JPH0664244B2 - Imaging device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an image pickup apparatus which is used by being connected to an endoscope via an adapter having an optical system with a fixed focal length.

[Problems to be Solved by Conventional Techniques and Inventions] In recent years, by inserting an elongated insertion portion into a body cavity, a body cavity built-in device or the like is observed, and a treatment instrument inserted into a treatment instrument channel as necessary. An endoscope that can be used for various medical treatments is widely used.

In the endoscope, in the eyepiece, for example, via an adapter,
There are some that allow you to connect a TV camera.

As described above, it is generally well known that an image pickup device such as a television camera connected to the eyepiece of an endoscope has an optical system capable of adjusting the focus. Then, for example, a solid-state image sensor is mechanically fixed, and an optical system for forming an image on the solid-state image sensor is moved to perform focusing. As such an imaging device, for example, US Pat. No. 4,600,9
No. 39 specification.

On the other hand, for example, as disclosed in Japanese Patent Application Laid-Open No. 58-106952, there is an image pickup apparatus that does not have an optical system capable of focus adjustment. An example of such an imaging device is shown in FIG. The image pickup apparatus shown in this figure includes a holder 71 that houses a solid-state image pickup element 70, and a mount portion 73 to which an image pickup optical system 72 can be attached is provided at a front end portion of the holder 71.

A lens barrel 74 accommodating the image pickup optical system 72 is connected to the mount portion 73 by, for example, a screw.

The solid-state imaging device 70 is attached to a substrate 75, and the substrate 75 is attached to the holder 71 with a plurality of screws 76.
It is attached to the inner wall of the front end of the.

In addition, a plurality of springs 77, which are externally mounted on the plurality of screws 76, are interposed between the holder 71 and the substrate 75, and the plurality of springs 77 ... bias the substrate 75 backward. It is supposed to be done. Further, by adjusting the plurality of screws 76, the solid-state image pickup device 70 is moved back and forth together with the substrate 75 so that the focus can be adjusted.

By the way, when assembling the image pickup apparatus as shown in FIG. 8, a plurality of springs 77 ... And a plurality of screws 76 ... It is designed to be completed by covering the cover. However, with such a configuration, there is a problem in that the entire image pickup apparatus becomes considerably larger than the size of the solid-state image pickup element 70 due to the focus adjustment mechanism.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an image pickup apparatus capable of moving a solid-state image pickup element with respect to an optical system during assembly without increasing the size and complexity. .

[Means and Actions for Solving the Problems] In order to achieve the above-mentioned object, an image pickup apparatus according to the present invention is a hold in which a solid-state image pickup element is fixed inside an exterior member that is detachable from an adapter having an image pickup optical system. A biasing member that presses the holding member from the front to the back, and a focus adjusting member that presses the holding member from the front to the front, and one end of the biasing member is part of the exterior member. By stopping with, the pressure applied from the focus adjusting member is adjusted to move the hold member back and forth,
Adjust the focus.

[Embodiment] FIGS. 1 to 6 relate to a first embodiment of the present invention.
1 is a sectional view showing the image pickup apparatus of the present embodiment, FIG. 2 is a sectional view taken along the line AA ′ in FIG. 1, FIG. 3 is a sectional view taken along the line BB ′ in FIG. 1,
FIG. 4 is a sectional view taken along the line CC ′ of FIG. 1, and FIG. 5 is D of FIG.
6 is a schematic view of the endoscope apparatus when the image pickup apparatus of the present invention is attached, and FIG.

In FIG. 6, the endoscope device 1 is composed of, for example, a rigid endoscope 2, an adapter 3, an image pickup device 4, a camera control unit 5, a television monitor 6, and a light source device 7.

The rigid endoscope 2 includes a holding portion 9 in an insertion portion 8 that contains an objective lens, an image guide, and a light guide, which are not shown.
A light guide cable connecting portion 11 is provided on a side portion of the grip portion 9, and an eyepiece portion 13 having an eyepiece 12 is provided on a rear portion thereof. An adapter 3 is connected to this eyepiece 12, and the adapter 3 has an image pickup optical system 1 inside.
4 is built in.

Further, the image pickup device 4 is connected to the adapter 3, a signal cable 16 for transmitting a signal from the solid-state image pickup device is extended from a rear end of the image pickup device 4, and a connector provided at an end portion of the signal cable 16. It is connected to the camera control unit 5 via 17. The camera control unit 5 has a video signal processing circuit (not shown), and the video signal processed signal is input to the television monitor 6 and displayed as an image.

