JPH07101782B2 - Cooling power supply mechanism for integrated circuits - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling power supply mechanism for an integrated circuit, and in particular, a liquid refrigerant such as water is circulated in the vicinity of the integrated circuit element which constitutes an electronic device such as an information processing device and is generated in the integrated circuit element. The present invention relates to a cooling structure for propagating heat to a liquid refrigerant to cool it.

[0002]

2. Description of the Related Art Conventionally, in this type of cooling structure, as shown in FIG. 2, a piston 23 is pressed against an integrated circuit 21 on a wiring board 20 by a spring 24. When the piston 23 takes away the heat generated in the integrated circuit 21, the heat is transferred to the hat 25 and the intervening layer 26 through the space filled with the helium gas 29, and is transferred from the intervening layer 26 to the cooling plate 27 and into the refrigerant 28. It is designed to dissipate heat.

The cooling method described above is based on "A Conducti
on-Cooled Modulefor High-
Performance LSI Devices "
(S. Oktay, HC Kammerer, IBM
Journal of Research and D
development. Vol. 26 No. 26. 1 Ja
n. 1982).

In the cooling structure shown in FIG. 2, the piston 23 urged by the spring 24 is brought into contact with the integrated circuit 21 to cool it, so that the integrated circuit 21 is always subjected to a force, and 21 may adversely affect the reliability of the connection portion between the wiring board 21 and the wiring board 20.

Further, in order to follow variations in height and inclination that occur when the integrated circuit 21 is attached to the wiring board 20, the contact surface of the piston 23 with the integrated circuit 21 is made spherical, and the hat 25 and the piston 23 are contacted with each other. Although a gap is provided between them, this reduces the effective heat transfer area, resulting in a decrease in cooling capacity.

Further, the flow path of the refrigerant 28 in the cooling plate 27 is formed for the purpose of heat transfer by forced convection, and the obtained heat transfer coefficient is about 0.1 to 0.5 W / cm ² ° C. If the power consumption increases as the integration degree of 21 increases, the cooling capacity may become insufficient.

On the other hand, as shown in FIG.
The heat generated in the chip 31 on the upper part of 0 is transmitted to the heat transfer substrate 32, the deformable heat transfer body 33, and the heat transfer plate 34, respectively, and the liquid refrigerant is discharged from the nozzle 35 to the heat transfer plate 34 in the bellows 36. There is also a structure for cooling by jetting. In this case, the liquid refrigerant ejected from the nozzle 35 is discharged from the bellows 36 to the flow path inside the cooling header 37. The cooling method described above is disclosed in JP-A-60-160150.

In the cooling structure shown in FIG. 3, the nozzle 35
Since the chip 31 is cooled by the liquid refrigerant ejected from the nozzles, the heat transfer substrate 32, the deformable heat transfer body 33, and the heat transfer plate 34 are provided between the chip 31 and the liquid refrigerant ejected from the nozzle 35. However, the high heat transfer rate may not be obtained and the cooling capacity may be insufficient.

Further, since the thin bellows 36 is used, corrosion occurs and the bellows 36 has a hole, and the nozzle 3
It is conceivable that the liquid refrigerant ejected from No. 5 leaks from the bellows 36.

In order to solve the above-mentioned problems of the cooling structure, the technique disclosed in JP-A-1-164053 and the technique disclosed in JP-A-2-237200 have been proposed.

In the technique disclosed in Japanese Patent Laid-Open No. 1-164053, cooling is performed from both the I / O (input / output) pin side of the wiring board and the integrated circuit side of the wiring board. Further, in the technique disclosed in Japanese Patent Application Laid-Open No. 2-237200, the inert liquid is directly jet-collised with the integrated circuit for cooling.

When the cooling structure as described above is adopted, for example, when the cooling structure as shown in FIG. 2 is adopted, power is supplied to the integrated circuit 21 from the I / I provided on the lower surface of the wiring board 20.
It is performed through the O pin 22. This is not limited to the case where the cooling structure of FIG. 2 is adopted, and the power is similarly supplied to the integrated circuit even when another cooling structure is adopted.

[0013]

In the above conventional cooling structure, cooling is performed from both the I / O pin side of the wiring board and the integrated circuit side of the wiring board, or the cooling is performed directly on the integrated circuit. In order to cope with the shortage of the cooling capacity when the power consumption is increased due to the high integration of the integrated circuit, the inert liquid is jet-collised to perform the cooling.

