JPH0661702B2 - Suede-like polishing cloth - Google Patents

Suede-like polishing cloth

Info

Publication number
JPH0661702B2
JPH0661702B2 JP2220571A JP22057190A JPH0661702B2 JP H0661702 B2 JPH0661702 B2 JP H0661702B2 JP 2220571 A JP2220571 A JP 2220571A JP 22057190 A JP22057190 A JP 22057190A JP H0661702 B2 JPH0661702 B2 JP H0661702B2
Authority
JP
Japan
Prior art keywords
polishing
suede
polishing cloth
polyurethane elastomer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2220571A
Other languages
Japanese (ja)
Other versions
JPH04101782A (en
Inventor
浩司 中川
茂樹 森本
Original Assignee
鐘紡株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鐘紡株式会社 filed Critical 鐘紡株式会社
Priority to JP2220571A priority Critical patent/JPH0661702B2/en
Publication of JPH04101782A publication Critical patent/JPH04101782A/en
Publication of JPH0661702B2 publication Critical patent/JPH0661702B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Polyurethanes Or Polyureas (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Synthetic Leather, Interior Materials Or Flexible Sheet Materials (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はスエード様研磨布に係り、更に詳しくは耐薬品
性に優れ、耐久性のよい、特に集積回路素子用半導体基
板、例えば高純度シリコンや化合物半導体等からなるウ
ェハーの鏡面加工、あるいはガラス,金属,セラミック
等の仕上研磨に好適なスエード様研磨布に関する。
Description: FIELD OF THE INVENTION The present invention relates to a suede-like polishing cloth, and more particularly to a semiconductor substrate having excellent chemical resistance and good durability, particularly for integrated circuit devices, such as high-purity silicon. The present invention relates to a suede-like polishing cloth suitable for mirror-finishing a wafer made of, for example, a compound semiconductor, or for finishing polishing of glass, metal, ceramics, or the like.

(従来の技術) 天然繊維,再生繊維または合成繊維からなる編織布又は
不織布、あるいはこれらにポリウレタンエラストマー等
の樹脂またはスチレンブタジエンゴム,ニトリルブタジ
エンゴム等のゴム状物質を充填して得られる基体に、ポ
リウレタンエラストマーの溶液を塗布し、これを凝固液
で処理し湿式凝固して多孔質銀面層を形成せしめ、水洗
乾燥後、該銀面層表面を研削して得られるスエード様研
磨布は夙によく知られており、高純度シリコンや化合物
半導体からなるウェハーの鏡面加工工程、或いはガラス
製品,金属製品等の仕上工程に於て、酸化セリウム,酸
化アルミニウム,酸化ケイ素等の微細遊離砥粒を分散せ
しめた研磨液を供給しながら研磨する所謂精密研磨用と
して広く使用されている。
(Prior Art) A woven or non-woven fabric made of natural fibers, recycled fibers or synthetic fibers, or a substrate obtained by filling a resin such as a polyurethane elastomer or a rubber-like substance such as styrene butadiene rubber or nitrile butadiene rubber into these. A suede-like polishing cloth obtained by coating a solution of a polyurethane elastomer, treating it with a coagulating liquid and wet coagulating it to form a porous silver surface layer, washing with water and drying, and then grinding the surface of the silver surface layer Well-known, fine free abrasive grains such as cerium oxide, aluminum oxide, and silicon oxide are dispersed in the mirror finishing process of wafers made of high-purity silicon and compound semiconductors, or the finishing process of glass products, metal products, etc. It is widely used for so-called precision polishing, in which polishing is performed while supplying a weak polishing liquid.

従来、スエード様研磨布を用いて研磨する場合には、供
給する研磨液中の砥粒の種類,粒度,濃度等、あるいは
研磨の際の温度,圧力,回転数等の加工条件を適宜設定
することで、所望する仕上精度のものを得ている。ま
た、仕上状態の向上を目的として、研磨液をpH9〜1
2のアルカリ性に調整したり、研磨液に次亜塩素酸ナト
リウム等の薬品を混入して、被研磨物の表面をエッチン
グしながら研磨する方法が一般的である。
Conventionally, in the case of polishing using a suede-like polishing cloth, the processing conditions such as the type, particle size, concentration, etc. of the abrasive grains in the supplied polishing liquid, or the temperature, pressure, rotation speed, etc. during polishing are set appropriately Thus, the desired finishing accuracy is obtained. Further, in order to improve the finish condition, the polishing liquid is adjusted to pH 9 to 1
A general method is to adjust the alkalinity to 2 or mix a polishing liquid with a chemical such as sodium hypochlorite to polish while polishing the surface of the object to be polished.

