JPH0677526A - Plastic molded type photoelectric transducer and its manufacture - Google Patents

Abstract

PURPOSE:To provide a plastic molded type photoelectric transducer which is excellent in environmental resistance and reliability for life, and capable of miniaturization of the whole part, cost reduction, and ensurance of sensitivity for low altitude light, and to realize the improve of yield at the time of manufacturing and the reduction of manufacturing cost, CONSTITUTION:On the surface side of a glass substrate (transparent substrate) 34 of a photoelectric transducer main body, a light shielding film 36 having a pin hole (incidence means) 35 is formed. On the rear side, a position detecting element 37 is formed which receives a spot light entering from the pin hole 35 and outputs an electric signal corresponding with the light receiving position and the light receiving amount. A package 33 formed by molding light shielding resin covers the both side parts of the glass substrate 34 and the position detecting element 37, and is constituted in the form wherein the peripheral part of the upper surface of the light shielding film 36 is covered so as to leave a circular window part 41 concentric with the pin hole 35. At the time of molding, an elastic member in closely pressed contact with the pin hole 35 part and its peripheral part is arranged in a mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed photoelectric conversion device suitable for applications where it is necessary to detect a light-receiving elevation angle, a light-receiving azimuth angle, and a light-receiving intensity, and a manufacturing method thereof.

[0002]

2. Description of the Related Art For example, in a solar radiation sensor used for an automobile air conditioner, a position detection element and an electrode, which are its main constituents, are vulnerable to moisture, and therefore have a sufficient sealing structure. It is necessary to secure the environment resistance by adopting. Therefore, conventionally, for example, the entire solar radiation sensor is covered by a transparent package formed by molding a transparent resin, or the solar radiation sensor is housed in a case with a window, and resin is filled between the solar radiation sensor and the case. Therefore, there has been considered a configuration in which the light receiving portion of the solar radiation sensor is fixed in a state of being exposed to the outside through the window of the case.

Further, conventionally, as seen in Japanese Patent Application Laid-Open No. 4-38871 or Japanese Patent Application Laid-Open No. 4-23469, a photoelectric conversion element is arranged on a base and the light receiving surface of the photoelectric conversion element is arranged. A configuration is conceivable in which a glass material is arranged and, in this arrangement state, the photoelectric conversion element, the base, and the periphery of the glass material are resin-molded with the upper surface of the glass material left.

Further, conventionally, as disclosed in Japanese Patent Application Laid-Open No. 4-2152, a photoelectric conversion element is adhered onto a base, and a coating section is previously formed on a sensing section of the photoelectric conversion element. A configuration may also be used in which the photoelectric conversion element and the base are surrounded by resin molding with a window (recess) having a shape corresponding to the coating section left, and then the coating section is removed by a solvent to expose the sensing section. It is considered.

[0005]

However, the structure in which the entire solar radiation sensor is molded by the transparent package has the following problems. In other words, with this product, there is a situation in which the filler for adjusting the coefficient of thermal expansion cannot be mixed with the mold resin in order to maintain the transparency of the transparent package. Is about 60 ppm / ° C. On the other hand, the thermal expansion coefficient of the glass substrate generally used for the solar radiation sensor is only about 9 ppm / ° C., so that the thermal stress caused by the difference causes cracks in the transparent package or internal wiring. It is inferior in cold and thermal shock resistance, such as a possibility of causing a disconnection, etc., resulting in low reliability for life. Further, since external light enters from the side surface of the transparent package, if the position detecting element is also sensitive to light from the side, there is a problem that the detecting operation by the solar radiation sensor cannot be performed normally.

Further, in the structure in which the solar radiation sensor is housed in the case with the window, the case with the window is required, which makes it difficult to downsize the whole, and the work of filling the resin between the solar radiation sensor and the case is complicated. And mass productivity deteriorates,
There is a problem that it is not possible to meet the needs of downsizing and cost reduction, and there is also a disadvantage that the sensitivity to low altitude light cannot be sufficiently secured because the case blocks the incident light from low altitude. .

Japanese Unexamined Patent Publication No. 4-38871 or Japanese Unexamined Patent Publication No.
The one described in JP-A-23469 also has a drawback that the sensitivity to low altitude light cannot be sufficiently secured because the mold resin located around the glass material blocks the incident light from low altitude. Further, in those described in these publications, at the time of molding, it is necessary to dispose a photoelectric conversion element and a glass material which are separate members in a molding die,
There is also a problem that the manufacturing process becomes complicated.

In the one disclosed in Japanese Patent Application Laid-Open No. 4-2152, since the sensing portion is directly exposed to the outside air and the environmental resistance is poor, the sensing portion and the conductive wire attached to the sensing portion due to moisture from the outside. However, there is a problem that there is a risk of corrosion, and the reliability of the life is reduced.

