JPH068912U - Connection structure between optical waveguide and optical device - Google Patents

Connection structure between optical waveguide and optical device

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Publication number
JPH068912U
JPH068912U JP5319792U JP5319792U JPH068912U JP H068912 U JPH068912 U JP H068912U JP 5319792 U JP5319792 U JP 5319792U JP 5319792 U JP5319792 U JP 5319792U JP H068912 U JPH068912 U JP H068912U
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JP
Japan
Prior art keywords
optical
substrate
optical waveguide
light
back surface
Prior art date
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Granted
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JP5319792U
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Japanese (ja)
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JP2591723Y2 (en
Inventor
俊道 安田
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Kyocera Corp
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Kyocera Corp
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Priority to JP1992053197U priority Critical patent/JP2591723Y2/en
Publication of JPH068912U publication Critical patent/JPH068912U/en
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Abstract

(57)【要約】 【目的】 光パワー分布が異なる光導波路と光デバイス
間を効率良く且つ精度良く接続でき、しかもその作製が
容易な光導波路と光デバイスの接続構造を提供するこ
と。 【構成】 光導波路基板1の基板表面3に光導波路2内
を伝搬する光の光軸を基板裏面4方向に変える反射面5
を形成する。一方基板裏面4に前記反射面5で反射され
た光の光軸を基板表面3方向に変える反射部6を形成す
る。さらに基板表面3に光波面変換部7を設けて基板裏
面4の反射部6で反射された光を光ファイバ8の光波面
に整合せしめる。
(57) [Summary] [Object] To provide an optical waveguide-optical device connection structure capable of efficiently and accurately connecting an optical waveguide and an optical device having different optical power distributions, and easily manufacturing the optical waveguide. [Structure] A reflecting surface 5 for changing the optical axis of light propagating in the optical waveguide 2 to the substrate back surface 4 on the substrate front surface 3 of the optical waveguide substrate 1.
To form. On the other hand, on the back surface 4 of the substrate, there is formed a reflecting portion 6 for changing the optical axis of the light reflected by the reflecting surface 5 toward the front surface 3 of the substrate. Further, a light wavefront conversion unit 7 is provided on the front surface 3 of the substrate to match the light reflected by the reflection unit 6 on the back surface 4 of the substrate with the light wavefront of the optical fiber 8.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、光パワー分布が異なる光導波路と光デバイス間を効率良く接続でき る光導波路と光デバイスの接続構造に関するものである。 The present invention relates to a connection structure of an optical waveguide and an optical device that can efficiently connect an optical waveguide and an optical device having different optical power distributions.

【0002】[0002]

【従来技術】[Prior art]

光パワー分布が異なる光導波路と光デバイスを直接接続すると結合損失が大き い。 If the optical waveguide and the optical device with different optical power distribution are directly connected, the coupling loss is large.

【0003】 このため従来、光パワー分布の異なる光導波路と光デバイスを効率良く接続す る方法として、図5に示す構造のものが提案されている。この従来例においては 、光導波路基板60に設けた光導波路62を斜めにカットするように反射面67 を形成し、また該光導波路基板60の他方の面に光ファイバ73挿入用のガイド 穴69を設け、さらに該ガイド穴69の底部にレンズ状の光波面変換部68を形 成して構成されている。Therefore, conventionally, as a method for efficiently connecting an optical waveguide having a different optical power distribution and an optical device, a structure shown in FIG. 5 has been proposed. In this conventional example, a reflection surface 67 is formed so as to obliquely cut the optical waveguide 62 provided on the optical waveguide substrate 60, and a guide hole 69 for inserting the optical fiber 73 is formed on the other surface of the optical waveguide substrate 60. And a lens-shaped light wavefront conversion portion 68 is formed at the bottom of the guide hole 69.

【0004】 このように構成すれば、光導波路62内を伝搬してきた光は、反射面67で反 射されてその光パワー分布を広げながら光波面変換部68に到り、光パワー分布 をほぼ整合した上で光ファイバ73のコア74に入射される。According to this structure, the light propagating in the optical waveguide 62 is reflected by the reflecting surface 67 and reaches the optical wavefront conversion unit 68 while expanding its optical power distribution, and the optical power distribution is almost equalized. After being aligned, they are incident on the core 74 of the optical fiber 73.

