JPH0689421B2 - Electrical contact material - Google Patents
Electrical contact materialInfo
- Publication number
- JPH0689421B2 JPH0689421B2 JP61076738A JP7673886A JPH0689421B2 JP H0689421 B2 JPH0689421 B2 JP H0689421B2 JP 61076738 A JP61076738 A JP 61076738A JP 7673886 A JP7673886 A JP 7673886A JP H0689421 B2 JPH0689421 B2 JP H0689421B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- powder
- electrical contact
- contact material
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は機械的強度が大でしかも耐溶着性に優れたAg−
Ni系合金の電気接点材料に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention provides Ag- which has high mechanical strength and is excellent in welding resistance.
The present invention relates to a Ni-based alloy electrical contact material.
従来、電気接点材料としてはいろいろな材質が用いられ
ているが、中でもAg−Ni接点は低接触抵抗で消耗量が少
ないためAgに代つてかなり広範に使用されている。Conventionally, various materials have been used as electric contact materials, but among them, Ag-Ni contacts are widely used in place of Ag because of their low contact resistance and low consumption.
また、Ag−Niは加工やスポツト溶接が容易なため台材な
どへの固着作業の自動化が可能となり組立コストが安
く、しかも品質の安定化が図れる。In addition, since Ag-Ni is easy to process and spot weld, it is possible to automate the work of fixing it to a base material, etc., which reduces the assembly cost and stabilizes the quality.
しかしながら、Ag−NiはAg−CdoなどAg−酸化物系と比
較して機械的強度が小さく耐溶着性が劣るため使用範囲
が、比較的小さい電流領域に限定されてしまう問題があ
る。However, Ag-Ni has a problem that its use range is limited to a relatively small current region because its mechanical strength is small and welding resistance is inferior as compared with Ag-oxide systems such as Ag-Cdo.
近年、装置や機器類は軽量かつ小型化をはかりしかも大
容量化を指向しているが、この点からもAg−Ni系の耐溶
着性は劣るという問題がある。In recent years, devices and equipment have been aiming for weight reduction, downsizing, and large capacity, but also from this point, there is a problem that the Ag-Ni-based welding resistance is poor.
これらの問題を解消する方法としてAg−Ni合金中に種々
の金属酸化物,窒化物,炭化物,硼化物などを添加して
特性の改善を試みている。Ag−Ni合金は、AgとNiの固溶
度がほとんどないために粉末焼結によつて製造される
が、前述の試みは金属酸化物,窒化物,炭化物,硼化物
を添加した場合その粉末の粒子の大きさ及び分散が問題
となり、接触面に添加物粒子が常に存在している。粒子
が粗かつたり分散状態が悪いと接触抵抗が著しく不安定
になつたり、接触抵抗が高くなり、Ag−Ni系本来の特徴
である安定した接触特性を損い、温度上昇などにより耐
溶着性を低下させることになる。As a method of solving these problems, we are trying to improve the characteristics by adding various metal oxides, nitrides, carbides, borides, etc. to the Ag-Ni alloy. Ag-Ni alloys are produced by powder sintering because there is almost no solid solubility between Ag and Ni. The above-mentioned attempts have been made with the addition of metal oxides, nitrides, carbides and borides. The size and dispersion of the particles are problematic, and additive particles are always present on the contact surface. If the particles are coarse or in a poorly dispersed state, the contact resistance becomes extremely unstable, or the contact resistance becomes high, impairing the stable contact property that is the original feature of Ag-Ni system, and the welding resistance due to temperature rise etc. Will be lowered.
また、Ag−Ni合金の特徴である加工性やスポツト溶接性
が種々の添加物の混在によつて阻害され自動化ラインが
組めないという問題もある。There is also a problem that the workability and spot weldability, which are the characteristics of Ag-Ni alloys, are impeded by the mixture of various additives, and an automated line cannot be built.
本発明の目的はAg−Ni合金の特徴である加工性やスポツ
ト溶接性を劣化させることなく機械的強度の向上と耐溶
着性を改善して使用電流範囲を拡大しようとするもので
ある。An object of the present invention is to improve the mechanical strength and the welding resistance without deteriorating the workability and spot weldability, which are the characteristics of Ag-Ni alloys, and to widen the operating current range.