しかしながら、従来使用されているスエード様研磨布
は、耐アルカリ性,耐薬品性が十分でなく、良好なる研
磨性能を長時間維持することができない。耐加水分解性
(耐アルカリ性)を向上させたスエード様シート状物が
いくつか提案されてはいるが、この場合も例えば次亜塩
素酸ナトリウム等に対する耐性に乏しいといった、耐薬
品性に問題がある。即ち、耐加水分解性(耐アルカリ
性),耐薬品性に優れ研磨耐久性の良好なスエード様研
磨布は未だ満足すべきものが提案されていないのが現状
である。
However, conventionally used suede-like polishing cloths do not have sufficient alkali resistance and chemical resistance and cannot maintain good polishing performance for a long time. Several suede-like sheet materials with improved hydrolysis resistance (alkali resistance) have been proposed, but in this case as well, there is a problem with chemical resistance, such as poor resistance to sodium hypochlorite. . That is, the present situation is that a suede-like polishing cloth excellent in hydrolysis resistance (alkali resistance), chemical resistance and polishing durability has not been proposed yet.

(発明が解決しようとする課題) 本発明者等は上述の如き問題点に鑑み鋭意研究した結果
完成したものであって、本発明の目的は耐加水分解性,
耐薬品性に優れ、耐久性が良く研磨可使寿命の長いスエ
ード様研磨布を提供するにある。
(Problems to be Solved by the Invention) The present inventors have completed as a result of earnest research in view of the above problems, and an object of the present invention is to provide hydrolysis resistance,
It is to provide a suede-like polishing cloth with excellent chemical resistance, durability, and a long working life.

(課題を解決するための手段) 上述の目的は、基体にポリウレタンエラストマーの水混
和性有機溶剤溶液を塗布し、水系凝固液で処理して基体
上に多孔質銀面層を形成せしめ、該銀面層表面を研削す
ることからなるスエード様研磨布であって、前記ポリウ
レタンエラストマーのポリオール成分としてポリヘキサ
メチレンカーボネートを30モル%以上含むことを特徴
とするスエード様研磨布によって達成される。
(Means for Solving the Problem) The above-mentioned object is to coat a substrate with a water-miscible organic solvent solution of a polyurethane elastomer and treat it with an aqueous coagulating liquid to form a porous silver surface layer on the substrate. A suede-like polishing cloth formed by grinding the surface of a face layer, which is achieved by including 30 mol% or more of polyhexamethylene carbonate as a polyol component of the polyurethane elastomer.

本発明に用いられる基体としては、綿,レーヨン,ポリ
アミド,ポリエステル,ポリアクリロニトリル等の繊維
またはこれらの混合物からなる編織布や不織布、或はこ
れらにスチレンブタジエンゴム,ニトリルブタジエンゴ
ム等のゴム状物質またはポリウレタンエラストマー等の
樹脂を充填して得られるものが挙げられるが、特にこれ
らに限定されるものではない。
The substrate used in the present invention includes a textile fabric such as cotton, rayon, polyamide, polyester, polyacrylonitrile or the like, or a woven or non-woven fabric made of a mixture thereof, or a rubber-like substance such as styrene-butadiene rubber or nitrile-butadiene rubber. Examples thereof include those obtained by filling a resin such as polyurethane elastomer, but are not particularly limited thereto.

一般にポリウレタンエラストマーは、ポリイソシアネー
ト,ポリオール及び鎖伸長剤とから製造されるが、本発
明の銀面形成用に使用されるポリウレタンエラストマー
は、ポリオール成分としてポリヘキサメチレンカーボネ
ートを30モル%以上、好ましくは50モル%以上含む
ものである。ポリヘキサメチレンカーボネートの割合が
30モル%未満の場合は、耐加水分解性(耐アルカリ
性)及び耐薬品性が不十分となる。
Generally, a polyurethane elastomer is produced from polyisocyanate, a polyol and a chain extender, but the polyurethane elastomer used for forming the silver surface of the present invention contains polyhexamethylene carbonate as a polyol component in an amount of 30 mol% or more, preferably It contains 50 mol% or more. When the proportion of polyhexamethylene carbonate is less than 30 mol%, hydrolysis resistance (alkali resistance) and chemical resistance are insufficient.