【0005】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら上記従来例においては、光導波路62や反射面67を作成する面 と、ガイド穴69や光波面変換部68を作成する面が、光導波路基板60の表裏 両面にあるため、作製する上での効率が悪く、また光導波路62と光波面変換部 68の相対位置を精度良く作成することが困難であるという欠点があった。 However, in the above-mentioned conventional example, since the surface for forming the optical waveguide 62 and the reflecting surface 67 and the surface for forming the guide hole 69 and the optical wavefront converting portion 68 are on the front and back surfaces of the optical waveguide substrate 60, However, it is difficult to accurately create the relative position between the optical waveguide 62 and the light wavefront conversion unit 68.

【0006】 本考案は上述の点に鑑みてなされたものであり、その目的は、光パワー分布が 異なる光導波路と光デバイス間を効率良く且つ精度良く接続でき、しかもその作 製が容易な光導波路と光デバイスの接続構造を提供することにある。The present invention has been made in view of the above-mentioned points, and an object thereof is to provide an optical fiber which can efficiently and accurately connect an optical waveguide and an optical device having different optical power distributions and which can be easily manufactured. It is to provide a connection structure between a waveguide and an optical device.

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

上記問題点を解決するため本考案は、光導波路を有する光導波路基板の表面に 該光導波路内を伝搬する光の光軸を基板裏面方向に変える反射面を形成し、一方 該基板裏面に前記反射面で反射された光の光軸を基板表面方向に変える反射部を 形成し、さらに該基板表面に基板裏面の反射部で反射された光を接続を行う光デ バイスの光波面に整合するような形状に加工した光波面変換部を設けて光導波路 と光デバイスの接続構造を構成した。 In order to solve the above-mentioned problems, the present invention forms a reflection surface on the surface of an optical waveguide substrate having an optical waveguide to change the optical axis of light propagating in the optical waveguide toward the back surface of the substrate, while Forming a reflection part that changes the optical axis of the light reflected by the reflection surface to the substrate surface direction, and further aligns the light reflected by the reflection part on the back surface of the substrate with the light wavefront of the optical device that connects The connection structure between the optical waveguide and the optical device was constructed by providing the light wavefront conversion part processed into such a shape.

【0008】[0008]

【作用】[Action]

光導波路内を伝搬してきた光は、反射面で光導波路基板の厚み方向に反射され 、光パワー分布を拡大しながら反射部で再び反射されて、光波面変換部に到る。 そして該光は該光波面変換部で接続する他の光デバイスの光パワー分布に整合さ れた状態で該光デバイス内に入射される。従って両者間の接続損失は少ない。ま た光導波路や反射面を作製する面に光波面変換部も作製できるので、それらの相 対的な位置を精度良くすることができ、また作製が容易となる。 The light propagating in the optical waveguide is reflected by the reflecting surface in the thickness direction of the optical waveguide substrate, is reflected again by the reflecting portion while expanding the optical power distribution, and reaches the light wavefront converting portion. Then, the light enters the optical device in a state of being matched with the optical power distribution of another optical device connected by the optical wavefront conversion unit. Therefore, the connection loss between the two is small. Moreover, since the light wavefront conversion portion can be formed on the surface on which the optical waveguide or the reflection surface is formed, the relative positions of them can be made accurate and the production becomes easy.

【0009】[0009]

【実施例】【Example】

以下、本考案の実施例を図面に基づいて詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

【0010】 〔第1実施例〕 図1は本考案の第1実施例を示す図であり、同図(a)は側断面図、同図(b )は平面図(但し光ファイバ8は省略してある)である。同図に示すようにこの 実施例においては、光導波路基板1の基板表面3付近に光導波路2を形成し、該 基板表面3に前記光導波路2内の光を光導波路基板1の基板裏面4方向に方向転 換させる反射面5を形成している。また基板裏面4には該反射面5で反射された 光を再度基板表面3方向に向かって反射する反射部6を設け、その反射光は基板 表面3に形成された光波面変換部7で光ファイバ8の光波面に整合した平行光に される。[First Embodiment] FIGS. 1A and 1B are views showing a first embodiment of the present invention. FIG. 1A is a side sectional view and FIG. 1B is a plan view (however, the optical fiber 8 is omitted. It is). As shown in the figure, in this embodiment, the optical waveguide 2 is formed near the substrate surface 3 of the optical waveguide substrate 1, and the light in the optical waveguide 2 is formed on the substrate surface 3 by the substrate back surface 4 of the optical waveguide substrate 1. The reflecting surface 5 is formed to change direction. Further, the back surface 4 of the substrate is provided with a reflecting portion 6 for reflecting the light reflected by the reflecting surface 5 toward the front surface 3 of the substrate again. The collimated light is matched with the light wavefront of the fiber 8.

