JPH0691701A - Injection mold - Google Patents
Injection moldInfo
- Publication number
- JPH0691701A JPH0691701A JP24100992A JP24100992A JPH0691701A JP H0691701 A JPH0691701 A JP H0691701A JP 24100992 A JP24100992 A JP 24100992A JP 24100992 A JP24100992 A JP 24100992A JP H0691701 A JPH0691701 A JP H0691701A
- Authority
- JP
- Japan
- Prior art keywords
- injection
- dummy
- runner
- cavity
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 title claims abstract description 49
- 239000007924 injection Substances 0.000 title claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000000465 moulding Methods 0.000 claims abstract description 14
- 238000001746 injection moulding Methods 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 230000007812 deficiency Effects 0.000 abstract 1
- 208000015943 Coeliac disease Diseases 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱硬化性樹脂を用いて
成形を行う射出成形用金型に関し、特に、射出量のバラ
ツキを緩和し、射出量不足やバリの発生を防止し得る射
出成形用金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding die for molding using a thermosetting resin, and more particularly, to an injection mold capable of alleviating variations in injection quantity and preventing insufficient injection quantity and occurrence of burrs. The present invention relates to a molding die.
【0002】[0002]
【従来の技術】一般に、合成樹脂の射出成形において
は、射出シリンダ内で樹脂を剪断発熱させて溶融し、射
出するため、各射出毎の射出量が計算値に対しばらつく
場合が多い。このため、各射出毎の射出量のバラツキを
吸収するために、熱可塑性樹脂用射出成形機のスクリュ
ー式射出機では、図6に示すように、射出完了時のスク
リュー20の先端とスクリュー外筒21のノズル部21
aとの間に、5〜15mm程度の間隙が設けられている。2. Description of the Related Art Generally, in injection molding of synthetic resin, since the resin is melted by shearing heat in an injection cylinder and injected, the injection amount for each injection often varies from the calculated value. For this reason, in order to absorb the variation in the injection amount for each injection, in the screw type injection machine of the thermoplastic resin injection molding machine, as shown in FIG. Nozzle part 21 of 21
A gap of about 5 to 15 mm is provided between a and a.
【0003】これにより、熱可塑性樹脂の射出時には、
スクリュー20とノズル部21aとの間に樹脂が残留し
て、射出成形時の射出量不足を防止し、射出量不足によ
る成形不良の発生を防止している。As a result, during injection of the thermoplastic resin,
The resin remains between the screw 20 and the nozzle portion 21a to prevent the injection amount from being insufficient at the time of injection molding, and to prevent the occurrence of molding failure due to the injection amount being insufficient.
【0004】一方、熱硬化性樹脂の射出成形において
は、スクリュー外筒内に樹脂を残留させると、次の射出
までにその残留樹脂が硬化してしまうため、図5に示す
ように、射出完了時におけるスクリュー22の先端とス
クリュー外筒23のノズル部23aの間に間隙は設けら
れていない。On the other hand, in the injection molding of a thermosetting resin, if the resin is left in the outer cylinder of the screw, the residual resin is hardened by the next injection, so that the injection is completed as shown in FIG. At this time, no gap is provided between the tip of the screw 22 and the nozzle portion 23a of the screw outer cylinder 23.
【0005】しかし、熱硬化性樹脂は、一般に熱可塑性
樹脂よりもその溶融温度幅及び溶融時間幅が小さく、射
出量の計算値に対する実際の射出量のバラツキが大き
い。このため、繰り返し熱硬化性樹脂の射出成形を行っ
た場合、スクリュー外筒のノズル部内に樹脂が徐々に残
留して硬化し、射出量不足による成形不良が発生し、そ
の不良発生率は、熱可塑性樹脂の射出成形に比べ、かな
り高いものとなっていた。However, the thermosetting resin generally has a smaller melting temperature range and melting time range than the thermoplastic resin, and has a large variation in the actual injection amount with respect to the calculated injection amount. For this reason, when the thermosetting resin is repeatedly injection-molded, the resin gradually remains in the nozzle portion of the screw outer cylinder and hardens, resulting in a molding failure due to insufficient injection amount. It was considerably higher than the injection molding of a plastic resin.
