JPH0681134A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To provide a vacuum deposition device capable of stably liquefying and recovering the material to be vacuum-deposited stuck to a vacuum deposition recovering boards in succession and capable of continuous operation for a long time. CONSTITUTION:A steam sealing vessel 2 having a wall face gradient in such a manner that the upper part is made wider than the lower part, further, in the lower part, an opening made narrower than the upper part of a crucible 3 storing the material 5 to be vacuum-deposited is formed, and provided with an opening 2a through which electron beams flow in to the inside of a vacuum tank whose vacuum degree is held to a prescribed value (10<-5> to 10<-6>Torr). On the upper part of the steam sealing vessel 2, a substrate 6 to be vacuum-deposited with the material 5 is supported, and in the side direction of the crucible 3 and on the outside of the steam sealing vessel 2, an electron gun 7 is equipped. Moreover, in the upper part of the steam sealing vessel 2, a pair of steam recovering boards 11 in which the recovering face is provided with plural blocks 21 for promoting the flowing-down of droplets (the recovering face is smooth: the block width W<=df: grooves in the recorvering face, W<=ds: the block length is 1>=3w) are arranged symmetrically, and they are inclined from the upper part of the substrate 6 toword the lower part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition apparatus of an electron beam heating system, and in particular, it continuously and stably recovers vapor deposition substances which have become ineffective because they are deposited on a substrate other than the substrate to be vapor deposited. The present invention also relates to a vacuum vapor deposition apparatus in which the operating efficiency and economic efficiency of the apparatus are improved by utilizing it again for vapor deposition on a substrate.

[0002]

2. Description of the Related Art In semiconductor film forming processing and the like, a thin film forming technique by vacuum vapor deposition is generally adopted. This thin film forming technique forms a vapor stream of a vapor deposition material and deposits it on a substrate. As a means for vaporizing a metal having a high melting point as a vapor deposition material, an electron beam is particularly preferable from the viewpoint of technology simplicity and economy. The heating method is widely used.

A conventional vacuum evaporation apparatus using an electron beam heating system is equipped with a vacuum chamber maintained at a predetermined vacuum degree (10 ^-5 to 10 ^-6 Torr) by the vacuum evaporation system. A vapor encapsulator having a wall surface inclined so as to widen upward is vapor-deposited, and a crucible containing a vapor deposition substance is provided below the vapor encapsulation container, and a substrate to be vapor-deposited is not provided above the crucible. I am trying to support it.
In addition, an electron gun is installed on the side of the crucible, and the vapor deposition material is heated and vaporized by irradiating the vapor deposition material with an electron beam emitted from the electron gun (electron impact). To do. Further, as shown in FIG. 1, a vapor recovery plate 11 for recovering a vapor flow (hereinafter referred to as ineffective vapor) that evaporates in a direction different from the direction toward the substrate 6 is diagonally downward from above the substrate above the substrate. It is tilted and arranged symmetrically, and is supported by a supporting means (not shown).

In order to form a vapor deposition film on a substrate by using the above vacuum vapor deposition apparatus, first, the vapor deposition material is placed in the crucible 3 and the vapor deposition is heated and evaporated by the electron gun 7. To generate. The vapor flow diffused toward the substrate 6 collides with the substrate 6 to form a vapor deposition film on the substrate 6. Of the vapor flow that diffuses, the ineffective vapor 20 evaporates in a direction different from the direction toward the substrate 6, so that it does not contribute to vapor deposition on the substrate 6 and is wasted, but is recovered and reused by the following method. . That is, the ineffective vapor 20 collides with the vapor recovery plate 11 to form the vapor deposition film 10. Next, the entire vapor recovery plate 11 is liquefied by uniformly heating the vapor recovery plate 11 above the melting point of the vapor deposition material using a heater (not shown), and the liquefied vapor deposition material is placed on the bottom surface of the vapor recovery plate 11. (Hereinafter, referred to as a recovery surface) and flow along the wall surface of the vapor sealing container 2 and collect in the crucible 3.