本発明は上記の目的を達成するものであり、Niが5重量
%〜25重量%のNi粉と、Bi,Gaの少なくとも1種を0.1重
量%〜5重量%含むAg合金粉とを混合焼結してなる合金
の合金組織におけるNi粉の外周部に、Bi,Gaの少なくと
も1種以上とNi粉との拡散合金層が形成されていること
を特徴とする。The present invention achieves the above object by mixing and firing Ni powder containing 5 wt% to 25 wt% of Ni and Ag alloy powder containing 0.1 wt% to 5 wt% of at least one of Bi and Ga. It is characterized in that a diffusion alloy layer of at least one of Bi and Ga and Ni powder is formed on the outer peripheral portion of the Ni powder in the alloy structure of the alloy formed by binding.
本発明によれば、Bi,Gaから選ばれた少なくとも一種以
上の金属0.1重量%から5重量%をAgと溶解して、溶湯
噴霧法(アトマイズ加工)で合金粉となし、合金成形後
該合金粉とNi粉5重量%から25重量%を所定温度で充分
に加熱焼結を施す。According to the present invention, 0.1 to 5% by weight of at least one metal selected from Bi and Ga is dissolved with Ag to form an alloy powder by a melt spraying method (atomizing), and the alloy is formed and then the alloy is formed. The powder and the Ni powder of 5% to 25% by weight are sufficiently heated and sintered at a predetermined temperature.
その後、通常の加工を行いAg合金素地中にNiを分散する
ものである。After that, normal processing is performed to disperse Ni in the Ag alloy matrix.
この際、成形後の焼結加熱によつてマトリツクス中の溶
質金属であるBi,GaとNi粒の拡散を充分に行うことが肝
要であり、単なるAg素地中にNiを分散させた従来のもの
と比較して機械的強度が向上すると共に耐溶着性が著し
く改善され、Ag−NiはNiと固溶する元素を介してNi粒の
外周部に拡散合金層が形成するため材質強度を向上する
ことができる。At this time, it is important to sufficiently diffuse the solute metal Bi, Ga and Ni particles in the matrix by sintering and heating after molding, and the conventional one in which Ni is simply dispersed in the Ag matrix. The mechanical strength is improved and the welding resistance is significantly improved as compared with, and Ag-Ni improves the material strength because a diffusion alloy layer is formed on the outer periphery of the Ni grain through the element that forms a solid solution with Ni. be able to.
以下本発明の実施例を説明する。 Examples of the present invention will be described below.
Ag−0.1Ga,Ag−5Bi,Ag−3Ga−0.5Bi,Ag−1Ga−3Bi,Ag−
0.05Ga−0.1Bi,Ag−0.7Ga−0.05Biの成分比からなる合
金をアトマイズ装置により粉体とし、300メッシュ以下
の粉末に篩分けする。Ag-0.1Ga, Ag-5Bi, Ag-3Ga-0.5Bi, Ag-1Ga-3Bi, Ag-
An alloy having a composition ratio of 0.05Ga-0.1Bi and Ag-0.7Ga-0.05Bi is made into powder by an atomizing device and sieved to powder of 300 mesh or less.
これらの合金粉を各々85重量%と、Ni15重量%の300メ
ッシュ以下の粉末をV型混合機を使用して混合し、85
(Ag−0.1Ga)−Ni,85(Ag−5Bi)−Ni,85(Ag−3Ga−
0.5Bi)−Ni,85(Ag−1Ga−3Bi)−Ni,85(Ag−0.05Ga
−0.1Bi)−Ni,85(Ag−0.7Ga−0.05Bi)−Niの各組成
となるように調合した。85% by weight of each of these alloy powders and 15% by weight of Ni and a powder of 300 mesh or less are mixed by using a V-type mixer.
(Ag-0.1Ga) -Ni, 85 (Ag-5Bi) -Ni, 85 (Ag-3Ga-
0.5Bi) -Ni, 85 (Ag-1Ga-3Bi) -Ni, 85 (Ag-0.05Ga
-0.1Bi) -Ni, 85 (Ag-0.7Ga-0.05Bi) -Ni was prepared.
