JPH0653261A - Manual die-bonder - Google Patents

Abstract

PURPOSE:To provide a manual die-bonder which can accurately position a semiconductor package on a stage where heating and cooling are performed repeatedly. CONSTITUTION:In an object which positions a semiconductor package 4A on the stage 32 of a heat block 3 through a positioning mechanism and mounts a semiconductor element on this positioned semiconductor package 4A in heated condition, the positioning mechanism is composed of a plurality of positioning holes 18 bored in the stage 32 and a plurality of columnar positioning bars 9 for positioning a semiconductor package 4A between themselves and press bars 37, being inserted respectively in the optional positioning bars 18 among a plurality of positioning holes 18 freely of insertion and extraction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manual die bonder for mounting a semiconductor element on a semiconductor package, and more particularly to an improvement of a positioning mechanism for positioning and fixing the semiconductor package.

[0002]

2. Description of the Related Art In recent years, semiconductor elements have tended to be developed for each specific application, and there is a strong demand for a mounting technology for mounting semiconductor elements in a semiconductor package that is compatible with various types and small quantities. In order to meet this demand, the manual die bonder shown in FIG. 5 is used in the die bonding process.

As shown in FIG. 1, this manual die bonder has a die bonder body 1 equipped with a microscope 2 for observation.
A heat block 3 for positioning and mounting the semiconductor package 4, and an operable arm 6 extending from a storage window 5 opened at the center of the front of the die bonder body 1 for mounting a semiconductor element (not shown) on the semiconductor package 4. The die bonder body 1 is pivotally supported on the lower right side of the die bonder main body 1 and is composed of an operating lever 7 for oscillating based on an artificial operation to move the arm 6 in the X, Y and Z directions.

As shown in FIGS. 5 and 6, the heat block 3 has a die bonder body 1 located directly below the microscope 2.
A bottomed cylindrical container 30 is placed on the lower overhanging portion 1a of the, and a cylindrical stage support base 31 is erected inside the container 30. The stage support base 31 has a top. A plane circular stage 32 on which the semiconductor package 4 is detachably mounted is horizontally mounted.

A swing rod 33 oriented in the vertical direction is screwed inside the container 30 via a screw 34 so as to swing freely, and between the swing rod 33 and the stage support 31. A coil spring 35 for constantly elastically biasing the rocking rod 33 in the rightward direction of FIG. 7A is horizontally stretched, and the lower part of the rocking rod 33 can freely reciprocate across the lower peripheral surface of the container 30. The operating rod 36 is attached to the top of the rocking rod 33, and the pressing rod 37, which is in pressure contact with the side surface of the semiconductor package 4, is attached to the screw 34.
It is screwed horizontally through A.

Further, the stage support base 31 and the stage 32
A heater 38 for heating which facilitates mounting of a semiconductor element is built in the inside of the. A plurality of screw holes 39 are bored in the stage 32 side by side at a predetermined interval, and one of the plurality of screw holes 39 is used to hold and hold the semiconductor package 4 with the pressing rod 37. Board 4
0 is screwed through the screw 34B.

Therefore, in order to mount a semiconductor element on the semiconductor package 4 using the manual die bonder, first, the pressing plate 40 is screwed into the screw hole 39 at a position corresponding to the size of the semiconductor package 4 via the screw 34B. The semiconductor package 4 between the pressing plate 40 and the pressing rod 37.
After arranging, the hand that was being pressed by the operating rod 36 may be released.

Then, the coil spring 35 that has been pulled
The swinging rod 33 swings from the left side to the right side in FIG. 7 due to the returning action, and the slightly pointed tip of the pressing rod 37 holds the semiconductor package 4 between itself and the pressing plate 40.

However, the heater 38 is heated by a temperature controller (not shown) to mount the semiconductor element on the semiconductor package 4 in a heated state, and then the package is taken out and cooled to mount the semiconductor element on the semiconductor package 4. be able to.

When the size of the semiconductor package 4 is changed, the screw 34B is loosened and removed with a tool (not shown) each time, and the pressing plate 40 is provided in the screw hole 39 at a position corresponding to the size of the semiconductor package 4. Had to be screwed again through the screw 34B.

[0011]

Since the conventional manual die bonder is constructed as described above and the stage 32 is repeatedly heated and cooled, the screw thread of the screw 34B and the screw groove of the screw hole 39 are deformed and pressed. There are problems that the screw 34B cannot be removed when the plate 40 is removed, and the holding plate 40 that performs the positioning function comes off. Further, there is a fear that only the head of the screw 34B may be removed due to metal fatigue caused by heating of the heater 38 and the like.

Further, when a semiconductor element is mounted on the semiconductor package 4 of the type having outer leads on the outer side, the pressing plate 40 becomes an obstacle and the semiconductor package 4 cannot be positioned on the stage 32. was there.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a manual die bonder capable of accurately positioning any type of semiconductor package on a stage where heating and cooling are repeatedly performed.

