JPH0689926A - Semiconductor chip and method for repairing its defective circuit - Google Patents

Abstract

PURPOSE:To use the circuit of a chip containing a defective circuit as a normal circuit as a whole on the assumption that the presence of the defective circuit is unavoidable. CONSTITUTION:The large-area circuit of a semiconductor chip 2 is divided into a plurality of small-area circuits 3A-3C,... and the circuits 3A-3C,... are connected to each other through wires 5 between electrode pads 4 in a state where the circuits 3A-3C,... can be electrically disconnected form each other. By inspecting the circuits 3A-3C,... for electrical characteristics and, when the circuit 3A is discriminated as defective, the wires 5 between the circuit 3A and the circuits 3B and 3C are disconnected. A block 7 for repair with a normal small-area circuit 3A' having the same function as the defective circuit 3A has is firmly fixed on the circuit 3A and the electrode pad 4 of the circuit 3A' is connected to the electrode pads 4 of the circuits 3B and 3C through bonding wires 9. Since the circuit 3A' is used as a substitute for the defective circuit 3A, the large-area circuit acts as a normal circuit as a whole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip capable of repairing a defective circuit portion in a chip and a method of repairing a defective circuit of the semiconductor chip, and is particularly suitable for constructing a large-sized semiconductor chip. It is a thing.

[0002]

2. Description of the Related Art Conventionally, in the manufacture of semiconductor chips, a plurality of identical circuits are arrayed and formed on a semiconductor wafer (Si substrate), and only the circuits judged to be normal by an appearance inspection and an electrical characteristic inspection are formed. The wafer is divided and cut and used as individual semiconductor chips.

[0003]

However, in this type of semiconductor chip, the larger the chip area, the more rapidly the yield decreases. That is, the larger the chip area, the higher the probability that a defective circuit portion will exist in the chip, and if there is a defective circuit portion even in a part of the chip, most other normal circuits will be wasted. is there. Therefore, it has been very difficult to manufacture a large-area semiconductor chip having a multi-functional and high-density circuit, especially from the viewpoint of lowering the yield.

Therefore, the present invention provides a semiconductor chip which can be used as a normal circuit as a whole including the defective circuit on the assumption that the defective circuit portion is unavoidable in the chip and the semiconductor chip. It is an object of the present invention to provide a defective circuit repairing method.

[0005]

In order to achieve the above object, in a semiconductor chip according to the present invention, an entire large area circuit is divided into a plurality of small area circuits, and each of the plurality of small area circuits is divided into a plurality of small area circuits. It is connected to the surrounding small area circuit so that it can be electrically disconnected.

Further, in the semiconductor chip according to the present invention, the entire large area circuit is divided into a plurality of small area circuits, and the plurality of small area circuits can be electrically separated from the surrounding small area circuits. In the semiconductor chip connected to, the small area circuit determined to be malfunctioning by the electrical characteristic inspection of the plurality of small area circuits is electrically separated from the surrounding normal small area circuit, A repair block having the same function as the defective circuit and a normal small-area circuit is mounted on the defective circuit, and the normal circuit of the repair block is electrically connected to the surrounding normal circuit. .

Further, in the method for repairing a defective circuit of a semiconductor chip according to the present invention, the whole large area circuit is divided into a plurality of small area circuits, and the plurality of small area circuits and the surrounding small area circuits are respectively formed. A method of repairing a defective circuit of a semiconductor chip that is electrically detachably connected, in which electrical characteristics of the plurality of small area circuits are inspected. It is electrically separated from a normal small area circuit, and a repair block having a normal small area circuit with the same function as the defective circuit is mounted on the defective circuit, and the normal circuit of this repair block and the surrounding normal circuit. Is to electrically connect with.

[0008]

According to the present invention configured as described above, the entire large area circuit is divided into a plurality of small area circuits. Therefore, even if a defective circuit portion occurs in the large area circuit, the defective circuit portion is defective. The circuit portion will be present in any of the individual small area circuits. Since each small area circuit and the surrounding small area circuits are electrically disconnectable, a small area circuit (defective circuit) determined to be defective by the electrical characteristic inspection
With regard to (2), by electrically disconnecting from the surrounding normal small area circuit (normal circuit), the defective circuit is prevented from adversely affecting the surrounding normal circuit. Then, a repair block having a normal circuit equivalent to the defective circuit is mounted on the defective circuit, and the normal circuit and surrounding normal circuits are electrically connected to replace the defective circuit with the normal circuit. As a result, the entire large area circuit can be operated as a normal circuit without completely wasting other normal circuits.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 5, a plurality of semiconductor chips 2 are formed on a semiconductor wafer (Si substrate) 1. Each of these semiconductor chips 2 is a large-area semiconductor chip which is the subject of the present invention. The entire circuit formed on each of the individual semiconductor chips 2 is a large area circuit 3 having one function. The large area circuit 3 has a plurality of small area circuits 3A depending on the function and the number of elements. ~ 3
It is divided into E ... In this example, the upper surface of the semiconductor chip 2 is divided into a plurality of square or rectangular regions of the same size, and the small area circuits 3A to 3 are respectively provided in the regions.
E ... Formed.

