(11)内に照射した紫外線で被
加熱物(3)の表面に薄膜を成膜するようにしたものであ
る。そして、紫外線発生装置(23)と反応室(11)との間に
形成したガラス窓(24)に嵌め込んだ窓ガラス(25)は2重
窓に形成してあり、この窓ガラス(25)間にパージ用の水
素ガスや窒素ガスを流通させるように構成してある。
FIG. 3 shows an example applied to a photo-CVD apparatus, in which a decompression chamber (1) is heated by a partition wall (4) in a heating chamber.
(7) and the reaction chamber (11) are partitioned, and the partition wall (4) supports an object to be heated (3) such as a wafer through a ring-shaped holder (6),
It is configured to supply a reaction gas to the reaction chamber (11), an ultraviolet ray generator (23) is arranged below the reaction chamber (11), and the ultraviolet ray generator (23) is used to move the inside of the reaction chamber (11). A thin film is formed on the surface of the object to be heated (3) by the ultraviolet rays irradiated to the object. The window glass (25) fitted in the glass window (24) formed between the ultraviolet ray generator (23) and the reaction chamber (11) is a double window, and this window glass (25) A hydrogen gas and a nitrogen gas for purging are circulated between them.

【0017】[0017]

【発明の効果】本発明では、減圧チャンバー内に隔壁を
形成し、この隔壁に開設した開口部にリング状ホルダー
を設置し、リング状ホルダーに装着した被加熱物と隔壁
とで減圧チャンバー内を区画することにより反応室と加
熱室とを形成し、加熱室の内圧が反応室の内圧よりもわ
ずかに高くなるように両室の内圧を設定し、反応室に処
理ガス供給路の先端部を開口し、被加熱物と対向する加
熱室の壁面にクオーツウインドウを形成し、このクオー
ツウインドウに臨ませてランプユニットを配置している
ので、反応室に供給した処理ガスは加熱室側に流れ込む
ことがなくなる。これにより、クオーツウインドウが高
温になっても、処理ガスとの化学反応が生じることがな
くなり、クオーツウインドウを曇らせることがなく、ラ
ンプユニットでの長時間にわたって加熱効率を高く維持
することができる。
According to the present invention, a partition is formed in the decompression chamber, a ring-shaped holder is installed in the opening formed in the partition, and the decompression chamber is surrounded by the object to be heated and the partition mounted on the ring-shaped holder. The reaction chamber and heating chamber are formed by partitioning, and the internal pressure of both chambers is set so that the internal pressure of the heating chamber is slightly higher than the internal pressure of the reaction chamber, and the tip of the processing gas supply path is set in the reaction chamber. Since the quartz window is formed on the wall of the heating chamber facing the object to be heated, and the lamp unit is arranged facing the quartz window, the processing gas supplied to the reaction chamber must flow into the heating chamber. Disappears. As a result, even if the quartz window becomes hot, a chemical reaction with the processing gas does not occur, the quartz window is not fogged, and the heating efficiency in the lamp unit can be kept high for a long time.

【0018】また、減圧チャンバーとランプユニットと
の間に配置したクオーツウインドウを微小間隔へだてて
積層した複数枚の石英ガラスで構成し、石英ガラス同士
間の微小間隙に冷却液を高速で流通させるように構成し
ているので、クオーツウインドウが冷却されることにな
り、クオーツウインドウの加熱室側表面が高温化するこ
とはなくなり、処理ガスとの化学反応を抑制することが
できる。これにより、クオーツウインドウが曇ることは
なく、ランプユニットでの加熱効率を長時間にわたって
高く維持することができる。
Further, the quartz window arranged between the decompression chamber and the lamp unit is made up of a plurality of quartz glasses laminated with a minute gap therebetween, and the cooling liquid is passed at a high speed in the minute gaps between the quartz glasses. With this configuration, the quartz window is cooled, the surface of the quartz window on the heating chamber side does not rise in temperature, and the chemical reaction with the processing gas can be suppressed. As a result, the quartz window does not become fogged and the heating efficiency in the lamp unit can be kept high for a long time.

