JPH0674921A - Cut surface inspecting system - Google Patents

Abstract

PURPOSE:To dispense with labour to repeat adjustment of beam width with every sample, and improve processing efficiency by arranging exclusive inspecting devices respectively for setting a direction of a sample and for detecting an angle of a cut surface. CONSTITUTION:Exclusive inspecting devices 11 and 12 by means of an X-ray are arranged respectively for setting a direction of a cut surface 17a of a sample 17 and for detecting an angle between the cut surface 17a and a crystal lattice surface. Thereby, labour such as to set and change beam width of an incident X-ray with every sample 17 being inspected can be dispensed with. When the sample 17 whose processing is finished in the first cut surface inspecting device 11 by a carrying means 27 of a sample carrying device 14 is sent to the second cut surface inspecting device 12, a new sample 17 is sent simultaneously to the first cut surface inspecting device 11 from a sample supply device 10 by a carrying means 26. In this way, detecting processing of the angle between the cut surface 17a and the crystal lattice surface and setting processing of the direction of the sample 17 can be carried forward in parallel with each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cut surface inspection for examining an angle between a cut surface and a crystal lattice surface of a crystalline sample conveyed to a fixed position by a sample supply device. The present invention relates to a cut surface inspection system to be executed.

[0002]

2. Description of the Related Art For example, a crystal oscillator (quartz wafer) used for a reference oscillator or the like is obtained by cutting a crystal ingot and cutting it into a thin plate shape. It is necessary that the plane (cut plane) and the crystal lattice plane have a predetermined angular relationship according to the application.

Therefore, in general, for a crystal oscillator cut out, a cut surface inspection apparatus is used to check whether or not the angle between the cut surface and the crystal lattice surface is a predetermined angle. carry out. In this cut surface inspection, as shown in FIG. 2, X-rays having a constant wavelength are made incident on the surface (cut surface) 2a of the crystal unit 2 installed on the sample holder 1 of the cut surface inspection apparatus, and diffraction is performed by the X-rays. When the X-ray 3 is obtained, the angle (incident angle) θ formed by the incident X-ray 4 and the cut surface 2a at that time is calculated to obtain the angle α between the cut surface 2a of the sample 2 and the crystal lattice surface 2b. Is to seek. In FIG. 2, reference numeral 6 is a hole formed in the sample holder 1 in order to guide the incident X-ray 4 to the crystal oscillator 2 which is a sample, and reference numeral 7 is a diffraction X-ray 4 for the X-ray detector 8. Is a hole formed in the sample holder 1 in order to reach the position 2 and the reference numeral 9 is a member for positioning the sample 2 at a fixed position.

By the way, when the above-mentioned cut surface inspection is performed, it is checked in advance whether or not the sample 2 is installed on the sample holder 1 in the correct direction. I have to. here,
The correct orientation is, as shown in FIG. 3, a case where the crystal lattice planes 2b of the sample 2 are aligned along the incident direction a of the incident X-ray. Whether or not the sample 2 is installed in the correct orientation depends on whether the sample 2 placed on the sample holder 1
The cut surface 2a is irradiated with X-rays, and it is determined whether or not the diffracted X-rays are output in a predetermined direction (in FIG. 3, the extension direction of the arrow A). Diffract X in a predetermined direction
If the line is visible, it is the correct orientation. When it is determined that the orientation is not correct, the orientation of the sample 2 on the sample holder 1 is changed and the same process (detection of diffracted X-rays) is repeated.

By the way, in order to detect the angle α formed between the crystal lattice plane 2b and the cut surface 2a in the sample 2 and to judge whether the sample 2 is correctly oriented on the holding table 1. There is a difference between the former method and the latter method that the narrow beam width X-rays are used to improve the detection accuracy and the latter method uses the wider beam width X-rays to improve the processing efficiency. Apart from that, the device environment is common.

Therefore, conventionally, the cut surface inspection apparatus is equipped with a mechanism for adjusting the beam width of the incident X-ray 4.
First, the setting process of the orientation of the sample 2 is performed with the beam width widened, and then the angle α of the sample 2 is detected by narrowing the beam width.

[0007]

However, when the orientation of the sample 2 and the detection of the angle α in the sample 2 are performed on the same device, the X-ray beam width of each sample is expanded. Since the operation and the reduction operation have to be repeated, there is a problem that the processing efficiency is significantly reduced due to the adjustment of the X-ray beam width.

