JPH0698976A - Jigsaw puzzle - Google Patents

Abstract

PURPOSE:To eliminate the restriction that a wide horizontal space is indispensable at the time of use. CONSTITUTION:This jigsaw puzzle has plural chips 2 to be aligned on a board 1, etc., by combining the chips with each other. Foamed resin layers 23 which have adhesiveness and elasticity and are exposed with closed cells 23a or open cells 23b on the outside surfaces are formed on the rear surfaces of the respective chips 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jigsaw puzzle which is a kind of intelligent toys.

[0002]

2. Description of the Related Art As is well known, a conventional jigsaw puzzle is one in which a large number of chips are arranged in a plane while meshing with each other.

[0003]

However, in this device, it is necessary to arrange the chips on the upper surface of a horizontally arranged board or the like, and if the board or the like is tilted or stood up in the middle of the board, the chip will come out from a predetermined position. It slips to another position. Therefore, a wide horizontal space is required for use.

It is not unusual that all such chips are attached to a poster panel or the like and used as interior decoration after several times of use, but in the conventional one, the chips are attached to the panel with an adhesive. Since they are attached by using them, there is also a problem that it is difficult to disassemble the chips and play again once they are attached.

An object of the present invention is to eliminate such a problem.

[0006]

The present invention takes the following means in order to achieve such an object. That is, the jigsaw puzzle according to the present invention comprises a plurality of chips to be arranged in combination with each other, and the back surface of each of the chips has adhesiveness and elasticity, and has foam formed by exposing bubbles on its outer surface. It is characterized in that a resin layer is formed. Another jigsaw puzzle according to the present invention is
Comprising a plurality of chips to be arranged in combination with each other, and an intermediate bonded body to be attached to the back side of the chip, forming a smooth surface on the back side of the chip, It is characterized in that a foamed resin layer having adhesiveness and elasticity on both sides and having exposed bubbles is formed on the outer surfaces thereof.

Still another jigsaw puzzle according to the present invention comprises a plurality of chips to be arranged in combination with each other,
An intermediate joint body to be attached to the back side of the chip, wherein one surface of the intermediate joint body is provided with an adhesive layer to be adhered to the back surface of the chip, and the other surface has tackiness and elasticity. And a foamed resin layer having air bubbles exposed on the outer surface thereof.

The intermediate bonded body may be in the form of a small piece that can be used one by one for each chip, or may be in the form of a sheet having an area corresponding to a plurality of chips. In the latter case, the area of one intermediate bonded body may be made to roughly correspond to the total area of all chips, but the total area of a plurality of intermediate bonded bodies may be made to roughly correspond to the total area of all chips. The intermediate bonded body may be of a size that is convenient for packaging or the like.

[0009]

With this structure, when each chip is loosely pressed against a smooth surface such as a board directly or through an intermediate bonded body, the adhesiveness of the outer surface of the foamed resin layer causes the chip to stick to the smooth surface. It will be easily peeled and adhered.
Then, when the chip is pressed against the smooth surface relatively strongly, the thickness of the foamed resin layer is temporarily reduced by elasticity, and a part of the air in the bubbles is removed. When the chip is released from the pressure in that state, the foamed resin layer thickens due to elasticity and the inside of the bubbles becomes a negative pressure, and the outer surface of the foamed resin layer is adsorbed to the mating surface, and the chip is bonded by the above-mentioned adhesion. It is fixed to a board with the above strength.

Therefore, with such a structure, even if the board or the like is erected obliquely or vertically, each chip can be attached to a desired position and played properly, and the assembled state can be obtained. It can also be hung as a decoration on a wall. When the chips are separated from the smooth surface by an external force of a certain level or more, the chips can be separated from the board or the like, and the puzzle play can be performed again.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

The jigsaw puzzle of the present invention comprises a plurality of chips 2 to be arranged on a surface 11 of a board 1, as shown in FIG.

The board 1 is made of a synthetic resin plate having a smooth surface 1a. The board 1 is not limited to the one made of synthetic resin, and may be, for example, a cardboard having a laminated layer of vinyl chloride or the like formed on at least the surface thereof.

Each chip 2 has a base material 21 made of, for example, cardboard.
A laminate layer 22 made of vinyl chloride or the like formed on the front surface 21a and the back surface 21b of the base material 21, and a foamed resin layer 23 formed on the entire back surface 21b of the base material 21 outside the laminate layer 22. It becomes. The foamed resin layer 23 is a resin having adhesiveness and elasticity, for example,
A foamed acrylic ester resin, urethane resin, or the like, and has a large number of closed cells 23a or communicating cells 23b inside.
And has bubbles 23a on their outer surface 23c,
A part of 23b is exposed. For example, a thin polyethylene sheet 24 is releasably attached to the outer surface 23c of the foamed resin layer 23 of the new chip 2. Instead of the laminate layer 22, a so-called varnishing treatment or another resin coating layer may be formed.