【0019】さらに、本発明では、クオーツウインドウ
の曇りを防止できるから、ウインドウガラスの取り替え
や、ガラスの磨き作業を省略することができ、成膜作業
の作業効率を向上させることができる。
Further, according to the present invention, since the fogging of the quartz window can be prevented, the replacement work of the window glass and the polishing work of the glass can be omitted, and the work efficiency of the film forming work can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】要部の取出し拡大図である。FIG. 1 is an enlarged view of a main part taken out.

【図2】CVD装置のチャンバー部断面図である。FIG. 2 is a sectional view of a chamber portion of a CVD apparatus.

【図3】光CVD装置のチャンバー部断面図である。FIG. 3 is a sectional view of a chamber portion of the photo CVD apparatus.

【符号の説明】[Explanation of symbols]

1…減圧チャンバー、 2…ランプユ
ニット、3…被加熱物、4…隔壁、5…開口部、
6…リング状ホルダー、7…加熱
室、 11…反応室、18…処理
ガス供給路 19…クオーツウインド
ウ、20…石英ガラス、 22…微小
間隙。
1 ... decompression chamber, 2 ... lamp unit, 3 ... object to be heated, 4 ... partition, 5 ... opening,
6 ... Ring-shaped holder, 7 ... Heating chamber, 11 ... Reaction chamber, 18 ... Processing gas supply path 19 ... Quartz window, 20 ... Quartz glass, 22 ... Minute gap.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 小野寺 廣一 神奈川県厚木市飯山台ノ岡2453番地20 株 式会社日本生産技術研究所内 (56)参考文献 実開 昭63−106767(JP,U) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirokazu Onodera 2453 Iinoyamadainooka, Atsugi City, Kanagawa 20 Japan Institute of Industrial Technology, Ltd. (56) Bibliography 63-106767 (JP, U)