However, whichever cooling structure is adopted, since power is supplied to the integrated circuit through the I / O pins provided on the lower surface of the wiring board, the power supply capacity per wire is limited. There is a problem that some I / O pins cannot cope with an increase in power consumption due to high integration of integrated circuits, resulting in insufficient power supply capability.

Therefore, an object of the present invention is to solve the above problems and to cool an integrated circuit capable of improving both the cooling capacity and the power feeding capacity when the power consumption increases due to the high integration of the integrated circuit. The provision of a power supply mechanism.

[0016]

A cooling and feeding mechanism for an integrated circuit according to the present invention includes a wiring board having input / output terminals on the bottom surface, a board frame member for holding the wiring board, and an upper surface side of the wiring board. A plurality of integrated circuits mounted and a plate-shaped conductive member that is closely fixed to the upper surface of the wiring board and partitions each of the plurality of integrated circuits, and a bottom surface is fixed to the upper surface of the integrated circuit. A plurality of cooling members having discharge holes on a peripheral wall surface for discharging a liquid coolant for cooling the space into the space formed by the wiring board, the board frame member and the conductive member; and a header for maintaining the space in a sealed state. A member, an insulating member that insulates and tightly adheres the substrate frame member and the conductive member to the header member, a plurality of nozzles that inject the liquid refrigerant to the bottom surface of the cooling member, and accumulates in the space Before And a plurality of discharge ports for discharging the liquid coolant, sequentially connecting the plurality of cooling member by said nozzle and said discharge port, and to supply power to the integrated circuit from each said conductive member.

[0017]

An embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a vertical sectional view showing an embodiment of the present invention. In the figure, the wiring board 1 has I / O pins 2 on its lower surface and is held by a board frame 3. A plurality of integrated circuits 4-1 to 4-4 are mounted on the wiring board 1, and a plate-shaped conductive member (for example, a copper plate) is provided between the integrated circuits 4-1 to 4-4. It is partitioned by the power supply bus 7.

The board frame 3 and the power supply bus 7 are closely fixed to the header portion 9 of the cooling container via the insulating plate 8. Therefore, the space around each of the integrated circuits 4-1 to 4-4 is maintained in a sealed state by the wiring board 1, the board frame 3, the power feeding bus 7, and the header portion 9.

Solder 6-1 to 6 is provided on each of the integrated circuits 4-1 to 4-4.
The cylindrical cooling parts 5-1 to 5-4 are fixed by -4. A plurality of holes are formed on the peripheral wall surfaces of the cooling units 5-1 to 5-4, respectively, and the nozzle 1 is provided on the upper surface of the cooling units 5-1 to 5-4.
0-1 to 10-4 are provided so as to inject the liquid refrigerant to the bottom of each of the cooling units 5-1 to 5-4.

These nozzles 10-1 to 10-4 are provided with a cooling unit 5-1.
5-4 are attached to the header portion 9 corresponding to each.
Further, in the header portion 9, the nozzles 10-1 to 10-4 are sprayed to the bottom portions of the cooling portions 5-1 to 5-4 corresponding to the integrated circuits 4-1 to 4-4, respectively, and the cooling portion 5- Refrigerant discharge ports 11-1 to 11-4 are provided for discharging the liquid refrigerant flowing out from the holes of the peripheral wall surfaces 1 to 5-4 and accumulated in the space around each of the integrated circuits 4-1 to 4-4. ing.

The nozzle 10-1 is connected to an inlet side header 13 for distributing the liquid refrigerant flowing in from the liquid refrigerant inlet 12, the nozzles 10-2 to 10-4 and the refrigerant outlets 11-1 to 1-1.
1-3 are counterbore grooves 14-1 to 14-3 provided in the header section 9.
Are sequentially connected via. The refrigerant outlet 11-4 is connected to an outlet side header 15 for collecting the liquid refrigerant that has cooled each of the integrated circuits 4-1 to 4-4, and the liquid refrigerant collected in the outlet side header 15 is discharged from the liquid refrigerant outlet 16. It is discharged to the outside.

That is, the liquid refrigerant flowing from the liquid refrigerant inlet 12 is jetted from the inlet side header 13 through the nozzle 10-1 to the bottom of the cooling section 5-1 and flows out from the hole of the peripheral wall surface of the cooling section 5-1. And is stored in the space around the integrated circuit 4-1.