Further, in the one disclosed in Japanese Patent Laid-Open No. 4-2152, a convex portion for forming a window portion is provided in a molding die, and at the time of molding, the convex portion is photoelectrically converted through a coating portion. It is configured to be pressed against the sensing part of the element. However, in such a configuration, it is necessary to set the pressing force (mold clamping force) by the convex portion to a large value in order to cope with the situation where the resin enters between the convex portion and the coating portion. There is a possibility that the element may be damaged, which causes a problem that the yield at the time of manufacturing is deteriorated. In addition, this method requires an additional step of applying the coating portion on the sensing portion and a step of removing the coating portion after resin molding, which makes it difficult to reduce the manufacturing cost. It was

The present invention has been made in view of the above circumstances, and a first object of the present invention is to realize a structure excellent in environment resistance and long-term reliability while achieving overall downsizing and cost reduction. At the same time, an object of the present invention is to provide a resin-sealed photoelectric conversion device capable of accurately performing a light detection operation in a state where sufficient sensitivity to low-altitude light is ensured. A second object is to improve yield. Another object of the present invention is to provide a method of manufacturing a resin-sealed photoelectric conversion device that can reduce the manufacturing cost by simplifying the process.

[0011]

In order to achieve the above-mentioned object, a resin-sealed photoelectric conversion device according to the present invention is provided with an incident means for squeezing external light into a spot shape on the surface side of a transparent substrate and making it incident. A photoelectric conversion device body provided with a position detection element that receives the incident spot light on the back surface side of the transparent substrate and outputs an electric signal according to the light receiving position and the amount of received light, and at least a side surface portion of the transparent substrate, And a package made of a light blocking resin provided so as to mold the position detecting element.

In order to achieve the above-mentioned object, the method of manufacturing a resin-sealed photoelectric conversion device according to the present invention comprises an incidence means for squeezing external light into a spot on the surface side of the transparent substrate into the molding die. The main body of the photoelectric conversion device, which is provided with a position detection element that receives the incident spot light and outputs an electric signal according to the light receiving position and the amount of received light, is housed in the back side of the transparent substrate. By injecting a light-blocking resin into the molding die, at least the side surface portion of the transparent substrate and the position detecting element are molded to form a package, and the molding die is formed at the time of molding the package. At least an elastic body that is in close contact with the incident means portion of the photoelectric conversion device body is disposed therein.

[0013]

In the photoelectric conversion device main body of the resin-encapsulated photoelectric conversion device according to the present invention, the spot light incident from the outside through the incident means is received by the position detecting element provided on the back surface side of the transparent substrate. The position detecting element outputs an electric signal corresponding to the light receiving position and the light receiving amount of the spot light.

In this case, at least the side surface portion of the transparent substrate of the photoelectric conversion device body and the position detecting element are molded by a resin package, so that the photoelectric conversion device body is improved in environmental resistance and As a result, a longer life can be realized, and since the package has a light blocking property, external light does not enter the position detecting element from the side surface of the transparent substrate. There is no fear that the detection operation of the light receiving elevation angle, the light receiving azimuth angle, and the light receiving intensity becomes inaccurate. In this case, the package does not need to be transparent and can be mixed with a filler for adjusting the coefficient of thermal expansion, so that the coefficient of thermal expansion of the package and the transparent substrate can be matched. Become. As a result, it is possible to prevent the occurrence of cracks in the package or the accidents of disconnection of the internal wiring due to thermal stress, and it is possible to improve the thermal shock resistance, and as a result, the reliability for life is improved. Like

Further, the package made of a light blocking resin has a shape in which at least the side surface portion of the photoelectric conversion device body and the position detecting element are molded as described above, and the surface side of the transparent substrate is formed. It is possible to prevent the situation where the incidence of low-altitude light is obstructed because the surroundings of the above-mentioned incident means provided in the above can be prevented, and thus sufficient sensitivity to low-altitude light can be ensured. become. Further, since the simple structure in which the transparent substrate and the position detection element are simply molded by the resin package is sufficient, the overall size can be reduced and the manufacturing process can be simplified to reduce the cost.

In the case of manufacturing the resin-sealed photoelectric conversion device having the above-mentioned structure, a light-blocking resin is injected into a molding die in which the photoelectric conversion device main body is housed to mold the package. However, at the time of molding, since the elastic body arranged in the molding die comes into pressure contact with at least the incident means portion of the photoelectric conversion device body in a close contact manner, unnecessary resin is not formed on the incident means. There is no possibility that a so-called resin burr will be generated due to the invasion of the resin. Therefore, the post-processing for removing the resin burr is unnecessary, and since only the simple process of molding the package is required, the whole process can be simplified and the manufacturing cost can be reduced. Further, since the elastic body is pressed against the surface of the transparent substrate during the molding of the package, the risk that the transparent substrate is cracked is reduced, so that the yield can be improved.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment in which the present invention is applied to a solar radiation sensor used in an automobile air conditioner and a manufacturing method thereof will be described with reference to FIGS.

FIG. 1 shows the sectional structure of an omnidirectional solar radiation sensor 31 as a resin-sealed photoelectric conversion device which is the subject of the present invention, and FIG. 2 shows the appearance of the solar radiation sensor 31. There is. 1 and 2, the solar radiation sensor 3
1 has a configuration including a photoelectric conversion device main body 32 and a resin rectangular package 33 provided in a molded state of the photoelectric conversion device main body 32.