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 減圧チャンバー(1)内に配置されたリン
グ状ホルダー(6)に被加熱物(3)を安定支持し、この被
加熱物(3)にランプユニット(2)からの熱線を照射する
ことにより加熱するとともに、減圧チャンバー(1)内に
処理ガスを供給して、被加熱物(3)の表面に薄膜を成膜
するように構成した減圧CVD装置において、 減圧チャンバー(1)内に隔壁(4)を形成し、この隔壁
(4)に開設した開口部(5)にリング状ホルダー(6)を設
置し、リング状ホルダー(6)に装着した被加熱物(3)と
隔壁(4)とで減圧チャンバー(1)内を区画することによ
り反応室(11)と加熱室(7)とを形成し、加熱室(7)側の
内圧が反応室(11)側の内圧よりもわずかに高くなるよう
に両室(7)(11)の内圧を設定し、反応室(11)に処理ガス
供給路(18)の先端部を開口し、被加熱物(3)と対向する
加熱室(7)の壁面にクオーツウインドウ(19)を形成し、
このクオーツウインドウ(19)に臨ませてランプユニット
(2)を配置したことを特徴とする減圧CVD装置。
1. An object to be heated (3) is stably supported by a ring-shaped holder (6) arranged in the decompression chamber (1), and the object to be heated (3) is exposed to heat rays from a lamp unit (2). In the low pressure CVD apparatus configured to heat by irradiation and to supply a processing gas into the low pressure chamber (1) to form a thin film on the surface of the object to be heated (3), the low pressure chamber (1) A partition (4) is formed in this partition
The ring-shaped holder (6) is installed in the opening (5) opened in (4), and the object to be heated (3) and the partition wall (4) mounted in the ring-shaped holder (6) are inside the decompression chamber (1). The reaction chamber (11) and the heating chamber (7) are formed by partitioning the chamber, and both chambers (7) are formed so that the internal pressure on the heating chamber (7) side is slightly higher than the internal pressure on the reaction chamber (11) side. ) (11) is set to an internal pressure, the tip of the processing gas supply path (18) is opened in the reaction chamber (11), and a quartz window (7) is placed on the wall surface of the heating chamber (7) facing the object to be heated (3). 19) forming
Lamp unit facing this quartz window (19)
A low pressure CVD apparatus characterized in that (2) is arranged.
【請求項2】 減圧チャンバー(1)とランプユニット
(2)との間に配置したクオーツウインドウ(19)を微小間
隔へだてて積層した複数枚の石英ガラス(20)で構成し、
石英ガラス(20)同士間の微小間隙(22)に冷却液を高速で
流通させるように構成した請求項1に記載の減圧CVD
装置。
2. A decompression chamber (1) and a lamp unit.
The quartz window (19) placed between (2) and the quartz window (19) are laminated at a very small interval.
The low pressure CVD according to claim 1, wherein the cooling liquid is made to flow at high speed through the minute gaps (22) between the quartz glasses (20).
apparatus.
【請求項3】 減圧チャンバー(1)内に配置されたリン
グ状ホルダー(6)に被加熱物(3)を支持し、この被加熱
物(3)にランプユニット(2)からの熱線を照射すること
により加熱し、減圧チャンバー(1)内に処理ガスを供給
するとともに減圧チャンバー内に紫外線を照射して、被
加熱物(3)の表面に薄膜を成膜するように構成した減圧
CVD装置において、 減圧チャンバー(1)内に隔壁(4)を形成し、この隔壁
(4)に開設した開口部(5)にリング状ホルダー(6)を設
置し、リング状ホルダー(6)に装着した被加熱物(3)と
隔壁(4)とで減圧チャンバー(1)内を区画することによ
り反応室(11)と加熱室(7)とを形成し、加熱室(7)側の
内圧が反応室(11)側の内圧よりもわずかに高くなるよう
に両室(7)(11)の内圧を設定し、反応室(11)に処理ガス
供給路(18)の先端部を開口したことを配置したことを特
徴とする減圧CVD装置。
3. An object to be heated (3) is supported by a ring-shaped holder (6) arranged in the decompression chamber (1), and the object to be heated (3) is irradiated with heat rays from a lamp unit (2). A low pressure CVD apparatus configured to heat the substrate to supply a processing gas into the decompression chamber (1) and irradiate the decompression chamber with ultraviolet rays to form a thin film on the surface of the object to be heated (3). In, the partition (4) is formed in the decompression chamber (1), and the partition
The ring-shaped holder (6) is installed in the opening (5) opened in (4), and the object to be heated (3) and the partition wall (4) mounted in the ring-shaped holder (6) are inside the decompression chamber (1). The reaction chamber (11) and the heating chamber (7) are formed by partitioning the chamber, and both chambers (7) are formed so that the internal pressure on the heating chamber (7) side is slightly higher than the internal pressure on the reaction chamber (11) side. (11) A low pressure CVD apparatus characterized in that an inner pressure of (11) is set, and a front end of a processing gas supply passage (18) is opened in a reaction chamber (11).
JP3033709A 1991-02-01 1991-02-01 Low pressure CVD equipment Expired - Lifetime JPH07108836B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3033709A JPH07108836B2 (en) 1991-02-01 1991-02-01 Low pressure CVD equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3033709A JPH07108836B2 (en) 1991-02-01 1991-02-01 Low pressure CVD equipment

Publications (2)

Publication Number Publication Date
JPH04254489A JPH04254489A (en) 1992-09-09
JPH07108836B2 true JPH07108836B2 (en) 1995-11-22

Family

ID=12393942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3033709A Expired - Lifetime JPH07108836B2 (en) 1991-02-01 1991-02-01 Low pressure CVD equipment

Country Status (1)

Country Link
JP (1) JPH07108836B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2734284B1 (en) * 1995-05-19 1997-06-13 Commissariat Energie Atomique DEVICE FOR THE SURFACE CHEMICAL TREATMENT OF A FLAT SAMPLE USING AN ACTIVE GAS
US20050037521A1 (en) * 2003-08-15 2005-02-17 Uwe Wellhausen Methods and apparatus for processing semiconductor devices by gas annealing
FR2900226B1 (en) * 2006-04-25 2017-09-29 Messier Bugatti PROCESSING OVEN OR THE LIKE

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106767U (en) * 1986-12-26 1988-07-09

Also Published As

Publication number Publication date
JPH04254489A (en) 1992-09-09

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