【0006】そこで、熱硬化性樹脂の射出成形では、連
続して射出成形を行う場合、ノズル部内に樹脂が徐々に
硬化して堆積し、計量部の容積が徐々に減少するため、
数回射出を行う毎に、材料の計量値の切換えを行って射
出量の補正を行うようにしている。Therefore, in injection molding of thermosetting resin, when continuous injection molding is performed, the resin gradually hardens and accumulates in the nozzle portion, and the volume of the measuring portion gradually decreases.
Every time the injection is performed several times, the measured value of the material is switched to correct the injection amount.
【0007】[0007]
【発明が解決しようとする課題】しかし、射出成形時に
おけるこのような計量値の切換えは、その時々の樹脂の
硬化の仕方によってそのタイミングと量を変える必要が
あるために、非常に難しく、熟練技術を必要とするた
め、射出量不足による不良発生率は依然としてかなり高
いという問題があった。However, it is very difficult to change the measured value at the time of injection molding because it is necessary to change the timing and the amount depending on the method of curing the resin at each time. Since technology is required, there is a problem that the defect occurrence rate due to insufficient injection amount is still high.
【0008】一方、従来では、特開昭58−10103
3号公報、特開平1−209112号公報において、金
型内に樹脂のスパイラルフローを測定するためのモニタ
ー用ランナーを設け、射出成形時に材料の流動性をモニ
タする金型が提案されているが、この金型は成形材料の
物性のバラツキを評価するものであり、熱硬化性樹脂の
射出成形時における上記のような射出量不足の対策とは
ならないものであった。On the other hand, in the prior art, Japanese Patent Laid-Open No. 58-10103
Japanese Patent Laid-Open No. 3-209112 and Japanese Patent Laid-Open No. 1-209112 propose a mold in which a monitor runner for measuring the spiral flow of resin is provided in the mold to monitor the fluidity of the material during injection molding. However, this mold is for evaluating the variation in the physical properties of the molding material, and is not a measure for the above-mentioned insufficient injection amount at the time of injection molding of the thermosetting resin.
【0009】また、特開昭56−49208号公報にお
いて、金型内の製品キャビティの隣に、ランナーに接続
されたダミーキャビティを設けた金型が提案されている
が、このダミーキャビティは、キャビティ内にインサー
トされる半導体部品のワイヤ等が材料注入時の圧力によ
って変形するのを防止するために、製品キャビティへの
材料の流入速度や圧力を緩和するものであり、上記のよ
うな射出量不足の対策とはならないものであった。Further, Japanese Laid-Open Patent Publication No. 56-49208 proposes a mold in which a dummy cavity connected to a runner is provided next to the product cavity in the mold. In order to prevent the wires of the semiconductor parts inserted into the product from being deformed by the pressure during material injection, the material inflow speed and pressure into the product cavity are alleviated. It was not a countermeasure of.
【0010】本発明は、上記の点に鑑みてなされたもの
で、射出量のバラツキを緩和し、射出量不足による成形
不良やバリの発生を抑制することができる射出成形用金
型を提供することを目的とする。The present invention has been made in view of the above points, and provides an injection molding die capable of alleviating variations in injection amount and suppressing defective molding and burrs due to insufficient injection amount. The purpose is to
【0011】[0011]
【課題を解決するための手段】上記目的を達成するため
に、本発明の射出成形用金型は、熱硬化性樹脂を用いて
成形を行う射出成形用金型において、ランナーの一部
に、ダミー用ランナーを介してダミーキャビティが接続
して形成され、射出時における材料の最終充填部がダミ
ーキャビティとなるように、ダミー用ランナーの内径と
長さ又はダミーキャビティのゲート部が調整されている
ことを特徴とする。In order to achieve the above object, an injection molding die of the present invention is an injection molding die for molding using a thermosetting resin. The inner diameter and length of the dummy runner or the gate of the dummy cavity are adjusted so that the dummy cavity is connected through the dummy runner to form the final filled portion of the material during injection. It is characterized by
【0012】[0012]
【作用】射出成形を行うに際し、射出機の計量装置の計
量値は、ダミーキャビティに入る余剰樹脂の量をも含め
た値に設定する。When performing injection molding, the measurement value of the measuring device of the injection machine is set to a value including the amount of surplus resin that enters the dummy cavity.