[0005]

However, in the conventional vacuum vapor deposition apparatus as described above, in the process of liquefying and recovering the ineffective vapor deposition material 20, the liquid droplets grow, and the liquid droplets are in the middle of flowing down. When they are combined, they may drop and may not be recovered properly. In particular, the vapor recovery plate 11
When the inclination angle with respect to the horizontal plane is small, the droplet diameter d _f when the droplet starts to flow down becomes large. That is, the period until the droplets flow down becomes long, the amount of the droplets attached to the recovery surface increases, and the droplets easily drop at the time of coalescence during the flow down.

Thus, the vapor deposition material dropped during the liquefaction recovery is not recovered in the crucible 3 passing through the wall surface of the vapor recovery container,
It directly falls on the crucible 3 and scatters the vapor deposition material contained in the crucible 3. The scattered vapor deposition material may attach to the electron gun and attach to the electron gun, thus degrading the performance of the electron gun.
In some cases, the operation of the vacuum vapor deposition device must be stopped. Therefore, the vapor recovery plate 11 of the conventional vacuum vapor deposition apparatus
However, the above configuration has a drawback that the vapor deposition material cannot be continuously and stably recovered.

The present invention has been made in view of the above circumstances, and provides a vacuum vapor deposition apparatus which can reliably and continuously liquefy and collect vapor deposition substances adhered to a vapor recovery plate, and can be continuously continued for a long time, which is economically advantageous. The purpose is to provide.

[0008]

In order to achieve the above-mentioned object, the present invention provides a vapor sealed container in a vacuum chamber, and a container containing a vapor deposition substance is arranged below the vapor sealed container, The vapor deposition material is heated and vaporized by beam irradiation and deposited on the substrate placed above the container to form a vapor deposition film, and a vapor recovery plate is placed at a position different from the substrate, and the direction toward the substrate is adjusted. The vapor deposition material that evaporates in different directions is attached to the recovery surface of the vapor recovery plate, and the vapor deposition material adhered to the recovery surface is heated and liquefied to flow down along the recovery surface to collect the vapor deposition material in the container. In the vacuum vapor deposition device configured in

A convex block for facilitating the flow of liquid droplets on the recovery surface of the vapor recovery plate (provided that the recovery surface is smooth “no groove”, block width W ≦ d _f , and a groove is formed on the recovery surface). W
≤ d _s , block length l ≥ 3 w, where d _f : average diameter of droplets of the liquefied vapor deposition material when the droplets start to flow,
d _s : the opening width of the groove recess).

[0010]

According to the above construction, since the droplet on the block cannot grow beyond the block width, when the diameter of the droplet becomes the groove width, thereafter the droplets coalesce and flow down in the length direction. . Since this block width W is narrower than the average diameter d _f of the droplets at the time of starting the flow and the opening width d _{s of the} groove recesses, the period in which the droplets on the block flow down is shorter than the other portions,
The liquid droplets flowing down from here flow down while absorbing and combining the liquid droplets in the downstream portion. In other words, by providing this block, the falling droplet diameter and the period in which the droplets fall are reduced,
It also reduces the total amount of droplets adhering to the collection plate. Therefore, it becomes possible to stably collect them as compared with the conventional one.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the present invention, a case where a groove is formed on the recovery surface of a vapor recovery plate will be described below with reference to the drawings. FIG. 1 is a sectional view for explaining one embodiment of the present invention. In the figure, 1 is a vacuum chamber, which has a predetermined degree of vacuum (10 ^-5 to 10 ^-6 Torr) by a vacuum exhaust device (not shown).
Held in. Reference numeral 2 denotes a vapor sealing container, which is supported by a supporting means (not shown) in the vacuum chamber 1 and has a wall surface which is wider at the upper side and is slanted at the lower side to form an opening narrower than the upper portion of the crucible described later. And an opening 2a through which an electron beam described later is passed. 3 is a crucible, which is attached to the lower portion of the vapor sealing container 2 by a supporting means (not shown), has a cooling pipe 4 buried therein, and the cooling water is caused to flow at the time of heating, so that the crucible 3 is melted by an excessive temperature rise. Is avoiding. The crucible 3 contains a vapor deposition material 5. In addition, a substrate 6 on which the vapor deposition material 5 is vapor-deposited is supported above the vapor enclosure 2 by a supporting means (not shown). Reference numeral 7 denotes an electron gun, which is supported by a supporting means (not shown) outside the vapor enclosing container 2 at the side of the crucible 3, and the irradiated electron beam 8 passes through the opening 2a of the vapor enclosing container 2 and inside the crucible 3. The vapor deposition material 5 is heated and evaporated to generate a vapor stream 9.