【0011】 ここで反射面5は、基板表面3をエッチングするか或いは直接切削研磨するこ とによって、光導波路2を斜めにカットするように形成される。この反射面5の 傾斜角度θ1が光導波路2内を伝搬してきた光を全反射させる条件を満たさない 場合は、該反射面5に金属等を蒸着すれば良い。Here, the reflecting surface 5 is formed so as to cut the optical waveguide 2 obliquely by etching the substrate surface 3 or directly cutting and polishing. If the inclination angle θ 1 of the reflecting surface 5 does not satisfy the condition for totally reflecting the light propagating in the optical waveguide 2, a metal or the like may be deposited on the reflecting surface 5.

【0012】 次に反射部6は、基板裏面4上に金属等を蒸着することによって形成される。 このとき該基板裏面4自体は何ら加工されない。Next, the reflection portion 6 is formed by depositing a metal or the like on the back surface 4 of the substrate. At this time, the back surface 4 of the substrate is not processed at all.

【0013】 次に光波面変換部7は、基板表面3をエッチングするか、或いは直接切削研磨 することによって球面状に加工される。Next, the light wavefront conversion portion 7 is processed into a spherical shape by etching the substrate surface 3 or by directly cutting and polishing.

【0014】 ところで接続する光デバイス(この実施例では光ファイバ8)の光パワー分布 により、光導波路基板1内での光路長l(l=l1+l2)と、光波面変換部7の 球面の曲率半径を決める。反射面5の角度θ1と光導波路基板1の厚さLを調整 すれば必要な光路長lを得ることができる。また光波面変換部7の曲率中心Oは 光軸上にとる。さらに光導波路基板1の光波面変換部7からの光の光軸はθ2の 角度をとるので、光ファイバ8の中心軸はスネルの法則より、 na×sinθ2=nf×sinθ3 a:光波面変換部7と光ファイバ8との間の空隙11の屈折率 (空気或いは接着剤の屈折率) nf:光ファイバ8のコア9の屈折率 を満たすように光ファイバ8の端面10を角度θ3で斜めにしておく必要がある 。By the way, due to the optical power distribution of the optical device (optical fiber 8 in this embodiment) to be connected, the optical path length l (l = 1) in the optical waveguide substrate 1 is obtained.1+12) And the radius of curvature of the spherical surface of the light wavefront conversion unit 7. Angle θ of reflecting surface 51By adjusting the thickness L of the optical waveguide substrate 1, the required optical path length 1 can be obtained. The center of curvature O of the light wavefront conversion unit 7 is on the optical axis. Further, the optical axis of the light from the light wavefront conversion unit 7 of the optical waveguide substrate 1 is θ.2Therefore, the central axis of the optical fiber 8 is na× sin θ2= Nf× sin θ3  na: Refractive index of the air gap 11 between the light wavefront conversion unit 7 and the optical fiber 8 (refractive index of air or adhesive) nf: The end face 10 of the optical fiber 8 is angled θ so as to satisfy the refractive index of the core 9 of the optical fiber 8.3You need to keep it at an angle.

【0015】 以上のように構成すれば、光導波路2内を伝搬してきた光は、反射面5で光導 波路基板1の厚み方向に反射され、光パワー分布を拡大しながら反射部6で再び 反射されて、光波面変換部7に到る。そして該光は該光波面変換部7で光ファイ バ8の光パワー分布に整合した平行光とされた後に、該光ファイバ8に入射され る。従って両者間の接続損失は少ない。With the above configuration, the light propagating in the optical waveguide 2 is reflected by the reflecting surface 5 in the thickness direction of the optical waveguide substrate 1, and is reflected again by the reflecting portion 6 while expanding the optical power distribution. Then, the light wavefront conversion unit 7 is reached. Then, the light is collimated by the optical wavefront conversion unit 7 into the optical power distribution of the optical fiber 8 and then incident on the optical fiber 8. Therefore, the connection loss between the two is small.

【0016】 〔第2実施例〕 図2は本考案の第2実施例を示す側断面図である。同図において前記第1実施 例と同一部分には同一符号を付しその説明は省略する。[Second Embodiment] FIG. 2 is a side sectional view showing a second embodiment of the present invention. In the figure, the same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

【0017】 この実施例において前記第1実施例と相違する点は、光デバイス(この実施例 では光ファイバ12)を光導波路基板1から離した点にある。これは光波面変換 部7の曲率半径と光路長を調整することによって構成できる。この実施例の場合 、光ファイバ12の端面21を斜めにする必要がないという利点がある。The difference between this embodiment and the first embodiment is that the optical device (optical fiber 12 in this embodiment) is separated from the optical waveguide substrate 1. This can be configured by adjusting the radius of curvature and the optical path length of the light wavefront conversion unit 7. In the case of this embodiment, there is an advantage that the end face 21 of the optical fiber 12 need not be inclined.

