JPH0679198U - Electronic equipment - Google Patents

Electronic equipment

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Publication number
JPH0679198U
JPH0679198U JP2184693U JP2184693U JPH0679198U JP H0679198 U JPH0679198 U JP H0679198U JP 2184693 U JP2184693 U JP 2184693U JP 2184693 U JP2184693 U JP 2184693U JP H0679198 U JPH0679198 U JP H0679198U
Authority
JP
Japan
Prior art keywords
circuit board
frame member
outer peripheral
peripheral edge
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2184693U
Other languages
Japanese (ja)
Other versions
JP2547256Y2 (en
Inventor
幸隆 森山
貫 深井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yagi Antenna Co Ltd
Original Assignee
Yagi Antenna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yagi Antenna Co Ltd filed Critical Yagi Antenna Co Ltd
Priority to JP1993021846U priority Critical patent/JP2547256Y2/en
Publication of JPH0679198U publication Critical patent/JPH0679198U/en
Application granted granted Critical
Publication of JP2547256Y2 publication Critical patent/JP2547256Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】 【目的】 本考案は、回路基板を搭載した電子機器装置
において、用途別に複数種類の電子回路及びその相互間
シールドを要する場合でも、複数の回路基板を個々に配
置する必要なく、1枚の回路基板にして収納することを
目的とする。 【構成】 複数種類の電子回路を隣接配置した1枚の回
路基板11の外周縁及び各回路の境界に対応して接地パ
ターンを設け、上記回路基板11の上面側では、その外
周縁及び各回路境界に対応してアルミニウムの角材から
なる上部枠部材12及び上部シールド部材14aを配置
し、また、下面側では、その外周縁及び各回路境界に対
応して同アルミニウムの角材からなる下部枠部材13及
び下部シールド部材14bを配置し、上部枠部材12及
び上部シールド部材14aと下部枠部材13及び下部シ
ールド部材14bとの間を皿ねじ15により貫通挾持し
て固定し、上カバー16a及び下カバー16bにより上
下被覆して構成する。
(57) [Summary] [Object] The present invention requires that a plurality of circuit boards be individually arranged even in the case where a plurality of types of electronic circuits and their mutual shields are required for different purposes in an electronic device equipped with a circuit board. Instead, it is intended to be stored as one circuit board. A ground pattern is provided corresponding to the outer peripheral edge of one circuit board 11 on which a plurality of types of electronic circuits are adjacently arranged and the boundary of each circuit, and the outer peripheral edge and each circuit are provided on the upper surface side of the circuit board 11. The upper frame member 12 and the upper shield member 14a made of aluminum squares are arranged corresponding to the boundaries, and on the lower surface side, the lower frame member 13 made of the aluminum squares corresponding to the outer peripheral edge and each circuit boundary. And the lower shield member 14b are arranged, and the upper frame member 12 and the upper shield member 14a and the lower frame member 13 and the lower shield member 14b are fixed by penetrating and fixing them with countersunk screws 15. The upper and lower parts are covered by the above.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、電子回路を配設した回路基板を搭載してなる電子機器装置に関する 。 The present invention relates to an electronic device apparatus having a circuit board on which an electronic circuit is mounted.

【0002】[0002]

【従来の技術】[Prior art]

従来の電子機器装置において、その内部に搭載される回路基板は、装置筐体の 底板や上板等に立設された支柱や金具等に対して固定されている。 また、高周波用の回路基板等を電磁シールドする場合、筐体内の一部に熔接等 により鋼板を取付けたシールド室が設けられる。 このため、回路基板は、その用途別に複数種類設けられ、それぞれ別々の位置 で別々の支柱や金具等を介して装置筐体内に収められている。 In a conventional electronic device, a circuit board mounted therein is fixed to columns, metal fittings, and the like that are erected on a bottom plate or an upper plate of a device housing. Further, when electromagnetically shielding a high-frequency circuit board or the like, a shield chamber in which a steel plate is attached by welding or the like is provided in a part of the housing. For this reason, a plurality of types of circuit boards are provided according to their uses, and they are housed in the device housing at different positions through different columns and metal fittings.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、上記従来の電子機器装置では、回路基板を取付ける支柱や金具 及びシールド用鋼板等を、用途別の回路基板の個々に対して設ける必要があり、 部品点数が多くなるばかりか、組立て作業工数も増加する問題がある。 However, in the above-mentioned conventional electronic device, it is necessary to provide columns for mounting the circuit board, metal fittings, shield steel plates, etc. for each circuit board for each application, which not only increases the number of parts but also increases the number of assembling steps. There is also an increasing problem.