Further, since the troublesome adjustment of the beam width is frequently repeated, there is a possibility that the beam width may be erroneously manipulated to proceed with the inspection.

The present invention has been made in view of the above circumstances, and can eliminate the inconvenience of repeating the adjustment of the beam width for each crystalline sample to be inspected and greatly improve the processing efficiency. The purpose is to provide a cut surface inspection system.

[0010]

According to a first aspect of the present invention, there is provided a cut surface inspection system for a crystalline sample conveyed to a fixed position by a sample supply device, wherein a cut surface and a crystal lattice surface of the sample are provided. Is to carry out a cut surface inspection for checking the angle formed by, and has a direction inspection base on which the sample is mounted, and the cut surface of the sample mounted on the direction inspection base is relatively wide. While irradiating an X-ray beam, a first cut surface inspection device that determines whether the orientation of the sample on the direction inspection base is correct by monitoring the diffracted X-rays from the sample, and mounting the sample. And an X-ray beam having a relatively narrow width is applied to the cut surface of the sample placed on the angle inspection base while detecting a diffracted X-ray from the sample and diffracting it. Obtain the angle of incidence of X-rays on the cut surface during X-ray detection A second cut surface inspection device for obtaining an angle between the cut surface of the sample and a crystal lattice surface, and a sample storage device for storing the sample that has been inspected by the second cut surface inspection device. A first transport means for carrying the sample from a fixed position where the sample is carried by the sample supply device onto the directional inspection base of the first cut surface inspection device; and the second cut from the directional inspection base. Second transportation means for transporting the sample onto the angle inspection base of the surface inspection device;
A sample transfer device having a third transfer means for transferring a sample from the angle inspection base to the sample storage device, and a transfer operation of the first to third transfer means in the sample transfer device. By synchronizing, the loading and unloading timings of the sample to and from the first cut surface inspection apparatus and the second cut surface inspection apparatus are aligned.

According to a second aspect of the present invention, there is provided a cut surface inspection system in which a configuration is further added to that of the first aspect. When the angle to be formed is calculated, the calculated value is compared with a reference value, and a quality judgment function for grading the inspected sample is provided on the system, and the sample storage device is a judgment result of the quality judgment function. Based on the above, the feature is that the incoming samples are sorted and stored.

A cut surface inspection system according to a third aspect of the present invention is the system according to the first or second aspect of the present invention in which a configuration is further added, and an incident X for irradiating a sample with the first cut surface inspection apparatus. The X-ray and the incident X-ray that irradiates the sample with the second cut surface inspection apparatus are obtained from a common X-ray tube.

[0013]

In other words, the cut surface inspection system according to the present invention is dedicated to setting the orientation of the cut surface of the sample and detecting the angle between the cut surface of the sample and the crystal lattice plane. Since the inspection apparatus using the X-ray is installed, the trouble of changing the setting of the beam width of the incident X-ray for each one of the samples to be inspected becomes unnecessary. In addition, when the sample that has been processed by the first cut surface inspection device by the transfer means of the sample transfer device is sent to the second cut surface inspection device, at the same time, a new sample is sent from the sample supply device by the transfer means. It can be sent to one cut surface inspection device, and each detection processing made by the cut surface and the crystal lattice surface and the setting processing of the orientation of the sample can proceed in parallel.

Therefore, compared with the conventional device, the processing efficiency can be greatly improved. Further, as described in claim 2, the sample is graded at the time of inspecting the cut surface, and the sample accommodating apparatus is automatically classified based on the grade. Management
It can save a lot of labor. Further, as described in claim 3, in a configuration in which one X-ray tube is shared by two cut surface inspection apparatuses, it is possible to promote the reduction of the apparatus cost due to the reduction of the number of parts.

[0015]

1 and 4 show the configuration of a cut surface inspection system according to an embodiment of the present invention. This cut surface inspection system performs a cut surface inspection on a crystalline sample such as a crystal oscillator (crystal wafer). Hereinafter, a system according to an embodiment will be described in detail with reference to FIGS. 1 and 4.

The system of this one embodiment is roughly
A sample supply device 10, a first cut surface inspection device 11,
A second cut surface inspection device 12, a sample storage device 13,
It comprises a sample transport device 14 and a control device 15. The sample supply device 10 is a device that conveys the crystalline sample 17 to a fixed position.