【0018】 〔第3実施例〕 図3は本考案の第3実施例を示す側断面図である。この実施例においては、光 導波路基板20の基板裏面14の反射部17を傾斜させるため、該基板裏面14 を切削研磨して斜面16を形成している。これによって光波面変換部18から上 方へ出射(或いは入射)される光の光軸を基板表面13に対して垂直にできる。[Third Embodiment] FIG. 3 is a sectional side view showing a third embodiment of the present invention. In this embodiment, in order to incline the reflecting portion 17 on the back surface 14 of the substrate of the optical waveguide substrate 20, the back surface 14 of the substrate is cut and polished to form the inclined surface 16. This makes it possible to make the optical axis of light emitted (or incident) upward from the light wavefront conversion unit 18 perpendicular to the substrate surface 13.

【0019】 このときの斜面16の傾斜角度θ5は、基板表面13の反射面15の傾斜角度 をθ4とすると、 θ5=45°−θ4 とすればよい。この実施例の場合、光ファイバ19の端面23を斜めにカットす る必要がないという利点がある。At this time, the inclination angle θ 5 of the inclined surface 16 may be θ 5 = 45 ° −θ 4 when the inclination angle of the reflection surface 15 of the substrate surface 13 is θ 4 . In the case of this embodiment, there is an advantage that it is not necessary to obliquely cut the end face 23 of the optical fiber 19.

【0020】 〔第4実施例〕 図4は本考案の第4実施例を示す側断面図である。この実施例は、図1に示す 構造の光導波路基板1を2組用意し、両者の光波面変換部7を対向するように接 続して構成されている。言い替えれば、図1に示す光ファイバ8の代わりに、同 じ構造の光導波路基板1を光デバイスとして接続したものである。Fourth Embodiment FIG. 4 is a side sectional view showing a fourth embodiment of the present invention. In this embodiment, two sets of the optical waveguide substrates 1 having the structure shown in FIG. 1 are prepared, and the optical wavefront conversion portions 7 of both sets are connected so as to face each other. In other words, instead of the optical fiber 8 shown in FIG. 1, the optical waveguide substrate 1 having the same structure is connected as an optical device.

【0021】 このように構成することにより、光パワー分布が広がった状態で両者の接続が 行えるので、光導波路同士を直接接続した場合に比べて位置ずれによる損失を小 さくすることができる。With this configuration, the two can be connected in a state where the optical power distribution is widened, so that the loss due to the positional deviation can be reduced as compared with the case where the optical waveguides are directly connected.

【0022】 ところで上記各実施例においては、光波面変換部を球面状として構成したが、 本考案はこれに限定されず、要はレンズ効果を持つ構造であれば良く、例えば屈 折率分布やグレーティングによって光波面変換部を構成してもよい。By the way, in each of the above-mentioned embodiments, the light wavefront conversion portion is formed into a spherical shape, but the present invention is not limited to this, and the point is that the structure has a lens effect, such as the refractive index distribution and The optical wavefront converter may be configured by a grating.

【0023】[0023]

【考案の効果】[Effect of device]

以上詳細に説明したように、本考案にかかる光導波路と光デバイスの接続構造 によれば、以下のような優れた効果を有する。 光導波路や反射面を作製する面に光波面変換部も作製できるので、それらの 相対的な位置を精度良くすることができ、また作製が容易となる。 As described in detail above, the connection structure between the optical waveguide and the optical device according to the present invention has the following excellent effects. Since the light wavefront conversion part can be formed on the surface on which the optical waveguide and the reflection surface are formed, their relative positions can be made accurate and the production becomes easy.

【0024】 反射面の角度を調節することにより、光導波路からの光が光導波路基板内で 進む光路長を任意に設定することが可能となり、光導波路基板の厚さを調整しな くても接続する光デバイスの光パワー分布と整合させることが可能である。By adjusting the angle of the reflecting surface, it is possible to arbitrarily set the optical path length that the light from the optical waveguide travels in the optical waveguide substrate, and it is possible to adjust the thickness of the optical waveguide substrate without adjusting. It is possible to match the optical power distribution of the connected optical device.