【0004】 本考案は上記課題に鑑みなされたもので、用途別に複数種類の電子回路及びそ の相互間シールドを要する場合でも、複数の回路基板を個々に配置する必要なく 、1枚の回路基板にして収納することが可能になる電子機器装置を提供すること を目的とする。The present invention has been made in view of the above problems. Even when a plurality of types of electronic circuits and their mutual shields are required for different applications, it is not necessary to individually arrange a plurality of circuit boards, and a single circuit board is required. It is an object of the present invention to provide an electronic device that can be stored as a package.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

すなわち、本考案に係わる電子機器装置は、電子回路を配設した回路基板を搭 載してなるもので、装置筐体の外周縁に対応する大きさでなり、用途別に複数種 類の電子回路が配設された1枚の回路基板と、この回路基板の外周縁及び上記複 数種類の電子回路間の境界に対応して設けられた接地パターンと、上記回路基板 の一面側において、該回路基板の外周縁及び複数種類の電子回路間の境界に対応 して枠状に連結配置され、それぞれ導電性の角材からなる複数本の第1枠部材と 、上記回路基板の他面側において、該回路基板の外周縁及び複数種類の電子回路 間の境界に対応して枠状に連結配置され、それぞれ導電性の角材からなる複数本 の第2枠部材と、上記回路基板をその一面側から上記第1枠部材により他面側か ら上記第2枠部材により挾持する基板挾持手段と、上記第1枠部材及び上記第2 枠部材により挾持された回路基板の一面側を、該第1枠部材を介して被覆する第 1カバーと、上記第1枠部材及び上記第2枠部材により挾持された回路基板の他 面側を、該第2枠部材を介して被覆する第2カバーとを備えて構成したものであ る。 That is, the electronic equipment device according to the present invention has a circuit board on which an electronic circuit is mounted, and has a size corresponding to the outer peripheral edge of the device housing. A single circuit board on which the circuit board is disposed, a ground pattern provided corresponding to the outer peripheral edge of the circuit board and the boundary between the plurality of types of electronic circuits, and the circuit board on one side of the circuit board. A plurality of first frame members, which are connected and arranged in a frame shape corresponding to the outer peripheral edge of the circuit board and a boundary between a plurality of types of electronic circuits, and each of which is made of a conductive square bar; A plurality of second frame members, which are connected and arranged in a frame shape corresponding to the outer peripheral edge of the board and the boundaries between the plurality of types of electronic circuits, and each of which is made of conductive squares, and the circuit board are arranged from the one surface side to the first side. The second frame portion from the other surface side by one frame member And a first cover that covers one surface side of the circuit board held by the first frame member and the second frame member via the first frame member, and the first frame member. And a second cover that covers the other surface side of the circuit board held by the second frame member via the second frame member.

【0006】[0006]

【作用】[Action]

つまり、上記第1枠部材及び第2枠部材は上記回路基板の支持部材及びシール ド部材として併用されることになる。 That is, the first frame member and the second frame member are used together as a support member and a shield member for the circuit board.

【0007】[0007]

【実施例】【Example】

以下図面により本考案の一実施例について説明する。 図1は電子機器装置の組立て構成を示す斜視図である。 図1において、11は回路基板、12は上部枠部材、13は下部枠部材、14 aは上部シールド部材、14bは下部シールド部材、15は基板挾持用皿ねじ、 16aは上カバー、16bは下カバー、17aは上カバー固定ねじ、17bは下 カバー固定ねじ、18は前面パネル、19はパネル固定ねじである。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an assembled configuration of an electronic device device. In FIG. 1, 11 is a circuit board, 12 is an upper frame member, 13 is a lower frame member, 14a is an upper shield member, 14b is a lower shield member, 15 is a board holding plate screw, 16a is an upper cover, and 16b is a lower part. A cover, 17a is an upper cover fixing screw, 17b is a lower cover fixing screw, 18 is a front panel, and 19 is a panel fixing screw.

