JPH0663992A - Liquidlike resin metering apparatus - Google Patents

Liquidlike resin metering apparatus

Info

Publication number
JPH0663992A
JPH0663992A JP22564692A JP22564692A JPH0663992A JP H0663992 A JPH0663992 A JP H0663992A JP 22564692 A JP22564692 A JP 22564692A JP 22564692 A JP22564692 A JP 22564692A JP H0663992 A JPH0663992 A JP H0663992A
Authority
JP
Japan
Prior art keywords
resin
resins
liquid
metering
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP22564692A
Other languages
Japanese (ja)
Inventor
Kazuhiko Tokumaru
和彦 徳丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP22564692A priority Critical patent/JPH0663992A/en
Publication of JPH0663992A publication Critical patent/JPH0663992A/en
Withdrawn legal-status Critical Current

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  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To accurately meter irrespective of viscosity of resin by providing metering cylinders having equal sectional areas to suck resin at storage tanks when two-liquid liquidlike resins is supplied to a liquidlike resin injection molding machine, and equalizing retracting speed ratio of pistons to a two-liquid mixture ratio. CONSTITUTION:Resins A, B are respectively contained in first, second resin tanks 5, 6, and pneumatic pressure is applied. Sectional areas of metering cylinders 1, 3 are made equal, and a speed ratio of servo motors 2, 4 for driving the pistons is equalized to a mixture ratio of the resins A, B. The resin is metered by opening resin metering valves 7, 8, closing injection metering valves 9, 10, simultaneously driving the motors 2, 4, and evacuating to fill the resins A, B in the cylinders 1, 3. Then, the resins, A, B are transferred to a mixing agitating cylinder 9.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は2液型の液状エポキシ樹
脂を計量する計量装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device for measuring a two-component liquid epoxy resin.

【0002】[0002]

【従来の技術】近年の電子部品関係の部材は、益々軽薄
短小化されており、例えばコイル部品の分野においても
基板表面実装が増加する傾向にある。そのため、電子部
品に絶縁材料による封止成形を施し、信頼性の確保を図
るようになってきている。従来、この種の封止樹脂に
は、IC等の封止で使用されている熱硬化性樹脂が使用
されているが、この種の樹脂は成形時に150〜180
℃の高温と、30〜100Kg/cm2 の高圧とを掛けなけ
ればならないため、電子部品の特性が損じられるおそれ
があった。
2. Description of the Related Art In recent years, members related to electronic parts have become lighter, thinner, shorter, and smaller, and for example, in the field of coil parts, the surface mounting of substrates tends to increase. Therefore, electronic parts have been sealed and molded with an insulating material to ensure reliability. Conventionally, a thermosetting resin used for sealing ICs and the like has been used for this type of sealing resin, but this type of resin is 150 to 180 at the time of molding.
Since a high temperature of [deg.] C. and a high pressure of 30 to 100 kg / cm < 2 > have to be applied, there is a possibility that the characteristics of the electronic component may be impaired.

【0003】上記のような成形時の高温、高圧の被害を
避けるには、液状の熱硬化性樹脂を電子部品に対して滴
下させながら、例えば120℃近辺のような比較的低い
温度で硬化させるボンディング法が採用されるが、この
ボンディング法は高温、高圧による前記の電子部品の性
能低下を生じることはないものの、硬化に要する時間が
長く、また電子部品の形状によっては実装の自動化が困
難であった。
In order to avoid the damage of high temperature and high pressure at the time of molding as described above, a liquid thermosetting resin is dropped onto an electronic component and cured at a relatively low temperature such as around 120 ° C. Although a bonding method is adopted, this bonding method does not cause performance deterioration of the electronic component due to high temperature and high pressure, but it takes a long time to cure, and automation of mounting is difficult depending on the shape of the electronic component. there were.

【0004】ボンディング法における上記の問題を解決
するため、封止金型のキャビティ内に比較的低い圧力
(3〜10Kg/cm2 ) で熱硬化性樹脂を充填し、比較的
低い温度(120℃〜150℃) で硬化させる成形法、
すなわち射出成形法が採用されるようになってきた。
In order to solve the above problems in the bonding method, the thermosetting resin is filled in the cavity of the sealing die at a relatively low pressure (3 to 10 kg / cm 2 ) and the temperature is relatively low (120 ° C.). Molding method of curing at ~ 150 ° C)
That is, the injection molding method has been adopted.