The photoelectric conversion device body 32 has a rectangular glass substrate 34 corresponding to the transparent substrate in the present invention.
A pinhole 35 (having a diameter of, for example, about 0.5 mm to 9 mm) as an incident means is provided in the central portion on the front surface side of the glass substrate 34.
In addition to providing the light-shielding film 36 having the above, a position detecting element 37 that receives the spot light incident from the pinhole 35 and outputs an electric signal according to the light receiving position and the light receiving amount is provided on the back surface side of the glass substrate 34. A total of four lead frames 38 are provided from the position detecting element 37 in a state of penetrating the side wall portion of the package 33.

The specific structure of the photoelectric conversion device main body 32 will be described in detail later, but in particular, the light shielding film 3 is used.
6 is formed by directly printing an epoxy resin mixed with carbon black on the surface of the glass substrate 34, or by depositing a metal thin film. Further, each lead frame 38 is provided with a conductive adhesive 40 (for example, an epoxy resin adhesive containing silver filler) for a total of four electrodes 39 (only two are shown in FIG. 1) provided on the position detection element 37. Are joined by.

The package 33 is formed so as to have a light blocking property by using a black epoxy resin mixed with about 0.3% by weight of carbon black, for example. In this case, by further adding a filler such as fused silica to the black epoxy resin,
The difference between the coefficient of thermal expansion of the package 33 and the coefficient of thermal expansion of the glass substrate 34 and the lead frame 38 is reduced. Specifically, regarding the coefficient of thermal expansion of the package 33, the coefficient of thermal expansion of the glass substrate 34 is about 9 ppm / ° C.,
When the lead frame 38 is made of copper, for example, its coefficient of thermal expansion is about 17 ppm / ° C., so 9 to 17 pp
It is desirable to adjust to the range of m / ° C., and in this embodiment, it is adjusted to 13 ppm / ° C.

The package 33 covers the side surface portion of the glass substrate 34 and the position detecting element 37 together with the joint portion of the electrode 39, and the peripheral portion of the upper surface of the light shielding film 36,
It is configured so as to cover the pinhole 35 while leaving a circular window portion 41 concentric with the pinhole 35. In this case, the peripheral edge portion of the window portion 41 of the package 33 is formed in a mortar shape that is gently inclined downward toward the window portion 41, so that light from a relatively low altitude also enters the pinhole 35. Is ready to go. Further, four columnar projections 42 (two shown in FIG. 1 and only three shown in FIG. 2) directed downward are integrally formed at the four corners of the lower surface of the package 33.

FIG. 3 schematically shows a mold structure for molding the package 33. In the following, the manufacturing method of the solar radiation sensor 31 will be described with reference to FIG. 3 as a gist of the present invention. Only the relevant parts will be described.

That is, the package 33 is provided between the upper die 44 and the lower die 45 which constitute the molding die 43 for transfer molding.
The cavity 46 is formed in accordance with the shape of the upper mold 44.
An elastic body 47 made of, for example, silicon rubber is arranged to form the No. 1 unit. Elastic body 4 arranged in this way
When the upper die 44 and the lower die 45 are clamped with the photoelectric conversion device body 32 housed in the molding die 43,
The pinhole 35 portion and its peripheral portion are in tight contact with each other.

When the package 33 is molded, the photoelectric conversion device main body 32 is housed in the molding die 43, and the black epoxy resin having the above-described composition is injected into the cavity 46 while being heated and softened. Then, after the resin is cured, the mold is opened and the integrated body of the photoelectric conversion device body 32 and the package 33 (that is, the solar radiation sensor 31) is taken out. At this time, in the mold clamped state of the upper mold 44 and the lower mold 45, the elastic body 47 moves the pinhole 35 on the glass substrate 34.
Since the portion and its peripheral portion are pressed into close contact with each other, there is no possibility that unnecessary resin will enter the surface of the pinhole 35 and a so-called resin burr will be generated. Since the elastic body 47 is pressed against the surface, the glass substrate 34 is less likely to be broken.

The solar radiation sensor 31 manufactured as described above.
Is fixed on a circular printed wiring board 48 as shown in FIG. 4, and is incorporated in a resin sensor body 49 having a shape as shown in FIGS.

In FIG. 4, the printed wiring board 48 is formed with four positioning holes 50 into which four cylindrical protrusions 42 protruding from the lower surface of the package 33 of the solar radiation sensor 31 are inserted and engaged. At the same time, four through holes 51 into which the four lead frames 38 of the solar radiation sensor 31 are inserted are formed. When fixing the solar radiation sensor 31 to the printed wiring board 48, the cylindrical protrusion 42 and the lead frame 38 are inserted into the positioning holes 50 and the through holes 51, respectively, and the lower surface of the package 33 is brought into contact with the printed wiring board 48. In this state, the lead frame 38 protruding from the lower surface of the printed wiring board 48 is fixed to the lower surface of the printed wiring board 48 by soldering.

As a result, the solar radiation sensor 31 is attached and fixed to the printed wiring board 48 while being positioned in the three-dimensional direction. In addition, the printed wiring board 48 is attached to the sensor body 4 at the edge of the printed wiring board 48.
A rectangular notch 52 is formed for preventing the rotation and positioning in the circumferential direction (direction of detection of the solar radiation direction by the solar radiation sensor 31) when it is housed in the housing 9.