【0013】射出機のスクリューが回転を開始すると、
スクリュー外筒内の材料の可塑化が行われ、これに伴な
い、溶融・混練された材料が順次前進し、その圧力でス
クリューが後退する。スクリューが所定位置まで後退
し、所定量の材料がスクリュー外筒内に充填されると、
計量装置の動作により、スクリューの回転が停止する。When the screw of the injection machine starts to rotate,
The material inside the screw outer cylinder is plasticized, and accordingly, the melted and kneaded material advances in sequence, and the screw retracts due to the pressure. When the screw retracts to a predetermined position and a predetermined amount of material is filled in the screw outer cylinder,
The rotation of the screw is stopped by the operation of the measuring device.
【0014】次に、射出行程に入り、油圧機構の作動に
よりスクリューが前進し、熱硬化性樹脂材料がノズル部
からスプルーを通して金型内に射出される。Next, in the injection stroke, the screw advances by the operation of the hydraulic mechanism, and the thermosetting resin material is injected from the nozzle portion through the sprue into the mold.
【0015】このとき、材料は金型内のメインランナー
からランナーに入り、材料の最終充填部がダミーキャビ
ティとなるように、ダミー用ランナー又はダミーキャビ
ティのゲート部が細く調整されているため、材料は先ず
流入抵抗の少ない製品キャビティに流入し充填される。
そして、製品キャビティ内への材料の充填が完了した
後、余剰材料がダミーキャビティ内に流れ込み、充填が
完了する。At this time, the material enters the runner from the main runner in the mold, and the dummy runner or the gate portion of the dummy cavity is finely adjusted so that the final filling portion of the material becomes the dummy cavity. First, it flows into and fills the product cavity with low inflow resistance.
Then, after the filling of the material into the product cavity is completed, the surplus material flows into the dummy cavity and the filling is completed.
【0016】したがって、スクリュー外筒内における材
料の計量値にバラツキが生じたとしても、そのバラツキ
は最終充填部であるダミーキャビティ内の材料の増減と
して吸収され、製品キャビティ内には所定量の材料が安
定して充填され、射出量不足による成形不良やバリの発
生を抑制することができる。Therefore, even if the measured value of the material in the screw outer cylinder varies, the variation is absorbed as an increase / decrease in the material in the dummy cavity which is the final filling portion, and a predetermined amount of material is stored in the product cavity. Can be stably filled, and molding defects and burrs due to insufficient injection amount can be suppressed.
【0017】[0017]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【0018】図1は熱硬化性樹脂を用いて射出成形する
射出成形用金型を示している。金型1内にはスプルー2
に接続されたメインランナー3が設けられ、メインラン
ナー3の両端に製品用ランナー4が接続・形成される。
そして、製品用ランナー4の先端にゲート部6を介して
製品キャビティ5が形成される。FIG. 1 shows an injection molding die for injection molding using a thermosetting resin. 2 sprues in mold 1
The main runner 3 connected to the main runner 3 is provided, and the product runners 4 are connected and formed at both ends of the main runner 3.
Then, the product cavity 5 is formed at the tip of the product runner 4 via the gate portion 6.
【0019】さらに、製品用ランナー4の一部には、ダ
ミー用ランナー7を介してダミーキャビティ8が接続・
形成される。このダミー用ランナー7は、射出時におけ
る材料の最終充填部がダミーキャビティ8となるよう
に、その内径と長さが調整されている。つまり、ダミー
用ランナー7は、材料注入時の流入抵抗が製品用ランナ
ー4及びゲート部6の流入抵抗より大きくなるように、
その内径が小さく長さが長く設定される。Further, a dummy cavity 8 is connected to a part of the product runner 4 via a dummy runner 7.