【0005】上記射出成形法で使用される液状の封止樹
脂は、封止すべき電子部品の特性によって異なるが、実
際には圧倒的に2液型の樹脂が使用されている。そし
て、上記2液型の樹脂は、各成分を例えば電子天秤等を
用いて手作業によって計量し、これらを射出用タンクに
セットして、金型に注入、充填するようにしている。
The liquid encapsulating resin used in the above injection molding method differs depending on the characteristics of the electronic component to be encapsulated, but in reality, a two-component resin is predominantly used. The two-liquid type resin is manually measured by using, for example, an electronic balance or the like, set in an injection tank, and then injected and filled in a mold.

【0006】[0006]

【発明が解決しようとする課題】上記の射出成形法が現
在のところ最も推奨される封止手段であるが、2液を予
め混合するタンク内で樹脂粘度が増加し、成形に支障を
来すおそれがある。そのため、射出直前の2液混合を行
うためには、樹脂粘度に関係なく高い計量精度で樹脂の
計量をなし得る計量装置が必要である。
The above-mentioned injection molding method is the most recommended sealing means at present, but the resin viscosity increases in the tank in which the two liquids are premixed, and molding is hindered. There is a risk. Therefore, in order to mix the two liquids immediately before injection, a measuring device capable of measuring the resin with high measuring accuracy is required regardless of the resin viscosity.

【0007】本発明は上記の問題を解決するためになさ
れたもので、液状樹脂射出成形システムを完全に自動化
することができ、高品質の射出成形品が得られる液状樹
脂計量装置を提供する。
The present invention has been made to solve the above problems, and provides a liquid resin measuring device which can completely automate a liquid resin injection molding system and obtain a high quality injection molded product.

【0008】[0008]

【課題を解決するための手段】本発明の液状樹脂計量装
置は、液状樹脂の射出成形装置に2液型の液状樹脂を供
給するに際して、それぞれの樹脂を貯蔵するタンクから
樹脂を吸引する計量シリンダを設け、これ等の計量シリ
ンダの断面積を等しくし、それぞれのシリンダ内で前記
吸引のため後退するピストンの速度比を上記2液の混合
比に等しくしたことを特徴とする。
A liquid resin measuring apparatus of the present invention is a measuring cylinder for sucking resin from a tank storing each resin when supplying a two-liquid type liquid resin to a liquid resin injection molding apparatus. Are provided, the cross-sectional areas of these metering cylinders are made equal, and the speed ratio of the pistons retracting due to the suction in each cylinder is made equal to the mixing ratio of the two liquids.

【0009】[0009]

【作用】上記構成の本発明の液状樹脂計量装置において
は、上記各計量シリンダの断面積は等しくされており、
各シリンダ内のピストンの後退速度比は2液の混合比と
等しくされているため、各計量シリンダ内に吸引充填さ
れた液状樹脂の容積比は、2液混合樹脂の混合比と等し
くなる。
In the liquid resin measuring device of the present invention having the above structure, the measuring cylinders have the same sectional area.
Since the retreat speed ratio of the piston in each cylinder is made equal to the mixing ratio of the two liquids, the volume ratio of the liquid resin suction-filled in each measuring cylinder becomes equal to the mixing ratio of the two liquid mixing resin.

【0010】[0010]

