JPH07106784A - Enclosure for electronic equipment - Google Patents
Enclosure for electronic equipmentInfo
- Publication number
- JPH07106784A JPH07106784A JP24655293A JP24655293A JPH07106784A JP H07106784 A JPH07106784 A JP H07106784A JP 24655293 A JP24655293 A JP 24655293A JP 24655293 A JP24655293 A JP 24655293A JP H07106784 A JPH07106784 A JP H07106784A
- Authority
- JP
- Japan
- Prior art keywords
- fibers
- enclosure
- plate
- circuit board
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電磁波シ−ルド性に優れ
た電子機器の筐体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for electronic equipment having an excellent electromagnetic shield property.
【0002】[0002]
【従来の技術】従来、電子機器の筐体は、プラスチック
樹脂で成形し、筐体の内部に亜鉛溶射またはメッキを施
すか、導電性繊維を含有するプラスチック樹脂を使用す
る等の方法で、プラスチック成形体に導電性を付与し、
電磁波に対する反射性を与えて電磁波の漏出を防ぎ、ま
た外部から浸入してくる電磁波を遮蔽している。亜鉛溶
射、またはメッキによる方法は、製造工程が煩雑となる
だけでなく、溶射層、またはメッキ層がプラスチック層
から剥離し、電磁波遮蔽性が低下するという欠点があ
る。2. Description of the Related Art Conventionally, a housing of an electronic device is molded by a plastic resin, and the inside of the housing is sprayed with zinc or plated, or a plastic resin containing a conductive fiber is used. Imparts conductivity to the molded body,
The electromagnetic wave is given a reflection property to prevent the electromagnetic wave from leaking out and also to shield the electromagnetic wave from entering from the outside. The method using zinc spraying or plating not only complicates the manufacturing process, but also has a drawback that the sprayed layer or the plated layer is separated from the plastic layer, and the electromagnetic wave shielding property is deteriorated.
【0003】一方、製造工程上の優位性がある金属繊維
を含有するプラスチック成形品の筐体は、80MHz以
上の高周波の電磁波遮断性に優れているが、それより小
さい低周波領域の電磁波の遮断性は不十分であるという
問題があった。On the other hand, the case of a plastic molded product containing metal fibers, which has an advantage in the manufacturing process, has an excellent electromagnetic wave shielding property at a high frequency of 80 MHz or more, but shields an electromagnetic wave in a low frequency region smaller than that. There was a problem that the sex was insufficient.
【0004】[0004]
【発明が解決しようとする課題】そこで、本発明は、導
電性繊維含有プラスチック製筐体であって、低周波領域
の電磁波を遮断することもできる該筐体を提供すること
である。SUMMARY OF THE INVENTION Therefore, the present invention is to provide a case made of a conductive fiber-containing plastic and capable of blocking electromagnetic waves in a low frequency region.
【0005】[0005]
【課題を解決するための手段】本発明は電子機器を収容
する導電性繊維含有プラスチック製筐体と、該筐体内部
に接地され金属板を有することを特徴とする電子機器の
筐体に関する。以下、本発明を図面に基づいて説明す
る。図1は本発明を説明するための概略部分透視図であ
る。導電性繊維含有プラスチック製筐体10は、ステン
レス繊維等の金属繊維、炭素繊維、ニッケルメッキ炭素
繊維等の金属コ−ト炭素繊維の導電性繊維を、熱可塑性
樹脂に配合し、射出成形等の通常の方法により所定の形
状に成形したものである。筐体10の内部には4個ない
しそれ以上の台座11が形成されており、その上に電子
回路板12がが周知の手段により固定される。SUMMARY OF THE INVENTION The present invention relates to a housing made of a conductive fiber-containing plastic for accommodating an electronic device, and a housing of the electronic device having a metal plate grounded inside the housing. Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is a schematic partial perspective view for explaining the present invention. The conductive fiber-containing plastic casing 10 is made by mixing conductive fibers such as metal fibers such as stainless fiber, metal fibers such as carbon fiber and nickel-plated carbon fiber with thermoplastic resin, and performing injection molding or the like. It is formed into a predetermined shape by a usual method. Four or more pedestals 11 are formed inside the housing 10, and an electronic circuit board 12 is fixed thereon by a well-known means.
【0006】熱可塑性樹脂としては、ABS樹脂、ポリ
スチレン樹脂、ポリプロピレンオキサイド樹脂、アクリ
ルニトリル−エチレンプロピレンゴム−スチレン共重合
樹脂、ポリカ−ボネ−ト樹脂、ポリエステル樹脂等があ
る。金属繊維の直径は、4〜50μmのものが、炭素繊
維、金属コ−ト炭素繊維の直径は6〜20μmのものが
それぞれ使用される。これらの導電性繊維は長さ500
μm〜1000μmの長繊維が電磁波シ−ルド効果に対
して効果が大きい。導電性繊維の含有量は、ステンレス
繊維を使用した場合、重量基準で4〜15%が好まし
い。Examples of the thermoplastic resin include ABS resin, polystyrene resin, polypropylene oxide resin, acrylonitrile-ethylene propylene rubber-styrene copolymer resin, polycarbonate resin and polyester resin. The diameter of the metal fiber is 4 to 50 μm, and the diameter of the carbon fiber and the metal coat carbon fiber is 6 to 20 μm. These conductive fibers have a length of 500
The long fibers of μm to 1000 μm have a great effect on the electromagnetic shield effect. When stainless steel fibers are used, the content of the conductive fibers is preferably 4 to 15% by weight.