In FIG. 5 to FIG. 7, the sensor body 49
Has a shape in which a cylindrical case 53 for accommodating the solar radiation sensor 31 and the printed wiring board 48 and an attachment base 54 concentrically connected to the lower portion of the cylindrical case 53 are integrally formed. ing. On the bottom surface of the cylindrical case 53, for example, three ribs 55 are integrally formed so as to be arranged at equal intervals along the peripheral wall portion of the cylindrical case 53, and printed inside the cylindrical case 53. Wiring board 4
When the printed wiring board 48 is stored, the printed wiring board 48 is placed on the ribs 55, and the axial positioning of the printed wiring board 48 is performed.

In this case, the printed wiring board 48 is positioned in the radial direction by bringing its outer peripheral portion into contact with the peripheral wall portion of the cylindrical case 53. Further, the printed wiring board 48 is positioned in the circumferential direction by the printed wiring board 4 concerned.
It is performed by fitting the notch 52 included in 8 into a ridge 56 formed on the peripheral wall of the cylindrical case 53 so as to extend in the vertical direction. It should be noted that the ends of four lead wires 57 (only two are shown) are connected to the printed wiring board 48 by soldering, and these lead wires 57 connect the mounting base portion 54 to each other. It penetrates and is led to the outside.

Further, a circular disk-shaped transparent cover 58 is attached to the cylindrical case 53 so as to close the upper opening. The transparent cover 58 is made of an acrylic resin or a polycarbonate resin having excellent transparency and weather resistance. As shown in FIGS. 8 and 9, the transparent cover 58 has a pair of engaging claws 59 on its lower edge. Is the transparent cover 58
The pair of substrate pressing claws 60 are also formed so as to project at respective positions facing each other with the center of the transparent cover 58 interposed therebetween, and also project at the positions facing each other with the center of the transparent cover 58 being orthogonal to the arrangement direction of the engaging claws 59. Has been formed.

In this case, the engaging claws 59 are a pair of engaging members formed on the peripheral wall of the cylindrical case 53 with the transparent cover 58 attached so as to close the opening of the cylindrical case 53. It engages with the dowel 61 (see FIGS. 6 and 7) and serves to fix the cylindrical case 53,
Further, the board pressing claw 60 has a tip portion in the printed wiring board 48 when the transparent cover 58 is attached.
The printed wiring board 48 is pressed against and is prevented from floating.

As described above, the solar radiation sensor 31 is fixed on the printed wiring board 48 while being positioned in the three-dimensional direction, and the printed wiring board 48 is fixed.
In the sensor body 49 in three-dimensional directions (circumferential direction, axial direction,
It is stored in a state in which it is positioned in the radial direction.

Now, in the following, the specific configuration and function of the photoelectric conversion device body 32 of the solar radiation sensor 31 will be described with reference to FIGS. 10 to 22. As shown in FIG. 10, the solar light incident on the photoelectric conversion device main body 32 is focused into a spot shape by the pinhole 35 and enters the glass substrate 34, and the incident spot light H is the position detection element. Light is received at point P (x, y) on 37. In this case, the position of the light receiving point P depends on the azimuth and altitude of the sunlight.

FIG. 11 shows the relationship between the pinhole 35 and the light receiving point P by three-dimensional coordinate axes of X, Y and Z in order to explain the principle of detecting the azimuth and altitude of the solar radiation. In FIG. 11, when the angle between the sunlight incident on the pinhole 35 and the surface of the glass substrate 34 (π / 2−incident angle), that is, the altitude of the sunlight is represented by θ, the glass is a high refractive index member. The spot light H incident on the substrate 34 and the glass substrate 34
The angle formed by the front surface and the back surface of is θ ′. That is, the spot light H reaches the point P (x, y) at an angle of θ ′.

Here, the Y-axis and P on the position detecting element 37
The angle formed by the (x, y) point, that is, the azimuth φ of the solar radiation is calculated by the following equation based on the P (x, y) point.

[Equation 1]

The output at the point P (x, y) detected by the position detecting element 37 as described later is (Vx, Vy).
And the point O on the position detecting element 37 directly below the pinhole 35
The output of (center coordinates) is (V0x, V0y), and the position detection element 3
If the potential gradient (V / mm) of 7 is (Δx, Δy), P
The X and Y coordinate components of the (x, y) point are represented by x = (Vx−V0x) / Δxy = (Vy−V0y) / Δy.

Further, the refractive index of air is 1, and the glass substrate 34
If the refractive index of is n, then the following relationship exists. sin β / sin β ′ = n where β = π / 2−θ and β ′ = π / 2−θ ′

When the thickness of the glass substrate 34 is t, the altitude θ of solar radiation can be calculated by the following equations (1) and (2).

[Equation 2]

However, in reality, the position of the center of the spot light H changes according to the size of the thickness of the light shielding film 36 provided with the pinhole 35. Therefore, instead of the above equation (2), The following expression (3) including the correction term α is used.

[Equation 3]

On the other hand, in the position detecting element 37, the photocurrent J generated at the point P (x, y) where the spot light is received is
It is proportional to the solar radiation intensity I, as will be apparent from the description below. In this case, since the actual altitude of the solar radiation is θ, its photocurrent J changes with respect to the solar radiation intensity I according to the following equation. J = I · sin θ Therefore, the solar radiation intensity I is calculated by the following equation. I = J / sin θ

However, in reality, due to the surface reflection on the transparent cover 58 and the glass substrate 34, the change curve according to the altitude θ of the solar radiation of the photocurrent J does not become a sine curve. (However, in the following equation, a, b, c, d, e, and f are constants).

