JPH065668A - Manufacture of semiconductor chip - Google Patents

Abstract

PURPOSE:To enable a semiconductor chip to be lessened in manufacturing cost and enhanced in yield when non-defective semiconductor chips are manufactured from a wafer. CONSTITUTION:A wafer sheet B is pasted on the rear of a wafer A, the wafer A is cut into separate semiconductor chips, then the wafer sheet B is biaxially oriented, wax 2a and 2b are applied onto the semiconductor chips 1a defective in shape and the defective semiconductor chips out of the semiconductor chips 1, and the semiconductor chips 1 are dipped into chemical liquid to separate the wafer sheet B and then screened.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a transistor or I
The present invention relates to a method of manufacturing a semiconductor chip used for a semiconductor component such as C.

[0002]

2. Description of the Related Art Generally, a semiconductor chip of this type has a large number of semiconductor chips, as shown in FIG.
The surface of one wafer A is formed through various processes such as photolithography, and a wafer sheet B made of a soft synthetic resin is attached to the back surface of this wafer A, and then the wafer A is After cutting with a rotary blade along the vertical and horizontal stripes that divide the semiconductor chips 1 from each other, the wafer sheet A is stretched in the biaxial directions of the X-axis direction and the Y-axis direction. Each semiconductor chip is separated and then the whole is immersed in a chemical solution in which acetone and ethanol are mixed to manufacture each semiconductor chip 1 by a method of peeling from the wafer sheet B. I have to.

By the way, in the above-mentioned method, each semiconductor chip 1 attached to the wafer sheet B has a partially defective shape, and the semiconductor chip 1 has an imperfect shape.
a, and a defective semiconductor chip 1b that does not have a predetermined performance even if it has a predetermined shape. Therefore, conventionally, before peeling each semiconductor chip attached to the wafer sheet B from the wafer sheet B, as shown in FIG.
As shown in FIG. 5, the wafer sheet B has only the complete semiconductor chip 1 and each semiconductor chip 1 having an incomplete shape.
After removing a and each defective semiconductor chip 1b from the wafer sheet B, the complete semiconductor chip 1 is peeled from the wafer sheet B by an appropriate means such as immersion in the chemical solution.

[0004]

However, when removing each incompletely shaped semiconductor chip 1a and each defective semiconductor chip 1b from the wafer sheet B, an operator uses tweezers to remove them one by one. It requires a lot of trouble,
There is a problem that the cost will increase significantly, and moreover,
There is also a problem that when the semiconductor chips 1a having an incomplete shape and the defective semiconductor chips 1b are removed by tweezers, the non-defective semiconductor chip 1 adjacent thereto is damaged.

The present invention has a technical object to provide a method capable of solving these problems.

[0006]

In order to achieve this technical object, the present invention is to attach a wafer sheet to the back surface of a wafer on which a large number of semiconductor chips are formed, and then attach the wafer to each semiconductor chip. After cutting along the line of lines that separates each other, wax or wax is applied only to each of the defective semiconductor chips and the defective semiconductor chips other than the good semiconductor chips of the semiconductor chips. After the synthetic resin liquid is applied and cured so that the wax or synthetic resin liquid protrudes from each semiconductor chip having an imperfect shape and each defective semiconductor chip, and then peeled from the wafer sheet by immersion in a chemical liquid. , Decided to sort.

[0007]

[Operation] In this way, only the semiconductor chips attached to the wafer sheet except the non-defective semiconductor chips are imperfectly shaped and the defective semiconductor chips are waxed only. Or synthetic resin liquid,
The size of the incompletely shaped semiconductor chips and the defective semiconductor chips is obtained by applying the wax or the synthetic resin liquid so as to protrude from the incompletely shaped semiconductor chips and the defective semiconductor chips, and then curing the wax or the synthetic resin liquid. By applying the wax or the synthetic resin liquid to this, the size becomes larger than the size of each good semiconductor chip.

Therefore, by separating the wafer sheet from the wafer sheet by immersion in a chemical solution and then selecting it, only good semiconductor chips can be selectively taken out.