本発明において上記ポリオール成分としては、ポリヘキ
サメチレンカーボネートのみを用いた場合が、耐加水分
解性,耐薬品性が良好であり好適であるが、他のポリオ
ールを併用し共重合させてもよい。併用されるポリオー
ルとしては、例えばポリエチレンアジペートグリコー
ル,ポリプロピレンアジペートグリコール,ポリエチレ
ンプロピレンアジペートグリコール,ポリブチレンアジ
ペートグリコール,ポリエチレンブチレンアジペートグ
リコール,ポリペンタメチレンアジペートグリコール等
のポリエステルポリオール類、或はポリエチレンエーテ
ルグリコール,ポリプロピレンエーテルグリコール,ポ
リテトラメチレンエーテルグリコール,ポリヘキサメチ
レンエーテルグリコール等のポリエーテルポリオール類
等、両末端に水酸基を有する分子量500〜8000の
ポリオール類が挙げられる。共重合されるポリオールと
してはポリエステル類よりもポリエーテル類の方が耐加
水分解性,耐薬品性が良く好ましい。
In the present invention, when only polyhexamethylene carbonate is used as the above-mentioned polyol component, hydrolysis resistance and chemical resistance are good, which is preferable, but other polyols may be used together and copolymerized. Examples of the polyol used in combination include polyester polyols such as polyethylene adipate glycol, polypropylene adipate glycol, polyethylene propylene adipate glycol, polybutylene adipate glycol, polyethylene butylene adipate glycol, polypentamethylene adipate glycol, or polyethylene ether glycol, polypropylene ether. Polyols such as glycol, polytetramethylene ether glycol, polyhexamethylene ether glycol, and other polyether polyols having hydroxyl groups at both ends and having a molecular weight of 500 to 8,000 can be used. As polyols to be copolymerized, polyethers are preferable to polyesters because they have better hydrolysis resistance and chemical resistance.

本発明の銀面ポリウレタンエラストマーに用いるポリイ
ソシアネートとしては、例えばジフェニルメタン−4,
4′−ジイソシアネート,トリレン−2,4−ジイソシ
アネート,キシレンジイソシアネート,ジシクロヘキシ
ルメタン−4,4′−ジイソシアネート,ヘキサメチレ
ンジイソシアネート等の有機ジイソシアネート、或いは
これらの混合物が挙げられる。また鎖伸長剤としては、
活性水素基を含んだ低分子化合物、例えばエチレングリ
コール,プロピレングリコール,ブチレングリコール,
ジエチレングリコール等のグリコール類、例えばエチレ
ンジアミン,トリメチレンジアミン,プロピレンジアミ
ン,ブチレンジアミン等のジアミン類、あるいはアミノ
アルコール等を挙げることができる。
Examples of the polyisocyanate used for the silver surface polyurethane elastomer of the present invention include diphenylmethane-4,
Organic diisocyanates such as 4'-diisocyanate, tolylene-2,4-diisocyanate, xylene diisocyanate, dicyclohexylmethane-4,4'-diisocyanate and hexamethylene diisocyanate, or a mixture thereof can be used. As a chain extender,
Low molecular weight compounds containing active hydrogen groups such as ethylene glycol, propylene glycol, butylene glycol,
Examples thereof include glycols such as diethylene glycol, diamines such as ethylenediamine, trimethylenediamine, propylenediamine, butylenediamine, and amino alcohols.