[Equation 4] An example of the output characteristic of the position detecting element 37 calculated using the above equation (4) is shown in FIGS. 12, 13 and 14.

FIG. 15 is a perspective view showing a schematic structure of the photoelectric conversion device body 32, and FIG. 16 is a schematic view of the photoelectric conversion device body 3.
The two-layer structure is shown in a schematic sectional view.

In FIG. 15, the position detecting element 37 of the photoelectric conversion device main body 32 is provided on the back surface of the glass substrate 34.
An X-direction resistor film 62 made of a transparent resistor, for example, a photoelectric conversion film 63 using amorphous silicon (hereinafter abbreviated as a-Si), and a Y-direction resistor film 64 made of a metal electrode resistor are sequentially laminated, and The resistor films 62 are provided on both ends of the X-direction resistor film 62 and the Y-direction resistor film 64, respectively.
And 64a, strip-shaped electrode bodies 62a, 62a and 64a, 64a are formed, and the respective electrode bodies 62a, 6a are formed.
2a and 64a, a total of four lead electrodes X from 64a,
X ', Y, Y'are derived. Actually, these strip-shaped electrode bodies 62a, 62a and 64a, 64a correspond to the electrodes 39 shown in FIG. 1, and the lead electrodes X,
X ', Y, and Y'are the lead frames 3 similarly shown in FIG.
It is equivalent to eight.

In this case, the X-direction resistor film 62 and the Y-direction resistor film 64 arranged orthogonal to each other are not in direct contact with each other because the photoelectric conversion film 63 is interposed therebetween. In the steady state (the state where no light is incident), the resistor films 62 and 64 are kept substantially insulated by the photoelectric conversion film 63.

In the following, the material of each layer of the photoelectric conversion device body 32 and its detailed structure will be described with reference to FIG. That is, as the glass substrate 34, a soda glass plate having a thickness of, for example, about 1.8 mm coated with SiO2 is used. X-direction resistor film 62
Is made of SnO2 having a thickness of 60 nm and has a sheet resistance value of 200 Ω / □. In this case, since the X-direction resistor film 62 needs to have a light-transmitting property and an appropriate sheet resistance value, its material is not limited to SnO2, but may be ZnO, ITO, or the like. Other transparent electrode materials can also be used.

The sheet resistance of the X-direction resistor film 62 is 10 Ω / □ or more and 1 MΩ / □ or less, preferably 1 Ω / □ or less.
Set to more than 00Ω / □ and less than 50KΩ / □. The reason for this is that if the sheet resistance value of the X-direction resistor film 62 is too low, there is no difference from the resistance value of the output (input) electrode and the sheet does not function as a resistor. Is too high, the resistance value of the photoelectric conversion film 63 when light enters (about 1 KΩ to 500 KΩ for a-Si)
This is because the output becomes higher and the output cannot be obtained.

Then, on the X-direction resistor film 62 having the above-mentioned structure, an a-Si alloy film is laminated in an nip-i-n layer structure, whereby two photodiode components have opposite polarities. In this state, the photoelectric conversion film 63 having a structure of serial connection is formed. As a result, in a steady state in which no light is incident, a current flows between both side surfaces of the photoelectric conversion film 63, that is, even when voltages having different polarities are applied between the photodiode components connected in series as described above. Will disappear.

Specifically, the photoelectric conversion film 63 is, as schematically shown in FIG. 17, an n-type semiconductor 631 made of a-Si from the light incident direction side (X-direction resistor film 62 side). , I-type semiconductor 63 composed of intrinsic a-SiC (i1 -SiC)
2, p-type semiconductor 633 made of a-SiC, intrinsic a-S
i-type semiconductor 634 made of i (i2 -Si), a-Si
It has a five-layer structure in which n-type semiconductors 635 are laminated in this order, and this structure is equivalent to a state in which two photodiodes are connected to each anode. The photoelectric conversion film 63 can also be formed by laminating an a-Si alloy film in a p-i-n-i-p layer structure, but the two photodiodes formed in this case are connected at each cathode. The state becomes equivalent to the state of doing.

The photoelectric conversion film 63 is required to have an extremely low resistance value only in the portion irradiated with the spot light. Further, what is important in the photoelectric conversion film 63 is the relationship between the film thicknesses of the i-type semiconductor 632 (hereinafter abbreviated as i1 film 632) and the i-type semiconductor 634 (hereinafter abbreviated as i2 film 634). In addition, the photocurrents generated in the respective photodiode components are set to be balanced at substantially equal values.

Therefore, in this case, in order to balance the values of the photocurrent, i in the layer structure of the photoelectric conversion film 63 shown in FIG.
2 The thickness of the film 634 needs to be larger than the thickness of the i1 film 632 on the front side thereof, and the thickness ratio of the i1 film 632 and the i2 film 634 is 1: 2 to 1: 2. It is desirable to set it within the range of 10. Note that, in FIG. 18, the photoelectric conversion film 63 is formed of an a-Si alloy film as ni-pi-i-.
An example of film forming conditions in the case of stacking in an n-layer structure is shown.