The liquid refrigerant accumulated in the space around the integrated circuit 4-1 is jetted from the nozzle 10-2 to the bottom of the cooling section 5-2 through the refrigerant discharge port 11-1 and the counterbore groove 14-1. , Flows out from the holes on the peripheral wall surface of the cooling unit 5-2 and is accumulated in the space around the integrated circuit 4-2.

The liquid refrigerant accumulated in the space around the integrated circuit 4-2 is jetted from the nozzle 10-3 to the bottom of the cooling section 5-3 through the refrigerant discharge port 11-2 and the counterbore 14-2. , Flows out from the holes on the peripheral wall surface of the cooling unit 5-3 and is accumulated in the space around the integrated circuit 4-3.

The liquid refrigerant accumulated in the space around the integrated circuit 4-3 is jetted from the nozzle 10-4 to the bottom of the cooling section 5-4 through the refrigerant discharge port 11-3 and the counterbore groove 14-3. , Flows out from the holes on the peripheral wall surface of the cooling unit 5-4 and is accumulated in the space around the integrated circuit 4-4. The liquid refrigerant accumulated in the space around the integrated circuit 4-4 passes through the refrigerant discharge port 11-4, is collected in the outlet-side header 15, and is discharged from the liquid refrigerant outlet 16 to the outside. The flow of the liquid refrigerant is shown by arrows in the figure.

On the other hand, the power supply bus 7 is tightly fixed on the wiring board 1 and supplies power to each of the integrated circuits 4-1 to 4-4 via a wiring pattern (not shown) on the wiring board 1. . Further, power is supplied to the power supply bus 7 from the outside through a connector (not shown) provided on the board frame 3. The integrated circuits 4-1 to 4-4 are arranged on the wiring board 1.
Are arranged in a matrix, the power supply buses 7 are arranged in a grid.

Therefore, the heat generated in each of the integrated circuits 4-1 to 4-4 and the liquid refrigerant injected from the nozzles 10-1 to 10-4 to the bottoms of the cooling units 5-1 to 5-4 and the cooling unit. It is cooled by the liquid refrigerant flowing out from the holes of the peripheral wall surfaces of 5-1 to 5-4 and accumulated in the space around each of the integrated circuits 4-1 to 4-4.

Further, the heat generated in the power supply bus 7 due to the supply of power to each of the integrated circuits 4-1 to 4-4 also cools the cooling units 5-1 to 5-5.
-4 is cooled by the liquid refrigerant flowing out from the hole of the peripheral wall surface and accumulated in the space around each of the integrated circuits 4-1 to 4-4.

In this case, an insulating refrigerant [for example, a fluorine-based (fluorocarbon etc.) insulating refrigerant] must be used as the liquid refrigerant. By using this insulating refrigerant, there is no problem even if the liquid refrigerant comes into direct contact with the outer peripheral surfaces of the integrated circuits 4-1 to 4-4 and the power supply bus 7, so that the integrated circuits 4-1 to 4-4 can be used. The heat generated in the power feeding bus 7 can be directly cooled by the liquid refrigerant 8.

Since the integrated circuits 4-1 to 4-4 and the header section 9 are not in direct contact with each other, the integrated circuits 4-1 to 4-4 are connected to the wiring board 1.
It is possible to absorb variations in height and inclination that occur when the circuit board is attached to the integrated circuit 4-1 to 4-4 and to prevent the connection between the integrated circuits 4-1 to 4-4 and the wiring board 1 from being adversely affected. Further, since the board frame 3 and the power feeding bus 7 are closely fixed to the wiring board 1 and the board frame 3 and the power feeding bus 7 are tightly fixed to the header portion 9 via the insulating plate 8, liquid leakage does not occur. It is possible to provide a highly reliable cooling structure.

Further, by fixing the power supply bus 7 on the same surface as the mounting surface of the integrated circuits 4-1 to 4-4 of the wiring board 1, the power supply bus 7 is changed to each integrated circuit 4-1 to 4-4. Since the power can be easily supplied, the power I / O pin 2 of the wiring board 1 can be used for other signals. Therefore, I of the wiring board 1
The number of signal I / O pins 2 can be increased without changing the number of / O pins 2 or the mounting density.