【0008】 図2は上記電子機器装置における上部枠部材12及び下部枠部材13の構成を 示す斜視図である。 上部枠部材14は、前記回路基板11の上面側において、該回路基板11の外 周縁及びその複数種類の電子回路間の境界に対応して枠状に連結配置され、それ ぞれアルミニウム等の導電性の角材からなるもので、この上部枠部材14には、 前記基板挾持用皿ねじ15に対応する貫通孔21、前記上カバー固定ねじ17a に対応するタップ穴22、部材間連結用のタップ穴23、皿ねじ貫通孔24が設 けられる。FIG. 2 is a perspective view showing the configuration of the upper frame member 12 and the lower frame member 13 in the electronic device. The upper frame member 14 is connected and arranged in a frame shape on the upper surface side of the circuit board 11 so as to correspond to the outer peripheral edge of the circuit board 11 and the boundary between a plurality of types of electronic circuits, and each of them is made of a conductive material such as aluminum. The upper frame member 14 has a through hole 21 corresponding to the countersunk screw 15 for holding the substrate, a tap hole 22 corresponding to the upper cover fixing screw 17a, and a tap hole for connecting members. 23 and a countersunk screw through hole 24 are provided.

【0009】 また、下部枠部材13は、前記回路基板11の下面側において、該回路基板1 1の外周縁及びその複数種類の電子回路間の境界に対応して枠状に連結配置され 、それぞれアルミニウム等の導電性の角材からなるもので、この下部枠部材13 には、上記上部枠部材14の貫通孔21に位置対応する貫通タップ穴25、部材 間連結用のタップ穴26、皿ねじ貫通孔27、前記下カバー固定ねじ17bに対 応するタップ穴28が設けられる。Further, the lower frame member 13 is arranged in a frame shape on the lower surface side of the circuit board 11 so as to correspond to the outer peripheral edge of the circuit board 11 and the boundaries between the plurality of types of electronic circuits. The lower frame member 13 is formed of a conductive square bar such as aluminum. The lower frame member 13 has a through tap hole 25 corresponding to the through hole 21 of the upper frame member 14, a tap hole 26 for connecting members, and a flat head screw through hole. A hole 27 and a tap hole 28 corresponding to the lower cover fixing screw 17b are provided.

【0010】 ここで、前記図1における上部シールド部材14a及び下部シールド部材14 bは、上記上部枠部材12及び下部枠部材13と同様にして構成される。 図3は上記電子機器装置における回路基板11の構成を示す斜視図である。Here, the upper shield member 14 a and the lower shield member 14 b in FIG. 1 are configured in the same manner as the upper frame member 12 and the lower frame member 13. FIG. 3 is a perspective view showing the configuration of the circuit board 11 in the electronic device.

【0011】 回路基板11は、装置筐体の外周縁に対応する大きさでなり、用途別に複数種 の電子回路a,b,c,dが1枚の基板上に配設されるもので、この回路基板1 1の外周縁及び上記複数種類の電子回路a,b,c,d相互間の境界には、接地 (アース)パターン31が設けられる。The circuit board 11 has a size corresponding to the outer peripheral edge of the device housing, and a plurality of types of electronic circuits a, b, c, d are arranged on one board for each purpose. A ground pattern 31 is provided on the outer peripheral edge of the circuit board 11 and on the boundaries between the plurality of types of electronic circuits a, b, c, d.

【0012】 この場合、隣接する電子回路間(例えばa,b間)の接続は、上記接地パター ン31を分断し回路パターン32を介して施される。 そして、上記回路基板11において接地パターン31が設けられた基板外周縁 部及び各電子回路a,b,c,d相互間の境界部には、前記上部枠部材12の貫 通孔21及び下部枠部材13の貫通タップ穴25、そして、上部シールド部材1 4aの貫通孔21及び下部シールド部材14bの貫通タップ穴25それぞれに位 置対応してねじ穴33が形成される。In this case, the connection between adjacent electronic circuits (for example, between a and b) is made via the circuit pattern 32 by dividing the ground pattern 31. Further, the through hole 21 and the lower frame of the upper frame member 12 are provided at the outer peripheral edge of the circuit board 11 where the ground pattern 31 is provided and the boundary between the electronic circuits a, b, c and d. Screw holes 33 are formed corresponding to the through tap holes 25 of the member 13, the through holes 21 of the upper shield member 14a and the through tap holes 25 of the lower shield member 14b.

【0013】 次に、上記構成による電子機器装置の組立て手順について説明する。 すなわち、まず、回路基板11の上側面において、その接地パターン31が設 けられた基板外周縁及び各電子回路a,b,c,d間の境界に対応して上部枠部 材12及び上部シールド部材14aを配置する。Next, a procedure for assembling the electronic device apparatus having the above configuration will be described. That is, first, on the upper side surface of the circuit board 11, the upper frame member 12 and the upper shield 12 correspond to the outer peripheral edge of the board on which the ground pattern 31 is provided and the boundaries between the electronic circuits a, b, c and d. The member 14a is arranged.

【0014】 また、回路基板11の下側面において、上記上部枠部材12及び上部シールド 部材14aが配置された基板外周縁及び各電子回路a,b,c,d間の境界に対 応して、下部枠部材13及び下部シールド部材14bを配置する。Further, on the lower surface of the circuit board 11, corresponding to the outer peripheral edge of the board on which the upper frame member 12 and the upper shield member 14a are arranged and the boundaries between the electronic circuits a, b, c, d, The lower frame member 13 and the lower shield member 14b are arranged.

【0015】 そして、基板挾持用皿ねじ15を、上記上部枠部材12及び上部シールド部材 14aそれぞれの貫通孔21から回路基板11のねじ穴33を挿通させて下部枠 部材13及び下部シールド部材14bの各対応する貫通タップ穴25に螺合させ る。Then, the board-holding countersunk screw 15 is inserted into the screw holes 33 of the circuit board 11 from the through holes 21 of the upper frame member 12 and the upper shield member 14a, respectively, and the lower frame member 13 and the lower shield member 14b are inserted. It is screwed into each corresponding through tap hole 25.

【0016】 これにより、上記回路基板11を、その外周縁部及び電子回路境界部において 、上部枠部材12及び上部シールド部材14aと下部枠部材13及び下部シール ド部材14bとにより挾持固定する。As a result, the circuit board 11 is clamped and fixed by the upper frame member 12 and the upper shield member 14a and the lower frame member 13 and the lower shield member 14b at the outer peripheral edge portion and the electronic circuit boundary portion.

【0017】 ここで、回路基板11の上面側では、上部枠部材12及び上部シールド部材1 4aにより各電子回路a,b,c,dの相互間がシールド分割された状態となり 、また、回路基板11の下面側では、下部枠部材13及び下部シールド部材14 bにより同各電子回路a,b,c,dの相互間がシールド分割された状態となる もので、この後、上記回路基板11に対応する大きさの上部カバー16aを、上 カバー固定ねじ17aを上部枠部材12のタップ穴22に螺合することにより固 定し、また、同サイズの下カバー16bを、下カバー固定ねじ17bを下部枠部 材13のタップ穴28に螺合することにより固定する。Here, on the upper surface side of the circuit board 11, the electronic circuits a, b, c, d are shield-divided from each other by the upper frame member 12 and the upper shield member 14a. On the lower surface side of 11, the lower frame member 13 and the lower shield member 14b are in a state in which the electronic circuits a, b, c, d are shield-divided from each other. The upper cover 16a of a corresponding size is fixed by screwing the upper cover fixing screw 17a into the tap hole 22 of the upper frame member 12, and the lower cover 16b of the same size is fixed to the lower cover fixing screw 17b. It is fixed by being screwed into the tap hole 28 of the lower frame member 13.