On the other hand, the Y-direction resistor film 64 is made of, for example, Ti having a thickness of about 40 nm. The Y-direction resistor film 64 may be basically the same as the X-direction resistor film 62, but as can be seen from the structure of FIG.
There is no need to transmit light. Therefore, as the material of the Y-direction resistor film 64, if the sheet resistance value is 10 Ω / □ or more and 1 MΩ / □ or less, in addition to the same material as Ti or the X-direction resistor film 62, Cr , Metals such as Ni, TiN, Ag paste, Ni paste, C
u paste or the like can be used.

FIG. 19 shows a schematic circuit diagram of the position detecting element 37, and FIG. 20 shows the relationship between the temperature-output voltage characteristic of the position detecting element 37 and the temperature-output voltage characteristic of the conventional position detecting element. Shows. As shown in FIG. 19, the position detection element 37 has a pair of photodiode components that generate a photocurrent when the spot light H is incident in a state of being connected in reverse polarity. Therefore, in the position detecting element 37, since the leakage current in the reverse direction is prevented from flowing due to the rectification action of the diode, the output voltage does not change even when the temperature rises, and accurate position detection is performed. You will be able to do it.

As is apparent from FIG. 20, in the position detecting element 37, the positions A, B, where spot light is incident,
The output voltages corresponding to the point C are clearly different in a wide temperature range, and the output voltages are almost constant regardless of the temperature. On the other hand, in the conventional configuration using the photoconductive film in which the resistance value of the spot light-irradiated portion decreases, the leakage current flows to the non-light-irradiated portion due to the thermal excitation of electrons when the temperature rises, There is a drawback that the output voltage at each point greatly deviates from the value divided according to the position where the spot light is incident, as the temperature rises.

However, in the following, the position detecting element 3
The operating principle of No. 7 will be schematically described with reference to FIGS. 21 and 22. FIG. 21 is a schematic circuit diagram showing the operating principle of the position detecting element 37. As shown in FIG. 21, the transparent resistor (actually, the X-direction resistor film 62) has 0s on both ends.
When a voltage of V or 5V (not limited to 5V) is applied, a potential gradient of 0V to 5V is generated in the transparent resistor. In this state, when the spot light is incident on the photoelectric conversion film, the diode component pair in that portion becomes conductive.

Then, the specific potential of the transparent resistor corresponding to the position where the spot light is irradiated is guided to the electrode (actually Y-direction resistor film 64) side. As a result, the position detecting element 37 functions as an element that obtains a potential signal according to the incident position of the spot light.

In the actual position detecting element 37, the transparent resistor and the X-direction resistor film 62 that serves as an electrode portion and the Y portion that serves as an electrode portion are used.
Each sheet resistance value of the directional resistor film 64 is 10 Ω / □
The resistance film 62, 64 and the photoelectric conversion film 63 are set as shown in FIG.
It has a laminated structure similar to the above, and has three functions of detecting an X coordinate and a Y coordinate corresponding to the position where the spot light is incident, and a photocurrent proportional to the solar radiation intensity.

FIG. 22 shows the principles of the above three detection functions, which will be described below. “X coordinate detection” ... Voltages of 5 V and 0 V are applied to both electrodes (lead electrodes X, X ′) of the X-direction resistor film 62,
Both electrodes of the Y-direction resistor film 64 (lead electrodes Y, Y ')
A potential signal Vx corresponding to the position is obtained from one or both of the above. At this time, the current is the X-direction resistor film 62.
Side to the Y direction resistor film 64 side through the incident position of the spot light H of the photoelectric conversion film 63.

"Y-coordinate detection" ... Voltages of 5 V and 0 V are applied to both electrodes (lead electrodes Y, Y ') of the Y-direction resistor film 64 so that both electrodes of the X-direction resistor film 62 (lead electrode X). , X ′), or a potential signal Vy corresponding to the position is obtained from either or both. At this time, the current flows from the Y-direction resistor film 64 side to the X-direction resistor film 62 side through the incident position of the spot light H of the photoelectric conversion film 63.

[Detection of photocurrent (solar radiation intensity)] ... A voltage of 5 V is applied to both electrodes (lead electrodes Y, Y ') of the Y-direction resistor film 64, and the Y-direction resistor film 64 is applied. The potential distribution is made uniform, and the output current flowing from the Y-direction resistor film 64 side to the X-direction resistor film 62 side is detected at the position where the spot light H is incident. Since the entire output current on the Y-direction resistor film 64 has the same potential, this output current has a substantially same level regardless of the incident position of the spot light H, and becomes a signal that changes according to the magnitude of the solar radiation intensity. In this case, the photoelectric conversion film 63 is configured such that the two photodiode components have mutually opposite polarities and have the same electrical characteristics, so that any one of the X-direction resistor film 62 and the Y-direction resistor film 64 is formed. Even if a resistor film is used, the solar radiation intensity can be sensed. Therefore, a voltage of 5 V is applied to both electrodes (lead electrodes X, X ') of the X-direction resistor film 62, and the Y-direction resistor film is applied. It is also possible to obtain the output current from the 64 side.

