JPH0673955A - Sealing method of tie-in joint section between glass plate and frame body - Google Patents

Abstract

PURPOSE:To move a glass plate and a frame body after a short time by coating a tie-in joint section between a glass frame and the frame body with a sealing medium composed of a specific one-pack normal-temperature moisture curing type composition. CONSTITUTION:A tie-in joint section between a frame body such as an aluminum sash and a glass plate is coated with one-pack normal-temperature moisture curing type composition under the state, in which the composition is heated at approximately 120-140 deg.C and liquefied, and a surface is levelled by a spatula immediately after the coating. The one-pack normal-temperature curing type composition contains a pulverulent organic high-molecular compound such as polyvinyl chloride, a dissolving swelling agent as a plasticizer dissolving and swelling the compound at the time of heating, a room-temperature moisture curing organic silicone compound and fillers. An ethylene vinyl acetate copolymer resin, etc., having vinyl acetate content less than 40wt.% is compounded as required. The frame body and the glass plate are fixed mutually after a fixed short time, and can be moved immediately after the fixing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various kinds of glass plates such as plate glass, tempered glass and meshed glass, and various sashes such as aluminum sashes, metal sashes, wood sashes, steel sashes and plastic sashes, and window frames. The present invention relates to an improvement in a sealing method for joints with a frame body.

[0002]

2. Description of the Related Art Conventionally, for example, in order to seal a joint portion between a glass plate of a bay window and a sash, it is usual to carry out a sealing treatment in a factory, and after the sealing material is fixed, transported to a site and used. .

In this case, a silicon-based sealing material is mainly used as the sealing material. Since this silicone-based sealing material requires 12 hours or more to be fixed, it cannot be moved until it is fixed, and it is necessary to leave the sealing material applied for a long time. there were. In such a state, it was impossible to perform line production in a factory, and it was very inefficient in terms of productivity.

[0004]

DISCLOSURE OF THE INVENTION The present invention has been invented in view of the above-mentioned problems of the prior art, and uses a sealing material made of a specific one-part room temperature moisture-curable composition, and uses a glass plate and a frame. When the sealing material is applied to the joints with the body, the sealing material is fixed in an extremely short time, for example, about 5 minutes. Therefore, after fixing the sealing material, that is, 5 minutes after application, move the glass plate and the frame body. Even if there is no deviation of the glass plate, it is possible to perform a moving operation, and it is an object to provide a sealing method of a joint portion between the glass plate and the frame body, which enables line production in a factory. To do.

[0005]

In order to solve the above-mentioned problems, in the method for sealing the joints between the glass plate and the frame of the present invention, the one-part normal temperature is applied to the joints between the glass plate and the frame. The moisture-curable composition is applied in a liquefied state by heating.

The above-mentioned one-part room temperature moisture-curable composition comprises a powdery organic polymer compound, a liquid dissolution swelling agent capable of dissolving and swelling the organic polymer compound when heated, and a room temperature moisture-curable organic silicon compound. And a filler.

The temperature for heating the one-part room temperature moisture-curable composition is not particularly limited as long as it maintains the liquid state of the one-part room temperature moisture-curable composition, but about 120 to 140 ° C. is preferably applied. To be done. In the specification of the application, a liquid state means a state having fluidity that can be applied using a gun or the like.

As the one-part room temperature moisture-curable composition used in the present invention, the composition described in JP-A-2-279766 can be used, which will be described below.

Any organic polymer compound can be used as long as it dissolves in a dissolution and swelling agent when heated and acts to put the entire composition into a putty form (broadly refers to clay-like ones). Used. It is necessary to be in powder form so that it can be easily dissolved with the organic polymer compound.

[0010] Polyvinyl chloride resin is preferably used as the polymer compound. The polyvinyl chloride resin in the present invention may be one for ordinary plastisols, and one produced by emulsion polymerization, suspension polymerization, solution polymerization or the like of vinyl chloride alone or with this and another copolymerizable monomer is adopted. May be done.

Examples of the above-mentioned copolymerizable monomers include vinyl bromide, vinylidene chloride, acrylic acid esters, methacrylic acid esters, vinyl carboxylates such as vinyl acetate and vinyl propionate, maleic anhydride, maleic acid and the like. be able to.

In the present invention, in addition to the above-mentioned polyvinyl chloride resin, methyl methacrylate resin can be preferably mentioned.