【0018】 そして、装置筐体の前面には、前面パネル18を、ねじ19を上記上部枠部材 12及び下部枠部材13それぞれのタップ穴23,26に螺合することにより固 定する。Then, the front panel 18 is fixed to the front surface of the apparatus housing by screwing screws 19 into the tap holes 23 and 26 of the upper frame member 12 and the lower frame member 13, respectively.

【0019】 これにより、この電子機器装置は、図4に示すような筐体として組上げられる ようになる。 したがって、上記構成の電子機器装置によれば、複数種類の電子回路a,b, c,dを隣接配置した1枚の回路基板11の外周縁及び各回路の境界に対応して 接地パターン31を設け、上記回路基板11の上面側では、その外周縁及び各回 路境界に対応してアルミニウムの角材からなる上部枠部材12及び上部シールド 部材14aを配置し、また、下面側では、その外周縁及び各回路境界に対応して 同アルミニウムの角材からなる下部枠部材13及び下部シールド部材14bを配 置し、上部枠部材12及び上部シールド部材14aと下部枠部材13及び下部シ ールド部材14bとの間を皿ねじ15により貫通挾持して固定し、上カバー16 a及び下カバー16bをそれぞれ対応するねじ17a,17bにより固定し、上 記回路基板11の上側面及び下側面を被覆するようにしたので、用途別に分離し た複数枚の回路基板を要することになく、1枚の回路基板11として、しかも各 電子回路a,b,c,d間をシールド分離することができるようになる。 また、専用指示部材や専用シールド部材等を要することなく、部品点数及び組 立て作業工数の削減を図ることができる。As a result, this electronic device device can be assembled as a housing as shown in FIG. Therefore, according to the electronic device having the above-described configuration, the ground pattern 31 is provided in correspondence with the outer peripheral edge of one circuit board 11 on which a plurality of types of electronic circuits a, b, c, d are arranged and the boundary of each circuit. The upper frame member 12 and the upper shield member 14a made of aluminum square are arranged on the upper surface side of the circuit board 11 corresponding to the outer peripheral edge and each circuit boundary, and on the lower surface side, the outer peripheral edge and A lower frame member 13 and a lower shield member 14b, which are made of the same aluminum material, are arranged corresponding to each circuit boundary, and are arranged between the upper frame member 12 and the upper shield member 14a and the lower frame member 13 and the lower shield member 14b. Is fixed by penetrating it with a countersunk screw 15, and the upper cover 16a and the lower cover 16b are fixed with corresponding screws 17a and 17b, respectively. Since the upper side surface and the lower side surface are covered, it is not necessary to use a plurality of circuit boards separated according to applications, and one circuit board 11 is provided, and each electronic circuit a, b, c, d is connected. The shield can be separated. Further, it is possible to reduce the number of parts and the man-hours for assembling work without requiring a dedicated indicating member, a dedicated shield member, or the like.

【0020】[0020]

【考案の効果】[Effect of device]