これらを2.5t/cm2の圧力で径50φ×長さ120mmに成形
し、成形材を非酸化性雰囲気中にて所定温度,所定時間
加熱焼結してビレツトを得る。These are molded to a diameter of 50φ and a length of 120 mm at a pressure of 2.5 t / cm 2 , and the molding material is heated and sintered in a non-oxidizing atmosphere at a predetermined temperature for a predetermined time to obtain a billet.
これらを非酸化性雰囲気中で加熱し押出し機にて径10φ
の棒状とし、さらに伸線機を用いて径6φの線材とす
る。These are heated in a non-oxidizing atmosphere and the diameter is 10φ with an extruder.
And a wire rod having a diameter of 6φ using a wire drawing machine.
該線材より径6φのリベツト状の接点材とする。A revetted contact material having a diameter of 6φ is formed from the wire.
以上のように作製したリベツト状の接点材を下記の条件
でASTM試験機を使用して接触抵抗,消耗量及び溶着回数
を測定した。その結果を第1表に比較する。The contact resistance, the amount of wear, and the number of weldings of the rivet-shaped contact material produced as described above were measured under the following conditions using an ASTM tester. The results are compared with Table 1.
尚、従来例として85Ag−Niを掲げた。Incidentally, 85Ag-Ni is listed as a conventional example.
〔発明の効果〕 以上説明したように本発明は、Bi,Gaの少なくとも1種
を所定範囲内の添加量でAgと合金させた素地にNiを分解
させ、外周部に拡散合金層を形成させることにより材質
強度が向上する。 [Effects of the Invention] As described above, according to the present invention, Ni is decomposed in a base material alloyed with Ag in an amount of addition of at least one of Bi and Ga to form a diffusion alloy layer on the outer peripheral portion. This improves the material strength.
また、比較的酸素親和力の大きいBi,Gaを添付すること
により、接点の接触界面にこれらの酸化物が容易に生成
され、この酸化物の昇華によつてアークの冷却現象が起
こり耐溶着性,耐消耗性が向上する。Also, by attaching Bi and Ga, which have a relatively high oxygen affinity, these oxides are easily generated at the contact interface of the contact, and the sublimation of this oxide causes a cooling phenomenon of the arc, which results in welding resistance, Wear resistance is improved.
以上のことから従来のAg−Ni系電気接点材料の特性を改
善したものとして効果が期待できる。From the above, the effect can be expected as an improvement of the characteristics of the conventional Ag-Ni-based electrical contact material.
Claims (1)
の少なくとも1種を0.1重量%〜5重量%含むAg合金粉
とを混合焼結してなる合金の合金組織におけるNi粉の外
周部に、Bi,Gaの少なくとも1種以上とNi粉との拡散合
金層が形成されていることを特徴とした電気接点材料。1. Ni powder containing 5% to 25% by weight of Ni and Bi, Ga
Of at least one of Bi and Ga and the Ni powder in the outer periphery of the Ni powder in the alloy structure of the alloy formed by mixing and sintering the Ag alloy powder containing at least one of 0.1% to 5% by weight of An electrical contact material characterized in that an alloy layer is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61076738A JPH0689421B2 (en) | 1986-04-04 | 1986-04-04 | Electrical contact material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61076738A JPH0689421B2 (en) | 1986-04-04 | 1986-04-04 | Electrical contact material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62235443A JPS62235443A (en) | 1987-10-15 |
JPH0689421B2 true JPH0689421B2 (en) | 1994-11-09 |
Family
ID=13613936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61076738A Expired - Lifetime JPH0689421B2 (en) | 1986-04-04 | 1986-04-04 | Electrical contact material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0689421B2 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6026623A (en) * | 1983-07-21 | 1985-02-09 | Omron Tateisi Electronics Co | Manufacture of electrical contact material |
JPS6036637A (en) * | 1983-08-09 | 1985-02-25 | Omron Tateisi Electronics Co | Electrical contact material |
-
1986
- 1986-04-04 JP JP61076738A patent/JPH0689421B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62235443A (en) | 1987-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |