JPH0677948B2 - Mold temperature controller - Google Patents

Mold temperature controller

Info

Publication number
JPH0677948B2
JPH0677948B2 JP61039161A JP3916186A JPH0677948B2 JP H0677948 B2 JPH0677948 B2 JP H0677948B2 JP 61039161 A JP61039161 A JP 61039161A JP 3916186 A JP3916186 A JP 3916186A JP H0677948 B2 JPH0677948 B2 JP H0677948B2
Authority
JP
Japan
Prior art keywords
mold
temperature
refrigerant
pump
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61039161A
Other languages
Japanese (ja)
Other versions
JPS62198418A (en
Inventor
昭 豊島
日出雄 壷井
泰造 東
薫 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP61039161A priority Critical patent/JPH0677948B2/en
Publication of JPS62198418A publication Critical patent/JPS62198418A/en
Publication of JPH0677948B2 publication Critical patent/JPH0677948B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C45/7306Control circuits therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、合成樹脂等の成形用金型の温度を所定の範
囲内に制御するための金型温度調節装置に関する。
The present invention relates to a mold temperature adjusting device for controlling the temperature of a mold for molding synthetic resin or the like within a predetermined range.

(従来の技術) 合成樹脂等の成形用金型の温度調節のために冷媒で金型
を冷やし、そこで温度上昇した冷媒を再び冷却する装置
として従来は第4図に示すように、金型31内で熱交換を
行い温度上昇を起こした媒体は、ポンプ34の作用により
冷却器32へ送られ、そこの熱交換器33により充分に冷却
された後、加熱器35で加熱され、適正な温度に調整され
る。加熱器35の下流に設置した温度検出器38で媒体温度
を検出し、設定温度との差に基づき発熱体36の発熱量を
調整して適正温度に制御される。37は調節されうる電源
である。
(Prior Art) As a device for cooling a mold with a refrigerant for controlling the temperature of a mold for molding synthetic resin or the like, and cooling the refrigerant whose temperature has risen again, as shown in FIG. The medium that has undergone heat exchange in the inside and has a temperature rise is sent to the cooler 32 by the action of the pump 34, is sufficiently cooled by the heat exchanger 33 there, and is then heated by the heater 35 to have an appropriate temperature. Adjusted to. The medium temperature is detected by a temperature detector 38 installed downstream of the heater 35, and the heat generation amount of the heating element 36 is adjusted based on the difference from the set temperature to control the temperature to an appropriate temperature. 37 is a power source that can be adjusted.

この従来装置においては媒体を冷却器32により一度所定
温度以下に冷却した後加熱器35により加熱して温度調整
を行うため、熱エネルギのロスが大きく、サイリスタ等
の高価な電力制御装置を必要とし、製作費は高価とな
る。又金型において熱交換を行つた媒体は、加熱溶融さ
れた合成樹脂等が金型に射出、充填された時の金型の温
度変化に伴ない射出成形機のシヨツトサイクルと同サイ
クルの温度変化をくり返しているが、従来装置には温度
変動の緩衝装置を備えていないため金型入口における媒
体温度が安定せず制御性が悪いといつた欠点があつた。
In this conventional device, since the medium is once cooled to a predetermined temperature or lower by the cooler 32 and then heated by the heater 35 to adjust the temperature, the loss of thermal energy is large and an expensive power control device such as a thyristor is required. , The production cost becomes expensive. In addition, the medium that has undergone heat exchange in the mold has the same cycle temperature as the shot cycle of the injection molding machine due to the temperature change of the mold when heated and melted synthetic resin is injected into the mold and filled. Although the change is repeated, the conventional device has a drawback that the medium temperature at the mold inlet is not stable and the controllability is poor because the device does not have a temperature fluctuation buffer.

(問題点を解決するための手段) この発明は従来の欠点を除去するため、配管状態を改良
し、温度変動を緩衝する機能を有したタンクを用いるこ
とで、熱エネルギロスをなくし、省エネ化、製作費の軽
減化、及び精密、敏速かつ安定した温度制御をうるよう
にしたものである。
(Means for Solving Problems) In order to eliminate the conventional drawbacks, the present invention eliminates thermal energy loss and saves energy by improving the piping condition and using a tank having a function of buffering temperature fluctuations. In addition, the manufacturing cost can be reduced, and precise, prompt and stable temperature control can be achieved.