【実施例】図1は本発明の一実施例の概要を示す模式的
断面図、図2は液状樹脂成形システムにおける混合攪拌
シリンダ部の模式的断面図である。図1において、第1
の計量シリンダ1はサーボモータ2によって駆動される
ピストン1aを有し、第2の計量シリンダ2はサーボモ
ータ4によって駆動されるピストン2aを有する。第1
の計量シリンダ内1は、第1の樹脂タンク5底面に樹脂
計量弁7を具えた管路7’により連通され、第2の液用
計量シリンダ3内は、第2の樹脂タンク6底面に樹脂計
量弁8を具えた管路8’により連通されている。管路
7’、管路8’は、前記各計量シリンダ1、3を越えて
延長され、射出計量弁10、11を介して混合攪拌シリ
ンダ9に連通されている。
1 is a schematic sectional view showing an outline of an embodiment of the present invention, and FIG. 2 is a schematic sectional view of a mixing and stirring cylinder portion in a liquid resin molding system. In FIG. 1, the first
The measuring cylinder 1 has a piston 1a driven by a servomotor 2, and the second measuring cylinder 2 has a piston 2a driven by a servomotor 4. First
The inside of the measuring cylinder 1 is communicated with the bottom surface of the first resin tank 5 by a pipe line 7 ′ equipped with a resin measuring valve 7, and the inside of the second liquid measuring cylinder 3 is connected to the bottom surface of the second resin tank 6 with the resin. It is communicated by a line 8'comprising a metering valve 8. The pipe lines 7'and 8'extend beyond the respective metering cylinders 1 and 3 and communicate with the mixing and stirring cylinder 9 via injection metering valves 10 and 11.

【0011】図2において、混合攪拌シリンダ9内に
は、攪拌スクリュー12が同心的に設けられ、この混合
攪拌シリンダ9の一端外部には、前記攪拌スクリューを
駆動する計量射出サーボモータ13が設けられている。
また、混合攪拌シリンダ9の他端には、図示しない射出
ノズルに至る管路9aが突出され、この管路9aには樹
脂圧力センサ14が設けられている。
In FIG. 2, a stirring screw 12 is concentrically provided in the mixing and stirring cylinder 9, and a metering injection servomotor 13 for driving the stirring screw is provided outside one end of the mixing and stirring cylinder 9. ing.
At the other end of the mixing and stirring cylinder 9, a pipe line 9a reaching an injection nozzle (not shown) is projected, and a resin pressure sensor 14 is provided in this pipe line 9a.

【0012】上記構成のシステムにおいて、第1の樹脂
タンク5内にはA樹脂が収納され、第2の樹脂タンク6
内にはB樹脂が収納されている。これ等のタンクには、
例えば約6Kg/cm2 程度の空気圧が印加されている。更
に、前記第1の計量シリンダ1の断面積と第2の計量シ
リンダ3の断面積は等しくしてあり、それ等の計量シリ
ンダのピストン1a、ピストン3aを駆動するサーボモ
ータ2、サーボモータ4の速度比は、A樹脂とB樹脂と
の混合比に等しくされている。例えば、A樹脂とB樹脂
との混合比が100:17であるとすれば、上記速度比
も100:17となるように設定される。
In the system having the above structure, the first resin tank 5 contains the A resin, and the second resin tank 6
B resin is stored inside. These tanks have
For example, an air pressure of about 6 kg / cm 2 is applied. Further, the cross-sectional area of the first measuring cylinder 1 and the cross-sectional area of the second measuring cylinder 3 are made equal, and the pistons 1a of these measuring cylinders, the servomotor 2 for driving the piston 3a, and the servomotor 4 are The speed ratio is made equal to the mixing ratio of A resin and B resin. For example, if the mixing ratio of A resin and B resin is 100: 17, the speed ratio is also set to 100: 17.

【0013】また、樹脂計量弁7、8は、図示しない作
動機構によって後に述べるタイミングで開閉される。ま
た、射出計量弁10、11も同様にして開閉されるもの
としてある。
The resin metering valves 7 and 8 are opened and closed at a timing described later by an operating mechanism (not shown). The injection metering valves 10 and 11 are also opened and closed in the same manner.