[0014]

In order to achieve the above-mentioned object in the present invention, a heat block stage is provided with
A semiconductor package is positioned by disposing a positioning mechanism, and a semiconductor element is mounted on the positioned semiconductor package in a heated state. The positioning mechanism includes a plurality of positioning holes formed on a stage and a plurality of positioning holes. It is characterized in that it is configured to be removably inserted into an arbitrary positioning hole of the positioning hole and to position the semiconductor package by sandwiching it between the pressing bar and the positioning bar.

In order to achieve the above object, the present invention is characterized in that the positioning rod has a substantially circular cross section.

Further, in order to achieve the above object, the present invention is characterized in that the positioning rod has a substantially hexagonal cross section.

[0017]

According to the present invention, since the positioning rod is inserted into the positioning hole at a position corresponding to the size of the semiconductor package, and the semiconductor package is held between the positioning rod and the pressing rod in a pressure contact state, the screw is used. Holes, screws and pressure plates can be omitted.

Therefore, it is possible to surely solve the problems that the screw groove of the screw hole is deformed, the screw cannot be removed when the pressing plate is removed, and the pressing plate having a positioning function is easily detached. You can Also,
It is possible to easily eliminate the risk that only the head of the screw will be removed due to metal fatigue associated with heating of the heater or the like.

Further, when mounting a semiconductor element on a semiconductor package of a type having outer leads on the outside,
By simply selecting and changing the positioning hole for inserting the positioning rod, it is possible to easily prevent the positioning rod from interfering with mounting, so it is extremely easy to position any type of semiconductor package on the stage. .

Furthermore, since a positioning rod having a substantially hexagonal cross section having a plurality of positioning surfaces is used, accurate positioning of the semiconductor package can be expected.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to one embodiment shown in FIGS. 1, 2 (a), 2 (b) and FIG. A positioning mechanism including a positioning hole 8 and a positioning rod 9 is provided, and the positioning mechanism is used to accurately position and arrange the semiconductor package 4A on the stage 32 where heating and cooling are repeatedly performed.

The heat block 3 is shown in FIGS.
As shown in (a) and (b), a bottomed cylindrical container 30 is placed on the lower projecting portion 1a of the die bonder body 1 located immediately below the microscope 2, and a cylindrical container 30 is placed inside the container 30. The stage support base 31 is vertically installed, and on the top of the stage support base 31, there is horizontally mounted a planar circular stage 32 on which the semiconductor package 4A having outer leads is detachably mounted. There is.

Inside the container 30, a vertically oriented rocking rod 33 is screwed by a screw 34 so as to be rockable, and the upper side of the rocking rod 33 and the stage support 31 are supported.
A coil spring 35 for constantly elastically biasing the rocking rod 33 in the right direction in FIG.
A reciprocating operation rod 36 that penetrates the lower peripheral surface of the container 30 is in contact with the lower portion of the container 3, and the pressing rod 3 that comes into pressure contact with the side surface of the semiconductor package 4A is attached to the top of the swing rod 33.
7 is screwed horizontally via a screw 34A.

In addition, the stage support base 31 and the stage 32
A heater 38 for heating which facilitates mounting of the semiconductor element is built in the inside of the. And stage 32
A plurality of planar circular positioning holes 8 are arranged in a matrix form in the vertical and horizontal directions to form a plurality of holes. The semiconductor package 4A is provided between the arbitrary positioning holes 8 in the plurality of positioning holes 8 and the pressing rod 37. Positioning rods 9 for holding the position of are respectively detachably inserted.

As shown in FIGS. 2 (a) and 2 (b), the positioning rod 9 is made of a hard stainless steel or the like having a small heat distortion and a good heat conduction in the form of a slender cylinder, and is formed on the outer wall of the semiconductor package 4A. It has a function of abutting from the direction and positioning and fixing. Other parts are the same as in the conventional example.

Therefore, in order to mount a semiconductor element on the semiconductor package 4A using the manual die bonder,
First, the positioning rods 9 are vertically inserted into the plurality of positioning holes 8 at positions corresponding to the size of the semiconductor package 4A, and the semiconductor package 4A is placed between the positioning rods 9 and the pressing rods 37, and then the operation rods. It suffices to release the pressing operation from the protruding end of 36.

Then, the coil spring 35 that has been pulled
2 (a) causes the swing bar 33 to center on the screw 34 by the return action of FIG.
Swings from the left to the right, and the slightly pointed tip of the pressing rod 37 holds the semiconductor package 4A in a pressure contact state with the positioning rod 9.

Then, the heater 38 is heated by a temperature controller (not shown), and the lever 7 is operated while observing with the microscope 2 to mount the semiconductor element (not shown) on the semiconductor package 4A in a heated state, and the package is taken out and cooled. Then, a semiconductor element can be mounted on the semiconductor package 4A.

When the size of the semiconductor package 4A is changed, the positioning rod 9 may be removed and the positioning rod 9 may be reinserted into the plurality of positioning holes 8 at the positions corresponding to the size of the semiconductor package 4A. .