The dissolution swelling agent is a liquid compound which dissolves and swells the above-mentioned powdery polymer compound when heated,
Generally, what is called a plasticizer can be used.

For example, di (2-ethylhexyl) phthalate, butylbenzyl phthalate, dinonyl phthalate, diheptyl phthalate, phthalic acid esters such as butylphthalyl butyl glycol, dioctyl adipate, didecyl adipate, dioctyl sebacate and other aliphatic bases. Examples thereof include acid esters, phosphates such as tricresyl phosphate and trioctyl phosphate, and other epoxy plasticizers, polyester plasticizers, polyether plasticizers and the like.

The room temperature moisture-curable organosilicon compound used in the present invention is represented by the general formula (I)

[0016]

[Chemical 1]

(In the formula, X is a hydrolyzable group, and R is
Is a group other than a hydrolyzable group, and n is an integer of 0-2. ) An organic silicon compound having at least two groups represented by the formula (hereinafter, this may be referred to as a “reactive silicon functional group”) in a molecule.

Specific examples of the hydrolyzable group X in the above general formula (I) include acyloxy groups such as acetoxy group, octanoyloxy group and benzoyloxy group; dimethylketoxime group, methylethylketoxime group and diethyl. Ketoxime group such as ketoxime group; alkoxy group such as methoxy group, ethoxy group, propoxy group; alkenyloxy group such as isopropenyloxy group, 1-ethyl-2-methylvinyloxy group; dimethylamino group, diethylamino group, butyl Amino group, amino group such as cyclohexylamino group; dimethylaminooxy group,
Examples thereof include aminooxy groups such as diethylaminooxy group; amide groups such as N-methylacetamide group, N-ethylacetamide group and N-methylbenzamide group.

Examples of the group R other than the hydrolyzable group in the above general formula (I) include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group. Group; alkenyl group such as vinyl group, allyl group; aryl group such as phenyl group, tolyl group, naphthyl group; aralkyl group such as 2-phenylethyl group; structural formula

[0020]

[Chemical 2]

[0021]

[Chemical 3]

Examples thereof include iminoalkyl groups represented by the following; groups in which a part or all of the hydrogen atoms of each of these groups are substituted with a halogen atom such as a chlorine atom.

Examples of the organosilicon compound having at least two silicon atoms to which the hydrolyzable group is bonded in the molecule include compounds obtained by the methods described in (a) to (c) below. To be

(A) Obtained by reacting various compounds having a group capable of reacting with an isocyanate group in the molecule and a reactive silicone functional group represented by the general formula (I) with various polyisocyanate compounds. Room temperature curable silicon terminal compound (see Japanese Patent Publication No. 46-30711):

(B) Obtained by reacting a compound having an isocyanate group and a reactive silicon functional group represented by the general formula (I) in the molecule with various organic polyhydroxy compounds or various organic polythiol compounds. Room Temperature Curable Silicon Terminated Compounds:

(C) A polyoxypolyalkylene polyether compound having an allyl group at the terminal of the molecule, a reactive silicon functional group represented by the general formula (I), and
Silicon-modified polyoxyalkylene polyether compound obtained by addition reaction with a compound having SH group or hydrogen directly bonded to silicon:

An organic tin compound or a primary, secondary or tertiary amine compound may be contained as a curing accelerator for the room temperature moisture curable organosilicon compound, and two or more of these curing accelerators are used in combination. be able to.

The mixing ratio of the powdery polymer compound and the room temperature moisture-curable organosilicon compound is about 10 to 150 parts by weight, preferably about 20 to 100 parts by weight, relative to 100 parts by weight of the room temperature moisture curable organosilicon compound. is there.

When the amount is less than this range, the composition does not become putty even if it is heated and cooled. If it exceeds this range, it becomes too hard and it is difficult to handle.

The amount of the dissolution swelling agent added is 5 to 80% by weight based on the total amount of the room temperature moisture-curable organosilicon compound and the dissolution swelling agent.
The amount is preferably about 10 to 50% by weight.

Below this range, the composition will not putty after heating and cooling. When the content is more than this range, the putty-like composition does not become rubber-like, that is, does not harden even after application.

As the filler used in the present invention, fumed silica, precipitated silica, silicic acid anhydride, silicic acid hydrate, carbon black, calcium carbonate, magnesium carbonate, diatomaceous earth, calcined clay, clay, talc, titanium oxide,
Examples thereof include bentonite, organic bentonite, ferric oxide, shirasu balloon, asbestos, glass fiber, and filament.