(実施例) 第1図はこの発明の構成を示す1例であつて媒体として
水を使用した場合を示すもので、金型12を通過し、金型
と熱交換を行い温度が上昇した水は、排水管14に導かれ
スタテイツクミキサ1を通じ温度変動緩衝装置15a,15b
を備えた冷媒貯蔵タンク2に一旦貯えられる。金型12か
らの排出管14を流れる水は、加熱溶融された合成樹脂等
が金型に射出、充填された時の金型の温度変化により射
出成形機のシヨツトサイクルと同サイクルの温度変動を
くり返している。当該変動をタンク2に装着された温度
変動緩衝装置15a,15bにより取り除き、水の温度を安定
させ、ポンプ4により加圧され、送水管16に導かれ金型
12へと送られる。ポンプ4の吐出側の下流で冷却配管17
が分岐され、冷却器7内の熱交換器21で冷却された後、
第1図に示す実施例ではさらに1次冷却配管18aと2次
冷却配管18bの2系統に分岐される。1次冷却水は1次
冷却配管18aに導かれ、弁6を経て排水管14を流れる金
型の戻り水と合流し、スタテイツクミキサ1を経てタン
ク2に戻る。この場合により戻り水の1次冷却を行う。
2次冷却水は2次冷却配管18bに導かれ小さな調節弁5
を経てポンプ4の吸込側直前において送水管16を流れる
水と合流し、微調整用の2次冷却を行う。金型12への入
口近くに温度検出器9を設置し、設定温度と検出温度と
の差に基づき、調節弁5の弁開度を調整し、金型12への
供給温度を精密かつ安定制御するものである。
(Embodiment) FIG. 1 is an example showing the structure of the present invention, in which water is used as a medium, and water which has passed through the mold 12 and has undergone heat exchange with the mold to raise its temperature. Is guided to the drain pipe 14 and passed through the status mixer 1 to the temperature fluctuation buffers 15a and 15b.
It is temporarily stored in the refrigerant storage tank 2 provided with. The water flowing through the discharge pipe 14 from the mold 12 changes in temperature in the same cycle as the shot cycle of the injection molding machine due to the temperature change of the mold when the molten synthetic resin is injected and filled in the mold. Is repeating. The fluctuation is removed by the temperature fluctuation buffers 15a and 15b attached to the tank 2, the temperature of the water is stabilized, the pressure is increased by the pump 4, and the water is guided to the water pipe 16 and the mold
Sent to 12. The cooling pipe 17 is provided downstream of the discharge side of the pump 4.
Is branched and cooled by the heat exchanger 21 in the cooler 7,
In the embodiment shown in FIG. 1, it is further branched into two systems, a primary cooling pipe 18a and a secondary cooling pipe 18b. The primary cooling water is guided to the primary cooling pipe 18a, merges with the return water of the mold flowing through the drain pipe 14 through the valve 6, and returns to the tank 2 through the static mixer 1. In this case, the return water is primarily cooled.
The secondary cooling water is guided to the secondary cooling pipe 18b and the small control valve 5
Immediately before the suction side of the pump 4, it merges with the water flowing through the water pipe 16 to perform secondary cooling for fine adjustment. A temperature detector 9 is installed near the entrance to the mold 12, and the valve opening of the control valve 5 is adjusted based on the difference between the set temperature and the detected temperature to precisely and stably control the supply temperature to the mold 12. To do.

また、タンク2には発熱体3を有する加熱器19を併置
し、起動時に設定温度まで昇温する為に弁10、弁13を閉
じ、弁11を開とし、冷媒を循環させ設定温度まで予熱す
る。
In addition, a heater 19 having a heating element 3 is placed in parallel in the tank 2, and the valves 10 and 13 are closed and the valve 11 is opened to raise the temperature to a preset temperature at the time of startup, and the refrigerant is circulated to preheat it to the preset temperature. To do.

第2図、第3図は別な実施例を示すもので、冷却配管17
を流れ、冷却器7で熱交換される冷媒の流量が少ない場
合に対応する。第2図では第1図に示される配管18aが
なく、配管18bのみが使用され、第3図では配管18bが省
略され、配管18aのみが使用されている。その他の部分
は第1図と同じ符号は同じ部分を示している。
2 and 3 show another embodiment, which is a cooling pipe 17
This corresponds to the case where the flow rate of the refrigerant flowing through the cooling device 7 and heat-exchanged in the cooler 7 is small. In FIG. 2, the pipe 18a shown in FIG. 1 is not provided and only the pipe 18b is used. In FIG. 3, the pipe 18b is omitted and only the pipe 18a is used. The other parts have the same reference numerals as those in FIG. 1 and indicate the same parts.