On the other hand, a light guide cable 18 for transmitting emitted light is extended from the optical image device 7, and a connector 19 is provided at an end of the light guide cable 18, and the connector 19 is connected to the connecting portion 11. It is supposed to be connected.

As shown in FIG. 1, the image pickup device 4 has an outer cover 21 internally provided with a conductive hold member 22 so as to be movable back and forth, and a filter frame 23 is provided in a front portion of the outer cover 21. The filter frame 23 is internally inscribed and detachably connected, and a glass (filter) 24 is built in the filter frame 23.
When a fiberscope is used for a rigid endoscope, a filter frame containing a crystal filter is connected to remove moire.

By the way, the connection between the exterior cover 21 and the filter frame 23 is
Grooves 2 formed in the inner circumference of the outer cover 21, for example, in the circumferential direction
5, convex portions 26 formed at least at two positions in the outer peripheral direction of the rear end portion of the filter frame 23 are engaged and connected. Further, as shown in FIG. 2, a notch 27 is formed at the front end of the outer cover 21, and a protrusion 28 that engages with the notch 27 is formed at the filter frame 23.

The conductive hold member 22 includes a cylindrical rear portion 22a,
The central portion 22 in which the solid-state imaging device 29 is held
b, a cylindrical front portion 22c having a smaller diameter than the rear portion, the rear portion and the central portion are inscribed in the exterior cover 21, and a step portion 31 is formed from the central portion to the front portion.

The front portion 22c of the conductive hold member 22 is located at the opening of the filter frame 23, and the crystal filter group 32 and the inner surface of the front portion 22c of the conductive hold member 22 are aligned with their optical axes. An infrared cut filter 33 is fixed behind the crystal filter 32.

A compression spring 34 is circumscribed on the front portion 22c of the conductive hold member 22, and one end of the compression spring 34 has a stepped portion 3.
1, and the other end is in contact with a convex portion 36 formed in the circumferential direction of the inner circumference of the outer cover 21. Further, the exterior cover in front of the convex portion 36 and the conductive hold member 22.
An O-ring 38 for waterproofing is provided in a space 37 formed by the outer periphery of the front portion 22c.

Behind the infrared cut filter 33, as shown in FIG. 3, the solid-state image pickup device 29 is formed on four conductive hold members 22 formed so as to face each other so that the outer circumference is inscribed in the outer cover 21. It is held by the supporting portions 39, 39, 39, 39, and is further fixed by screws 41, 41 screwed to face each other. An insulating cylinder 42 is brought into contact with the solid-state image sensor 29 near the outer periphery of the rear end surface thereof.
It is inscribed and fixed to the conductive hold member 22. Then, behind the insulating cylinder 42, a cable support member 44 is inscribed in the conductive hold member 22 via a fixed spring 43, and a positioning screw 46, which is provided so as to face each other as shown in FIG. It is fixed at 46. The positioning screws 46, 46 are provided to prevent the exterior cover 21 from rotating with respect to the conductive hold member.
Therefore, grooves 47, 4 are formed on the inner circumference of the outer cover 21 so that the heads of the positioning screws 46, 46 can move in the axial direction.
7 are formed.

A female screw portion 48 is formed in the circumferential direction on the inner periphery of the outer cover 21 behind the groove 47 formed on the inner periphery of the outer cover 21, and the cable support member 4 is formed on the female screw portion 48.
4 Focus adjusting ring 5 having a male screw portion 51 on the outer circumference so as to abut on a convex portion 49 formed on the outer circumference
2 is screwed together.

The rear section of the focus adjusting ring 52 has a fifth section.
As shown in the drawing, the cable 16 inserted through the center of the exterior cover 21 is provided with a cylinder 53 having a partially cutaway cross section. The cable support member 44 is externally mounted on the cylinder 53, and the cylinder 53 is pressed and fixed by a screw 54 provided through the cable support member 44 so as to face it. Further, a cable fixing member 56 is externally mounted on the cable supporting member 44 such that a tip end portion 56 a of the cable fixing member 56 is inscribed in the external cover 21.

Further, a ring 57 continuous with the rear end of the outer cover 21 is screwed into the cable fixing member 56, and a groove 58 formed around the outer periphery of the cable fixing member 56 is continuous with the ring 51. End portion 59a of the cable break stop 59
Is involved.