Furthermore, the cross-sectional area of the power supply bus 7 is I / O.
Since it is easy to make it larger than the cross-sectional area of the pin 2, a large-capacity power source can be easily supplied to each integrated circuit 4-1 to 4-4. Therefore, it is possible to easily deal with the increase in power consumption due to the high integration of the integrated circuits 4-1 to 4-4, and it is possible to improve the cooling capacity and the power supply capacity when the power consumption increases.

As described above, the wiring board 1, the board frame 3 for holding the wiring board 1, and the power supply for partitioning the plurality of integrated circuits 4-1 to 4-4 mounted on the upper surface side of the wiring board 1 respectively. Bus 7
Nozzle 10 which maintains the space consisting of and in a sealed state by the header part 9 and injects the liquid refrigerant to the bottom surface of each of the cooling parts 5-1 to 5-4 mounted on the integrated circuits 4-1 to 4-4. Refrigerant outlet 11 for discharging the liquid refrigerant accumulated in the space 1 to 10-4 and the space
-1 to 11-4 and the counterbore grooves 14-1 to 14-3 are connected to the cooling units 5-1 to 5-4 in order, and the power supply bus 7 supplies power to the integrated circuits 4-1 to 4-4. By supplying, it is possible to improve both the cooling capacity and the power supply capacity when the power consumption increases due to the high integration of the integrated circuits 4-1 to 4-4.

Incidentally, in one embodiment of the present invention, the cooling unit 5
Although -1 to 5-4 have a cylindrical shape, they may have a hollow rectangular parallelepiped shape. Further, the nozzles 10-1 to 10-4 are provided on the cooling units 5-1 to 5-4.
And refrigerant discharge ports 11-1 to 11-4 and counterbore grooves 14-1 to 14-3
The header section 9 having the above is attached to form the refrigerant flow path connecting the cooling sections 5-1 to 5-4 to each other.
To 4-4 surrounding spaces and cooling sections 5-1 to 5-4 may be independently formed with coolant flow paths for circulating a liquid coolant,
It is not limited to these. In this case, the integrated circuits 4-1 to 4-4
The surrounding space may be maintained in a sealed state with a conductive member.

[0036]

As described above, according to the present invention, the wiring board, the board frame member for holding the wiring board, and the plurality of integrated circuits mounted on the upper surface side of the wiring board are partitioned from each other. A header member keeps a space consisting of the conductive member of FIG. 3 sealed and a liquid refrigerant is jetted to the bottom surface of each of a plurality of cooling members having a discharge hole for discharging the liquid refrigerant for cooling the integrated circuit in the space. The plurality of nozzles and the plurality of outlets for discharging the liquid refrigerant accumulated in the space are connected to the plurality of cooling members in sequence, and the power is supplied from the conductive member to each integrated circuit. There is an effect that both the cooling capacity and the power supply capacity can be improved when the power consumption increases due to the high integration of the circuit.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a vertical sectional view showing a conventional example.

FIG. 3 is a vertical sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 I / O pin 3 Board frame 4-1 to 4-4 Integrated circuit 5-1 to 5-4 Cooling part 7 Power supply bus 8 Insulating plate 9 Cooling container header part 10-1 to 10-4 Nozzle 11 -1 to 11-4 Refrigerant discharge port 14-1 to 14-3 Counterbore groove

Claims (2)

[Claims] 1. A wiring board having input / output terminals on a bottom surface side, a board frame member for holding the wiring board, a plurality of integrated circuits mounted on an upper surface side of the wiring board, and an upper surface of the wiring board. A plate-shaped conductive member that is tightly fixed and partitions between each of the plurality of integrated circuits, and a bottom surface is fixed to an upper surface of the integrated circuit, and a liquid coolant for cooling the integrated circuit is provided to the wiring substrate and the substrate frame. A plurality of cooling members having discharge holes for discharging into a space formed of a member and the conductive member on a peripheral wall surface, a header member for maintaining the space in a sealed state, the substrate frame member, the conductive member, and the header member An insulating member that insulates and closely adheres to each other, a plurality of nozzles that inject the liquid refrigerant to the bottom surface of the cooling member, and a plurality of discharge ports that discharge the liquid refrigerant accumulated in the space, With the nozzle A cooling power feeding mechanism for an integrated circuit, wherein the plurality of cooling members are sequentially connected by the discharge port, and power is supplied from the conductive member to each of the integrated circuits. 2. The cooling power feeding mechanism for an integrated circuit according to claim 1, wherein the liquid refrigerant is an insulating refrigerant.