【0025】 光デバイスと光導波路の接続を、光パワー分布の広がった状態で行えるので 、位置ずれによる損失を小さくすることができる。Since the connection between the optical device and the optical waveguide can be performed in the state where the optical power distribution is widened, the loss due to the positional deviation can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の第1実施例を示す図であり、同図
(a)は側断面図、同図(b)は平面図(但し光ファイ
バ8は省略している)である。
1A and 1B are views showing a first embodiment of the present invention, wherein FIG. 1A is a side sectional view and FIG. 1B is a plan view (however, an optical fiber 8 is omitted).

【図2】本考案の第2実施例を示す側断面図である。FIG. 2 is a side sectional view showing a second embodiment of the present invention.

【図3】本考案の第3実施例を示す側断面図である。FIG. 3 is a side sectional view showing a third embodiment of the present invention.

【図4】本考案の第4実施例を示す側断面図である。FIG. 4 is a side sectional view showing a fourth embodiment of the present invention.

【図5】従来の光導波路と光デバイスの接続構造を示す
側断面図である。
FIG. 5 is a side sectional view showing a conventional connection structure between an optical waveguide and an optical device.

【符号の説明】[Explanation of symbols]

1,20 光導波路基板 2 光導波路 3,13 基板表面 4,14 基板裏面 5,15 反射面 6,17 反射部 7,18 光波面変換部 8,12,19 光ファイバ 9 コア 1,20 Optical Waveguide Substrate 2 Optical Waveguide 3,13 Substrate Front Surface 4,14 Substrate Backside 5,15 Reflecting Surface 6,17 Reflecting Part 7,18 Optical Wavefront Converting Part 8,12,19 Optical Fiber 9 Core

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 光導波路を有する光導波路基板の表面に
該光導波路内を伝搬する光の光軸を基板裏面方向に変え
る反射面を形成し、一方該基板裏面に前記反射面で反射
された光の光軸を基板表面方向に変える反射部を形成
し、さらに該基板表面には、基板裏面の反射部で反射さ
れた光を接続を行う光デバイスの光波面に整合する形状
に加工した光波面変換部を設けたことを特徴とする光導
波路と光デバイスの接続構造。
1. A reflection surface is formed on the surface of an optical waveguide substrate having an optical waveguide to change the optical axis of light propagating in the optical waveguide toward the back surface of the substrate, while the back surface of the substrate is reflected by the reflection surface. A light wave formed by forming a reflection portion that changes the optical axis of light to the surface direction of the substrate, and further processing the light reflected by the reflection portion on the back surface of the substrate into a shape that matches the light wave front of the optical device for connection. A connection structure between an optical waveguide and an optical device, characterized in that a surface conversion portion is provided.
JP1992053197U 1992-07-06 1992-07-06 Connection structure between optical waveguide and optical device Expired - Fee Related JP2591723Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992053197U JP2591723Y2 (en) 1992-07-06 1992-07-06 Connection structure between optical waveguide and optical device

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131591A (en) * 2000-10-27 2002-05-09 Fuji Xerox Co Ltd Optical signal transmitting device and light incident method into translucent medium
JP2004125854A (en) * 2002-09-30 2004-04-22 Sumitomo Osaka Cement Co Ltd Optical waveguide element and its manufacturing method
JP2011133536A (en) * 2009-12-22 2011-07-07 Nec Corp Optical coupler
JP2019101444A (en) * 2017-12-06 2019-06-24 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ Photonic chip with folding of optical path and integrated collimation structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189610U (en) * 1983-05-31 1984-12-15 オムロン株式会社 optical coupler
JPH01307707A (en) * 1988-06-06 1989-12-12 Nippon Telegr & Teleph Corp <Ntt> Optical coupling circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189610U (en) * 1983-05-31 1984-12-15 オムロン株式会社 optical coupler
JPH01307707A (en) * 1988-06-06 1989-12-12 Nippon Telegr & Teleph Corp <Ntt> Optical coupling circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131591A (en) * 2000-10-27 2002-05-09 Fuji Xerox Co Ltd Optical signal transmitting device and light incident method into translucent medium
JP2004125854A (en) * 2002-09-30 2004-04-22 Sumitomo Osaka Cement Co Ltd Optical waveguide element and its manufacturing method
JP2011133536A (en) * 2009-12-22 2011-07-07 Nec Corp Optical coupler
JP2019101444A (en) * 2017-12-06 2019-06-24 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ Photonic chip with folding of optical path and integrated collimation structure

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