Further, the first cut surface inspection device 11
Has a direction inspection base 11a, which is a sample holder on which the sample 17 is placed, and a relatively wide X on the cut surface 17a of the sample 17 placed on the direction inspection base 11a. While irradiating the line beam 18a, the diffraction X from the sample 17
Monitor line 18b. Then, when the diffracted X-ray 18b can be detected by the X-ray detector 19, it is determined that the orientation of the sample 17 on the base 11a is correct, and the determination result is output to the control device 15. . If the X-ray detector 19 cannot detect the diffracted X-rays 18b, it judges that the orientation of the sample 17 is not correct and outputs the judgment result to the controller 15.

The second cut surface inspection device 12 is an angle inspection base 1 which is a sample holder on which the sample 17 is placed.
Sample 1 having 2a and placed on the angle inspection base 17
7 has a relatively narrow X-ray beam 21 on the cut surface 17a.
While irradiating a, the diffraction X-ray 21b from the sample 17 is X-rayed.
By detecting the incident angle (angle θ in FIG. 2) of the X-rays on the cut surface 17a at the time of detecting the diffracted X-rays 21b by the line detector 22, the cut surface of the sample 17 and the crystal lattice plane are separated. The angle formed (angle α in FIG. 2) is determined.

The system of this embodiment is equipped with a quality judgment function for grading an inspected sample by comparing the angle α obtained by the inspection device 12 with a preset reference value. Then, the calculated grade is notified to the sample storage device 13 via the control device 15. The quality determination function may be provided in an arithmetic processing unit (not shown) provided in the inspection device 12 or the control device 15. Further, in this embodiment, the incident X-ray 18a in the first cut surface inspection apparatus 11 and the incident X-ray 21a in the second cut surface inspection apparatus 12 described above are transmitted from one common X-ray tube 24. It has gained.

The sample storage device 13 is for storing the sample 17 that has been inspected by the second cut surface inspection device 12, and has a plurality of partitioned storage chambers 13a. The sample 17 carried into the sample inlet (chute) 13b is classified and stored based on the determination result of the quality determination function. Each of the inlet 13b, the second cut surface inspection device 12, the first cut surface inspection device 11, and the fixed position T on the sample supply device 10 are aligned on a straight line.

The sample carrying device 14 carries the sample 17 from the fixed position T, where the sample 17 is carried by the sample supplying device 110, onto the direction inspection base 11a of the first cut surface inspection device 11. Means 26 and second transport means 27 for carrying the sample 17 from the direction inspection base 11a onto the angle inspection base 12a of the second cut surface inspection device 12.
From the angle inspection base 12a to the sample storage device 13
Third transport means 2 for transporting the sample 17 to the sample input port 13b of
8 and.

The sample 1 is attached to each of the transporting means 26, 27 and 28.
A holding unit H capable of gripping 7 by suction and an elevating mechanism S for moving the holding unit H up and down to the mounting position of the sample 17 as indicated by arrow B are provided. Further, the carrying means 27 has a built-in mechanism for rotating the holding portion H in the direction shown by the arrow C. This rotating mechanism
Used to change the orientation of. The transport means 2
6, 28 is not equipped with a rotation mechanism for the holding portion H,
It may be equipped in the same manner as the transporting means 26. Further, the respective transporting means 26, 27, 28 have fixed positions T of the inlet 13b, the second cut surface inspection device 12, the first cut surface inspection device 11 and the sample supply device 10.
A guide running straight above the above-mentioned device allows the sample to move back and forth linearly in the sample transport direction (the direction of arrow D in the figure). Further, the respective transporting means 26, 27, 28 advance and retreat together in synchronization with each other so that the time of loading and unloading of the sample to and from the first cut surface inspection apparatus and the second cut surface inspection apparatus coincide with each other. It is designed to be moved.

In other words, the cut surface inspection system of the above-described embodiment is used for setting the orientation of the cut surface 17a of the sample 17 and for detecting the angle formed by the cut surface of the sample 17 and the crystal lattice plane. , Each dedicated X-ray inspection device 1
Since 1 and 12 are installed, it is not necessary to change the beam width of the incident X-ray for each sample to be inspected. Moreover, the sample 1 that has been processed by the first cut surface inspection apparatus 11 by the transfer means 27 of the sample transfer apparatus 14
When 7 is sent to the second cut surface inspection device 12, at the same time, a new sample 17 can be sent from the sample supply device 10 to the first cut surface inspection device 11 by the transport means 26, and the cut surface and the crystal lattice Each detection process performed by the surface and the setting process of the orientation of the sample 17 can proceed in parallel.