上述の如き組成からなる銀面ポリウレタンエラストマー
を溶解する溶剤としては、例えばジメチルホルムアミ
ド,ジメチルスルホキシド,テトラヒドロフラン,ジメ
チルアセトアミド,エチルアセテート,ジオキサン等の
水混和性有機溶剤を挙げることができるが、特にこれら
に限定されるものではない。ポリウレタンエラストマー
溶液のエラストマー固形分濃度は好ましくは10〜40
重量%、更に好ましくは15〜30重量%である。エラ
ストマー固形分濃度が低過ぎる場合、溶液粘度が低過ぎ
て、溶液が基体へ過度に浸み込み、良好なる多孔質銀面
層が形成されにくくなる。
Examples of the solvent that dissolves the silver surface polyurethane elastomer having the above composition include water-miscible organic solvents such as dimethylformamide, dimethylsulfoxide, tetrahydrofuran, dimethylacetamide, ethylacetate, and dioxane. It is not limited. The concentration of elastomer solids in the polyurethane elastomer solution is preferably 10-40.
%, More preferably 15 to 30% by weight. When the elastomer solid content concentration is too low, the solution viscosity is too low, and the solution excessively penetrates into the substrate, making it difficult to form a good porous silver surface layer.

本発明のスエード様研磨布を製造するには、例えば次の
様にすればよい。即ち、上述の如き組成に調整された銀
面形成用ポリウレタンエラストマー溶液を前記基体上に
ロールコーター,ナイフコーター等の適宜な塗布手段を
用いて、好ましくは150〜1500g/cm、更に
好ましくは300〜1,200g/mの塗布量(溶液
として)になるように塗布し、次いで水或は水とポリウ
レタンエラストマーの溶剤との混合液中に浸漬して湿式
凝固せしめた後、脱溶剤のための水洗,乾燥をすること
により、基体面に垂直且つ均一な紡錘状気孔を有する銀
面層を具えたシート状物質が得られる。更に、サンドペ
ーパー使用の表面研削機などにより該シート状物質の銀
面表面を研削することにより、表面孔形状も均一で且つ
断面孔形状が基体面に垂直で均一な紡錘状気孔であるス
エード様研磨布が得られる。
To produce the suede-like polishing cloth of the present invention, for example, the following may be carried out. That is, the polyurethane elastomer solution for silver surface formation having the composition as described above is applied onto the substrate by a suitable coating means such as a roll coater or a knife coater, preferably 150 to 1500 g / cm 2 , and more preferably 300. To obtain a coating amount of 1,200 g / m 2 (as a solution), and then wet-coagulate by immersing in water or a mixed solution of water and a solvent of polyurethane elastomer for solvent removal. By washing with water and drying, a sheet-like substance having a silver layer having vertical and uniform spindle-shaped pores on the substrate surface can be obtained. Furthermore, by grinding the silver surface of the sheet-like substance with a surface grinder using sandpaper, a suede-like shape with a uniform surface pore shape and a uniform cross-sectional pore shape perpendicular to the substrate surface. A polishing cloth is obtained.

(発明の効果) 本発明のスエード様研磨布は耐加水分解性(耐アルカリ
性),耐薬品性に優れているため、これを用いて研磨す
れば被研磨体への加工傷(所謂スクラッチ)の発生が少
なく、且つ良好なる研磨状態が長時間にわたり維持さ
れ、従来品に比べ耐久性に優れ且つ安定した研磨ができ
る。
(Effect of the invention) Since the suede-like polishing cloth of the present invention is excellent in hydrolysis resistance (alkali resistance) and chemical resistance, polishing by using it causes processing scratches (so-called scratches) on the object to be polished. It is less likely to occur, and a good polishing state is maintained for a long time, and it has excellent durability and stable polishing as compared with conventional products.

以下、実施例及び比較例により本発明を詳述する。なお
その前に本実施例及び比較例における研磨試験方法及び
その評価方法について記述する。また、実施例及び比較
例中の「部」及び「%」は特に断りのない限り、「重量
部」及び「重量%」を意味する。
Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples. Before that, the polishing test method and its evaluation method in the present example and comparative example will be described. Further, "parts" and "%" in Examples and Comparative Examples mean "parts by weight" and "% by weight" unless otherwise specified.

<研磨試験I> 平均粒径0.01μのコロイダルシリカを3%分散し、
且つ水酸化ナトリウムによりpH11に調整された研磨
液を用い、得られた研磨布を使用して、スピードファム
社製36SPAW研磨機にて、5インチシリコンウェハ
ーを1回の研磨時間30分間で研磨した。研磨は全部で
60回くり返し行った。その他の研磨条件は次の通りで
あった。
<Polishing Test I> 3% of colloidal silica having an average particle diameter of 0.01 μ is dispersed,
Further, a polishing liquid adjusted to pH 11 with sodium hydroxide was used, and the obtained polishing cloth was used to polish a 5-inch silicon wafer once at a polishing time of 30 minutes with a 36 SPAW polishing machine manufactured by Speedfam. . Polishing was repeated 60 times in total. The other polishing conditions were as follows.