On the other hand, above the substrate 6, a pair of vapor recovery plates 11, 11 for recovering the ineffective vapor flow 20 that evaporates in a direction different from the direction toward the substrate 6 is provided obliquely downward from above the substrate 6. Are arranged symmetrically with respect to each other, and are supported by a supporting means (not shown) .The vapor recovery plate 11 is provided with a heater for heating and liquefying the ineffective vapor adhering film. There is. 2 is a partially enlarged front view of the uppermost part of the recovery surface of the vapor recovery plate 11, and FIG. 3 is a sectional view taken along line AA of FIG. A plurality of droplet flow-down promoting blocks 21 are provided at the uppermost portion of the vapor recovery plate 11 and at the center of the groove recess 23. When the vapor recovery plate 11 is heated, the invalid vapor deposition film is melted,
Droplets are generated where nuclei are formed. Of these, the droplets on the narrow block cannot grow to a width greater than that width, and coalesce in the flow direction to form elongated droplets 25 that flow down. The droplets 23 in the areas other than the blocks have not grown so much as to be able to flow down, and are thus absorbed and combined with the droplets flowing down from the upstream block.

Even when the collecting surface is smooth (no groove), the size of the liquid drop can be reduced by providing the block in the same manner.
Has a similar effect. The same effect can be expected in a recovery method in which the vapor recovery plate is heated in advance before the operation of the apparatus and the ineffective vapor is condensed on the recovery surface.

[0014]

As described above, during the liquefaction recovery process, the droplets on the narrow droplet flow-down promoting block first flow down,
Absorbs and coalesces liquid droplets in the downstream region. That is, by providing the block, it is possible to reduce the diameter of the liquid droplets flowing down and the period of the liquid droplets flowing down, and it is possible to reduce the total amount of the invalid droplets of the deposition material adhering to the recovery surface. Therefore, it is possible to continuously and stably recover the ineffective vapor, and it is possible to provide a vacuum vapor deposition apparatus capable of continuous operation for a long time.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining the configuration of a vacuum vapor deposition device.

FIG. 2 is a front view showing a main part of an embodiment of the present invention.

3 is a sectional view taken along line AA of FIG.

[Explanation of symbols]

1 ... Vacuum tank 2 ... Vapor-filling container 3 ... Crucible 5 ... Vapor deposition material 6 ... Substrate 7 ... Electron gun 8 ... Electron beam 9 ... Vapor flow 10 ... Invalid vapor deposition material 11 ... Vapor recovery plate 20 ... Invalid vapor 21 ... Droplet flow acceleration block 22 ... Groove protrusion 23 ... Groove recess 24 ... Droplet 25 ... Droplet on block

Claims (1)

[Claims] 1. A vapor sealing container is provided in a vacuum chamber, and a crucible containing a vapor deposition substance is arranged below the vapor sealing container. The vapor deposition substance is heated and vaporized by electron beam irradiation. The vapor deposition film is formed by adhering it onto the substrate disposed above, and the vapor recovery plate is disposed at a position different from the substrate to vaporize the vapor deposition substance that evaporates in a direction different from the direction toward the substrate. The vapor deposition material adhered to the recovery surface of the recovery plate was heated and liquefied to flow down along the recovery surface of the recovery plate to recover the vapor deposition material into the crucible. In the vacuum vapor deposition apparatus, a convex block for promoting the flow of droplets is provided on the recovery surface of the vapor recovery plate (however, if the recovery surface is a smooth “no groove”, a block width W ≦ d _f , and a groove is formed on the recovery surface). W ≤ d _s , if Lock length l ≧ 3w, where d _f is an average diameter of droplets of the liquefied vapor deposition material at the time when the droplets start to flow down, d _{s is} the opening width of the groove recess) Vacuum deposition equipment.