【0014】上記構成の実施例において、A樹脂および
B樹脂の計量は次のようにして行われる。樹脂計量開始
に際しては、先ず樹脂計量弁7、8が開かれ、射出計量
弁9、10は閉じられる。これと同時に、第1の計量シ
リンダ1、第2の計量シリンダ3それぞれのピストン1
a、3aがサーボモータ2、4によって駆動され、後退
する。これにより、各樹脂タンク5および6内の樹脂す
なわちA樹脂およびB樹脂は、第1、第2の計量シリン
ダ1、3内に吸引、充填される。そして、前記各計量シ
リンダ1、3の断面積は等しくされ、それ等のピストン
1a、3aの後退の速度比は、上記のようにA樹脂、B
樹脂の混合比に等しくしてあるから、各シリンダ内に充
満したA樹脂、B樹脂の容積比は、混合比に等しいもの
となる。混合攪拌シリンダ9内に、上記計量シリンダ1
および3内のA樹脂およびB樹脂を移送し、A樹脂およ
びB樹脂を所定の混合比で混合攪拌シリンダ9内に充填
するには次のようにする。すなわち、樹脂計量弁7、8
を閉じ、射出計量弁10、11を開き、計量シリンダ
1、3のピストン1a、3aをサーボモータ2、4によ
り駆動、前進させる。この時、混合攪拌シリンダ9内の
スクリュー12は、計量射出サーボモータ13により後
退方向、すなわち吸い込み方向に回転される。
In the embodiment having the above construction, the A resin and the B resin are weighed as follows. When the resin metering is started, first, the resin metering valves 7 and 8 are opened, and the injection metering valves 9 and 10 are closed. At the same time, the pistons 1 of the first measuring cylinder 1 and the second measuring cylinder 3 respectively
a and 3a are driven by the servomotors 2 and 4 and move backward. As a result, the resins in the resin tanks 5 and 6, that is, the A resin and the B resin, are sucked and filled in the first and second measuring cylinders 1 and 3. The cross-sectional areas of the respective measuring cylinders 1 and 3 are made equal, and the reciprocating speed ratios of the pistons 1a and 3a thereof are set to A resin, B as described above.
Since the mixing ratio of the resins is made equal, the volume ratio of the A resin and B resin filled in each cylinder is equal to the mixing ratio. The measuring cylinder 1 is placed in the mixing and stirring cylinder 9.
To transfer the A resin and B resin in 3 and 3 and to fill the A resin and B resin into the mixing and stirring cylinder 9 at a predetermined mixing ratio, the procedure is as follows. That is, the resin metering valves 7, 8
Is closed, the injection metering valves 10 and 11 are opened, and the pistons 1a and 3a of the metering cylinders 1 and 3 are driven and moved forward by the servomotors 2 and 4. At this time, the screw 12 in the mixing and stirring cylinder 9 is rotated by the metering injection servomotor 13 in the backward direction, that is, the suction direction.

【0015】上記のようにすれば、計量シリンダ1、3
内に混合比に等しい比で充填されていたA樹脂、B樹脂
は、混合攪拌シリンダ9内に充填される。なお、前記の
スクリュー12の回転速度は、計量射出サーボモータ1
3により管理されるが、その速度は計量シリンダ1、3
および混合攪拌シリンダ9内の圧力が過度に降下しない
程度、実際には例えば2〜3Kg/cm2 に保持されるよう
に管理される。また、前記の混合攪拌シリンダ9内の圧
力は、圧力センサ14によって監視され、圧力センサ1
4の出力は第1、第2の計量シリンダ1、3のピストン
1a、3aを駆動するサーボモータ2、4にフィードバ
ックされ、これを制御するものとしてある。
According to the above, the measuring cylinders 1, 3
The resin A and the resin B, which had been filled in the mixture at a ratio equal to the mixing ratio, are filled in the mixing and stirring cylinder 9. The rotation speed of the screw 12 is the same as that of the metering injection servomotor 1.
3, the speed is controlled by the measuring cylinders 1, 3
The pressure in the mixing and stirring cylinder 9 is controlled so that it is actually maintained at, for example, 2 to 3 kg / cm 2 to the extent that the pressure does not drop excessively. The pressure in the mixing and stirring cylinder 9 is monitored by the pressure sensor 14, and the pressure sensor 1
The output of 4 is fed back to the servomotors 2 and 4 for driving the pistons 1a and 3a of the first and second measuring cylinders 1 and 3, and controls them.

【0016】上記構成の本発明の計量装置は、±1%以
内の計量精度が得られる。また、計量シリンダ内のピス
トンの駆動により計量を行っているため、樹脂の粘度が
例えば10ps〜500psのように広範囲で変化して
も、それと無関係に正確な計量を行うことができる。
The measuring device of the present invention having the above-mentioned structure can obtain the measuring accuracy within ± 1%. Further, since the measurement is performed by driving the piston in the measuring cylinder, even if the viscosity of the resin changes in a wide range such as 10 ps to 500 ps, accurate measurement can be performed regardless of the change.