It is formed. The inner diameter and the length of the dummy runner 7 are adjusted so that the final filling portion of the material at the time of injection becomes the dummy cavity 8. That is, the dummy runner 7 has a larger inflow resistance at the time of material injection than the product runner 4 and the gate portion 6.
The inner diameter is small and the length is set long.
【0020】射出機には、例えばインライン式のスクリ
ュー射出機が使用され、スクリュー10を内蔵したスク
リュー外筒11のノズル部11aが、金型1のスプルー
2の開口部に当接して配置される。As the injection machine, for example, an in-line type screw injection machine is used, and the nozzle portion 11a of the screw outer cylinder 11 containing the screw 10 is arranged in contact with the opening of the sprue 2 of the mold 1. .
【0021】次に、上記構成の射出成形用金型を用いて
行う熱硬化性樹脂の射出成形行程を説明する。Next, the injection molding process of the thermosetting resin, which is carried out using the injection molding die having the above construction, will be described.
【0022】先ず、射出成形を行うに際し、射出機の計
量装置(図示は省略されている)の計量値は、ダミーキ
ャビティ8に入る余剰樹脂の量をも含めた値に設定す
る。First, when performing injection molding, the weighing value of a weighing device (not shown) of the injection machine is set to a value including the amount of surplus resin that enters the dummy cavity 8.
【0023】射出機のスクリュー10が回転を開始する
と、スクリュー外筒11内の熱硬化性樹脂材料の可塑化
が行われ、これに伴ない、溶融・混練された材料が順次
前進し、その圧力でスクリュー10が後退する。そし
て、スクリュー10が所定位置まで後退し、所定量の材
料がスクリュー外筒内に充填されると、計量装置の動作
により、スクリュー10の回転が停止する。When the screw 10 of the injection machine starts to rotate, the thermosetting resin material in the screw outer cylinder 11 is plasticized, and along with this, the melted and kneaded material sequentially advances and its pressure increases. The screw 10 moves backward. Then, when the screw 10 retracts to a predetermined position and a predetermined amount of material is filled in the screw outer cylinder, the rotation of the screw 10 is stopped by the operation of the measuring device.
【0024】次に、射出行程に入り、図示しない油圧機
構の作動によりスクリュー10が前進し、熱硬化性樹脂
材料がノズル部11aからスプルー2を通して金型内に
射出される。Next, in the injection stroke, the screw 10 advances by the operation of a hydraulic mechanism (not shown), and the thermosetting resin material is injected from the nozzle portion 11a through the sprue 2 into the mold.
【0025】このとき、図2Aに示すように、材料は金
型内のメインランナー3から製品用ランナー4に入り、
材料の最終充填部がダミーキャビティ8となるように、
ダミー用ランナー7が細く調整されているため、材料は
先ず流入抵抗の少ない製品キャビティ5に流入し充填さ
れる。そして、図2Bに示すように、製品キャビティ5
内への材料の充填が完了した後、余剰材料がダミーキャ
ビティ8内に流れ込み、充填が完了する(図2C)。At this time, as shown in FIG. 2A, the material enters the product runner 4 from the main runner 3 in the mold,
So that the final filling part of the material becomes the dummy cavity 8,
Since the dummy runner 7 is finely adjusted, the material first flows into the product cavity 5 having a small inflow resistance and is filled therein. Then, as shown in FIG. 2B, the product cavity 5
After the filling of the material inside is completed, the excess material flows into the dummy cavity 8 and the filling is completed (FIG. 2C).
【0026】したがって、スクリュー外筒11内におけ
る材料の計量値にバラツキが生じたとしても、そのバラ
ツキは最終充填部であるダミーキャビティ8内の材料の
増減として吸収され、製品キャビティ5内には所定量の
材料が安定して充填され、射出量不足による成形不良や
バリの発生を抑制することができる。Therefore, even if the measured value of the material in the screw outer cylinder 11 varies, the variation is absorbed as an increase / decrease of the material in the dummy cavity 8 which is the final filling portion, and the variation exists in the product cavity 5. It is possible to stably fill a fixed amount of material, and prevent defective molding and burrs due to insufficient injection amount.