With such a structure, the chip 2
When the polyethylene sheet 24 is used while being attached, the chip 2 can be slid on the board 1 and can be enjoyed in a conventional manner. With the polyethylene sheet 24 removed from the back surface of the chip 2,
The chip 2 can be adhered to the surface 1a of the board 1 by an adhesive force or a suction force. That is, when each chip 2 is loosely pressed against the board 1, the outer surface 2 of the foamed resin layer 23 is
Due to the adhesiveness of 3c, the chip 2 is on the surface 1a of the board 1
It will be easily peeled off and adhered. And tip 2
Is pressed against the board 1 relatively strongly, the foamed resin layer 23
Of the bubbles 23a, 23
Some of the air in b is eliminated. When the pressing of the chip 2 is released in that state, the foamed resin layer 23 is elastically thickened and a negative pressure is generated in the bubbles 23a and 23b, and the outer surface 23c of the foamed resin layer 23 is adsorbed to the mating surface 1a. , The chip 2 is fixed to the board 1 with a strength higher than that of the above-mentioned adhesive bonding. Therefore, with such a configuration, each chip 2 can be attached to a desired position and appropriately played even when the board 1 is obliquely or vertically erected. Therefore, even a large chip having a large number of chips 2 can be used without requiring a large flat floor area. Further, with such a structure, even if an impact force is applied to the board 1 or the like during use or after completion, the arrangement state of the chips 2 is not disturbed. After completion, you can hang it on the wall and decorate it as it is. It is also possible to peel off the chip 2 from the board 1 again and play a puzzle.

The structure of the chip is not limited to that of the above embodiment, and may be, for example, as shown in FIGS. The chip 102 includes a base material 121 made of cardboard, a laminate layer of vinyl chloride or the like formed on the front surface and the back surface of the base material 121 in the same manner as in the above-described embodiment, and an outer surface of the laminate layer on the back surface of the base material 121. The foamed resin layer 123 is formed, and the foamed resin layer 123 is partially formed on a portion of the back surface of the base material 121 excluding the peripheral edge portion. And
On the back side of the new chip 102, the polyethylene sheet 1
24 is attached to the foamed resin layer 123 so that it can be peeled off. This polyethylene sheet 124 is formed by punching simultaneously with the corresponding chip 102.
Has the same shape as Thus, the peripheral edge portion 124a of the polyethylene sheet 124 is released from the foamed resin layer 123 and serves as a picking margin when peeling. In the chip 102, for example, a foamed resin layer 123 is partially formed on a base material plate by a technique such as silk printing, and a polyethylene sheet 123 is adhered on the foamed resin layer 123, which is then punched into a predetermined shape by pressing. It may be manufactured by

Further, the structure of the foamed resin layer itself is not limited to the one described above, and may be one as shown in FIGS. 7 and 8, for example. 7 and 8
The foamed resin layer 223 shown in FIG. 2 is a partially spherical shape that does not have a flat surface, and is formed on the back surface of the chip 202 or the board 202.
Many protrusions are formed by regularly arraying on the surface of. The foamed resin layer 223 is, for example, the chip 202.
This is used when you want to weaken the suction force to prevent the sticking from the board. Other modes of the foamed resin layer include those shown in FIGS. 9 to 11. The foamed resin layer 323 of the chip 302 shown in FIG.
a and the communication bubbles 323b as well as a large number of concave portions 3 on the surface.
25 is formed regularly. In the case of this embodiment, since the base material 321 is covered with the laminate layer 324 and does not have air permeability, the concave portion 325 mainly serves to strengthen the suction force. In the case of FIG. 10 as well, the concave portion 325 also plays a role of enhancing the suction force. It should be noted that it is not impossible to provide the concave portion so as to penetrate to the surface of the base material, but in that case, it works to weaken the adsorption force.

Further, in the present invention, for example, as shown in FIG. 11, a smooth surface 402a is formed on the back side of the chip 402, and between the chip 402 and the board 401 and the like,
Intermediate joined body 426 having foamed resin layers 423 on both sides
It also includes those that are installed. The intermediate bonded body 426 has adhesiveness and elasticity, and has a foamed resin layer 4 in which individual cells 423a and communicating cells 423b are exposed on the outer surface thereof.
23 on both sides. Specifically, for example, as shown in FIG. 12, this intermediate joined body 426 is formed by bonding two synthetic resin films 421 having a foamed resin layer 423 formed on one surface back to back via an adhesive 427. . And
In the unused state, a polyethylene sheet 424 or the like is adhered to the outer surface of each foamed resin layer 423, and the polyethylene sheet 424 is peeled off when used. In this case, a smooth surface 40 is formed on the back side of the chip 402 by a laminating layer or the like.
2a is formed. When the board is made of cardboard, a laminate layer or the like is preferably formed on the surface of the board.