加工圧力 200g/cm 定盤回転数 77rpm 加工温度 40℃ 研磨液供給量 100cc/分 <研磨試験II> 平均粒径0.1μの酸化ケイ素を5%分散し且つ次亜塩
素酸ナトリウムを1%溶解した研磨液を用い、得られた
研磨布を使用して、スピードファム社製36SPAW研
磨機にて、3インチGa・Asウェハーを研磨した。1
回の研磨時間を30分間とし、研磨は60回くり返し行
った。その他の研磨条件は研磨試験Iと同様とした。
Processing pressure 200 g / cm 2 Surface plate rotation speed 77 rpm Processing temperature 40 ° C. Polishing liquid supply amount 100 cc / min <Polishing test II> 5% silicon oxide having an average particle size of 0.1 μ is dispersed and sodium hypochlorite is 1%. A 3-inch Ga.As wafer was polished with a 36 SPAW polishing machine manufactured by Speed Fam Co., using the resulting polishing cloth using the dissolved polishing liquid. 1
The polishing time was 30 minutes, and the polishing was repeated 60 times. Other polishing conditions were the same as those in the polishing test I.

<研磨能率> 30分間研磨における研削深度(μ)を測定した。<Polishing efficiency> The grinding depth (μ) in 30 minutes of polishing was measured.

<不良発生性> 5万ルクスの照射光下にて、目視により加工傷(スクラ
ッチ)を確認したウェハーの割合を求め、下記基準に準
拠して評価した。
<Defective occurrence> The ratio of wafers in which processing scratches (scratches) were visually confirmed under irradiation light of 50,000 lux was obtained and evaluated according to the following criteria.

◎ 5%未満 ○ 5〜10% △ 10〜50% × 50%以上 (実施例1〜4,比較例1〜2) ポリエステル短繊維(繊度1.5d,長さ51mm)よ
りなるニードルパンチされた不織布(目付300g/m
2,厚み2.0m/m)に、スチレンブタジエン共重合体
のエマルジョン溶液を含浸させ、加熱架橋反応後、0.
9mmの厚さにスライスして、繊維比率46%,スチレ
ンブタジエン共重合体比率54%の基体を得た。
◎ Less than 5% ○ 5-10% △ 10-50% × 50% or more (Examples 1 to 4, Comparative Examples 1 to 2) Needle punched with polyester short fibers (fineness 1.5d, length 51mm) Non-woven fabric (Basis weight 300g / m
2 , thickness 2.0 m / m) was impregnated with an emulsion solution of a styrene-butadiene copolymer, and after heat-crosslinking reaction,
It was sliced to a thickness of 9 mm to obtain a substrate having a fiber ratio of 46% and a styrene-butadiene copolymer ratio of 54%.

また、分子量が各2000のポリヘキサメチレンカーボ
ネート(PHMC)とポリテトラメチレンエーテルグリ
コール(PTMG)とを第1表に示す如きモル比率にて
計1モルをポリオール成分として用い、ジフェニルメタ
ン−4,4′−ジイソシアネート3モル,エチレングリ
コール2モルを、ジメチルホルムアミド中で溶液重合さ
せて濃度30%のポリウレタンエラストマー溶液を得
た。このポリウレタンエラストマー溶液100部に、カ
ーボンブラック粉末5部,ステアリルアルコール3部,
ジメチルホルムアミド100部を加え、粘度100ポイ
ズ/30℃の銀面ポリウレタンエラストマー塗布液を得
た。得られた塗布液を上記基体上にロールコーターで8
00g/m塗布した後、30℃の凝固浴(水:ジメチ
ルホルムアミド=90:10重量比)の中に浸漬して凝
固させ、温水で充分に脱溶媒した後、120℃にて熱風
乾燥を行った。
Also, polyhexamethylene carbonate (PHMC) and polytetramethylene ether glycol (PTMG) each having a molecular weight of 2000 were used as a polyol component in a total molar ratio of 1 mol as shown in Table 1, and diphenylmethane-4,4 '. 3 mol of diisocyanate and 2 mol of ethylene glycol were solution polymerized in dimethylformamide to obtain a polyurethane elastomer solution having a concentration of 30%. To 100 parts of this polyurethane elastomer solution, 5 parts of carbon black powder, 3 parts of stearyl alcohol,
100 parts of dimethylformamide was added to obtain a silver surface polyurethane elastomer coating solution having a viscosity of 100 poise / 30 ° C. The obtained coating liquid is applied onto the above substrate with a roll coater.
After applying 00 g / m 2 , it is immersed in a coagulation bath (water: dimethylformamide = 90: 10 weight ratio) at 30 ° C. for coagulation, sufficiently desolvated with warm water, and dried with hot air at 120 ° C. went.