【0027】図3は他の実施例を示し、この例では、ダ
ミーキャビティ8の入口にゲート部12が設けられる。
そして、射出成形時における材料の最終充填部がダミー
キャビティ8となるように、そのゲート部12が細く調
整されている。FIG. 3 shows another embodiment, in which a gate portion 12 is provided at the entrance of the dummy cavity 8.
The gate portion 12 is finely adjusted so that the final filling portion of the material at the time of injection molding becomes the dummy cavity 8.
【0028】このように、ダミーキャビティ8のゲート
部12の幅を調整することによっても、上記と同様に、
製品キャビティ5内への材料の充填が完了した後、余剰
材料をダミーキャビティ8内に流入させて、計量値のバ
ラツキを吸収することができる。As described above, by adjusting the width of the gate portion 12 of the dummy cavity 8 in the same manner as described above,
After the filling of the material into the product cavity 5 is completed, the surplus material can be caused to flow into the dummy cavity 8 to absorb the variation in the measured value.
【0029】図4はさらに他の実施例を示し、この例で
は、ダミーキャビティ8内に材料の充填量を計測するた
めの目盛13が付されている。FIG. 4 shows still another embodiment. In this example, the dummy cavity 8 is provided with a scale 13 for measuring the filling amount of the material.
【0030】この目盛13によって、射出成形時におけ
るダミーキャビティ8に流入した樹脂量、つまり余剰樹
脂の量を容易に目視することができる。このため、連続
して射出成形を行ったとき、ダミーキャビティ8内の余
剰樹脂の硬化状態をモニタすることにより、材料の計量
値の切換えのタイミングとその量を容易に確認すること
ができる。The scale 13 makes it possible to easily visually check the amount of resin that has flowed into the dummy cavity 8 during injection molding, that is, the amount of surplus resin. Therefore, when injection molding is continuously performed, the timing and amount of switching of the material measurement value can be easily confirmed by monitoring the cured state of the excess resin in the dummy cavity 8.
【0031】[0031]
【発明の効果】以上説明したように、本発明の射出成形
用金型によれば、スクリュー外筒内における材料の計量
値にバラツキが生じたとしても、そのバラツキは最終充
填部であるダミーキャビティ内の材料の増減として吸収
され、製品キャビティ内には所定量の材料が安定して充
填され、射出量不足による成形不良やバリの発生を抑制
することができる。このため、連続して射出成形を行っ
た場合の計量値の切換えのタイミングを、通常より長く
またラフにすることができ、経験の浅い成形技術者であ
っても、不良の少ない安定した成形を行うことができ
る。As described above, according to the injection molding die of the present invention, even if the measured value of the material in the screw outer cylinder varies, the variation is the dummy cavity which is the final filling portion. It is absorbed as the amount of the material in the inside increases and decreases, and a predetermined amount of the material is stably filled in the product cavity, so that it is possible to suppress the occurrence of defective molding and burrs due to insufficient injection amount. For this reason, the timing of switching the measured values when injection molding is performed continuously can be made longer and rougher than usual, and even inexperienced molding engineers can perform stable molding with few defects. It can be carried out.
【図1】本発明の一実施例を示す射出成形用金型の平面
図である。FIG. 1 is a plan view of an injection molding die showing an embodiment of the present invention.
【図2】射出成形時の材料の流れを示す説明図である。FIG. 2 is an explanatory diagram showing the flow of materials during injection molding.
【図3】他の実施例を示す射出成形用金型の部分平面図
である。FIG. 3 is a partial plan view of an injection molding die showing another embodiment.
【図4】他の実施例を示す射出成形用金型の部分平面図
である。FIG. 4 is a partial plan view of an injection molding die showing another embodiment.
【図5】熱硬化性樹脂用の射出機における射出完了時の
先端部の断面図である。FIG. 5 is a cross-sectional view of a tip portion of a thermosetting resin injection machine when injection is completed.