As shown in FIGS. 1 to 4, a plurality of electrode pads (terminals) 4 are arranged in a row in the vicinity of the outer periphery of each of the small area circuits 3A to 3E ... The wirings 5 electrically connect the electrode pads 4 of 3A to 3E. In FIG. 5, the outermost peripheral electrode pads (terminals) 6 of the small area circuit located on the outer peripheral portion of the semiconductor chip 2 are for external connection of the semiconductor chip 2 as a whole.

The electrode pads 4 and the wirings 5 of the small-area circuits 3A to 3E ... Are formed in the circuit element forming process at the wafer stage, and when the circuit elements of the semiconductor chip 2 are completed, Adjacent small area circuits 3A to 3E ...
The two are already connected.

As described above, since the whole large area circuit 3 of the semiconductor chip 2 is divided into a plurality of small area circuits 3A to 3E ... Even if a defective circuit portion occurs in the large area circuit 3. , The defective circuit portion is an individual small area circuit 3A-
3E ... Therefore, for example, when the operation of the small area circuit 3A is defective, cutting the wiring 5 around the small area circuit 3A electrically disconnects the small area circuit 3A from the surrounding small area circuits 3B to 3E. It will be. When the small area circuit 3A is repaired, the large area circuit 3 of the semiconductor chip 2 can be normally used as a whole.

Then, a method of repairing a defective circuit in the semiconductor chip 2 constructed as described above will be specifically described.

First, each of the small area circuits 3A to 3E ... In the semiconductor chip 2 of FIG. 5 is individually or all of the small area circuits 3A to 3E ... Inspect electrical characteristics. Note that the electrode pads 4 of the small area circuits 3A to 3E ... Can be used for this electrical characteristic inspection.

Next, when the small area circuit 3A is judged to be defective in operation by the above inspection, as shown in FIGS. 1 and 2, this small area circuit (hereinafter referred to as defective circuit) 3 is shown.
The wiring 5 is cut, for example, by laser fusing between A and the small-area circuits (hereinafter, referred to as normal circuits) 3B to 3E that are in normal operation and are in the vicinity thereof. As a result, the defective circuit 3A
Prevents the surrounding normal circuits 3B to 3E from being electrically adversely affected.

Then, a repair block 7 having a normal circuit 3A 'for replacement, which operates normally with the same function as the defective circuit 3A, is prepared separately, and the repair block 7 is provided on the defective circuit 3A with, for example, an insulating property. It is fixed by the adhesive 8. When the repair block 7 having the normal circuit 3A 'on the upper surface is used as in this example, the repair block 7 can be obtained by dividing and cutting the semiconductor chip 2 in the region.

Next, the normal circuit 3A 'of the repair block 7
The plurality of electrode pads (terminals) 4 ′ formed on the above and the respective electrode pads 4 of the normal circuits 3 </ b> B to 3 </ b> E in the periphery are connected by bonding wires 9.

As described above, only the defective circuit 3A existing in the semiconductor chip 2 is repaired by the normal circuit 3 of the repair block 7.
By replacing with A'and repairing, the whole large area circuit 3 of the semiconductor chip 2 can be operated as a normal circuit without wasting the other normal circuits 3B to 3E.

The defective circuit 3A in the semiconductor chip 2 may be replaced with the normal circuit 3A 'either before or after cutting each semiconductor chip 2 from the wafer 1. The same repair is applied to all defective circuits in the semiconductor chip 2. However, when there are too many defective circuits in the semiconductor chip 2, these defective circuits are not repaired and the semiconductor chip 2 is unused. . Then, the remaining normal circuit is divided and cut and stocked as the above-mentioned repair block 7.

Next, a method of repairing a defective circuit in another embodiment will be described with reference to FIGS.

In this example, the normal circuit 3A "is provided on the lower surface.
Using the repair block 10 having the following, the normal circuit 3A ″ of this repair block 10 and the defective circuit 3 of the semiconductor chip 2 are used.
A is made to face each other. Similarly to the above, the wiring 5 between the defective circuit 3A and the surrounding normal circuits 3B to 3E is cut, and the repair block 10 is placed on the defective circuit 3A.
To place. Then, a plurality of electrode pads (terminals) 4 ″ formed on the normal circuit 3A ″ and surrounding normal circuits 3B to 3
The respective electrodes 4 of E are collectively bonded via the bumps 11.
In this case as well, it is preferable to use the insulating adhesive 8 as a supplement.