According to the present embodiment described above, various effects as described below can be obtained. That is, since the side surface portion of the glass substrate 34 of the photoelectric conversion device body 32 and the position detection element 37 are molded by the resin package 33, the photoelectric conversion device body 32 is formed.
It is possible to improve the environmental resistance of the product and prolong the life of the product.

The photoelectric conversion device 34 needs to block the light incident from the side surface of the glass substrate 34 because it is an essential prerequisite that a transparent substrate such as the glass substrate 34 is used. In the embodiment, the package 33
Is configured with a black epoxy resin so as to have a light blocking property, it is possible to reliably prevent a situation in which unnecessary external light enters the position detection element 37 from the side surface of the glass substrate 34, and as a result, It is possible to prevent the situation where the position detecting element 37 detects the solar elevation angle, the solar azimuth angle, and the solar radiation intensity from becoming inaccurate.

In addition, since it is not necessary to make the package 33 transparent, it is possible to mix a filler for adjusting the coefficient of thermal expansion with the package 33. In this embodiment, the mold of the package 33 is molded. A filler such as fused silica is mixed during molding so that the difference in the coefficient of thermal expansion between the package 33 and the glass substrate 34 and the lead frame 38 is minimized. This allows
It is possible to prevent the occurrence of cracks in the package 33 or the disconnection of the internal wiring due to thermal stress, improve the thermal shock resistance, and consequently improve the reliability of life. Become.

The package 33 made of a light-blocking resin is a glass substrate 34 included in the photoelectric conversion device body 32.
The side portion and the position detecting element 37 are molded, and the window portion 41 concentric with the pinhole 35 is present around the pinhole 35 provided on the surface side of the glass substrate 34, that is, the pin. Since the structure around the hole 35 is wide open, it is possible to prevent the incidence of the low-altitude light from being impeded, and thus it is possible to sufficiently secure the sensitivity to the low-altitude light. Particularly, in this case, since the peripheral edge of the window portion 41 in the package 33 is formed in a mortar shape that is gently inclined downward toward the window portion 41, the sensitivity to low altitude light can be more reliably ensured. Has the advantage that

By the way, in Table 1 below, the results of examining the characteristics (moisture resistance, thermal shock resistance and response to low altitude light) of the solar radiation sensor 31 according to the present embodiment are shown in Conventional Example 1 (entire solar radiation sensor as a whole). (A structure covered with a transparent package formed by molding a transparent resin), Conventional Example 2 (a structure in which a solar radiation sensor is housed in a case with a window and filled with resin)
It is shown in a state of being compared with each characteristic of.

[0066]

[Table 1]

On the other hand, in the present embodiment, in order to obtain the above-mentioned effects, the glass substrate 34 and the position detecting element 37 are resin-molded so that the package 33 is simply formed. The cost can be reduced by downsizing the whole and simplifying the manufacturing process.

In particular, during such resin molding, the molding die 43 with the photoelectric conversion device body 32 housed therein is used.
The package 33 is molded by injecting a light-shielding resin into the package 33. At the time of molding, the elastic body 47 arranged in the molding die 43 forms the pin hole 35 portion on the glass substrate 34 and the portion thereof. Since it comes into pressure contact with the surrounding portion in an intimate contact state, there is no possibility that unnecessary resin will enter the surface of the pinhole 35 and so-called resin burr will occur. Therefore, the post-processing for removing the resin burr is not necessary, and the simple process of molding the package 33 is sufficient, which simplifies the whole process and reduces the manufacturing cost. I will get it. Further, since the elastic body 47 is pressed against the surface of the glass substrate 34 during the molding of the package 33, the risk that the glass substrate 34 is cracked is reduced, and thus the yield can be improved.

Although the transparent cover 58 is attached and fixed to the cylindrical case 53 of the sensor body 49 in the above embodiment, the present invention is not limited to this.
A plurality of arms are integrally formed on the lower surface of the transparent cover 58, and the arms are engaged with the engaging holes formed on the package 33 side of the solar radiation sensor 31 to attach the transparent cover 58. It can be configured.

Further, for example, the plurality of arms integrally formed on the lower surface of the transparent cover 58 through the through holes formed in the package 33 of the solar radiation sensor 31 are engaged with each other formed on the printed wiring board 48. The transparent cover 58 can be attached by engaging with the hole.

In the above embodiment, the package 33 covers the peripheral portion of the upper surface of the light shielding film 36.
However, the present invention is not limited to this, and as shown in FIG. 23 showing the second embodiment of the present invention, a package 33 ′ having a structure for covering at least the side surface portion of the glass substrate 34 and the position detection element 37 together with the bonding portion of the electrode 39 is provided. It is good to have a configuration.

[0072]

As is apparent from the above description, according to the resin-sealed photoelectric conversion device described in claim 1, the external light is incident on the front surface side and the back surface side of the transparent substrate in the form of spots. The photoelectric conversion device main body is provided with the incident means for causing the incident spot light and the position detection element for outputting an electric signal according to the light receiving position and the amount of received light of the incident spot light, and at least the transparent portion of the photoelectric conversion device main body Since a package having a light blocking property for molding the side surface portion of the substrate and the position detection element is provided,
It is possible to realize a structure with excellent environment resistance and long-term reliability while achieving overall downsizing and cost reduction.Also, the detection operation of light is normal with sufficient sensitivity to low altitude light. It is possible to obtain an excellent effect that it can be carried out.