【図6】熱可塑性樹脂用の射出機における射出完了時の
先端部の断面図である。FIG. 6 is a cross-sectional view of a tip portion of a thermoplastic resin injection machine when injection is completed.
1−金型、4−製品用ランナー、5−製品キャビティ、
7−ダミー用ランナー、8−ダミーキャビティ、12−
ゲート部。1-mold, 4-product runner, 5-product cavity,
7-Dummy runner, 8-Dummy cavity, 12-
Gate section.
Claims (3)
形用金型において、 ランナーの一部に、ダミー用ランナーを介してダミーキ
ャビティが接続して形成され、射出時における材料の最
終充填部がダミーキャビティとなるように、該ダミー用
ランナーの内径と長さが調整されていることを特徴とす
る射出成形用金型。1. An injection molding die for molding using a thermosetting resin, wherein a dummy cavity is connected to a part of the runner via a dummy runner, and the final filling of material at the time of injection. An injection molding die, wherein an inner diameter and a length of the dummy runner are adjusted so that the portion becomes a dummy cavity.
形用金型において、 ランナーの一部に、ダミー用ランナーを介してダミーキ
ャビティが接続して形成され、射出時における材料の最
終充填部がダミーキャビティとなるように、該ダミーキ
ャビティのゲート部が調整されていることを特徴とする
射出成形用金型。2. In an injection molding die for molding using a thermosetting resin, a dummy cavity is formed by connecting a dummy runner to a part of the runner, and the final filling of the material at the time of injection. A mold for injection molding, wherein a gate portion of the dummy cavity is adjusted so that the portion becomes a dummy cavity.
を計測するための目盛を設けたことを特徴とする請求項
1又は2に記載の射出成形用金型。3. A mold for injection molding according to claim 1, wherein a scale for measuring a filling amount of the material is provided in the dummy cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24100992A JP3092348B2 (en) | 1992-09-09 | 1992-09-09 | Injection mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24100992A JP3092348B2 (en) | 1992-09-09 | 1992-09-09 | Injection mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0691701A true JPH0691701A (en) | 1994-04-05 |
JP3092348B2 JP3092348B2 (en) | 2000-09-25 |
Family
ID=17067977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24100992A Expired - Fee Related JP3092348B2 (en) | 1992-09-09 | 1992-09-09 | Injection mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3092348B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105309055A (en) * | 2013-11-12 | 2016-02-03 | 日本梅克特隆株式会社 | Conductor paste filling method, and production method for multilayer printed circuit board |
WO2020085860A1 (en) * | 2018-10-26 | 2020-04-30 | 삼성전자 주식회사 | Electroinc device member of metallic structure and non-metallic structure, and method for manufacturing same |
WO2023282440A1 (en) * | 2021-07-08 | 2023-01-12 | 삼성전자 주식회사 | Electronic device comprising support member |
-
1992
- 1992-09-09 JP JP24100992A patent/JP3092348B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105309055A (en) * | 2013-11-12 | 2016-02-03 | 日本梅克特隆株式会社 | Conductor paste filling method, and production method for multilayer printed circuit board |
US10321578B2 (en) | 2013-11-12 | 2019-06-11 | Nippon Mektron, Ltd. | Filling method of conductive paste and manufacturing method of multi-layer printed circuit board |
WO2020085860A1 (en) * | 2018-10-26 | 2020-04-30 | 삼성전자 주식회사 | Electroinc device member of metallic structure and non-metallic structure, and method for manufacturing same |
KR20200047045A (en) * | 2018-10-26 | 2020-05-07 | 삼성전자주식회사 | Member of metal structure and nonmetal structure in electronic device, and method for manufacturing the same |
US20210347098A1 (en) * | 2018-10-26 | 2021-11-11 | Samsung Electronics Co., Ltd. | Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same |
WO2023282440A1 (en) * | 2021-07-08 | 2023-01-12 | 삼성전자 주식회사 | Electronic device comprising support member |
Also Published As
Publication number | Publication date |
---|---|
JP3092348B2 (en) | 2000-09-25 |
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