この両実施例の何れを使用するかは装置に要求されてい
る精度、容器、反応速度度による。例えば精密制御が要
求される場合は、反応性に優れ精度の高い温度検出器
9、調節弁5、さらに制御系統、さらに安定性のよい冷
却器及び冷却装置を備えた第2図のような系を使用し、
それほど精密な制御を必要としない場合は第2図の場合
より反応速度は劣るが基本的には安定な第3図のような
系を使用する。
Which of these two embodiments is used depends on the accuracy, container and reaction rate required for the apparatus. For example, when precise control is required, a system such as that shown in FIG. 2 equipped with a highly sensitive and highly accurate temperature detector 9, a control valve 5, a control system, and a cooler and a cooling device with good stability. Use
When not requiring very precise control, a system as shown in FIG. 3 is used, which has a reaction rate lower than that in the case of FIG. 2 but is basically stable.

又冷却配管を流れ冷却器7で熱交換される冷媒の流量が
多い場合は、混合性、熱安定性を良くするために第1図
に示すように、冷却器7の下流で、1次冷却配管18aと
2次冷却配管18bとに分岐し、第1図で説明したような
系を使用する。この場合第2図、第3図に示す系よりは
配管が増加するが混合性、冷却効果が向上する。
When the flow rate of the refrigerant that flows through the cooling pipe and is heat-exchanged in the cooler 7 is large, the primary cooling is performed downstream of the cooler 7 in order to improve the mixing property and the thermal stability, as shown in FIG. A system as described with reference to FIG. 1 is used by branching to a pipe 18a and a secondary cooling pipe 18b. In this case, the pipes are increased as compared with the systems shown in FIGS. 2 and 3, but the mixing property and the cooling effect are improved.

(効果) この考案はこのような構成であつて、冷媒で金型を冷却
した後、温度上昇した冷媒を冷却する装置、温度変動を
緩衝しうるタンク、タンクを通過して流れる冷媒への冷
却された冷媒の混入量を調節する装置等を備え、加熱器
等による加熱制御系が除かれ、熱エネルギロスをなくし
て省エネ化、製作費の軽減化および精密、敏速かつ安定
した温度制御ができるものである。
(Effect) The present invention has such a structure, and a device for cooling the mold with a coolant and then cooling the coolant whose temperature has risen, a tank capable of buffering temperature fluctuations, and a cooling for the coolant flowing through the tank. Equipped with a device for adjusting the amount of mixed refrigerant that has been mixed, the heating control system such as a heater is eliminated, energy loss can be eliminated to reduce energy consumption, production costs can be reduced, and precise, prompt and stable temperature control can be performed. It is a thing.

【図面の簡単な説明】[Brief description of drawings]

第1図、第2図、第3図は夫々この考案の異なる実施例
を示す図、第4図は従来の装置を示す図である。 符号の説明 1……スタテイツクミキサ、2……冷媒貯蔵タンク、3
……発熱体、4……ポンプ、5……調節弁、6……弁、
7……冷却器、9……温度検出器、10,11……弁、12…
…金型、13……弁、14……排出管、15a,15b……緩衝装
置、16……送水管、17……冷却配管、18a……1次冷却
配管、18b……2次冷却配管、19……加熱器、21……熱
交換器。
FIGS. 1, 2, and 3 are views showing different embodiments of the present invention, and FIG. 4 is a view showing a conventional device. Explanation of symbols 1 ... Static mixer, 2 ... Refrigerant storage tank, 3
...... Heating element, 4 ... Pump, 5 ... Control valve, 6 ... Valve,
7 ... Cooler, 9 ... Temperature detector, 10, 11 ... Valve, 12 ...
… Mold, 13 …… Valve, 14 …… Discharge pipe, 15a, 15b …… Shock absorber, 16 …… Water pipe, 17 …… Cooling pipe, 18a …… Primary cooling pipe, 18b …… Secondary cooling pipe , 19 …… heater, 21 …… heat exchanger.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 大野 薫 東京都大田区羽田旭町11番1号 株式会社 荏原製作所内 (56)参考文献 実公 昭41−18868(JP,Y1) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kaoru Ono 11-1 Haneda-Asahi-cho, Ota-ku, Tokyo Inside the EBARA CORPORATION (56) Bibliographic references Sho 41-18868 (JP, Y1)