次いで、それぞれの表面を#120のサンドペーパーに
て0.15mm研削し、スエード様研磨布を得た。結果
は第1表の通りであった。
Then, each surface was ground by 0.15 mm with # 120 sandpaper to obtain a suede-like polishing cloth. The results are shown in Table 1.

(実施例5) 実施例1〜4で用いたポリオールに代えて、ポリヘキサ
メチレンカーボネート(PHMC)とポリヘキサメチレ
ンアジペートグリコール(AD)とをモル比率50:5
0で用いた他は、実施例1〜4と同様の方法でスエード
様研磨布を得た。結果は第1表の通りであった。
(Example 5) Instead of the polyol used in Examples 1 to 4, polyhexamethylene carbonate (PHMC) and polyhexamethylene adipate glycol (AD) were used in a molar ratio of 50: 5.
A suede-like polishing cloth was obtained in the same manner as in Examples 1 to 4 except that the suede-like polishing cloth was used. The results are shown in Table 1.

(比較例3) 実施例5で用いたPHMCを用いずポリオールとしてA
Dのみを用いた他は、実施例5と同様の方法でスエード
様研磨布を得た。結果は第1表の通りであった。
(Comparative Example 3) A was used as the polyol without using the PHMC used in Example 5.
A suede-like polishing cloth was obtained in the same manner as in Example 5, except that only D was used. The results are shown in Table 1.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】基体にポリウレタンエラストマーの水混和
性有機溶剤溶液を塗布し、水系凝固液で処理して基体上
に多孔質銀面層を形成せしめ、該銀面層表面を研削する
ことからなるスエード様研磨布であって、前記ポリウレ
タンエラストマーのポリオール成分としてポリヘキサメ
チレンカーボネートを30モル%以上含むことを特徴と
するスエード様研磨布。
1. A method comprising applying a water-miscible organic solvent solution of a polyurethane elastomer to a substrate, treating it with an aqueous coagulating liquid to form a porous silver surface layer on the substrate, and grinding the surface of the silver surface layer. A suede-like polishing cloth comprising 30 mol% or more of polyhexamethylene carbonate as a polyol component of the polyurethane elastomer.
JP2220571A 1990-08-21 1990-08-21 Suede-like polishing cloth Expired - Fee Related JPH0661702B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2220571A JPH0661702B2 (en) 1990-08-21 1990-08-21 Suede-like polishing cloth

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2220571A JPH0661702B2 (en) 1990-08-21 1990-08-21 Suede-like polishing cloth

Publications (2)

Publication Number Publication Date
JPH04101782A JPH04101782A (en) 1992-04-03
JPH0661702B2 true JPH0661702B2 (en) 1994-08-17

Family

ID=16753075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2220571A Expired - Fee Related JPH0661702B2 (en) 1990-08-21 1990-08-21 Suede-like polishing cloth

Country Status (1)

Country Link
JP (1) JPH0661702B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4552968B2 (en) * 2007-05-29 2010-09-29 住友電気工業株式会社 Compound semiconductor substrate polishing method, compound semiconductor substrate, compound semiconductor epi substrate manufacturing method, and compound semiconductor epi substrate
JP2009074217A (en) * 2007-09-25 2009-04-09 Toray Coatex Co Ltd Polishing tape
JP5501721B2 (en) * 2009-09-30 2014-05-28 富士紡ホールディングス株式会社 Polishing pad

Also Published As

Publication number Publication date
JPH04101782A (en) 1992-04-03

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