以上のように本考案によれば、装置筐体の外周縁に対応する大きさでなり、用 途別に複数種類の電子回路が配設された1枚の回路基板と、この回路基板の外周 縁及び上記複数種類の電子回路間の境界に対応して設けられた接地パターンと、 上記回路基板の一面側において、該回路基板の外周縁及び複数種類の電子回路間 の境界に対応して枠状に連結配置され、それぞれ導電性の角材からなる複数本の 第1枠部材と、上記回路基板の他面側において、該回路基板の外周縁及び複数種 類の電子回路間の境界に対応して枠状に連結配置され、それぞれ導電性の角材か らなる複数本の第2枠部材と、上記回路基板をその一面側から上記第1枠部材に より他面側から上記第2枠部材により挾持する基板挾持手段と、上記第1枠部材 及び上記第2枠部材により挾持された回路基板の一面側を、該第1枠部材を介し て被覆する第1カバーと、上記第1枠部材及び上記第2枠部材により挾持された 回路基板の他面側を、該第2枠部材を介して被覆する第2カバーとを備えて構成 したので、用途別に複数種類の電子回路及びその相互間シールドを要する場合で も、複数の回路基板を個々に配置する必要なく、1枚の回路基板にして収納する ことが可能になる。 As described above, according to the present invention, a single circuit board having a size corresponding to the outer peripheral edge of the device housing and provided with a plurality of types of electronic circuits for different purposes, and an outer peripheral edge of the circuit board. And a ground pattern provided corresponding to a boundary between the plurality of types of electronic circuits, and a frame shape on the one surface side of the circuit board corresponding to an outer peripheral edge of the circuit board and a boundary between the plurality of types of electronic circuits. A plurality of first frame members, each of which is made of a conductive square bar, are connected to each other, and on the other surface side of the circuit board, corresponding to the outer peripheral edge of the circuit board and the boundary between the plurality of types of electronic circuits. A plurality of second frame members connected and arranged in a frame shape, each of which is made of conductive squares, and the circuit board is sandwiched between the first frame member from one surface side and the second frame member from the other surface side. Holding means for holding, the first frame member, and the second frame A first cover for covering one surface side of the circuit board held by the material through the first frame member, and the other surface side of the circuit board held by the first frame member and the second frame member, Since the second cover that covers the second frame member is provided, it is not necessary to individually arrange a plurality of circuit boards even when a plurality of types of electronic circuits and their mutual shields are required for each application. It becomes possible to store it as one circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例に係わる電子機器装置の組立
て構成を示す斜視図。
FIG. 1 is a perspective view showing an assembled configuration of an electronic device apparatus according to an embodiment of the present invention.

【図2】上記電子機器装置における上部枠部材及び下部
枠部材の構成を示す斜視図。
FIG. 2 is a perspective view showing a configuration of an upper frame member and a lower frame member in the electronic device device.

【図3】上記電子機器装置における回路基板の構成を示
す斜視図。
FIG. 3 is a perspective view showing a configuration of a circuit board in the electronic device device.

【図4】上記電子機器装置の組立て完了状態を示す斜視
図。
FIG. 4 is a perspective view showing a completed assembly state of the electronic device.

【符号の説明】[Explanation of symbols]