Further, according to the present invention, as shown in FIG. 13, for example, the intermediate bonded body 5 is formed on the back surface 502a of the chip 502.
26 is attached, and the chip 5 is inserted through the intermediate bonded body 526.
A device in which 02 is detachably attached to the board 501 is also included. An adhesive layer 527 to be attached to the back surface of the chip 502 is provided on one surface of the intermediate bonded body 526, and the other surface has adhesiveness and elasticity, and the closed surface 523a and the communicating bubbles 523b are exposed on the outer surface thereof. The foamed resin layer 523 is formed. In this case, however, the back surface of the chip 502 may be such that the cardboard is directly exposed.

In the above-described illustrated example, the intermediate bonded body is a small piece that can be used one by one for each chip, but the intermediate bonded body has a sheet shape having an area corresponding to a plurality of chips. It may be one. In this case, the area of one intermediate bonded body and the total area of all chips may be made to correspond substantially, or the total area of a plurality of intermediate bonded bodies and the total area of all chips may be made to correspond substantially. You may let me.

In addition, various modifications can be made without departing from the spirit of the present invention.

[0022]

Since the present invention is constructed as described above,
It can be used not only horizontally but also in an upright position diagonally or vertically, so that it is possible to diversify the manner of use, and it is possible to play a large-sized one having a large number of chips without requiring a large space. Also,
Even if an impact force is applied from the outside during use or when all the chips have been arranged, there is an advantage that the chip arrangement will not be disturbed. It can be hung as a wall. What's more, even after making it ready for wall hangings,
If necessary, the chips can be disassembled and re-created as a puzzle.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is a rear view showing the chip of the embodiment.

4 is an enlarged cross-sectional view corresponding to line BB in FIG.

FIG. 5 is a rear view of a chip showing another embodiment of the present invention.

FIG. 6 is a view on arrow D in FIG.

FIG. 7 is a rear view of a chip showing still another embodiment of the present invention.

8 is an enlarged cross-sectional view corresponding to line BB in FIG.

FIG. 9 is an enlarged cross-sectional view corresponding to FIG. 8 showing still another embodiment of the present invention.

FIG. 10 is an enlarged sectional view corresponding to FIG. 8 showing still another embodiment of the present invention.

FIG. 11 is an explanatory view showing still another embodiment of the present invention.

FIG. 12 is an enlarged cross-sectional view showing the intermediate joining piece of the embodiment.

FIG. 13 is an explanatory view showing still another embodiment of the present invention.

FIG. 14 is an enlarged cross-sectional view showing the intermediate joining piece of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Board 1a ... Surface 2 ... Chip 21 ... Base material 22 ... Laminate layer 23 ... Foaming resin layer 23a ... Air bubbles (closed air bubbles) 23b ... Air bubbles (communication air bubbles) 23c ... Outer surface 202 ... Chip 223 ... Foaming resin layer 302 ... Chips 323 ... Foamed resin layer 323a ... Bubbles (closed bubbles) 323b ... Bubbles (opened bubbles) 401 ... Board 402 ... Chip 402a ... Smooth surface 423 ... Foamed resin layer 423a ... Bubbles (closed bubbles) 423b ... Bubbles (open bubbles) 426 ... Intermediate joined body 501 ... Board 502 ... Chip 523 ... Foamed resin layer 523a ... Bubbles (closed bubbles) 523b ... Bubbles (communication bubbles) 526 ... Intermediate joined body

Claims (7)

[Claims] 1. A foamed resin layer comprising a plurality of chips to be arranged in combination with each other, the back surface of each of the chips having adhesiveness and elasticity and having bubbles exposed on the outer surface thereof. A jigsaw puzzle featuring what you have done. 2. A jigsaw puzzle comprising a plurality of chips to be arranged in combination with each other and an intermediate bonded body to be abutted on the back side of the chip, wherein a smooth surface is formed on the back side of the chip. A jigsaw puzzle in which a foamed resin layer having adhesiveness and elasticity on both sides of the intermediate bonded body and having exposed bubbles is formed on the outer surface thereof. 3. A jigsaw puzzle comprising a plurality of chips to be arranged in combination with each other and an intermediate bonded body to be abutted on the back side of the chip, wherein one surface of the intermediate bonded body is provided on the back surface of the chip. A jigsaw puzzle, which is characterized in that an adhesive layer to be stuck is provided and a foamed resin layer having adhesiveness and elasticity on the other surface and exposing air bubbles is formed on the outer surface thereof. 4. The jigsaw puzzle according to claim 2, wherein the intermediate bonded body is a small piece that can be used one by one for each chip. 5. The jigsaw puzzle according to claim 2 or 3, wherein the intermediate bonded body is a sheet having an area corresponding to a plurality of chips. 6. The area of one intermediate bonded body and the total area of all the chips substantially correspond to each other.
The described jigsaw puzzle. 7. The jigsaw puzzle according to claim 5, wherein a total area of the plurality of intermediate bonded bodies and a total area of all the chips substantially correspond to each other.