By the way, a plurality of lead receivers 61 ... Are provided at the tip of the signal cable 16, and the plurality of lead receivers 6 are provided.
Leads 63 ... Inserted from the solid-state image pickup device 29 into the substrate 62 are connected to 1 ...

The adjusting mechanism of the image pickup apparatus 4 configured as described above is capable of being assembled, and when the focus adjusting ring 52 is rotated in a direction to be pushed in, the conductive holding member 22 is provided.
Is urged rearward by the compression spring 34 provided in the front, and moves forward while being pressed forward through the convex portion 49. Therefore, the crystal filter group 32, the infrared cut filter 33, and the solid-state imaging device 29 installed in the conductive hold member 22 move forward.

At this time, in order to prevent the conductive hold member 22 from rotating with respect to the exterior cover 21, the positioning screw 46 screwed into the conductive hold member 22 is inserted into the groove 47 formed in the axial direction of the exterior cover 21. Since the head portion of the conductive holding member 22 can be moved back and forth, the conductive holding member 22 does not rotate due to the frictional force between the members generated when the focus adjusting ring 52 rotates.

When the focus adjustment ring 52 is rotated in the loosening direction, the conductive hold member 22 is moved backward by the compression spring biasing the conductive hold member 22 to the conductive hold member 2.
The crystal filter group 32, the infrared cut filter 33, and the solid-state image sensor 29, which are installed in the second unit, also move backward.

With the configuration and operation as described above, focus adjustment can be easily performed at the time of assembly, and the size of the imaging device can be reduced.

FIG. 7 is a sectional view of an image pickup apparatus according to the second embodiment of the present invention.

In this embodiment, the focus adjusting ring 52 in the first embodiment is replaced with a plurality of screws 65, and a step portion 66 is provided around the inner circumference of the outer cover 21. The heads of a plurality of screws 65 ... Are engaged with. Further, the plurality of screws 65 ... Are screwed into convex portions 67 provided around the outer circumference of the cable support member 44. Further, a spring 68 is interposed between the screw 65 and the convex portion 67.

Then, screw in or loosen this screw 65,
By moving the conductive hold member 22 back and forth,
Focus is adjusted. Further, other configurations, operations and effects are the same as those of the first embodiment.

EFFECTS OF THE INVENTION As described above, according to the present invention, the optical system and the solid-state image sensor can move the member in which the optical system and the solid-state image sensor are internally fixed, so that the adjustment mechanism is easy. Therefore, there is an effect that a member mounted on the housing can be made small and simple, and the imaging device can be made small and simple.

[Brief description of drawings]

1 to 6 relate to a first embodiment of the present invention.
1 is a sectional view showing the image pickup apparatus of the present embodiment, FIG. 2 is a sectional view taken along the line AA ′ in FIG. 1, FIG. 3 is a sectional view taken along the line BB ′ in FIG. 1,
FIG. 4 is a sectional view taken along the line CC ′ of FIG. 1, and FIG. 5 is D of FIG.
-D 'sectional view, FIG. 6 is a schematic view of the endoscope apparatus when the imaging apparatus of the present invention is mounted, and FIG. 7 is a sectional view of the imaging apparatus according to the second embodiment of the present invention. The figure is an explanatory view showing a conventional example. 21 ... Exterior cover 22 ... Conductive hold member 29 ... Solid-state image sensor, 32 ... Crystal filter group 33 ... Infrared cut filter 46 ... Positioning screw, 47 ... Groove 52 ... Focus adjustment ring

Claims (1)

[Claims] 1. A solid-state image sensor for converting an optical image into an electric signal, and a light-receiving surface side of the solid-state image sensor abutting against each other, and a contact surface for supporting the light-receiving surface perpendicularly to the optical axis of the optical image. A holding member having a holding member, an exterior member in which the holding member is provided, a pressing unit that presses the back side of the light receiving surface of the solid-state imaging device to press and fix the light receiving surface to the contact surface, and the solid-state imaging device. Vertical adjustment means for moving the element in a direction perpendicular to the optical axis of the optical image, and the solid-state imaging device by moving the hold member in the exterior member in the horizontal direction with respect to the optical axis of the optical image. An image pickup apparatus comprising: a focus adjustment unit that adjusts the focus of the.