This filler may be added in an amount of 40 to 1000 parts by weight, preferably 50 to 800 parts by weight, based on 100 parts by weight of the room temperature moisture-curable organosilicon compound.

In addition to the above-mentioned components, the one-component room temperature moisture-curable composition used in the present invention includes adhesion promoters such as silane compounds: natural resins such as rosin and terpenes, aliphatic and aromatic compounds. Adhesion-imparting resins such as petroleum resins, coumarone, and coal resins such as indene: Dehydrants such as molecular sieves and calcium oxide: Anti-aging agents that impart acid resistance and heat resistance: UV absorbers: Colorants: nonflammable agents (Or a flame retardant) may be included as necessary.

Ordinary polymer compounds (plastic, rubber) may be dissolved in a plasticizer and added.

Furthermore, a silicon compound such as a mixture of a ketimine compound which is hydrolyzed to form a polyamino compound, a polyimino compound or the like, and an epoxy resin compound having a reactive epoxy group, is added to the one-part room temperature moisture-curable composition. It is also possible to add a physical property improver (a sea-island structure is provided by the above mixture) or the like.

As the one-part room temperature moisture-curable composition used in the present invention, in addition to the composition described above, Japanese Patent Application No.
Since the composition proposed in -308418 can be applied, it will be described below.

As this one-liquid room temperature moisture-curable composition,
It comprises (a) a room temperature moisture-curable organosilicon compound, (b) a thermoplastic resin compatible with the room temperature moisture-curable organosilicon compound, and (c) a filler.

As the room temperature moisture curable organosilicon compound (a), a composition similar to the room temperature moisture curable organosilicon compound may be used.

The thermoplastic resin (b) compatible with the room temperature moisture-curable organic silicon compound (a) is any thermoplastic resin compatible with the room temperature moisture-curable organic silicon compound (a). Although an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 40% by weight or more is suitable, an ethylene-ethyl acrylate copolymer resin having an ethyl acrylate content of 40% by weight or more is also usable. Etc. can be used.

It is preferable to add 10 to 200 parts by weight, preferably 20 to 1000 parts by weight of the above ethylene-vinyl acetate copolymer, to 100 parts by weight of the room temperature moisture-curable organosilicon compound (a).

The same filler as the above-mentioned filler is used as the filler of the above-mentioned component (c).

In addition to the above components (a), (b) and (c), (d) an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of less than 40% by weight and / or an ethylene-ethyl acrylate copolymer resin is further compounded. Preferably. This component (d) is not compatible with (a) room temperature moisture-curable organosilicon compound, but (b) has a vinyl acetate content of 40.
It has compatibility with the ethylene-vinyl acetate copolymer resin in an amount of at least wt%.

The mixing ratio of the above-mentioned component (b) and component (d) is preferably 3:97 to 100: 0 by weight.

In addition to the above-mentioned essential components, the above-mentioned various additives can be added to the one-part room temperature moisture-curable composition.

In carrying out the method of the present invention, it goes without saying that various primers can be applied as desired for the purpose of preventing ultraviolet rays and the like.

As the glass plate used in the present invention, plate glass, tempered glass, reticulated glass and the like can be used.

Examples of the frame body include various sashes such as metal sashes (aluminum sashes, steel sashes, stainless sashes, etc.), wood sashes, plastic sashes, and window frames.

Products to which the present invention is applied include windows of houses, windows of low-rise buildings, windows of various vehicles, and the like.

[0050]

The present invention will be described in more detail with reference to the following examples, but it goes without saying that the present invention is not limited to these examples.

Example 1 A bay window in which a glass plate was fitted in an aluminum sash was prepared. A primer for S-511 [UV protection primer manufactured by Cemedine Co., Ltd.] was applied to the surface of the glass plate of the bay window, left for 30 minutes and dried.

Example 1 of JP-A-2-279766
The sealing material composed of the putty-like composition described in 1. is heated at 130 ° C. for 30 minutes using TS-215 / HS [a heating and discharging device manufactured by Suntool Co., Ltd.], and the glass plate and the bay window sash are kept in the heated state. It was applied to the joint area of and the surface was immediately flattened with a spatula.

After being left to cool for 5 minutes, the glass plate and bay window sash were fixed to each other and could be moved immediately. Moreover, when the surface of the sealing material smoothed with a spatula was touched with a finger, it was easy to move without sticking to the finger. Therefore, it was confirmed that it is extremely suitable when performing line production in a factory.

Example 2 Composition component MS polymer # 300 (room temperature moisture-curable organosilicon compound, trade name of Kanegafuchi Chemical Co., Ltd.) ...・ ・ ・ 100 parts by weight Evaflex 45X (Ethylene-vinyl acetate copolymer resin, Mitsui DuPont Polychemical Co., Ltd. trade name, vinyl acetate content 45% by weight) ・ ・ ・ 20 parts by weight Calcium carbonate ・ ・ ・ ・ ・200 parts by weight Dibutyltin dilaurate (curing accelerator) 2 parts by weight γ, β (aminoethyl) -Γ-Aminopropyltrimethoxysilane (adhesion-imparting agent) ... 6 parts by weight

The above composition was kneaded with a mixer while being heated to 120 ° C., and then kneaded under a reduced pressure of 10 mmHg,
It was defoamed and then cooled to obtain a composition. The viscosity of this composition [penetration, rheometer (manufactured by Sun Kagaku Co., CR200D)] was 115 g, and it was a little sticky but putty when touched by hand. Using a sealant composed of this putty-like composition, and Dynamelt DM
-5 [LTI Graco Co., Ltd. heating / discharging device] with the XL hand gun [LTI Graco Co., Ltd.] attached and used, except that the sealing material was applied to the joints of the bay window in the same manner as in Example 1. Then, similarly, it was confirmed that the sealing material was fixed by cooling for 5 minutes.

Comparative Example 1 A bay window having a glass plate fitted in an aluminum sash was prepared. A primer for S-511 [manufactured by Cemedine Co., Ltd.] was applied to the surface of the glass plate of the bay window, left for 30 minutes and dried.

A POS seal [a modified silicone sealing material manufactured by Cemedine Co., Ltd.] was applied and the surface was flattened with a spatula.

When the glass plate was moved one hour after the work was completed, the glass plate was displaced. Moreover, the spatula-shaped surface was pasty and adhered to the finger, which made it difficult to move.
It was after 12 hours that the sealing material hardened and became movable.

[0059]

As described above, according to the present invention, when a sealing material composed of a specific one-liquid room temperature / humidity curable composition is used and the sealing material is applied to the joints between the glass plate and the frame. The sealing material is fixed in an extremely short time, for example, about 5 minutes. Therefore, even if the glass plate and the frame are moved after fixing the sealing material, that is, 5 minutes after application, there is no deviation of the glass plate and the moving work is performed. Therefore, it is possible to perform the line production in the factory.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI Technical display location C08L 27/06 LEP 9166-4J 33/12 LHU 7921-4J LHV 7921-4J LJB 7921-4J C09D 5 / 34 PRC 7211-4J C09K 3/10 G (72) Inventor Akio Futamura 4-5-9 Higashigotanda, Shinagawa-ku, Tokyo Within Cemedine Co., Ltd. (72) Naomi Okamura 4-chome, Higashigotanda, Shinagawa-ku, Tokyo 5-9 No. 9 Cemedine Co., Ltd. (72) Inventor Hisashi Mitsuda 4-5-9 Higashi Gotanda, Shinagawa-ku, Tokyo Cemedine Co., Ltd.

Claims (7)

[Claims] 1. A sealing method, which comprises applying a one-liquid room temperature moisture-curable composition to a joint between a glass plate and a frame in a liquefied state by heating. 2. The one-part room temperature moisture-curable composition comprises a powdery organic polymer compound, a liquid dissolution and swelling agent capable of dissolving and swelling the organic polymer compound when heated, and a room temperature moisture-curable organic silicon compound. The method according to claim 1, further comprising: and a filler. 3. The method according to claim 2, wherein the organic polymer compound is a polyvinyl chloride resin or a methyl methacrylate resin, and the dissolution swelling agent is a plasticizer. 4. The one-part ambient temperature moisture-curable composition,
A (a) room temperature moisture-curable organosilicon compound, (b) a thermoplastic resin compatible with the room temperature moisture-curable organosilicon compound, and (c) a filler as essential components. The method described in 1. 5. The method according to claim 4, wherein the thermoplastic resin (b) is an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 40% by weight or more. 6. The components (a), (b) and (c) above,
The method according to claim 5, further comprising (d) an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of less than 40% by weight and / or an ethylene-ethyl acrylate copolymer resin. 7. A sealing structure for a joint between a glass plate and a frame, which is produced by the method according to claim 1.