According to the above configuration, the semiconductor package 4A
Since the positioning bar 9 is inserted into the positioning hole 8 at a position corresponding to the size of the semiconductor package 4A and the semiconductor package 4A is clamped between the positioning bar 9 and the pressing bar 37 under pressure,
It is possible to omit the screw hole 39, the screw 34B, and the pressing plate 40 that are deformed due to heating or the like.

Therefore, the screw groove of the screw hole 39 is deformed,
When the pressing plate 40 is removed, the screw 34B cannot be removed, and the pressing plate 40 has a positioning function.
It is possible to solve the problem that is removed.
Also, the screw 34B may be damaged due to metal fatigue caused by heating of the heater 38 and the like.
It is possible to eliminate the risk that only the head of the robot will be removed.

Further, when a semiconductor element is mounted on the semiconductor package 4A of the type having outer leads on the outside, the positioning rod 9 is simply selected and changed so that the positioning rod 9 does not collide with the outer lead. Since it is possible to prevent an obstacle during mounting, it is possible to easily position any type of semiconductor package on the stage 32.

Next, FIGS. 3 and 4A and 4B show another embodiment of the present invention. In this case, the size of a plurality of existing semiconductor packages is added to the stage 32. Based on the (shape), a plurality of planar circular positioning holes 8 are arranged and drilled, and the semiconductor package 4A is held between the pressing rod 37 and the arbitrary positioning holes 8 in the plurality of positioning holes 8. Each of the positioning rods 9 to be inserted is detachably inserted. In other words, the plurality of positioning holes 8 are arranged and drilled so as to surround a plurality of existing semiconductor packages.

Also in this embodiment, the same effects as the above embodiment can be expected, and the semiconductor package 4A can be expected.
It is obvious that an appropriate positioning hole 8 corresponding to the size of can be selected and used very easily.

Although the cylindrical positioning rod 9 is used in the above-mentioned embodiments, the positioning rod 9 having a plurality of positioning surfaces and having a substantially hexagonal or square cross section may be used. Needless to say, the stage 32 may be provided with a groove or the like having the same function instead of the positioning hole 8.

[0036]

As described above, according to the present invention, the positioning bar is inserted into the positioning hole at a position corresponding to the size of the semiconductor package, and the semiconductor package is pressed between the positioning bar and the pressing bar. Since the positioning is held, there is a remarkable effect that the screw hole, the screw, and the pressing plate can be surely and easily omitted.

Therefore, despite repeated heating and cooling of the stage, the thread of the screw, the thread groove of the screw hole, and the like are deformed, and the screw cannot be removed when the pressing plate is removed, or the positioning function is removed. There is a remarkable effect that it is possible to surely solve the big problem that the pressing plate that is operated easily comes off.

Further, it is possible to very easily eliminate the risk that only the head of the screw will be removed due to metal fatigue due to heating of the heater, and it is possible to significantly extend the life of the heat block. It has a great effect.

Further, when mounting a semiconductor element on a semiconductor package of a type having outer leads on the outside,
By simply selecting and changing the positioning hole for inserting the positioning rod, it is possible to easily prevent the positioning rod from interfering with mounting, so it is extremely easy to position any type of semiconductor package on the stage. There is a remarkable effect.

Furthermore, since a positioning rod having a substantially hexagonal cross section having a plurality of positioning surfaces is used, there is a remarkable effect that extremely accurate positioning of the semiconductor package can be expected.

[Brief description of drawings]

FIG. 1 is a sectional perspective view showing an embodiment of a manual die bonder according to the present invention.

FIG. 2 is an explanatory view showing an embodiment of a manual die bonder according to the present invention.

FIG. 3 is a sectional perspective view showing another embodiment of the manual die bonder according to the present invention.

FIG. 4 is an explanatory view showing another embodiment of the manual die bonder according to the present invention.

FIG. 5 is an overall perspective view showing a manual die bonder.

FIG. 6 is a sectional perspective view showing a conventional manual die bonder.

FIG. 7 is an explanatory view showing a conventional manual die bonder.

[Explanation of symbols]

3 ... Heat block, 4.4A ... Semiconductor package, 8
... Positioning hole, 9 ... Positioning rod, 32 ... Stage, 37
... Presser bar, 38 ... Heater.

Claims (3)

[Claims] 1. A manual die bonder in which a semiconductor package is positioned and arranged on a stage of a heat block by using a positioning mechanism, and a semiconductor element is mounted on the positioned semiconductor package in a heated state. It is characterized by comprising a plurality of positioning holes that are opened and a positioning bar that is removably inserted into any of the positioning holes of the plurality of positioning holes and that sandwiches the semiconductor package between itself and the pressing bar. Manual die bonder. 2. The manual die bonder according to claim 1, wherein the positioning rod has a substantially circular cross section. 3. The manual die bonder according to claim 1, wherein the positioning rod has a substantially hexagonal cross section.