Therefore, compared with the conventional device, the processing efficiency can be greatly improved. Further, in the case of this embodiment, the sample 17 can be graded at the time of inspecting the cut surface, and can be automatically classified into the sample storage device 13 based on the grade. The management of can also be greatly labor-saving. Also, one X
Since the wire tube 24 is configured to be shared by the two cut surface inspection devices 11 and 12, it is possible to promote a reduction in the cost of the device by reducing the number of parts.

[0025]

The cut surface inspection system according to the present invention is
In other words, a dedicated X-ray inspection device is installed for setting the orientation of the cut surface of the sample and for detecting the angle between the cut surface of the sample and the crystal lattice plane. No need to change the setting of the beam width of the incident X-ray for each of the above. In addition, when the sample that has been processed by the first cut surface inspection device by the transfer means of the sample transfer device is sent to the second cut surface inspection device, at the same time, a new sample is sent from the sample supply device by the transfer means. It can be sent to one cut surface inspection device, and each detection processing made by the cut surface and the crystal lattice surface and the setting processing of the orientation of the sample can proceed in parallel.

Therefore, compared with the conventional device, the processing efficiency can be greatly improved. Further, as described in claim 2, the sample is graded at the time of inspecting the cut surface, and the sample accommodating apparatus is automatically classified based on the grade. Management
It can save a lot of labor. Further, as described in claim 3, in a configuration in which one X-ray tube is shared by two cut surface inspection apparatuses, it is possible to promote the reduction of the apparatus cost due to the reduction of the number of parts.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a cut surface inspection.

FIG. 3 is an explanatory diagram of the orientation of a sample at the time of inspecting a cut surface.

FIG. 4 is a plan view of an embodiment of the present invention.

[Explanation of symbols]

 10 sample supply device 11 first cut surface inspection device 12 second cut surface inspection device 13 sample storage device 14 sample transfer device 26 transfer means 27 transfer means 28 transfer means

Claims (3)

[Claims] 1. A cut surface inspection system for performing a cut surface inspection on a crystalline sample conveyed to a fixed position by a sample supply device to check an angle formed between the cut surface and the crystal lattice surface of the sample. And has a direction inspection base on which the sample is placed, and a relatively wide X on the cut surface of the sample placed on the direction inspection base.
A first cut surface inspection apparatus that determines whether the orientation of the sample on the directional inspection base is correct by monitoring the diffracted X-rays from the sample while irradiating a line beam, and mounting the sample X having a relatively narrow width on the cut surface of the sample placed on the angle inspection base, which has an angle inspection base.
Forming the cut surface of the sample and the crystal lattice plane by detecting the diffracted X-ray from the sample while irradiating the beam and obtaining the incident angle of the X-ray to the cut surface at the time of detecting the diffracted X-ray. A second cut surface inspection device for obtaining an angle, a sample storage device for storing a sample that has been inspected by the second cut surface inspection device, and a fixed position from which a sample is carried by the sample supply device. A first transport means for carrying the sample onto the direction inspection base of the first cut surface inspection device and a second carrying means for carrying the sample from the direction inspection base onto the angle inspection base of the second cut surface inspection device. And a sample transfer device including a third transfer device for transferring a sample from the angle inspection base to the sample storage device, and the first to third transfer devices in the sample transfer device. Synchronize the transport operation of the means By Rukoto, the first cut surface inspection device and the cut surface inspection system characterized by having uniform loading and unloading time of the sample into the second cut surface inspection apparatus. 2. When the second cut surface inspection apparatus obtains the angle formed by the cut surface of the sample and the crystal lattice plane, the obtained value is compared with a reference value to classify the inspected sample. The cut surface inspection according to claim 1, wherein the sample storage device classifies and stores the sample to be carried in based on the determination result of the quality determination function. system. 3. The X-ray incident on the sample by the first cut surface inspection apparatus and the X-ray incident on the sample by the second cut surface inspection apparatus are obtained from a common X-ray tube. The cut surface inspection system according to claim 1 or 2.