In the case of this example, the repair block 10 needs to have a circuit configuration and a pad arrangement in which the normal circuit 3A ″ is symmetrical to the defective circuit 3A, and mechanical fixing of the repair block 10 and its arrangement are required. Since the electrical connection of the normal circuit 3A ″ can be performed at the same time, the repair work process and time can be significantly reduced.

The embodiments of the present invention have been described above.
The present invention is not limited to the above embodiments, and various effective modifications and applications are possible based on the technical idea of the present invention. For example, in the embodiment, a plurality of small area circuits are formed in square or rectangular regions having the same size, but the shapes and sizes of these regions may be different from each other.

[0025]

As described above, according to the present invention,
The entire large-area circuit is divided into multiple small-area circuits, and these multiple small-area circuits and the surrounding small-area circuits are connected so that they can be electrically disconnected. By electrically disconnecting and replacing with a normal circuit for repair, the whole large area circuit can be used as a normal circuit without wasting other normal circuits. Therefore, it is possible to extremely easily manufacture a large-area semiconductor chip having a multifunctional and high-density circuit without being affected by a decrease in yield, and it is possible to reduce the size of a device using this kind of semiconductor chip. Can be greatly promoted.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts in a state where a defective circuit of a semiconductor chip is repaired by a normal circuit of a repair block in an embodiment of the present invention.

FIG. 2 is a plan view of a main part of the above embodiment.

FIG. 3 is a cross-sectional view of essential parts in a state where a defective circuit in a semiconductor chip has been repaired by a normal circuit in a repair block in another embodiment of the present invention.

FIG. 4 is a plan view of an essential part of the another embodiment.

FIG. 5 is a plan view of a semiconductor chip having a plurality of small area circuits formed therein and a semiconductor wafer having a plurality of the semiconductor chips formed therein according to an embodiment of the present invention.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Semiconductor Chip 3 Large Area Circuit 3A to 3E Small Area Circuit 3A Defective Circuit 3B to 3E Normal Circuit 4, 6 Electrode Pad 5 Wiring 7, 10 Repair Block 3A ′, 3A ″ Normal Circuit 4 ′, 4 ″ Electrode Pad 8 Insulating adhesive 9 Bonding wire 11 Bump

Claims (9)

[Claims] 1. In a semiconductor chip in which a large number of semiconductor circuit elements having a large circuit area with a predetermined degree of integration are integrated, the entire large area circuit is divided into a plurality of small area circuits, and the plurality of small area circuits are divided. A semiconductor chip characterized in that an area circuit and a peripheral small area circuit are electrically detachably connected to each other. 2. The semiconductor chip according to claim 1, wherein the plurality of small area circuits are formed in rectangular regions of the same size. 3. The semiconductor according to claim 1, wherein electrode terminals are formed in the vicinity of the outer periphery of the plurality of small area circuits, and the electrode terminals of the adjacent small area circuits are electrically connected by wiring. Chips. 4. A semiconductor chip in which the entire large-area circuit is divided into a plurality of small-area circuits, and the plurality of small-area circuits and their surrounding small-area circuits are electrically detachably connected to each other. The small area circuit determined to be malfunctioning by the electrical characteristic inspection of the plurality of small area circuits is electrically separated from the surrounding normal small area circuit, and has the same function as the defective circuit. A semiconductor chip, wherein a repair block having a normal small-area circuit is mounted on the defective circuit, and the normal circuit of the repair block is electrically connected to the surrounding normal circuit. 5. The repair block has a normal circuit on its upper surface, and the electrode terminals of the normal circuit and the electrode terminals of the surrounding normal circuit are connected by a bonding wire. The semiconductor chip described. 6. The repair block has a normal circuit on a lower surface thereof, and an electrode terminal of the normal circuit and an electrode terminal of the surrounding normal circuit are joined to each other.
The semiconductor chip described. 7. A semiconductor chip in which an entire large-area circuit is divided into a plurality of small-area circuits, and the plurality of small-area circuits and their surrounding small-area circuits are electrically detachably connected to each other. A defective circuit repairing method, inspecting the electrical characteristics of the plurality of small area circuits, electrically disconnecting the small area circuit determined to be malfunctioning by this inspection from the surrounding normal small area circuit, A repair block having the same function as the defective circuit and a normal small area circuit is mounted on the defective circuit, and the normal circuit of the repair block and the surrounding normal circuit are electrically connected. Method for repairing defective circuit of semiconductor chip. 8. A repair block having a normal circuit on its upper surface is fixed onto the defective circuit, and the electrode terminals of the normal circuit and the electrode terminals of the surrounding normal circuit are connected by bonding wires. A method for repairing a defective circuit of a semiconductor chip according to claim 7. 9. A repair block having a normal circuit on the lower surface is placed on the defective circuit, and the electrode terminals of the normal circuit and the electrode terminals of the surrounding normal circuit are joined together. 7. A method for repairing a defective circuit of a semiconductor chip according to 7.