【0007】これらの導電性繊維は2種以上を組み合わ
せて用いることができるが、中でもステンレス繊維が高
強度、高剛性を有しており、加工後も高い長さ/直径比
を保持できるため好ましい。筐体10の底に金属板13
が配置されている。金属板13は、アルミニウム、鋼等
で形成された厚さ50μm〜300μmの板である。金
属板13を筐体10に接地して設けることにより、導電
性繊維含有プラスチック製筐体だけでは難しかった低周
波領域の電磁波の遮断ができる。従って金属板として
は、筐体に接地したいればよく、金属板13の大きさ
は、電子回路板に比べて大きくても小さくてもよい。
又、金属板13は1枚でも2枚以上でもよい。さらに金
属板13の大きは電子回路板12と同程度の大きさであ
って良いが、電磁波シ−ルド性を高めるためにそれより
大きくすることが好ましい。Two or more kinds of these conductive fibers can be used in combination. Among them, stainless fiber is preferable because it has high strength and high rigidity and can maintain a high length / diameter ratio even after processing. . A metal plate 13 is provided on the bottom of the housing 10.
Are arranged. The metal plate 13 is a plate made of aluminum, steel or the like and having a thickness of 50 μm to 300 μm. By providing the metal plate 13 on the housing 10 so as to be grounded, it is possible to shield electromagnetic waves in the low frequency region, which was difficult only with the conductive fiber-containing plastic housing. Therefore, the metal plate may be grounded to the housing, and the size of the metal plate 13 may be larger or smaller than that of the electronic circuit board.
The number of metal plates 13 may be one or two or more. Further, the size of the metal plate 13 may be the same as the size of the electronic circuit board 12, but it is preferable to make it larger than that in order to enhance the electromagnetic wave shielding property.
【0008】金属板13は、電子回路板12上の電子回
路と接続し接地するが、例えば、電子回路板12と金属
板13とが全面で接続するのではなく、台座11の部分
で接続するように、台座11の一つの上に金属板13の
部分を折り曲げ成形して、回路板12と共に固定するよ
うにすれば良い。尚、台座11は回路板12を筐体に固
定するために、設けられるもので必須ではない。The metal plate 13 is connected to an electronic circuit on the electronic circuit board 12 and is grounded. For example, the electronic circuit board 12 and the metal plate 13 are not connected on the entire surface but are connected on the base 11 part. As described above, the metal plate 13 may be bent and formed on one of the pedestals 11 and fixed together with the circuit board 12. The pedestal 11 is provided for fixing the circuit board 12 to the housing, and is not essential.
【0009】[0009]
【実施例】実施例1 繊維直径8mmのステンレス繊維を重量基準で8%を含
有するABS系樹脂を用い,携帯用電子計算機の筐体を
射出成形にて作成した。該筐体は上部,下部により構成
されており,下部の底面及び上部の底面に相対する面に
厚さ100μmのアルミニウムシートを設置し,台座に
ネジで固定する。また,上部及び下部に設置されたアル
ミニウムシート間は,銅フィルムテープにて電気的に接
続する。Example 1 A casing of a portable computer was prepared by injection molding using an ABS resin containing 8% by weight of stainless fiber having a fiber diameter of 8 mm. The housing is composed of an upper part and a lower part, and an aluminum sheet having a thickness of 100 μm is installed on the bottom surface of the lower part and the surface facing the bottom surface of the upper part, and fixed to the pedestal with screws. In addition, the aluminum sheets installed at the top and bottom are electrically connected with copper film tape.
【0010】以上のような筐体を有する携帯用電子計算
機をリードフレームにて,VCCI(情報処理装置等の
電波障害自主規制協議会)の技術基準に基づく妨害波の
測定を行った結果,30MHz〜1000MHzの測定
周波数領域でVCCIクラス2の基準を満足した。As a result of measuring the interference wave based on the technical standard of VCCI (Voluntary Control Council for Radio Interference of Information Processing Equipment) using a portable computer having the above-mentioned housing with a lead frame, 30 MHz The standard of VCCI class 2 was satisfied in the measurement frequency region of 1000 MHz.
【0011】[0011]
【発明の効果】本発明の電子機器の筐体は、導電性繊維
含有プラスチック製筐体の内部に金属板を配置している
ので80MHz以下の低周波領域の電磁波が遮断できる
という効果を有する。The housing of the electronic device of the present invention has the effect of blocking electromagnetic waves in the low frequency region of 80 MHz or less because the metal plate is placed inside the housing made of conductive fiber-containing plastic.
【図1】は,部分透視図である。FIG. 1 is a partial perspective view.
10:筐体 11:台座 12:電子回路板 13:金属板 10: case 11: pedestal 12: electronic circuit board 13: metal plate
Claims (1)
チック製筐体と、該筐体の内部に接地され金属板を有す
ることを特徴とする電子機器の筐体。1. A housing for an electronic device, comprising a conductive fiber-containing plastic housing for housing the electronic device, and a grounded metal plate inside the housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24655293A JPH07106784A (en) | 1993-10-01 | 1993-10-01 | Enclosure for electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24655293A JPH07106784A (en) | 1993-10-01 | 1993-10-01 | Enclosure for electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07106784A true JPH07106784A (en) | 1995-04-21 |
Family
ID=17150117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24655293A Pending JPH07106784A (en) | 1993-10-01 | 1993-10-01 | Enclosure for electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07106784A (en) |
-
1993
- 1993-10-01 JP JP24655293A patent/JPH07106784A/en active Pending
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