According to the apparatus for manufacturing a resin-sealed photoelectric conversion device described in claim 2, the photoelectric conversion device main body having the above-mentioned configuration is housed in the molding die, and then the molding die is housed in the molding die. By injecting a light-blocking resin, at least the side surface of the transparent substrate and the step of molding a package in which the position detection element is molded are performed, and in the molding step, at least the photoelectric conversion device main body Since the elastic body is arranged in close contact with the incidence means in a pressure-contact manner, the transparent substrate of the photoelectric conversion device body can be prevented from cracking and the yield can be improved.
Moreover, during such molding, it becomes possible to prevent the occurrence of resin burrs on the surface of the incident means, and the post-processing for removing the resin burrs becomes unnecessary.
The manufacturing cost can be reduced by simplifying the process.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a solar radiation sensor (resin-sealed photoelectric conversion device) showing a first embodiment of the present invention.

FIG. 2 is a perspective view of a solar radiation sensor.

FIG. 3 is a vertical cross-sectional view showing a resin molding process of a solar radiation sensor together with a molding die.

FIG. 4 is a perspective view showing a state before the solar radiation sensor is attached to the printed wiring board.

FIG. 5 is a vertical cross-sectional view showing a solar radiation sensor assembled to a sensor body.

FIG. 6 is a perspective view showing a state before the solar radiation sensor and the transparent cover are attached to the sensor body.

FIG. 7 is a plan view showing the solar radiation sensor assembled to the sensor body.

FIG. 8 is a bottom view of the transparent cover.

FIG. 9 is a side view of the transparent cover.

FIG. 10 is a perspective view showing a schematic external appearance of a photoelectric conversion device body included in a solar radiation sensor.

FIG. 11 is a three-dimensional coordinate diagram for explaining the principle of calculation of the azimuth and altitude of solar radiation by the solar sensor.

FIG. 12 is a diagram showing an altitude detection characteristic of incident light by a position detection element.

FIG. 13 is a diagram showing azimuth detection characteristics of incident light by a position detection element.

FIG. 14 is a diagram showing an intensity detection characteristic of incident light by a position detection element.

FIG. 15 is a perspective view from below showing a schematic configuration of a photoelectric conversion device body.

FIG. 16 is a sectional view schematically showing a layer structure of a photoelectric conversion device body.

FIG. 17 is a schematic diagram for explaining the function of a photoelectric conversion film included in a position detection element.

FIG. 18 is a diagram showing an example of film forming conditions of a photoelectric conversion film.

FIG. 19 is a schematic circuit diagram of a position detection element.

FIG. 20 is a characteristic diagram showing a relationship between temperature and output voltage in the position detection element.

FIG. 21 is a schematic circuit diagram showing the operation principle of the position detection element.

FIG. 22 is a substantive diagram showing the principle of a spot light incident position and a solar radiation intensity detection function by a position detection element.

FIG. 23 is a view corresponding to FIG. 1, showing a second embodiment of the present invention.

[Explanation of symbols]

In the figure, 31 is a solar radiation sensor (resin-sealed photoelectric conversion device),
32 is a photoelectric conversion device main body, 33 is a package, 34 is a glass substrate (transparent substrate), 35 is a pinhole (incident means), 36 is a light-shielding film, 37 is a position detection element, 38 is a lead frame, 39 is an electrode, 40 Is a conductive adhesive, 41 is a window, 43 is a mold, 47 is an elastic body, 48 is a printed wiring board, 49 is a sensor body, 53 is a cylindrical case, 5
8 is a transparent cover, 62 is an X-direction resistor film, 63 is a photoelectric conversion film, and 64 is a Y-direction resistor film.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yutaka Maeda, 1-1, Showa-cho, Kariya city, Aichi Prefecture, Nihon Denso Co., Ltd. (72) Inventor, Tomoji Terada, 1-1, Showa-cho, Kariya city, Aichi prefecture Within the corporation

Claims (2)

[Claims] 1. An incident means for squeezing and entering external light into a spot shape is provided on the front surface side of the transparent substrate, and the incident spot light is received on the back surface side of the transparent substrate, depending on the light receiving position and the light receiving amount. A photoelectric conversion device body provided with a position detection element for outputting an electric signal, and a package made of a light blocking resin provided so as to mold at least the side surface portion of the transparent substrate and the position detection element. A resin-sealed photoelectric conversion device, characterized in that 2. A molding die is provided with an incident means for squeezing external light into a spot shape on the front surface side of the transparent substrate, and the incident spot light is received on the rear surface side of the transparent substrate and its light receiving position and At least the side surface of the transparent substrate is accommodated by accommodating the photoelectric conversion device main body provided with a position detection element that outputs an electric signal according to the amount of received light, and injecting a light-blocking resin into the molding die in this accommodated state. And a position detection element are molded to form a package, and an elastic body that is in close contact with at least the incident means portion of the photoelectric conversion device body is disposed in the mold during molding of the package. A method of manufacturing a resin-encapsulated photoelectric conversion device, comprising: