JPH0673655U - PTC thermistor device - Google Patents

Abstract

(57) [Summary] [Purpose] To obtain a positive temperature coefficient thermistor device capable of preventing corrosion of a radiator and achieving high output. [Constitution] It is desirable to use a far-infrared radiation material (a material having a large emissivity and excellent heat resistance for the surfaces of the heat radiation plate 3 and the heat radiation fins 17. Specifically, manganese dioxide, chromium oxide, and oxidation. VI-VIII such as iron and cobalt oxide
A silicone resin-based paint mainly composed of group III metal oxides and copper oxide, or aluminum paste is used.)
Coating. The coating film 19 is made of water,
The heat dissipation plate 3 and the heat dissipation fins 17 are protected from moisture, active gas and the like.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a positive temperature coefficient thermistor device used for a hot air heater or the like.

[0002]

[Prior art and problems]

 Conventionally, as described in JP-A-64-72488 and JP-A-64-77888, heat dissipation for radiating heat by contacting a plate-shaped positive characteristic thermistor element and both main surfaces of the positive characteristic thermistor element A PTC thermistor device with a body is known. In the positive temperature coefficient thermistor device having the above structure, a material having excellent thermal conductivity and easily dissipating heat is adopted as the material of the radiator. Specifically, metals such as aluminum and copper are usually used.

However, these metals are easily corroded by an ambient atmosphere such as water, moisture or an active gas, which may limit the use environment. Therefore, an object of the present invention is to provide a positive temperature coefficient thermistor device capable of preventing corrosion of a radiator and achieving high output.

[0004]

[Means and actions for solving the problem]

 In order to solve the above problems, a positive temperature coefficient thermistor device according to the present invention comprises: (a) a positive temperature coefficient thermistor element; (b) a heat radiator containing the positive temperature coefficient thermistor element in a housing; and (c) the heat radiation. And a coating film made of a far-infrared radiation material provided on the surface of the body.

As the far infrared radiation material, it is desirable to use a material having a large emissivity and excellent heat resistance. Specifically, silicone resin-based paints mainly composed of Group VI to VIII metal oxides such as manganese dioxide, chromium oxide, iron oxide, and cobalt oxide and copper oxide, zirconia, alumina, zircon, titania, etc. Silicone resin-based paint or aluminum paste, which is the main component, is used. The coating film made of this far-infrared radiation material has excellent corrosion resistance against ambient atmosphere such as water, moisture and active gas. Therefore, the surface of the heat radiator is protected from the ambient atmosphere by the coating film made of the far infrared radiation material. Then, the coating film made of the far-infrared radiation material emits a large amount of far-infrared rays when heated by the positive temperature coefficient thermistor element.

In addition, in the PTC thermistor device according to the present invention, the heat radiator is composed of at least two members, and the PTC thermistor element is housed in the accommodating portion provided between the two members. The side surface of the body is provided with a shielding portion for preventing air from entering the accommodation portion. With the above configuration, the shielding part prevents water, moisture, active gas, dust, etc. carried with the air from entering the housing part of the radiator, and the characteristic thermistor element housed in the housing part. Prevent deterioration of the.

[0007]

【Example】

 An embodiment of the PTC thermistor device according to the present invention will be described below with reference to the accompanying drawings. 1 shows a front view of the positive temperature coefficient thermistor device, and FIG. 2 shows a side view thereof. The PTC thermistor device generally includes a radiator 1, a PTC thermistor element 20, a terminal plate 21, a spacer 22, and a coil pin 24 housed in the radiator 1.

The radiator 1 is composed of the radiator plates 2 and 3 and a large number of radiator fins 17 and 18 integrally provided on the radiator plates 2 and 3, respectively. The heat sinks 2 and 3 are rectangular long bodies. As a material for the heat dissipation plates 2 and 3 and the heat dissipation fins 17 and 18, a metal such as aluminum or copper having excellent heat conductivity and having a property of easily dissipating heat is used. As shown in FIG. 3, a coating film 19 made of a far-infrared radiation material is provided on the surfaces of the heat dissipation plates 2 and 3 and the heat dissipation fins 17 and 18. As the far-infrared radiation material, it is desirable to use a material having a large emissivity and excellent heat resistance. Specifically, a silicone resin-based coating material containing a metal oxide of Group VI to VIII such as manganese dioxide, chromium oxide, iron oxide, and cobalt oxide and copper oxide as a main component, or an aluminum paste is used. The coating film 19 is heated by the positive temperature coefficient thermistor element 20 to radiate a large amount of far infrared rays. The coating film 19 shields the radiator plates 2 and 3 and the radiator fins 17 and 18 (in other words, the radiator 1) from the ambient atmosphere such as water, moisture or active gas, and protects the radiator 1 from corrosion due to the ambient atmosphere. To do.

As shown in FIG. 4, the heat dissipation plate 2 has an accommodating portion 4 which is partitioned by a partition wall 5 provided in the longitudinal direction at the center thereof. A flange 6 is provided outside the lower part of the partition wall 5. On the upper portion of the partition wall 5, a pin receiver 10 extending outward is provided. The pin receiving surface of the pin receiver 10 is a concave curved surface to facilitate press-fitting of a coil pin 24 described later. The heat sink 3 is provided with flanges 12 on both left and right sides. The flange 12 has a locking portion 12a at its tip. The locking portion 12a wraps around the pin receiver 10 and faces it. The locking portion 12a has a concave curved surface on the surface facing the pin receiver 10 to facilitate press fitting of the coil pin 24. A gap for press-fitting the coil pin 24 is secured in parallel with the partition wall 5 between the locking portion 12a and the pin receiver 10.

As shown in FIG. 5, the PTC thermistor element 20 has a rectangular plate shape and is made of a ceramic material such as BaTiO ₃ . Electrodes are formed on both main surfaces of the element 20. The elements 20 are arranged in the housing portion 4 of the heat dissipation plate 2 and positioned by a resin spacer 22. One electrode of the element 20 is in contact with and electrically connected to the heat dissipation plate 3, and the other electrode is in contact with and electrically connected to the terminal plate 21. Therefore, power is supplied between the terminal plate 21 and the heat sink 3 (that is, the heat sink 1).

As shown in FIG. 6, the terminal plate 21 is made of a metal plate having substantially the same shape as the inner shape of the spacer 22, and the external terminal portion 21 a is projected from one of the spacers 22. An insulating sheet 23 is sandwiched between the terminal plate 21 and the heat dissipation plate 2 in order to electrically insulate them from each other. The lead portion 21b adjacent to the external terminal portion 21a has a narrow width and has a fuse function for overcurrent. The spacer 22 is provided with a hole 22a so that the lead-out portion 21b can be stably blown. The spacer 22 has a symmetrical structure so that it can be used in either the left or right direction.

The coil pin 24 is an elongated, substantially circular tubular member, and a part of its side wall is cut out in the axial direction. The dimension of the diameter of the coil pin 24 is designed to be larger than the dimension of the gap formed between the locking portion 12a of the flange 12 and the pin receiver 10. As the coil pin 24, a molded metal plate made of a spring material is used. Next, a procedure for assembling the PTC thermistor device having the above configuration will be described.

The insulating sheet 23, the spacer 22 having the terminal plate 21 attached thereto, and the element 20 are sequentially stacked in the housing portion 4 of the heat dissipation plate 2. One end in the longitudinal direction of the heat dissipation plate 3 is engaged with one end in the longitudinal direction of the heat dissipation plate 2 thus prepared. That is, the engaging portions 12 a of the flange 12 of the heat sink 3 are arranged so as to face the pin receivers 10 of the heat sink 2. The engaged radiator plate 3 is slid to the predetermined position in the longitudinal direction of the radiator plate 2.

Next, the coil pin 24 is press-fitted into the gap formed between the pin receiver 10 and the locking portion 12 a of the flange 12 from one end of the radiator 1 in the longitudinal direction. At this time, the coil pin 24 is arranged so that the cutout portion faces inward. The coil pin 24 firmly joins the pin receiver 10 and the flange 12 by its elastic force. For this reason, air is prevented from entering the both sides of the housing portion 4 of the heat dissipation plate 2 by the shield portion including the pin receiver 10, the flange 12, and the coil pin 24. Therefore, water, moisture, active gas, dust or the like carried along with the air will not enter the housing portion 4, and deterioration of the positive temperature coefficient thermistor 20 and the terminal plate 21 can be prevented.

The assembled positive temperature coefficient thermistor device is provided with holders (not shown) at both ends thereof, and is attached to a predetermined position in the warm air heater by the holders in a state orthogonal to the air blowing direction. Then, the blown air is heated by the radiator 1 and is output as hot air. In the obtained positive temperature coefficient thermistor device, the surface of the heat radiator 1 is covered with the coating film 19 made of the far-infrared radiation material, so that the surface of the heat radiator 1 is shielded from the ambient atmosphere and corrosion by the ambient atmosphere is avoided. can do. Moreover, in addition to the output from the warm air obtained during blowing, the output from far-infrared radiation can be obtained, and higher output can be achieved compared to the conventional PTC thermistor device. In addition, since far-infrared rays are generated, it is possible to obtain the heating effect by far-infrared rays even if the hot air does not hit the object directly. As a result, it is possible to obtain a positive temperature coefficient thermistor device which can prevent corrosion of the radiator and can achieve high output.

The PTC thermistor device according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist thereof. For the PTC thermistor element, various shapes such as a disk shape are selected according to the specifications. In this case, the radiator is also deformed according to the shape of the PTC thermistor element. Further, an elastic body such as a leaf spring or rubber may be used instead of the coil pin.

Further, the radiator may be a box-shaped one having an opening. The PTC thermistor element is housed in the housing provided inside the opening of the radiator, and then the PTC thermistor device is manufactured by closing the opening with a sealing material.

[0018]

[Effect of device]

 As is clear from the above description, according to the present invention, since the coating film made of the far infrared radiation material is provided on the surface of the radiator, the surface of the heat radiation body is coated with the far infrared radiation material. It is shielded from the ambient atmosphere by the membrane. Therefore, the radiator can avoid corrosion due to the ambient atmosphere, and a highly reliable positive temperature coefficient thermistor device can be obtained. Moreover, in addition to the output from the warm air obtained during air blowing, the output from the far infrared ray generation is also obtained, so higher output can be achieved compared to the conventional positive temperature coefficient thermistor device. Further, since far infrared rays that are good for the human body are generated, two types of heating effects of warm air and far infrared rays can be obtained, and the added value as a positive temperature coefficient thermistor device is increased.

In addition, the air blown air does not enter the housing portion of the heat radiator due to the shielding portion provided on the side surface of the heat radiator. Therefore, water, moisture, active gas, dust or the like carried along with the air will not enter the housing portion, and deterioration of the positive temperature coefficient thermistor element housed in the housing portion can be prevented.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a positive temperature coefficient thermistor device according to the present invention.

FIG. 2 is a side view of the positive temperature coefficient thermistor device shown in FIG.

3 is a partially enlarged cross-sectional view of a radiation fin portion of the PTC thermistor device shown in FIG.

4 is a cross-sectional view showing the internal structure of the positive temperature coefficient thermistor device shown in FIG.

5 is a perspective view showing the inside of the positive temperature coefficient thermistor device shown in FIG. 1. FIG.

6 is a plan view seen from the terminal plate side to show the shape of the terminal plate used in the positive temperature coefficient thermistor device shown in FIG. 1. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heat-dissipating body 2, 3 ... Heat-dissipating plate 4 ... Housing 10 ... Pin receiving 12 ... Flange 17, 18 ... Radiating fin 19 ... Far-infrared radiation material coating film 20 ... Positive characteristic thermistor element 24 ... Coil pin

Claims (2)

[Scope of utility model registration request] 1. A positive temperature coefficient thermistor element, a heat radiator containing the positive temperature coefficient thermistor element in a housing, and a coating film made of far-infrared radiation material provided on the surface of the heat radiator. Positive temperature coefficient thermistor device. 2. The heat radiator comprises at least two members, and the positive temperature coefficient thermistor element is housed in a housing provided between the two members, and air is supplied to the housing at a side surface of the heat radiator. 2. The positive temperature coefficient thermistor device according to claim 1, further comprising a shield portion for preventing the entry of the thermistor.