[0009]

As described above, according to the present invention, when manufacturing a semiconductor chip, it is possible to selectively remove only one defective semiconductor chip and one defective semiconductor chip one by one with tweezers as in the prior art. Since it is not necessary, the manufacturing process can be simplified, the cost can be significantly reduced, and the yield rate can be improved without damaging a good semiconductor chip.

[0010]

Embodiments of the present invention will be described below with reference to the drawings of FIGS. In FIG. 3, a large number of semiconductor chips are formed on the front surface of one wafer A through various processes such as photolithography, and a wafer sheet B made of a soft synthetic resin is attached to the back surface of the wafer A, , The wafer A
Is cut by a rotary blade along vertical and horizontal streak lines dividing each semiconductor chip from each other, and then the wafer sheet A is stretched biaxially in the X-axis direction and the Y-axis direction. Shows the separated state for each semiconductor chip. Of the semiconductor chips on the wafer sheet B, the semiconductor chips 1a other than the non-defective semiconductor chips 1 and the defective semiconductor chips 1a and defective ones Waxes 2a and 2b are applied and cured in a liquid state only on the semiconductor chip 1b so that the waxes 2a and 2b extend beyond the imperfectly shaped semiconductor chips 1a and the defective semiconductor chips 1b. Alternatively, the ultraviolet-curable synthetic resin liquid is used for the semiconductor chips 1a each having an incomplete shape of the ultraviolet-curable synthetic resin liquid and each defective semiconductor chip 1b.
It is applied so that it protrudes further and then cured by irradiation with ultraviolet rays.

Then, the size of each of the defective semiconductor chips 1a and each defective semiconductor chip 1b becomes larger than that of each non-defective semiconductor chip 1 by applying the wax 2a, 2b or the synthetic resin thereto. . Therefore, as shown in FIG. 4, a meshed inner net basket 5 through which only the non-defective semiconductor chip 1 passes, and the inner net basket 5 are placed in a chemical liquid tank 4 containing a chemical liquid 3 in which acetone and ethanol are mixed.
An outer net basket 6 having a smaller mesh is inserted into the inner net basket 5, and as shown in FIG.
By dipping the entire wafer sheet B, which has been applied and cured, and peeling off all the semiconductor chips of the wafer sheet B from the wafer sheet B, the non-defective semiconductor chip 1 becomes While passing through the outer net basket 6 and accumulating in the outer net basket 6, the incompletely shaped semiconductor chips 1a and the defective semiconductor chips 1b, which are enlarged by applying and curing the waxes 2a and 2b, and the wafer sheet B are
Since the inner net cage 5 remains in the inner net basket 5, both the inner net basket 5 and the outer net basket 6 are pulled up from the chemical solution tank 4, so that each of the good semiconductor chips 1 from the inside of the outer net basket 6 is removed. Without damaging the non-defective semiconductor chip 1.
It can be acquired selectively.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer sheet having a plurality of semiconductor chips formed thereon and a wafer attached thereto, which is biaxially stretched.

FIG. 2 is a perspective view showing a state in which semiconductor chips having imperfect shapes and defective semiconductor chips are removed from a wafer sheet in a conventional method.

FIG. 3 is a perspective view showing a state in which a wax is applied to each semiconductor chip having an imperfect shape and each defective semiconductor chip in the wafer sheet in the method of the present invention.

FIG. 4 is a vertical cross-sectional front view of a chemical liquid tank for peeling each semiconductor chip from a wafer sheet.

[Explanation of symbols]

 A wafer B wafer sheet 1 good semiconductor chip 1a defective semiconductor chip 1b defective semiconductor chip 2a, 2b wax 3 chemical liquid 4 chemical liquid tank 5 inner net basket 6 outer net basket

Claims (1)

[Claims] 1. A wafer sheet is attached to the back surface of a wafer on which a large number of semiconductor chips are formed, and then the wafer is cut along a score line that separates the semiconductor chips from each other. Other than the good semiconductor chips among the semiconductor chips, the wax or the synthetic resin liquid is used only for the defective semiconductor chips and the defective semiconductor chips only. A method for manufacturing a semiconductor chip, which comprises: coating so as to protrude from each semiconductor chip and each semiconductor chip of a defective product, curing, and peeling from a wafer sheet by immersion in a chemical solution;