11…回路基板、12…上部枠部材、13…下部枠部
材、14a…上部シールド部材、14b…下部シールド
部材、15…基板挾持用皿ねじ、16a…上カバー、1
6b…下カバー、17a…上カバー固定ねじ、17b…
下カバー固定ねじ、18…前面パネル、19…パネル固
定ねじ、21、24、27…皿ねじ貫通孔、22、28
…タップ穴、25…貫通タップ穴、23、26…部材間
連結用タップ穴、31…接地(アース)パターン、32
…回路パターン、33…ねじ穴、a,b,c,d…電子
回路。
DESCRIPTION OF SYMBOLS 11 ... Circuit board, 12 ... Upper frame member, 13 ... Lower frame member, 14a ... Upper shield member, 14b ... Lower shield member, 15 ... Board holding plate screw, 16a ... Upper cover, 1
6b ... lower cover, 17a ... upper cover fixing screw, 17b ...
Lower cover fixing screw, 18 ... Front panel, 19 ... Panel fixing screw, 21, 24, 27 ... Countersunk screw through hole, 22, 28
... tap hole, 25 ... through tap hole, 23, 26 ... inter-member connection tap hole, 31 ... ground pattern (ground), 32
... circuit pattern, 33 ... screw holes, a, b, c, d ... electronic circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 電子回路を配設した回路基板を搭載して
なる電子機器装置において、 装置筐体の外周縁に対応する大きさでなり、用途別に複
数種類の電子回路が配設された1枚の回路基板と、 この回路基板の外周縁及び上記複数種類の電子回路間の
境界に対応して設けられた接地パターンと、 上記回路基板の一面側において、該回路基板の外周縁及
び複数種類の電子回路間の境界に対応して枠状に連結配
置され、それぞれ導電性の角材からなる複数本の第1枠
部材と、 上記回路基板の他面側において、該回路基板の外周縁及
び複数種類の電子回路間の境界に対応して枠状に連結配
置され、それぞれ導電性の角材からなる複数本の第2枠
部材と、 上記回路基板をその一面側から上記第1枠部材により他
面側から上記第2枠部材により挾持する基板挾持手段
と、 上記第1枠部材及び上記第2枠部材により挾持された回
路基板の一面側を、該第1枠部材を介して被覆する第1
カバーと、 上記第1枠部材及び上記第2枠部材により挾持された回
路基板の他面側を、該第2枠部材を介して被覆する第2
カバーとを具備し、 上記第1枠部材及び第2枠部材を上記回路基板の支持部
材及びシールド部材として併用したことを特徴とする電
子機器装置。
1. An electronic device including a circuit board on which an electronic circuit is mounted, the electronic device having a size corresponding to an outer peripheral edge of a device housing, and a plurality of types of electronic circuits arranged according to use. A plurality of circuit boards, an outer peripheral edge of the circuit board and a ground pattern provided corresponding to a boundary between the plurality of types of electronic circuits; and an outer peripheral edge of the circuit board and a plurality of types on one surface side of the circuit board. A plurality of first frame members connected and arranged in a frame shape corresponding to the boundaries between the electronic circuits, each of which is made of a conductive square bar; and on the other surface side of the circuit board, the outer peripheral edge of the circuit board and the plurality of first frame members. A plurality of second frame members, which are connected and arranged in a frame shape corresponding to the boundaries between the types of electronic circuits, and each of which is made of conductive squares, and the circuit board from the one surface side to the other surface by the first frame member. Hold by the second frame member from the side A plate clamping means, the one side of the circuit board which is clamped by the first frame member and said second frame member, the covering through the first frame member 1
A second cover which covers the cover and the other surface side of the circuit board held by the first frame member and the second frame member via the second frame member.
An electronic device device comprising a cover, wherein the first frame member and the second frame member are used together as a support member and a shield member for the circuit board.
JP1993021846U 1993-04-26 1993-04-26 Electronic equipment Expired - Fee Related JP2547256Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1993021846U JP2547256Y2 (en) 1993-04-26 1993-04-26 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1993021846U JP2547256Y2 (en) 1993-04-26 1993-04-26 Electronic equipment

Publications (2)

Publication Number Publication Date
JPH0679198U true JPH0679198U (en) 1994-11-04
JP2547256Y2 JP2547256Y2 (en) 1997-09-10

Family

ID=12066467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1993021846U Expired - Fee Related JP2547256Y2 (en) 1993-04-26 1993-04-26 Electronic equipment

Country Status (1)

Country Link
JP (1) JP2547256Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017159531A1 (en) * 2016-03-16 2017-09-21 株式会社ソニー・インタラクティブエンタテインメント Electronic device
CN108541127A (en) * 2017-03-06 2018-09-14 索尼互动娱乐股份有限公司 Electronic equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935540A (en) * 1982-08-18 1984-02-27 株式会社明電舎 System state monitor for wirings
JPS63133600A (en) * 1986-11-26 1988-06-06 株式会社日立国際電気 Shielding structure of electronic equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935540A (en) * 1982-08-18 1984-02-27 株式会社明電舎 System state monitor for wirings
JPS63133600A (en) * 1986-11-26 1988-06-06 株式会社日立国際電気 Shielding structure of electronic equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017159531A1 (en) * 2016-03-16 2017-09-21 株式会社ソニー・インタラクティブエンタテインメント Electronic device
CN108781526A (en) * 2016-03-16 2018-11-09 索尼互动娱乐股份有限公司 Electronic equipment
US10966356B2 (en) * 2016-03-16 2021-03-30 Sony Interactive Entertainment Inc. Electronic apparatus
CN108541127A (en) * 2017-03-06 2018-09-14 索尼互动娱乐股份有限公司 Electronic equipment
JP2018148026A (en) * 2017-03-06 2018-09-20 株式会社ソニー・インタラクティブエンタテインメント Electronic equipment
US10932356B2 (en) 2017-03-06 2021-02-23 Sony Interactive Entertainment Inc. Electronic equipment

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