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】合成樹脂等の成形に用いる金型の上流側に
設けた冷媒圧送用のポンプと、該ポンプの吸込側に設け
られた冷媒貯蔵タンクと、該ポンプ吐出側から分岐され
た冷却配管に設けられた冷却器と、さらに冷媒の温度、
流量を検知、制御する系とにより構成される金型温度調
節器において、 冷媒貯蔵タンクには温度変動緩衝装置が装着されてお
り、上記冷却器を経由した冷媒は、金型から上記の冷媒
貯蔵タンクを経て、ポンプの吸込口直前にまで戻る冷媒
の経路中に接続されることを特徴とする金型温度調節装
置。
1. A pump for pumping a refrigerant, which is provided on an upstream side of a mold used for molding a synthetic resin, a refrigerant storage tank provided on a suction side of the pump, and a cooling branched from a discharge side of the pump. The cooler provided in the pipe, and the temperature of the refrigerant,
In the mold temperature controller composed of a system for detecting and controlling the flow rate, the refrigerant storage tank is equipped with a temperature fluctuation buffer, and the refrigerant that has passed through the cooler is stored in the mold from the mold. A mold temperature control device, characterized in that the mold temperature control device is connected in a path of a refrigerant which returns to a position immediately before a suction port of a pump through a tank.
【請求項2】前記の冷却器と前記のタンクからポンプに
冷媒を送る配管のポンプへの吸込直前の個所とを結ぶ冷
却配管に温度調節弁を設け、該調節弁はポンプ下流側
で、かつ金型の入口前の個所の冷媒温度により制御され
ることを特徴とする前記特許請求の範囲第1項記載の金
型温度調節装置。
2. A temperature control valve is provided in a cooling pipe connecting the cooler and a portion of the pipe for sending the refrigerant from the tank to the pump immediately before suction to the pump, and the control valve is provided on the downstream side of the pump, and The mold temperature controller according to claim 1, wherein the mold temperature is controlled by the temperature of the refrigerant at a position before the entrance of the mold.
【請求項3】前記の金型と前記のタンクとを結ぶ排出管
に前記の冷却器からの、弁を有する冷却配管を連結し、
この連結個所とタンクとの間にスタティックミキサを設
けたことを特徴とする前記特許請求の範囲第1項記載の
金型温度調節装置。
3. A discharge pipe connecting the mold and the tank is connected with a cooling pipe from the cooler, the cooling pipe having a valve,
The mold temperature controller according to claim 1, characterized in that a static mixer is provided between the connecting point and the tank.
JP61039161A 1986-02-26 1986-02-26 Mold temperature controller Expired - Lifetime JPH0677948B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61039161A JPH0677948B2 (en) 1986-02-26 1986-02-26 Mold temperature controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61039161A JPH0677948B2 (en) 1986-02-26 1986-02-26 Mold temperature controller

Publications (2)

Publication Number Publication Date
JPS62198418A JPS62198418A (en) 1987-09-02
JPH0677948B2 true JPH0677948B2 (en) 1994-10-05

Family

ID=12545393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61039161A Expired - Lifetime JPH0677948B2 (en) 1986-02-26 1986-02-26 Mold temperature controller

Country Status (1)

Country Link
JP (1) JPH0677948B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671728B2 (en) * 1987-09-30 1994-09-14 クボタカラートロニック株式会社 Mold temperature controller
JPH0727148Y2 (en) * 1989-09-18 1995-06-21 株式会社新潟鐵工所 Cooling device for injection molding machine
EP0904911A1 (en) * 1997-09-30 1999-03-31 Regloplas AG Process and apparatus for regulating temperature of a load with a tempering medium
EP0953425A1 (en) * 1998-04-27 1999-11-03 Regloplas AG Method and apparatus to regulate mould temperatures
CN103991196A (en) * 2014-04-29 2014-08-20 成都龙泉鑫锐模具塑料厂 Injection mold convenient in temperature adjusting
CN113320077B (en) * 2021-05-20 2022-08-02 青岛海佰利机械有限公司 Cooling assembly, cooling process, injection molding machine and injection molding process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4118868Y1 (en) * 1964-08-24 1966-09-02

Also Published As

Publication number Publication date
JPS62198418A (en) 1987-09-02

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