【0017】[0017]

【発明の効果】上記から明らかなように本発明の液状樹
脂計量装置は、被測定液状樹脂の粘度の変化に無関係に
高精度で計量をなし得るので、2液混合樹脂の射出成形
等の生産性を高めることができる。また、液状樹脂の連
続計量が可能であり、2液混合樹脂射出成形システムの
自動化が容易である。
As is apparent from the above, the liquid resin measuring device of the present invention can perform high-precision measurement regardless of the change in the viscosity of the liquid resin to be measured. You can improve your sex. Further, the liquid resin can be continuously measured, and the automation of the two-liquid mixed resin injection molding system is easy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の概要を示す模式的断面図。FIG. 1 is a schematic sectional view showing an outline of an embodiment of the present invention.

【図2】液状樹脂成形システムにおける混合攪拌シリン
ダ部の模式的断面図。
FIG. 2 is a schematic cross-sectional view of a mixing and stirring cylinder portion in a liquid resin molding system.

【符号の説明】[Explanation of symbols]

1、3…計量シリンダ 1a、3a…ピストン 2、4…サーボモータ 5、6…樹脂タンク 7、8…樹脂計量弁 9………混合攪拌シリンダ 10、11…計量射出弁 12………スクリュー 13………計量射出サーボモータ 14………圧力センサ 1, 3 ... Metering cylinder 1a, 3a ... Piston 2, 4 ... Servo motor 5, 6 ... Resin tank 7, 8 ... Resin metering valve 9 ... Mixing and stirring cylinder 10, 11 ... Metering injection valve 12 ... Screw 13 ……… Metering injection servo motor 14 ……… Pressure sensor

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 液状樹脂の射出成形装置に2液型の液状
樹脂を供給するに際して、それぞれの樹脂を貯蔵するタ
ンクから樹脂を吸引する計量シリンダを設け、これ等の
計量シリンダの断面積を等しくし、それぞれのシリンダ
内で前記吸引のため後退するピストンの速度比を上記2
液の混合比に等しくしたことを特徴とする液状樹脂計量
装置。
1. When supplying a two-liquid type liquid resin to a liquid resin injection molding apparatus, a measuring cylinder for sucking the resin from a tank storing each resin is provided, and the cross-sectional areas of these measuring cylinders are equal. Then, in each cylinder, the speed ratio of the piston retracting due to the suction is
A liquid resin measuring device characterized in that the liquid mixing ratio is made equal.
JP22564692A 1992-08-25 1992-08-25 Liquidlike resin metering apparatus Withdrawn JPH0663992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22564692A JPH0663992A (en) 1992-08-25 1992-08-25 Liquidlike resin metering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22564692A JPH0663992A (en) 1992-08-25 1992-08-25 Liquidlike resin metering apparatus

Publications (1)

Publication Number Publication Date
JPH0663992A true JPH0663992A (en) 1994-03-08

Family

ID=16832564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22564692A Withdrawn JPH0663992A (en) 1992-08-25 1992-08-25 Liquidlike resin metering apparatus

Country Status (1)

Country Link
JP (1) JPH0663992A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005254539A (en) * 2004-03-10 2005-09-22 Yamashiro Seiki Seisakusho:Kk Liquid material metering/conveying device
JP2006123398A (en) * 2004-10-29 2006-05-18 Fujikura Rubber Ltd Injection molding machine of liquid resin
EP1767331A1 (en) * 2005-09-26 2007-03-28 Reinhardt Technik Gmbh & Co Apparatus for injection molding for material supply by cartridges

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005254539A (en) * 2004-03-10 2005-09-22 Yamashiro Seiki Seisakusho:Kk Liquid material metering/conveying device
JP2006123398A (en) * 2004-10-29 2006-05-18 Fujikura Rubber Ltd Injection molding machine of liquid resin
EP1767331A1 (en) * 2005-09-26 2007-03-28 Reinhardt Technik Gmbh & Co Apparatus for injection molding for material supply by cartridges

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