JPH0680720B2 - Vacuum processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a vacuum processing apparatus, and more particularly to a wafer when moving an object to be processed from a vacuum chamber to a processing chamber (or vice versa). It is an improvement of the transport mechanism.

(Prior Art) Conventionally, for example, as a vacuum processing apparatus for performing etching,
The one shown in FIG. 2 is known.

Reference numeral 1 in the figure denotes a processing chamber for etching the semiconductor wafer 2. A first belt conveyor 3 that conveys the wafer 2 is arranged in the processing chamber 1. The belt conveyor 3 is driven via a roll 4 connected to a drive source (not shown). On both sides of the vacuum chamber 1, vacuum chambers 5 and 6 for reducing the pressure difference are formed on the partition wall 7.
It is provided through. Here, the partition wall 7 is provided with an opening 7a for passing a wafer. Inside the vacuum chambers 5 and 6, there are provided a second belt conveyor 9 driven via a roll 8 connected to a driving source (not shown), respectively, and a roll 10 for surely transferring the wafer 2 to the vacuum chamber 1 side. They are arranged respectively. Here, the roll 10 is provided between the partition wall and the second belt conveyor 9, and the reason is that the thickness of the partition wall 7 and the end portion of the second belt conveyor 9 are equal to each other because the valve body of the gate belt described later is relatively thick. This is because a large distance must be provided, and as a result, a wafer having a small diameter may fall from the gap. Inside the vacuum chambers 5 and 6, a gate valve 11 for opening and closing the opening 7a of the partition 7 is arranged.

However, according to the conventional apparatus, the roll 10 provided between the partition wall 7 and the end portion of the second belt conveyor 8 is for preventing the wafer 2 being conveyed from falling. Therefore, when the size of the wafer 2 is small, the driving force of the second belt conveyor 8 in the vacuum chambers 5 and 6 is not transmitted to the wafer 2 and the transfer time of the wafer 2 is such that the wafer 2 is stationary on the roll 10. However, there arises a problem that the transfer cannot be performed from the vacuum chamber 5 to the processing chamber 1 and from the processing chamber 1 to the vacuum chamber 6.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances. By improving the transfer mechanism in the vacuum chamber, the wafer is transferred from the vacuum chamber to the processing chamber regardless of the size of the wafer. On the contrary, it is an object of the present invention to provide a vacuum processing apparatus which can surely convey.

[Configuration of the Invention] (Means for Solving the Problems) The present invention is directed to a processing chamber for etching or depositing a semiconductor wafer, a vacuum chamber adjacent to the processing chamber, and between the processing chamber and the vacuum chamber. A partition wall provided with an opening for passing a wafer, first and second belt conveyors for wafer transfer provided in the processing chamber and the vacuum chamber, respectively, and arranged in the same vacuum chamber, one end of which is The second belt conveyor includes a third belt conveyor rotatably connected to an end portion of the belt conveyor near the processing chamber, and a gate valve connected to the third belt conveyor via a link to open and close the opening of the partition wall. However, when the semiconductor wafer is moved from the vacuum chamber to the processing chamber or vice versa, the third belt conveyor is arranged in line with the second belt conveyor, and when the vacuum chamber and the processing chamber are shut off, 3 Beltco The vacuum processing apparatus is characterized in that the bearing is rotated and inclined with respect to the second belt conveyor.

(Operation) According to the present invention, by improving the transfer mechanism in the vacuum chamber, specifically, the third belt conveyor, which is interlocked with the gate valve that opens and closes the opening of the partition between the processing chamber and the vacuum chamber, is vacuumed. By arranging the wafer in the chamber, it is possible to reliably transfer the wafer from the vacuum chamber to the processing chamber or vice versa even if the size of the wafer is small to some extent.

Embodiment An embodiment of the present invention will be described below with reference to FIG.
However, the same members as those in FIG. 2 (conventional) are designated by the same reference numerals and the description thereof will be omitted.

Reference numeral 21 in the figure denotes a third belt conveyor whose one end is connected to the second belt conveyor 9. This third belt conveyor 21
Is connected to the gate valve 11 via a link 22.

In the vacuum processing apparatus having such a structure, for example, when the semiconductor wafer 2 is transferred from the vacuum chamber 5 to the processing chamber 1, the gate valve 11 may be lowered as shown in FIG. As a result, the third belt conveyor 21 connected to the gate valve 11 via the link 22 is replaced by the second belt conveyor 9
And the first belt conveyor 3 in the processing chamber 1
The gap with the (left) end of is significantly narrower than the conventional one,
Even a wafer of a considerably small size can be easily transported. In addition, the transfer of the wafer 2 is completed and the opening 7a of the partition wall 7 is
When closing, the gate valve 11 need only be moved upward. That is, by this operation, the link 22 moves upward, the third belt conveyor 21 rotates counterclockwise from the connection point (point P) with the second belt conveyor 9, and the valve of the gate valve 11 operates. The body will close the opening 7a of the partition wall 7.

Therefore, according to the vacuum processing apparatus according to the above-described embodiment, the third belt conveyor 21 whose one end is connected to the second belt conveyor 9 is arranged in the vacuum chambers 5 and 6, and is linked to the third belt conveyor 21. Since the wafer 2 is connected to the gate valve via the valve 22, when the wafer 2 is transferred from the vacuum chamber 5 to the processing chamber 1 or when it is transferred from the processing chamber 1 to the vacuum chamber 6, as shown in FIG. Link the gate valve 11 by lowering it as shown.
The third belt conveyor 21 connected via 22 becomes in line with the second belt conveyor 9, and the gap between the (left) end of the first belt conveyor 3 in the processing chamber 1 becomes significantly narrower than the conventional one, Even a wafer having a considerably small size can be easily transported.

In the above embodiment, the case where the semiconductor wafer is etched in the processing chamber has been described, but the present invention is not limited to this, and a case where metal or the like is deposited (deposited) on the wafer may be used.

[Effects of Description] As described in detail above, according to the present invention, by improving the transfer mechanism in the vacuum chamber, the wafer can be reliably transferred from the vacuum chamber to the processing chamber and vice versa even if the size of the wafer is small to some extent. It is possible to provide a vacuum processing apparatus that can be transported to the inside.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of a vacuum processing apparatus according to an embodiment of the present invention, and FIG. 2 is an explanatory view of a conventional vacuum processing apparatus. 1 ... Processing chamber, 2 ... Semiconductor wafer, 5, 6 ... Vacuum chamber, 7 ... Partition wall, 4, 9, 21 ... Belt conveyor, 22 ... Link.

Claims (1)

[Claims] 1. A processing chamber for etching or depositing a semiconductor wafer, and a vacuum chamber adjacent to the processing chamber.
A partition provided between the processing chamber and the vacuum chamber and having an opening for passing a wafer, first and second belt conveyors for wafer transfer provided in the processing chamber and the vacuum chamber, respectively, and the vacuum chamber. And a third belt conveyor, one end of which is rotatably connected to an end of the second belt conveyor near the processing chamber, and an opening of the partition wall connected to the third belt conveyor via a link. And a gate valve for opening and closing the valve, the third belt conveyor is arranged in line with the second belt conveyor when the semiconductor wafer is moved from the vacuum chamber to the processing chamber or vice versa, and the vacuum chamber and the processing chamber are also provided. The vacuum processing apparatus is characterized in that the third belt conveyor rotates to incline with respect to the second belt conveyor in the case of shutting off.